CN113829532A - Transmission device is used in silicon chip production with lead positive mechanism - Google Patents
Transmission device is used in silicon chip production with lead positive mechanism Download PDFInfo
- Publication number
- CN113829532A CN113829532A CN202010591071.9A CN202010591071A CN113829532A CN 113829532 A CN113829532 A CN 113829532A CN 202010591071 A CN202010591071 A CN 202010591071A CN 113829532 A CN113829532 A CN 113829532A
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- China
- Prior art keywords
- silicon wafer
- sets
- groups
- conveying device
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 41
- 239000010703 silicon Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000005540 biological transmission Effects 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 title claims abstract description 14
- 239000000428 dust Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 8
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 8
- 241001330002 Bambuseae Species 0.000 claims description 8
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 8
- 239000011425 bamboo Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 21
- 230000033001 locomotion Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a transmission device with a guide mechanism for silicon wafer production, which belongs to the technical field of silicon wafer production equipment and comprises a workbench, wherein universal wheels are arranged at the bottom of the workbench, stand columns are arranged at four corners of the top of the workbench, top plates are connected to the tops of the four groups of stand columns, a dust removal device and a guide device are respectively arranged on the top plates, two groups of motor bases are transversely arranged in an inner cavity of the workbench, motors are arranged in inner cavities of the two groups of motor bases, motor shafts are connected to the front end surfaces of the two groups of motors, the front ends of the two groups of motor shafts penetrate through the front end surface of the workbench, rotating wheels are sleeved on the peripheries of the two groups of motor shafts, belts are sleeved on the peripheries of the two groups of rotating wheels, and the transmission device can guide and transmit a silicon wafer to the transmission device so as to avoid the silicon wafer from being skewed and affecting the processing effect of the silicon wafer.
Description
Technical Field
The invention relates to the technical field of silicon wafer production equipment, in particular to a transmission device with a guide mechanism for silicon wafer production.
Background
Silicon wafers are important materials for manufacturing integrated circuits, and various semiconductor devices can be manufactured by means of photolithography, ion implantation and the like.
The processing of silicon wafers comprises the steps of firstly squaring a silicon single crystal rod and then slicing the silicon single crystal rod, most of the existing silicon wafer transmission devices do not conduct straightening treatment on the silicon wafers before the silicon wafers are guided into the transmission devices, so that the silicon wafers are prone to being inclined in the transmission process, and the slicing processing effect of the silicon wafers is influenced.
Disclosure of Invention
The invention aims to provide a conveying device with a guide mechanism for silicon wafer production, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a silicon chip production is with transmission device with lead mechanism, comprises a workbench, the workstation bottom is provided with the universal wheel, workstation top four corners department all is provided with stand, four groups the stand top all is connected with the roof, the roof is provided with dust collector respectively and leads the device, the workstation inner chamber transversely is provided with two sets of motor cabinet, and is two sets of the motor cabinet inner chamber all is provided with the motor, and is two sets of the terminal surface all is connected with the motor shaft before the motor, and is two sets of the terminal surface before the workstation is all run through to the motor shaft front end, and is two sets of the motor shaft periphery all cup joints and is provided with the runner, and is two sets of the runner periphery all cup joints and is provided with the belt.
Preferably, dust collector includes electric telescopic handle, electric telescopic handle pass through bolt one and roof bottom swing joint, the electric telescopic handle bottom is provided with the dust removal section of thick bamboo, the dust removal section of thick bamboo inner chamber is provided with the fan of breathing in, the dust removal section of thick bamboo right side is connected with the air duct, the roof top is provided with the water tank, the water tank right side is provided with solid fixed ring, dust removal section of thick bamboo one end is kept away from to the air duct and is passed solid fixed ring and extend to water tank inner chamber bottom.
Preferably, the guide device comprises an outer barrel, an inner barrel is movably inserted into an inner cavity of the outer barrel, an outer connecting ring is arranged on the periphery of the outer barrel, the inner cavity of the outer barrel extends from the top end and the bottom end of the inner barrel, a bottom pressing plate is arranged at the bottom of the inner barrel, a return spring is sleeved on the periphery of the inner barrel, two ends of the return spring are respectively welded with the outer connecting ring and the bottom pressing plate, and a pressing plate is arranged at the top of the inner barrel.
