CN113552746B - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN113552746B
CN113552746B CN202110836736.2A CN202110836736A CN113552746B CN 113552746 B CN113552746 B CN 113552746B CN 202110836736 A CN202110836736 A CN 202110836736A CN 113552746 B CN113552746 B CN 113552746B
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China
Prior art keywords
layer
substrate
display panel
array substrate
silver paste
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CN202110836736.2A
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Chinese (zh)
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CN113552746A (en
Inventor
刘建龙
金伟超
王少楠
吴继涛
王贵云
崔志洋
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Qingdao Boe Optoelectronic Technology Co ltd
BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
BOE Hebei Mobile Display Technology Co Ltd
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Priority to CN202110836736.2A priority Critical patent/CN113552746B/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/22—Antistatic materials or arrangements

Abstract

The embodiment of the application provides a display panel and a display device, the display panel comprises an array substrate and a color film substrate which is opposite to the array substrate in box, the array substrate comprises a display area and a non-display area which surrounds the display area, the non-display area is provided with a grounding wire, and the display panel further comprises a high-resistance film, a polarizer and silver paste. The high-resistance film is positioned on one side of the color film substrate, which is far away from the array substrate; the polaroid is positioned on one side of the high-resistance film far away from the color film substrate; the silver paste body extends to the array substrate from the polaroid, and the silver paste body is electrically connected with the grounding wire.

Description

Display panel and display device
Technical Field
The present disclosure relates to display technologies, and particularly to a display panel and a display device.
Background
Along with the development and popularization of electronic equipment (such as mobile phones, electronic bracelets and the like), the antistatic performance of the electronic equipment is more and more important. And in order to promote user's experience and feel, electronic equipment gradually to narrow frame and high screen account for the direction development of ratio, this has restricted display substrate's the available space of terminal and display substrate's line space of walking to a great extent for electronic equipment's antistatic behavior is relatively poor. Therefore, how to improve the antistatic ability of electronic devices is a problem that needs to be solved.
Disclosure of Invention
An object of the embodiments of the present application is to provide a display panel and a display device, so as to improve the antistatic performance of an electronic device. The specific technical scheme is as follows:
a first aspect of the embodiments of the present application provides a display panel, where the display panel includes an array substrate and a color film substrate that is aligned with the array substrate, the array substrate includes a display area and a non-display area surrounding the display area, the non-display area is provided with a ground trace, and the display panel further includes a high resistance film, a polarizer and a silver paste. The high-resistance film is positioned on one side of the color film substrate, which is far away from the array substrate; the polarizer is positioned on one side of the high-resistance film far away from the color film substrate; the silver paste extends from the polarizer to the array substrate, and the silver paste is electrically connected with the grounding wire.
In some embodiments, the silver paste body includes two point silver pastes spaced apart from each other, and both the two point silver pastes extend to the array substrate from the same side of the polarizer.
In some embodiments, the high-resistance film is substantially rectangular, and corner points of the high-resistance film far away from the silver paste have a round chamfer structure.
In some embodiments, the high resistance film is U-shaped, and the rounded side of the U-shape of the high resistance film is distal to the silver paste. In some embodiments, the display panel further includes a flexible circuit board bonded to the non-display region, the flexible circuit board including a ground region, the ground trace being connected to the ground region to connect the silver paste to the ground region.
In some embodiments, the polarizer has a resistance in the range of 10 < Lambda > 8 ohm to 10 < Lambda > 9 ohm.
In some embodiments, the non-display region of the array substrate includes:
a substrate;
the metal routing layer is positioned on one side of the substrate, and the grounding routing is arranged on the metal routing layer;
the first planarization layer is located on one side, far away from the substrate, of the metal routing layer, the first planarization layer covers the grounding routing, a through hole is formed in the first planarization layer, and the silver paste is connected with the grounding routing on the metal routing layer through the through hole.
In some embodiments, a groove is formed on the first planarization layer, and an orthogonal projection of the groove on the metal routing layer is located on one side of the ground routing layer close to the display area.
In some embodiments, the display region of the array substrate includes a substrate, and an active layer, a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, an interlayer dielectric layer, a third metal layer, and a passivation layer that are located on one side of the substrate and sequentially distributed along a direction away from the substrate, wherein the metal routing layer is fabricated on the same layer as the first metal layer or the third metal layer, and the first planarization layer is fabricated on the same layer as the passivation layer.
