CN113543481B - 3D circuit board manufacturing method - Google Patents
3D circuit board manufacturing method Download PDFInfo
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- CN113543481B CN113543481B CN202110623557.0A CN202110623557A CN113543481B CN 113543481 B CN113543481 B CN 113543481B CN 202110623557 A CN202110623557 A CN 202110623557A CN 113543481 B CN113543481 B CN 113543481B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a 3D (three-dimensional) circuit board, which comprises the following steps of obtaining a plastic support; laser etching a circuit pattern on the plastic support; sequentially plating a copper layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit on the plastic support, wherein the three-dimensional circuit is provided with a bonding pad; and laser etching the three-dimensional circuit to strip part of the gold layer close to the bonding pad to expose part of the nickel layer, so as to obtain the 3D three-dimensional circuit board. The 3D three-dimensional circuit board manufactured by the manufacturing method of the 3D three-dimensional circuit board effectively avoids the phenomenon of tin climbing when the electronic components are mounted to influence the appearance of the product, prevents the three-dimensional circuit from short circuit, improves the mounting quality of the electronic components on the 3D three-dimensional circuit board, and meanwhile, the 3D three-dimensional circuit board has good contact performance and oxidation resistance.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a 3D (three-dimensional) circuit board manufacturing method.
Background
In order to conduct electronic components located at different spatial positions in an electronic product, a 3D (three-dimensional) circuit board with a three-dimensional circuit structure appears in the market, and the electronic components located at different spatial positions can be conveniently communicated by mounting the electronic components to the corresponding positions of the three-dimensional circuit board or communicating the electronic components with the corresponding terminals of the three-dimensional circuit.
As shown in fig. 1, in order to improve the conductivity and prevent the oxidation of the three-dimensional circuit board 2, a gold layer is usually plated on the surface of the three-dimensional circuit board 2 to ensure that the 3D three-dimensional circuit board has good contact performance. When the electronic component 8 is mounted on the 3D three-dimensional circuit board through the SMT device, since the molten solder paste has good fluidity on the surface of the gold layer, the molten solder paste flows along the three-dimensional circuit 2 and overflows to cause a solder-climbing phenomenon, which affects the appearance of the product, and if the distance between two adjacent circuits of the three-dimensional circuit 2 is small, the circuits that should not be conducted are communicated to cause a short circuit.
Referring to fig. 2 and fig. 3, in order to avoid the tin-climbing phenomenon generated in the mounting process of the electronic component 8, the following two schemes are generally adopted in the prior art: the first method is that ink is sprayed on the three-dimensional circuit 2 of the 3D three-dimensional circuit board to cover a partial area of the three-dimensional circuit 2 to form an ink area 6 so as to block the flowing of solder paste, and the method has high cost and low efficiency due to the three-dimensional structure of the 3D three-dimensional circuit board, the spraying process error is usually +/-0.2 mm, and the deviation is easily generated when the ink area 6 is sprayed on the three-dimensional circuit 2 with the line width or line distance of 0.15mm or less; the second is that attached wheat pulling-on piece 7 forms to shield the region and blocks the solder paste and flow on the three-dimensional circuit 2 of 3D three-dimensional circuit board, and skew appears easily in the position of this kind of scheme operational difficulty and attached in-process wheat pulling-on piece 7 to make the double faced adhesive tape of wheat pulling-on piece 7 attached on 3D three-dimensional circuit board not high temperature resistant usually, heat the solder paste and make its melting probably can make the double faced adhesive tape lose efficacy simultaneously and lead to wheat pulling-on piece 7 to drop at electronic components 8 subsides dress in-process, and the reliability is relatively poor.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the 3D three-dimensional circuit board manufacturing method can effectively avoid tin climbing when devices are pasted on the 3D three-dimensional circuit board.
In order to solve the technical problems, the invention adopts the technical scheme that: A3D circuit board manufacturing method comprises the following steps of obtaining a plastic support; laser etching a circuit pattern on the plastic support; sequentially plating a copper layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit on the plastic support, wherein the three-dimensional circuit is provided with a bonding pad; and laser etching the three-dimensional circuit to strip part of the gold layer close to the bonding pad to expose part of the nickel layer, so as to obtain the 3D three-dimensional circuit board.