Preferably, a guide groove matched with the outer cylinder is transversely formed in the right side of the top plate, and the outer cylinder is movably inserted into an inner cavity of the guide groove matched with the outer cylinder.
Preferably, the front end face and the rear end face of the outer barrel are respectively provided with a side sliding block, the front end face and the rear end face of the inner cavity of the guide groove are respectively transversely provided with a sliding groove matched with the side sliding blocks, and the two groups of side sliding blocks are respectively movably arranged in the inner cavities of the matched sliding grooves.
Preferably, the bottom of the bottom pressing plate is provided with an anti-skid cushion layer in an adhesive manner.
Compared with the prior art, the invention has the beneficial effects that: a transmission device with a guide mechanism for silicon wafer production drives an air suction fan to move downwards through an electric telescopic rod to realize dust removal treatment on the surface of a silicon wafer, and dust is guided into an inner cavity of a water tank through an air guide pipe to be washed and dedusted;
when a silicon wafer is required to be guided onto a belt, the inner cylinder is pressed to drive the bottom pressing plate to push downwards, then the silicon wafer is clamped by the bottom pressing plate, the outer cylinder is driven by the inner cylinder to move leftwards in the inner cavity of the guide groove, when the inner cylinder moves to the belt, the hand is loosened, the inner cylinder quickly drives the bottom pressing plate to move upwards under the action of the reset spring, so that the bottom pressing plate is separated from the silicon wafer, and the motion track is limited and guided by the guide groove, so that the guide effect is realized;
the terminal surface all sets up the spout that matches with the side slider around leading positive inslot chamber to conveniently make the urceolus pass through the side slider and conveniently leading positive inslot chamber lateral shifting, on the other hand carries out spacing processing through spout offside slider motion, thereby the guarantee urceolus is leading positive inslot chamber lateral shifting to not taking place the incline, thereby makes to lead the positive effect not influenced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the structure of the present invention.
In the figure: 1. a work table; 2. a universal wheel; 3. a motor base; 4. a motor; 5. a motor shaft; 6. a rotating wheel; 7. a belt; 8. a column; 9. a top plate; 10. a dust removal device; 11. an electric telescopic rod; 12. a dust removal cylinder; 13. an air suction fan; 14. a water tank; 15. a fixing ring; 16. an air duct; 17. a pilot device; 18. an outer cylinder; 19. a side slider; 20. an inner barrel; 21. an outer connecting ring; 22. a return spring; 23. a bottom platen; 24. an anti-slip cushion layer; 25. a guide groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a transmission device is used in silicon chip production with lead positive mechanism, including workstation 1, 1 bottom of workstation is provided with universal wheel 2, 1 top four corners department of workstation all is provided with stand 8, 8 tops of four group's stands all are connected with roof 9, roof 9 is provided with dust collector 10 respectively and leads positive device 17, 1 inner chamber of workstation transversely is provided with two sets of motor cabinet 3, 3 inner chambers of two sets of motor cabinets all are provided with motor 4, the terminal surface all is connected with motor shaft 5 before two sets of motor 4, two sets of motor shaft 5 turn to the same, 5 front ends of two sets of motor shafts all run through 1 preceding terminal surface of workstation, 5 peripheries of two sets of motor shafts all cup joint and are provided with runner 6, 6 peripheries of two sets of runner all cup joint and are provided with belt 7.