In some embodiments, the high resistance film has a resistance in a range of 10^8 ohms to 10^9 ohms.
A second aspect of embodiments of the present application provides a display device including the display panel described in any one of the above.
The embodiment of the application has the following beneficial effects:
the display panel and the display device provided by the embodiment of the application comprise an array substrate, a color film substrate, a high-resistance film, a polarizer and silver paste. The color film substrate and the array substrate are oppositely arranged, the array substrate comprises a display area and a non-display area surrounding the display area, and the non-display area of the array substrate is provided with a grounding wire. The high-resistance film is located on one side of the color film substrate far away from the array substrate, and the polaroid is located on one side of the high-resistance film far away from the array substrate and covers the high-resistance film. The silver paste extends from the polarizer to the grounding wire on the array substrate and is connected with the grounding wire. In the display panel that this application embodiment provided, high resistant film and polaroid range upon range of setting, the silver thick liquid is walked the line by the ground connection that the polaroid extends to array substrate on and is connected for behind the polaroid and the high resistant film of glass apron below that static on the glass apron on the display panel reachs, can walk the line through the ground connection that silver thick liquid body transmitted to array substrate on, thereby walk the line by the ground connection and derive. The polaroid and the high-resistance film are arranged in a laminated mode, the static electricity releasing capacity of the surface of the display panel is improved, the antistatic performance of the display panel is improved, and the antistatic performance of the display device comprising the display panel is further improved.
Of course, not all advantages described above need to be achieved at the same time in the practice of any one product or method of the present application.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is also obvious for a person skilled in the art to obtain other embodiments according to the drawings.
FIG. 1 is a schematic view of a display panel according to some embodiments of the present disclosure;
FIG. 2 isbase:Sub>A cross-sectional view taken along the line A-A in FIG. 1;
FIG. 3 is a top view of a display panel according to some embodiments of the present application;
FIG. 4 is another cross-sectional view taken along the line A-A in FIG. 1;
fig. 5 is a cross-sectional view taken along the line B-B in fig. 1.
Reference numerals: 1-an array substrate; 100-a display area; 110-non-display area; 111-ground trace; 112-a substrate; 113-metal routing layer; 114-a first planarizing layer; 1141 — a first via; 1142-grooves; 2-a color film substrate; 21-a black matrix layer; 22-a color film layer; 221-color block; 3-high resistance film; 31-round chamfer structure; 4-a polarizer; 5-silver paste; 51-point silver paste; 6-a glass cover plate; 7-a flexible circuit board; 71-a ground region; 101-a buffer layer; 102-an active layer; 103-a first insulating layer; 104-a first metal layer; 1041-a gate; 1042 — a first electrode plate; 105-a second insulating layer; 106-a second metal layer; 1061-a second electrode plate; 107-interlayer dielectric layer; 108-a third metal layer; 1081-source; 1082-drain; 109-a passivation layer; 120-a pixel defining layer; 130-a light emitting layer; 1301-a light emitting cell; 1302-an anode layer; 1303-organic light emitting layers; 1304-a cathode layer; 140-encapsulation layer.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the description herein are intended to be within the scope of the present disclosure.
In order to improve the antistatic capability of electronic equipment, embodiments of the present application provide a display panel and a display device, which will be described in detail below with reference to the accompanying drawings. The Display panel includes, but is not limited to, an LCD (Liquid Crystal Display) Display panel, an OLED (Organic Light-Emitting Diode) Display panel, a QLED (Quantum Dot Light-Emitting Diode) Display panel, a mini LED (small Light-Emitting Diode) Display panel, and a micro LED (micro Light-Emitting Diode) Display panel.
As shown in fig. 1 to 4, the display panel provided in the embodiment of the present application includes an array substrate 1, a color film substrate 2, a high resistance film 3, a polarizer 4, and a silver paste 5. The color film substrate 2 is located on one side of the array substrate 1 and is paired with the array substrate 1, the array substrate 1 includes a display area 100 and a non-display area 110 surrounding the display area 100, and the non-display area 110 is provided with a grounding trace 111. The high-resistance film 3 is positioned on one side of the color film substrate 2 far away from the array substrate 1. The polarizer 4 is located on one side of the high-resistance film 3 far away from the color film substrate 2. The silver paste 5 extends from the polarizer 4 to the array substrate 1, and the silver paste 5 is connected to the grounding trace 111.