The invention has the beneficial effects that: the manufacturing method of the 3D three-dimensional circuit board provided by the invention has the advantages that part of the gold layer of the three-dimensional circuit formed on the plastic support is stripped to expose the nickel layer in the three-dimensional circuit, the stripped gold layer is close to the bonding pad of the three-dimensional circuit, the molten tin paste has lower liquidity on the nickel layer than on the gold layer, so that the molten tin paste is slowed down to flow along the three-dimensional circuit in the process of mounting the electronic component on the 3D three-dimensional circuit board, and the space formed by stripping the gold layer contains part of the tin paste, the phenomenon of tin climbing is avoided to influence the appearance of the product, meanwhile, the three-dimensional circuit is prevented from short circuit, the mounting quality of the electronic component on the 3D three-dimensional circuit board is ensured, and the surface of the exposed part of the three-dimensional circuit and the surface of the bonding pad are still covered with the gold layer, so that the 3D three-dimensional circuit board has good contact performance and oxidation resistance.
Drawings
Fig. 1 is a schematic structural diagram of a 3D three-dimensional circuit board in the prior art;
FIG. 2 is a schematic diagram of a prior art scheme for preventing a tin-climbing phenomenon from occurring on a 3D circuit board;
fig. 3 is a schematic diagram of another scheme for preventing a tin-climbing phenomenon from occurring on a 3D three-dimensional circuit board in the prior art;
fig. 4 is a step diagram of a method for manufacturing a 3D circuit board according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of a 3D stereoscopic circuit board provided by the present invention.
Description of reference numerals:
1. a plastic bracket; 2. a three-dimensional line; 3. a pad; 4. windowing; 5. a planar portion; 6. an ink area; 7. mylar; 8. an electronic component.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 4 and 5, a method for manufacturing a 3D three-dimensional circuit board includes the following steps of obtaining a plastic support 1; laser etching a circuit pattern on the plastic support 1; sequentially plating a copper layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit 2 on the plastic support 1, wherein the three-dimensional circuit 2 is provided with a bonding pad 3; and laser etching the three-dimensional circuit 2 to strip part of the gold layer close to the bonding pad 3 to expose part of the nickel layer, so as to obtain the 3D three-dimensional circuit board.
The working principle of the invention is briefly described as follows: the method for manufacturing the 3D three-dimensional circuit board comprises the steps of firstly obtaining a plastic support 1, laser-engraving a circuit pattern on the plastic support 1, then sequentially plating a copper layer, a nickel layer and a gold layer in the circuit pattern to form the three-dimensional circuit 2 on the plastic support 1, removing part of the gold layer of the three-dimensional circuit 2 through laser engraving to expose part of the nickel layer, enabling the removed part of the gold layer to be close to a bonding pad 3 in the three-dimensional circuit 2, and greatly slowing down the flow of molten tin paste from a bonding pad 3 to the nickel layer when the molten tin paste flows along the three-dimensional circuit 2 in the process that an electronic component 8 is attached to the three-dimensional circuit 2 because the fluidity of the molten tin paste on the nickel layer is lower than that of the molten tin paste on the gold layer, accommodating part of the tin paste in a space formed by removing part of the gold layer, effectively avoiding the phenomenon of tin climbing caused by the flow or overflow of the tin paste, and preventing the three-dimensional circuit 2 from short circuit, and the exposed part of the three-dimensional circuit 2 and the bonding pad 3 are both provided with gold layers, so that the electronic component 8 is stably contacted with the 3D three-dimensional circuit board, and the three-dimensional circuit 2 is prevented from being oxidized.
From the above description, the beneficial effects of the present invention are: the 3D three-dimensional circuit board manufactured by the manufacturing method of the 3D three-dimensional circuit board effectively avoids the phenomenon of tin climbing when the electronic component 8 is pasted to affect the appearance of the product, prevents the three-dimensional circuit 2 from short circuit, improves the pasting quality of the electronic component 8 on the 3D three-dimensional circuit board, and meanwhile, the 3D three-dimensional circuit board has good contact performance and oxidation resistance.
Further, the method also comprises the following step of cleaning the circuit pattern after laser etching the circuit pattern on the plastic support 1.
From the above description, it can be known that the line pattern formed after laser etching the line pattern on the plastic support 1 is cleaned to remove the residue on the plastic support 1, so as to ensure the stable connection between the chemical plating metal layer and the plastic support 1.
Further, in the process of laser etching the three-dimensional line 2, the power of a laser etching machine for performing laser etching treatment on the three-dimensional line 2 is 6W, the frequency of laser generated by the laser etching machine is 40kHz, and the speed of the laser generated by the laser etching machine is 2500 mm/s.
As can be seen from the above description, the parameters of the laser etching machine are set according to actual production conditions so as to effectively strip part of the gold layer on the surface of the three-dimensional circuit 2 and improve the production efficiency.
Further, the thickness of the gold layer is more than 0.5 μm.
Further, the thickness of the copper layer is 5-20 μm.