Please refer to fig. 1, the dust removing device 10 includes an electric telescopic rod 11, the electric telescopic rod 11 is movably connected with the bottom of the top plate 9 through a first bolt, a dust removing cylinder 12 is arranged at the bottom of the electric telescopic rod 11, an inner cavity of the dust removing cylinder 12 is provided with an air suction fan 13, the right side of the dust removing cylinder 12 is connected with an air duct 16, a water tank 14 is arranged at the top of the top plate 9, a fixing ring 15 is arranged at the right side of the water tank 14, one end of the air duct 16, far away from the dust removing cylinder 12, penetrates through the fixing ring 15 and extends to the bottom of the inner cavity of the water tank 14, the transmission device drives the air suction fan 13 to move downwards through the electric telescopic rod 11 to remove dust on the surface of a silicon wafer, and dust is guided into the inner cavity of the water tank 14 through the air duct 16 to be washed with air and removed dust.
Referring to fig. 1, the guiding device 17 includes an outer cylinder 18, an inner cylinder 20 movably inserted into an inner cavity of the outer cylinder 18, an outer connecting ring 21 disposed on an outer periphery of the outer cylinder 18, a bottom pressing plate 23 disposed at a bottom of the inner cylinder 20, a return spring 22 sleeved on an outer periphery of the inner cylinder 20, two ends of the return spring 22 respectively welded to the outer connecting ring 21 and the bottom pressing plate 23, and a pressing plate disposed on a top of the inner cylinder 20.
Referring to fig. 1 and 2, a guiding groove 25 matched with the outer cylinder 18 is transversely arranged on the right side of the top plate 9, the outer cylinder 18 is movably inserted into an inner cavity of the matched guiding groove 25, when a silicon wafer is required to be guided onto the belt 7, the inner cylinder 20 is pressed to drive the bottom pressing plate 23 to be pushed downwards, then the silicon wafer is clamped by the bottom pressing plate 23, the outer cylinder 18 is driven by the inner cylinder 20 to move leftwards in the inner cavity of the guiding groove 25, when the inner cylinder 20 moves to the belt 7, the hand is released, due to the action of the return spring 22, the inner cylinder 20 rapidly drives the bottom pressing plate 23 to move upwards, so that the bottom pressing plate 23 is separated from the silicon wafer, and the motion track of the silicon wafer is limited and guided by the guiding groove 25, so that the guiding effect is realized.
Referring to fig. 1 and 2, the front and rear end faces of the outer cylinder 18 are respectively provided with a side slider 19, the front and rear end faces of the inner cavity of the guide groove 25 are respectively transversely provided with a sliding groove matched with the side slider 19, and the two groups of side sliders 19 are respectively movably arranged in the inner cavities of the matched sliding grooves, and the front and rear end faces of the inner cavity of the guide groove 25 are respectively provided with a sliding groove matched with the side slider 19, so that the outer cylinder 18 can conveniently move transversely in the inner cavity of the guide groove 25 through the side sliders 19, and on the other hand, the movement of the side sliders 19 is limited through the sliding grooves, so that the outer cylinder 18 is ensured to move transversely in the inner cavity of the guide groove 25 until no deflection occurs, and the guide effect is not affected.
Referring to fig. 1, an anti-slip pad layer 24 is adhered to the bottom of the bottom pressing plate 23.
The working principle is as follows:
the transmission device drives the air suction fan 13 to move downwards through the electric telescopic rod 11 to realize dust removal treatment on the surface of the silicon wafer, and dust is guided into an inner cavity of the water tank 14 through the air guide pipe 16 to be washed and dedusted;
when the silicon chip is required to be guided into the belt 7, the inner cylinder 20 is pressed, the inner cylinder 20 drives the bottom pressing plate 23 to be pushed downwards, the silicon chip is clamped by the bottom pressing plate 23, the outer cylinder 18 is driven by the inner cylinder 20 to move leftwards in the guide groove 25, when the inner cylinder 20 moves to the belt 7, the hand is loosened, the inner cylinder 20 quickly drives the bottom pressing plate 23 to move upwards due to the action of the reset spring 22, the bottom pressing plate 23 is separated from the silicon chip, the 28 movement track is limited and guided through the guide groove 25, and therefore the guide effect is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a transmission device is used in silicon chip production with lead positive mechanism, includes workstation (1), its characterized in that: workstation (1) bottom is provided with universal wheel (2), workstation (1) top four corners department all is provided with stand (8), four groups stand (8) top all is connected with roof (9), roof (9) are provided with dust collector (10) respectively and lead positive device (17), workstation (1) inner chamber transversely is provided with two sets of motor cabinet (3), and is two sets of motor cabinet (3) inner chamber all is provided with motor (4), and is two sets of the terminal surface all is connected with motor shaft (5) before motor (4), and is two sets of terminal surface before workstation (1) is all run through to motor shaft (5) front end, and is two sets of motor shaft (5) periphery all cup joints and is provided with runner (6), and is two sets of runner (6) periphery all cup joints and is provided with belt (7).