In the embodiment of the present application, the display area 100 of the array substrate 1 corresponds to the display area of the display panel, and the non-display area 110 of the array substrate 1 corresponds to the non-display area of the display panel. The non-display area 110 of the array substrate 1 is provided with a ground trace 111 (GND line). As shown in fig. 1, the ground trace 111 may be disposed around the display area 100. In addition, as shown in fig. 2, the display panel may further include a glass cover plate 6, where the glass cover plate 6 is located on a side of the polarizer 4 away from the array substrate 1. The glass cover plate 6 is used for protecting the array substrate 1 and the color film substrate 2, and static electricity generated on the glass cover plate 6 can be transmitted into the polarizer 4 below the glass cover plate 6. The glass cover plate 6 may be bonded to the polarizer 4 by an OCA (Optically Clear Adhesive) optical Adhesive or the like, so as to reduce the influence of the glass cover plate 6 on the display area 100.
In the display panel provided in the embodiment of the present application, the display panel includes an array substrate 1, a color film substrate 2, a high resistance film 3, a polarizer 4, and a silver paste 5. The color film substrate 2 is located on one side of the array substrate 1 and is aligned with the array substrate 1, and the non-display area 110 of the array substrate 1 is provided with a grounding trace 111. The high-resistance film 3 is positioned on one side of the color film substrate 2, which is far away from the array substrate 1, and the polarizer 4 is positioned on one side of the high-resistance film 3, which is far away from the array substrate 1 and covers the high-resistance film 3. The silver paste 5 extends from the polarizer 4 to the ground trace 111 on the array substrate 1 and is connected to the ground trace 111. The high-resistance film 3 and the polarizer 4 are stacked, and the silver paste 5 extends from the polarizer 4 to the array substrate 1 and is connected with the grounding wire 111 of the array substrate 1. After the static electricity generated on the glass cover plate 6 is transferred to the polarizer 4 and the high-resistance film 3 below the glass cover plate 6, the static electricity can be transferred to the grounding wire 111 on the array substrate 1 through the silver paste 5 connected with the polarizer 4, so that the static electricity is led out by the grounding wire 111. The electrostatic discharge capacity of the surface of the display panel is increased jointly by the lamination of the polaroid 4 and the high-resistance film 3, the antistatic performance of the display panel is improved, and the antistatic performance of the display device comprising the display panel is further improved.
The high-resistance film 3 has good light transmittance and antistatic effect. The material of the high-resistance film 3 may include a transparent metal oxide material such as ITO (Indium Tin Oxides) and IZO (Indium zinc Oxides).
In some embodiments, polarizer 4 has a resistance in the range of 10 < Lambda > 8 ohms to 10 < Lambda > 9 ohms. Specifically, the polarizer 4 may be a low-resistance polarizer with a low resistance value, so as to reduce the influence of the resistance of the polarizer 4 on the electrostatic discharge process in the display panel. The resistance range of the polarizer 4 may also be adjusted according to actual requirements, which is not specifically limited in this embodiment of the application. The shape and thickness of the polarizer 4 may be determined according to actual requirements, which is not specifically limited in the embodiment of the present application.
In some embodiments, the resistance of the high resistance film 3 ranges from 10 < SP > 8 </SP > ohm to 10 < SP > 9 </SP > ohm, and the thickness of the high resistance film 3 ranges from 175 + -25 </SP >. The resistance of the high-resistance film 3 is matched with the resistance of the polarizer 4, so that the influence of the resistance on the electrostatic discharge process in the display panel is reduced. The resistance range and the thickness range of the high-resistance film 3 may also be adjusted according to actual requirements, which is not specifically limited in the embodiment of the present application. The method for manufacturing the high-resistance film 3 may be: and plating a high-resistance film 3 on the surface of one side of the color film substrate 2 close to the polarizer 4.
In some embodiments, as shown in fig. 3, the high resistance film 3 is substantially rectangular, and the corner points of the high resistance film 3 away from the silver paste 5 have rounded chamfer structures 31.