Further, the thickness of the nickel layer is 2-6 μm.
As can be seen from the above description, the thicknesses of the copper layer, the nickel layer and the gold layer formed on the plastic bracket 1 by electroless plating are set according to actual use requirements, so that the three-dimensional circuit 2 is stably conducted.
Furthermore, the plastic support 1 further has a plane portion 5, the pad 3 is located on the plane portion 5, and a partial area of the gold layer to be peeled off is located on the plane portion 5.
As can be seen from the above description, the planar portion 5 is disposed on the plastic support 1 for attaching the electronic component 8, so that the electronic component 8 and the 3D three-dimensional circuit board are stably connected.
Further, the step of cleaning the 3D three-dimensional circuit board after the three-dimensional circuit 2 is laser-etched is also included.
Further, the step of cleaning the 3D three-dimensional circuit board includes the steps of brushing solder paste on the bonding pad 3 and mounting an electronic component 8.
As can be seen from the above description, the 3D three-dimensional circuit board is cleaned after the three-dimensional circuit 2 is subjected to laser etching to remove part of the gold layer, so as to remove the residual impurities on the surface of the 3D three-dimensional circuit board, and avoid the influence on the mounting quality of the electronic component 8 and the 3D three-dimensional circuit board.
Example one
Referring to fig. 4 and 5, a first embodiment of the present invention is: a manufacturing method of a 3D circuit board is used for manufacturing the 3D circuit board.
The manufacturing method of the 3D circuit board specifically comprises the following steps,
and S1, obtaining the plastic bracket 1.
In step S1, an injection molding machine is used to injection mold the plastic support 1 from thermoplastic plastics, and metal particles are added into the plastic as seeds, and after the plastic support 1 with a preset shape is obtained, a laser is used to perform an activation treatment on the surface of the plastic support 1, so that the seeds are activated to form metal cores, and a rough conductor layer is formed on the surface of the plastic support 1.
And S2, laser etching a circuit pattern on the plastic support 1.
In step S2, the unnecessary portion of the conductive layer on the surface of the plastic frame 1 is removed by laser, so that the conductive layer remained on the surface of the plastic frame 1 forms the circuit pattern.
Step S21 of cleaning the circuit pattern is further included after step S2. After the circuit pattern is formed on the plastic support 1 through laser etching, the circuit pattern is cleaned to remove residues remained on the plastic support 1, so that a metal layer plated on the circuit pattern in the subsequent step is tightly combined with the circuit pattern. Specifically, in step S21, the plastic bracket 1 may be washed with water, or the plastic bracket 1 may be cleaned with an acidic or alkaline solution.
S3, sequentially plating a copper plating layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit 2 on the plastic support 1, wherein the three-dimensional circuit 2 is provided with a bonding pad 3.
In step S3, the plastic support 1 subjected to laser etching is subjected to chemical plating, and a copper layer, a nickel layer and a gold layer are sequentially subjected to chemical plating on the circuit pattern, wherein the activated surface of the circuit pattern is rough, so that the copper layer can be stably attached to the circuit pattern, the nickel layer and the gold layer are sequentially formed on the copper layer to obtain the three-dimensional circuit 2, so as to ensure that the three-dimensional circuit 2 is stably conducted, and the three-dimensional circuit 2 has good contact performance and oxidation resistance through the gold layer attached to the outermost layer of the three-dimensional circuit 2. And the three-dimensional circuit 2 formed by plating the circuit pattern is provided with the bonding pad 3 for connecting the electronic component 8, so that the electronic component 8 can be conveniently attached to the 3D three-dimensional circuit board.
Optionally, the thickness of the copper layer is 5 to 20 μm, the thickness of the nickel layer is 2 to 6 μm, and the thickness of the gold layer is greater than 0.05 μm. The thicknesses of the copper layer and the nickel layer can be selected according to actual use conditions so as to ensure that the three-dimensional circuit 2 has certain structural strength.
And S4, radium-carving the three-dimensional circuit 2 to strip part of the gold layer close to the bonding pad 3 to expose part of the nickel layer, and obtaining the 3D three-dimensional circuit board.
Step S31 is further included before step S4, a plurality of plastic supports 1 with the three-dimensional lines 2 formed in the same batch are selected, trial cutting is performed on the three-dimensional lines 2 on the plurality of plastic supports 1, and the thickness range of the gold layer in the three-dimensional lines 2 is measured.