2. The conveying device with the guide mechanism for silicon wafer production according to claim 1, wherein the conveying device comprises: dust collector (10) include electric telescopic handle (11), electric telescopic handle (11) are through bolt one and roof (9) bottom swing joint, electric telescopic handle (11) bottom is provided with dust removal section of thick bamboo (12), dust removal section of thick bamboo (12) inner chamber is provided with suction fan (13), dust removal section of thick bamboo (12) right side is connected with air duct (16), roof (9) top is provided with water tank (14), water tank (14) right side is provided with solid fixed ring (15), dust removal section of thick bamboo (12) one end is kept away from in air duct (16) passes solid fixed ring (15) and extends to water tank (14) inner chamber bottom.
3. The conveying device with the guide mechanism for silicon wafer production according to claim 1, wherein the conveying device comprises: the guide device (17) comprises an outer barrel (18), an inner barrel (20) is movably inserted into an inner cavity of the outer barrel (18), an outer connecting ring (21) is arranged on the periphery of the outer barrel (18), the inner cavity of the outer barrel (18) is extended from the top end and the bottom end of the inner barrel (20), a bottom pressing plate (23) is arranged at the bottom of the inner barrel (20), a reset spring (22) is sleeved on the periphery of the inner barrel (20), two ends of the reset spring (22) are welded with the outer connecting ring (21) and the bottom pressing plate (23) respectively, and a pressing plate is arranged at the top of the inner barrel (20).
4. The conveying device with the guide mechanism for silicon wafer production as claimed in claim 3, wherein: the right side of the top plate (9) is transversely provided with a guide groove (25) matched with the outer cylinder (18), and the outer cylinder (18) is movably inserted into an inner cavity of the matched guide groove (25).
5. The conveying device with the guide mechanism for silicon wafer production as claimed in claim 4, wherein: the front end face and the rear end face of the outer barrel (18) are respectively provided with a side sliding block (19), the front end face and the rear end face of the inner cavity of the guide groove (25) are respectively transversely provided with a sliding groove matched with the side sliding blocks (19), and the two groups of side sliding blocks (19) are respectively movably arranged in the inner cavities of the matched sliding grooves.
6. The conveying device with the guide mechanism for silicon wafer production as claimed in claim 3, wherein: and an anti-skid cushion layer (24) is arranged at the bottom of the bottom pressing plate (23) in an adhesive manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010591071.9A CN113829532A (en) | 2020-06-24 | 2020-06-24 | Transmission device is used in silicon chip production with lead positive mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010591071.9A CN113829532A (en) | 2020-06-24 | 2020-06-24 | Transmission device is used in silicon chip production with lead positive mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113829532A true CN113829532A (en) | 2021-12-24 |
Family
ID=78964863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010591071.9A Pending CN113829532A (en) | 2020-06-24 | 2020-06-24 | Transmission device is used in silicon chip production with lead positive mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113829532A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116198779A (en) * | 2023-03-31 | 2023-06-02 | 西安奕斯伟材料科技股份有限公司 | Device and method for packaging silicon wafer box |
-
2020
- 2020-06-24 CN CN202010591071.9A patent/CN113829532A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116198779A (en) * | 2023-03-31 | 2023-06-02 | 西安奕斯伟材料科技股份有限公司 | Device and method for packaging silicon wafer box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20211224 |
|
| WD01 | Invention patent application deemed withdrawn after publication |