In the embodiment of the present application, as shown in fig. 3, two corner points of the high resistance film 3, which are far away from the silver paste 5, may have circular chamfer structures 31, that is, two corner points of the high resistance film 3, which are far away from the silver paste 5, are circular arc-shaped. Based on this, the distance between the side of the high-resistance film 3 away from the silver paste 5 and the upper edge of the display panel is increased, and the risk of external static electricity being introduced from the high-resistance film 3 is reduced. The upper edge of the display panel is the edge of one side of the display device far away from an operator after the display panel is installed on the display device. The chamfer degree corresponding to the round chamfer structure 31 is not specifically limited in the embodiment of the present application.
In some embodiments, as shown in fig. 3, the high resistance film 3 has a U shape, and the arc side of the U shape of the high resistance film 3 is away from the silver paste 5.
In the embodiment of the present application, the chamfering degree corresponding to the round chamfering structure 31 can be adjusted, so that the high resistance film 3 is U-shaped, and the arc side of the U-shape of the high resistance film 3 is far away from the silver paste 5 and the flexible circuit board 7. For the side of the high-resistance film 3 far from the silver paste 5, since the side is far from both the silver paste 5 and the flexible circuit board 7, the discharge difficulty of static electricity introduced from the side position is increased compared to static electricity near the silver paste 5. Therefore, the side of the high resistance film 3 away from the silver paste 5 is set to be the arc of the U, and the arc side of the U is relatively distant from the edge of the glass cover plate 6, whereby the risk of static electricity being introduced from the side of the high resistance film 3 away from the silver paste 5 can be reduced. In contrast, since the side of the high-resistance film 3 close to the silver paste 5 has a strong electrostatic discharge capability, it is not necessary to adjust the edge position of the side of the high-resistance film 3.
In some embodiments, as shown in fig. 3, the silver paste 5 includes two point silver pastes 51, the two point silver pastes 51 are spaced apart, and both the point silver pastes 51 extend to the array substrate 1 from the same side of the polarizer 4.
In the embodiment of the present application, the silver paste 5 may include two point silver pastes 51 arranged at intervals, and the two point silver pastes 51 extend to the array substrate 1 from the same side of the polarizer 4, so that the volume of the silver paste 5 and the occupied area of the silver paste 5 are reduced, and the width of the lower frame of the display device including the display panel is reduced. As shown in fig. 3, the distance S between the two silver paste dots 51 can be adjusted according to actual situations, which is not specifically limited in the embodiment of the present application.
In some embodiments, the silver paste body 5 includes a line silver paste, and the line silver paste extends along the first direction, i.e., along the short side of the polarizer 4, so as to increase the conductivity of the silver paste body 5.
In some embodiments, as shown in fig. 1, the display panel further includes a flexible circuit board 7, the flexible circuit board 7 is bonded to the non-display area 110, the flexible circuit board 7 includes a ground area 71, and the ground trace 111 is connected to the ground area 71, so that the silver paste 5 is connected to the ground area 71.
In the embodiment of the present application, the grounding trace 111 may be connected to the grounding area 71 on the flexible circuit board 7, so that the static electricity of the display panel may be transmitted to the grounding area 71 of the flexible circuit board 7 after passing through the polarizer 4 and the high resistance film 3 to the silver paste 5 and then to the grounding trace 111, and then released from the grounding area 71, thereby further increasing the static electricity releasing capability of the display panel. The grounding area 71 of the flexible circuit board 7 may be a copper sheet disposed in a non-trace area on the flexible circuit board 7. In addition, the embodiment of the present application does not specifically limit the way in which the ground trace 111 on the array substrate 1 is connected to the ground region 71, and in one example, the ground trace 111 may be connected to the ground region 71 of the flexible circuit board 7 through a Driver IC (Driver chip).
In some embodiments, as shown in fig. 4, the non-display region 110 of the array substrate 1 includes a substrate 112, a metal wiring layer 113, and a first planarization layer 114. The metal wiring layer 113 is disposed on one side of the substrate 112, and the ground wiring 111 is disposed on the metal wiring layer 113. The first planarization layer 114 is located on a side of the metal routing layer 113 away from the substrate 112, the first planarization layer 114 covers the ground routing 111, a first via 1141 is formed on the first planarization layer 114, and the silver paste 5 is connected with the ground routing 111 on the metal routing layer 113 through the first via 1141.