In step S4, the outermost gold layer of the three-dimensional circuit 2 is peeled off by a laser engraving machine to expose the nickel layer in the three-dimensional circuit 2, the operation is simple, the feasibility is good, and the peeled gold layer is disposed close to the pad 3, so that the flow of the solder paste along the three-dimensional circuit 2 in the subsequent mounting process of the electronic component 8 is slowed down by using the characteristic that the fluidity of the molten solder paste on the nickel layer is far inferior to that on the gold layer, and the space formed by peeling off part of the gold layer accommodates part of the solder paste to prevent the solder paste from overflowing, thereby avoiding the phenomenon of tin climbing. Specifically, the power setting of the laser etching machine in the step S4 can be adjusted according to the thickness range of the gold layer measured in the step S31, so as to prevent the nickel layer in the gold layer from being damaged due to too high power setting of the laser etching machine, or prevent the gold layer from being completely peeled due to too low power setting of the laser etching machine, so as to ensure that part of the gold layer on the surface of the three-dimensional circuit 2 is completely peeled at one time, ensure the quality of the 3D three-dimensional circuit board, and improve the production efficiency.
Optionally, in step S4, the power of the laser engraving machine may be set to 6W, the frequency of the laser generated by the laser engraving machine is 40kHz, and the speed of the laser generated by the laser engraving machine is 2500mm/S, so as to effectively peel off the gold layer on the surface of the three-dimensional circuit 2 to expose the nickel layer, so that the processing efficiency is high and the processing precision is high, thereby ensuring the obtained 3D three-dimensional circuit board has reliable quality.
The step S41 of cleaning the 3D three-dimensional circuit board is also included after the step S4. The 3D three-dimensional circuit board is cleaned after the 3D three-dimensional circuit board is obtained so as to remove impurities remained on the surface of the 3D three-dimensional circuit board, and the condition that the attachment is unstable due to the influence of the impurities when an electronic component 8 is attached to the 3D three-dimensional circuit board is avoided.
Step S42 is further included after step S41, in which solder paste is applied to the pads 3 and the electronic component 8 is mounted. The step can be completed by automatic equipment such as a solder paste printer and a chip mounter so as to attach the electronic component 8 to the 3D three-dimensional circuit board.
In step S41, the used solder paste is the existing solder paste, for example, HX-670 series solder paste produced by shenzhen china Hua Xiang electronics ltd, and the connection between the electronic component 8 and the 3D three-dimensional circuit board can be achieved.
Example two
Referring to fig. 5, a second embodiment of the invention is: A3D circuit board is manufactured by the method for manufacturing the 3D circuit board.
As shown in fig. 5, 3D three-dimensional circuit board includes plastic support 1, three-dimensional circuit 2 has on the plastic support 1, just three-dimensional circuit 2 has pad 3 that electronic components 8 are connected, three-dimensional circuit 2 specifically includes first circuit layer and the second circuit layer of range upon range of setting, first circuit layer covers on the second line layer just first circuit layer expose in outside of the layer in plastic support 1, molten state tin cream is in mobility on the first circuit layer is superior to it and is in mobility on the second circuit layer, just be equipped with windowing 4 on the first circuit layer, windowing 4 is close to pad 3 sets up just windowing 4 supplies the part the second circuit layer exposes, three-dimensional circuit 2 passes through the second circuit layer switches on.
Specifically, when the solder paste is brushed on the bonding pad 3 and heated to be melted, the molten solder paste flows along the first circuit layer and enters the area surrounded by the windowing 4, the flow of the solder paste is greatly slowed down because the fluidity of the solder paste on the second circuit layer is far inferior to that of the solder paste on the first circuit layer, and meanwhile, the windowing 4 is used for accommodating partial solder paste to prevent the solder paste from overflowing the three-dimensional circuit 2, so that the phenomenon of tin climbing is avoided to cause poor product appearance or two adjacent circuits of the three-dimensional circuit 2 are conducted by the solder paste to cause short circuit.
Optionally, the first circuit layer is made of metal gold, and the second circuit layer is made of metal nickel. The first circuit layer is arranged to be a metal gold layer and covers the second circuit layer, so that the contact performance of the three-dimensional circuit 2 and the electronic component 8 can be improved, the three-dimensional circuit 2 is prevented from being oxidized, and the performance and the service life of the 3D three-dimensional circuit board are improved. The thickness of the first circuit layer is larger than 0.5 mu m, so that the windowing 4 is formed on the first circuit layer, and the windowing 4 can be formed by stripping part of the first circuit layer by using a laser etching machine.
The three-dimensional circuit 2 further comprises a third circuit layer, the second circuit layer covers the third circuit layer, and the third circuit layer is preferably made of metal copper, so that the conductivity of the three-dimensional circuit 2 is improved. And the thickness of the third circuit layer is 5-20 μm, and the thickness of the second circuit layer is 2-6 μm, so that the three-dimensional circuit 2 has certain structural strength.