In the embodiment of the present application, the first planarization layer 114 is located above the metal routing layer 113, and is used for planarizing a surface of the metal routing layer 113 on a side provided with the ground trace 111. The first planarization layer 114 is formed with a first via 1141 to expose the metal wiring layer 113 under the first planarization layer 114, so that the silver paste 5 is connected to the ground trace 111 on the metal wiring layer 113 through the first via 1141.
In some embodiments, a recess 1142 is formed on the first planarization layer 114, and an orthogonal projection of the recess 1142 on the metal wiring layer 113 is located on a side of the ground wiring 111 close to the display area 100.
In the embodiment of the present application, the groove 1142 is formed on a side surface of the first planarization layer 114 away from the metal routing layer 113, and the groove 1142 does not penetrate through the first planarization layer 114. Because the groove 1142 is disposed between the ground trace 111 and the display region 100, when the silver paste 5 flows toward the display region 100 of the array substrate 1, the silver paste 5 will flow into the groove 1142 between the ground trace 111 and the display region 100, so as to avoid the influence of the silver paste 5 on the display region 100 of the array substrate 1.
In some embodiments, the display area 100 of the array substrate 1 includes a substrate 112 and a pixel circuit located on one side of the substrate 112, and the pixel circuit includes a thin film transistor device and a capacitor device. The pixel circuit comprises a buffer layer 101, an active layer 102, a first insulating layer 103, a first metal layer 104, a second insulating layer 105, a second metal layer 106, an interlayer dielectric layer 107, a third metal layer 108 and a passivation layer 109 which are positioned on one side of a substrate 112 and distributed in sequence along a direction far away from the substrate 112. The pixel circuit may be a top gate type pixel circuit, and the pixel circuit may also be a bottom gate type pixel circuit. When the pixel circuit is a bottom gate type pixel circuit, the first metal layer 104 at least includes a gate 1041 of the thin film transistor device and a first electrode plate 1042 of the capacitor device, the second metal layer 106 at least includes a second electrode plate 1061 of the capacitor device, the third metal layer 108 at least includes a source 1081 and a drain 1082 of the thin film transistor device, and the source 1081 and the drain 1082 are connected to the active layer 102 through the second via. The metal wiring layer 113 may be fabricated on the same layer as the first metal layer 104, and the metal wiring layer 113 may also be fabricated on the same layer as the third metal layer 108, that is, the metal wiring layer 113 and the first metal layer 104 or the third metal layer 108 may be fabricated by the same mask patterning process. The first planarization layer 114 may be fabricated in the same layer as the passivation layer 109.
In some embodiments, as shown in fig. 5, the color filter substrate 2 includes a black matrix layer 21 and a color filter layer 22. The color film layer 22 includes a plurality of color blocks 221 arranged at intervals. The display area 100 of the array substrate 1 further includes a pixel defining layer 120, a light emitting layer 130 and an encapsulation layer 140 located on a side of the passivation layer 109 away from the substrate 112 and distributed in sequence along a direction away from the substrate 112. The light-emitting layer 130 includes a plurality of light-emitting units 1301 defined by the pixel defining layer 120, wherein each light-emitting unit 1301 corresponds to one color block 221. The light emitting layer 130 includes an anode layer 1302, an organic light emitting layer 1303 and a cathode layer 1304 on one side of the substrate 112 and sequentially distributed in a direction away from the substrate 112. The organic light emitting layer 1303 may be formed by evaporation, and the organic light emitting layer 1303 may include a hole transport layer and an electron transport layer stacked in layers. The encapsulation layer 140 is used for encapsulating the pixel circuit and the light emitting unit 1301 of the array substrate 1.
The embodiment of the application also provides a display device which comprises the display panel. The display device may be an electroluminescent display device or a photoluminescent display device. In the case where the display device is an electroluminescent display device, the electroluminescent display device may be an OLED (Organic Light-Emitting Diode) or a QLED (Quantum Dot Light-Emitting Diode). In the case where the display device is a photoluminescent display device, the photoluminescent display device may be a quantum dot photoluminescent display device. In the embodiment of the present disclosure, the display device includes, but is not limited to, a mobile phone, a tablet computer, a display, a television, a picture screen, an advertisement screen, electronic paper, and the like.
In the display device provided by the embodiment of the present disclosure, a display panel included in the display device includes an array substrate 1, a color film substrate 2, a high resistance film 3, a polarizer 4, and a silver paste 5. The color film substrate 2 is located on one side of the array substrate 1 and is aligned with the array substrate 1, and the non-display area 110 of the array substrate 1 is provided with a grounding trace 111. The high-resistance film 3 is positioned on one side of the color film substrate 2, which is far away from the array substrate 1, and the polarizer 4 is positioned on one side of the high-resistance film 3, which is far away from the array substrate 1 and covers the high-resistance film 3. The silver paste 5 extends from the polarizer 4 to the ground trace 111 on the array substrate 1 and is connected to the ground trace 111. The high-resistance film 3 and the polarizer 4 are stacked, and the silver paste 5 extends from the polarizer 4 to the array substrate 1 and is connected with the grounding wire 111 of the array substrate 1. After the static electricity generated on the glass cover plate 6 is transferred to the polarizer 4 and the high-resistance film 3 below the glass cover plate 6, the static electricity can be transferred to the grounding wire 111 on the array substrate 1 through the silver paste body 5 connected with the polarizer 4, so that the static electricity can be led out by the grounding wire 111. The electrostatic discharge capacity of the surface of the display panel is increased jointly by the lamination of the polaroid 4 and the high-resistance film 3, the antistatic performance of the display panel is improved, and the antistatic performance of the display device comprising the display panel is further improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The above description is only for the preferred embodiment of the present application and is not intended to limit the scope of the present application. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims (9)

1. A display panel comprises an array substrate and a color film substrate which is in box alignment with the array substrate, wherein the array substrate comprises a display area and a non-display area surrounding the display area, the non-display area is provided with a grounding wire, and the display panel is characterized by comprising:
the high-resistance film is positioned on one side, far away from the array substrate, of the color film substrate, the high-resistance film is U-shaped, and the arc side of the U-shaped high-resistance film is far away from the silver paste;
the polaroid is positioned on one side of the high-resistance film, which is far away from the color film substrate;
the silver paste extends from the polaroid to the array substrate, and is connected with the grounding wire.
2. The display panel according to claim 1, wherein the silver paste comprises two point silver pastes which are arranged at intervals, and both the point silver pastes extend to the array substrate from the same side of the polarizer.
3. The display panel of claim 1, wherein the display panel further comprises a flexible circuit board bonded to the non-display area, the flexible circuit board comprising a ground area, and wherein the ground trace is connected to the ground area to connect the silver paste to the ground area.
4. The display panel of claim 1, wherein the polarizer has a resistance in a range of 10^8 ohms to 10^9 ohms.
5. The display panel according to claim 1, wherein the non-display region of the array substrate comprises:
a substrate;
the metal wiring layer is positioned on one side of the substrate, and the grounding wiring is arranged on the metal wiring layer;
the first planarization layer is located on one side, far away from the substrate, of the metal routing layer, the first planarization layer covers the grounding routing, a through hole is formed in the first planarization layer, and the silver paste is connected with the grounding routing on the metal routing layer through the through hole.
6. The display panel according to claim 5, wherein a groove is formed on the first planarization layer, and an orthogonal projection of the groove on the metal routing layer is located on a side of the ground trace close to the display area.
7. The display panel of claim 5, wherein the display area of the array substrate comprises a substrate, and an active layer, a first insulating layer, a first metal layer, a second insulating layer, a second metal layer, an interlayer dielectric layer, a third metal layer and a passivation layer which are located on one side of the substrate and sequentially distributed along a direction away from the substrate, wherein the metal routing layer and the first metal layer or the third metal layer are fabricated in the same layer, and the first planarization layer and the passivation layer are fabricated in the same layer.
8. The display panel according to claim 1, wherein the high-resistance film has a resistance ranging from 10^8 ohms to 10^9 ohms.
9. A display device characterized in that it comprises a display panel according to any one of claims 1 to 8.
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