Please refer to fig. 5, in order to facilitate the mounting of the electronic component 8 onto the 3D three-dimensional circuit board, the plastic support 1 is provided with a plane portion 5 for placing the electronic component 8, the pad 3 is located on the plane portion 5 and partially the window 4 is located in an area surrounded by the plane portion 5, so that the structure of the 3D three-dimensional circuit board is adapted to the automatic equipment such as a solder paste printer and a chip mounter, and then the electronic component 8 is mounted onto the 3D three-dimensional circuit board through the automatic equipment, so that the 3D three-dimensional circuit board is convenient to use.
In conclusion, the manufacturing method of the 3D three-dimensional circuit board provided by the invention is simple to operate, the part of the gold layer on the surface of the three-dimensional circuit is removed to expose the part of the nickel layer in the three-dimensional circuit, so that the flowing of the solder paste along the three-dimensional circuit is slowed down by utilizing the characteristic that the flowing property of the molten solder paste on the surface of the nickel layer is poor, the solder paste is prevented from overflowing by accommodating part of the solder paste in the space formed by stripping part of the gold layer, the phenomenon of tin climbing is further prevented, and the obtained 3D three-dimensional circuit board has no flaw in appearance and is reliable in work; the manufacturing method of the 3D three-dimensional circuit board peels off part of the gold layer through the laser etching machine, the operation is simple, the feasibility is strong, and the machining precision of the laser etching machine is high, so that the obtained 3D three-dimensional circuit board is good in quality reliability, the machining efficiency of the laser etching machine is high, and the production efficiency of the 3D three-dimensional circuit board is favorably improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (9)
1. A3D circuit board manufacturing method is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
obtaining a plastic support;
laser etching a circuit pattern on the plastic support;
sequentially plating a copper layer, a nickel layer and a gold layer on the circuit pattern to form a three-dimensional circuit on the plastic support, wherein the three-dimensional circuit is provided with a bonding pad;
and laser etching the three-dimensional circuit to strip part of the gold layer close to the bonding pad to expose part of the nickel layer, so as to obtain the 3D three-dimensional circuit board.
2. The manufacturing method of the 3D circuit board according to claim 1, wherein the manufacturing method comprises the following steps: the method also comprises the following steps of cleaning the circuit pattern after the circuit pattern is laser-etched on the plastic support.
3. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: in the process of laser etching the three-dimensional circuit, the power of a laser etching machine for performing laser etching treatment on the three-dimensional circuit is 6W, the frequency of laser generated by the laser etching machine is 40kHz, and the speed of the laser generated by the laser etching machine is 2500 mm/s.
4. The manufacturing method of the 3D circuit board according to claim 1, wherein the manufacturing method comprises the following steps: the thickness of the gold layer is greater than 0.5 μm.
5. The manufacturing method of the 3D circuit board according to claim 1, wherein the manufacturing method comprises the following steps: the thickness of the copper layer is 5-20 μm.
6. The manufacturing method of the 3D circuit board according to claim 1, wherein the manufacturing method comprises the following steps: the thickness of the nickel layer is 2-6 μm.
7. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: the plastic support still has plane portion, the pad is located on the plane portion, and the subregion of the gold layer of just being peeled off is located on the plane portion.
8. The method for manufacturing the 3D circuit board according to claim 1, wherein the method comprises the following steps: the method further comprises the following step of cleaning the 3D three-dimensional circuit board after the three-dimensional circuit is laser-etched.
9. The method for manufacturing the 3D circuit board according to claim 8, wherein the method comprises the following steps: and cleaning the 3D circuit board, namely brushing tin paste on the bonding pad and mounting an electronic component.
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| CN202110623557.0A CN113543481B (en) | 2021-06-04 | 2021-06-04 | 3D circuit board manufacturing method |
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| JPS59107769A (en) * | 1982-12-10 | 1984-06-22 | Fujitsu Ltd | Formation of area for preventing solder flow |
| US5957736A (en) * | 1997-11-19 | 1999-09-28 | Ddk Ltd. | Electronic part |
| CN204362411U (en) * | 2014-11-20 | 2015-05-27 | 启碁科技股份有限公司 | There is the metal pattern structure of alignment layers |
| CN107633967B (en) * | 2017-10-13 | 2021-01-08 | 维沃移动通信有限公司 | Key switch support, preparation method, key and electronic equipment |
| CN111805091A (en) * | 2020-06-09 | 2020-10-23 | 深圳市信维通信股份有限公司 | LAP laser etching process |
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