CN113539910A - Method for picking and placing wafer in packaging box, mechanical arm and wafer processing equipment - Google Patents
Method for picking and placing wafer in packaging box, mechanical arm and wafer processing equipment Download PDFInfo
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- CN113539910A CN113539910A CN202010295604.9A CN202010295604A CN113539910A CN 113539910 A CN113539910 A CN 113539910A CN 202010295604 A CN202010295604 A CN 202010295604A CN 113539910 A CN113539910 A CN 113539910A
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000012545 processing Methods 0.000 title claims abstract description 25
- 238000001179 sorption measurement Methods 0.000 claims abstract description 78
- 230000001681 protective effect Effects 0.000 claims abstract description 42
- 238000012856 packing Methods 0.000 claims description 35
- 238000007599 discharging Methods 0.000 claims description 7
- 238000007786 electrostatic charging Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 5
- 239000012634 fragment Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 111
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 239000004775 Tyvek Substances 0.000 description 2
- 229920000690 Tyvek Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
The invention provides a method for taking and placing a wafer in a packaging box, a mechanical arm and wafer processing equipment, wherein the packaging box is provided with a plurality of upwards-protruding cards, the wafer is placed in a placement area defined by the cards, and protective paper covers the wafer, and the method comprises the following steps: providing a movable mechanical arm, enabling the mechanical arm to be provided with an adsorption picking end which can move downwards into the placing area and has adjustable adsorption force, and simultaneously being provided with an arm body which can move downwards to gaps among a plurality of cards along with the adsorption picking end; moving the mechanical arm to enable the arm body to enter the notch and enable the adsorption picking end to reach a set position above the protective paper; adsorbing the protection paper, and transferring the protection paper to a set protection paper placing position; moving the mechanical arm to enable the arm body to enter the notch and enable the adsorption pickup end to reach a set position above the wafer; and adsorbing the wafer, and transferring the wafer to a set wafer placing position. The invention improves the loading efficiency and reduces the risk of fragment.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to the field of wafer processing, and particularly relates to a method for taking and placing a wafer in a packaging box, a mechanical arm and wafer processing equipment.
Background
Wafers with a thickness less than 150um are generally called thin wafers, and the thin wafers are transported in an anti-static wafer packaging box. As shown in fig. 9, a plurality of cards 301 protruding upward are arranged on the packaging box 30, a gap 302 is arranged between the plurality of cards 301, and the wafer is placed in the placement area surrounded by the plurality of cards 301, and TYVEK protection paper covers the wafer.
When the wafer is processed (for example, testing, quality inspection, and transmission), the wafer is taken out from the wafer packaging box and placed in the wafer boat box, and then the wafer boat box is placed in the machine for the next step. However, in the conventional devices (e.g., testing device, quality inspection device, transmission device, etc.), the robot arm is used to pick and place the wafer, and the robot arm can only move simply, for example, the robot arm can only pick and place the wafer from the wafer cassette into the device and pick and place the wafer from the device into the wafer cassette, but the robot arm cannot perform the task when the wafer needs to be picked and placed from the anti-static wafer packaging box with a more complicated packaging structure. Manual operation is not only inefficient, but also easily results in wafer breakage; in addition, when the protection paper is manually taken, the protection paper is easily wrinkled, so that the thin wafer is further broken; also, when the wafer boat is manually loaded, the wafer is broken due to a position error. It is therefore desirable to provide a method, robot and wafer handling apparatus for wafer handling in a package to effect wafer transfer between the package and the apparatus.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method for picking and placing a wafer in a packaging box, a mechanical arm and wafer processing equipment, which are used for solving the problem that the wafer is easily broken due to manual wafer picking.
In view of the above problem, a first aspect of the present invention provides a method for taking and placing a wafer in a packaging box, the packaging box being provided with a plurality of cards protruding upwards, the wafer being placed in a placement area defined by the cards and covered with a protective paper, the method including the following steps of taking the wafer out of the packaging box:
providing a movable mechanical arm, enabling the mechanical arm to be provided with an adsorption picking end which can move downwards into the placing area and has adjustable adsorption force, and meanwhile, the mechanical arm is provided with an arm body which can move downwards along with the adsorption picking end to a gap between the cards;
moving the mechanical arm to enable the arm body to enter the gap and enable the adsorption picking end to reach a set position above the protective paper;
adsorbing the protection paper, and transferring the protection paper to a set protection paper placing position;
moving the mechanical arm to enable the arm body to enter the gap, and enabling the adsorption picking end to reach a set position above the wafer;
and adsorbing the wafer, and transferring the wafer to a set wafer placing position.
As an example of the present invention, the method further comprises the following process of placing the wafer back into the packaging box:
moving the adsorption picking end to be above the wafer placing position;
adsorbing the wafer, moving the mechanical arm to enable the arm body to enter the notch, and placing the wafer into the placing area of the packaging box;
moving the adsorption picking end to be above the protective paper placing position;
and adsorbing the protection paper, moving the mechanical arm to enable the arm body to enter the gap, and placing the protection paper on the upper part of the wafer in the placement area.
As an example of the present invention, the process of adsorbing the protection paper includes providing an adsorption force capable of adsorbing the protection paper and incapable of adsorbing the wafer to the adsorption pickup end.
As an example of the present invention, the process of attracting the wafer includes providing an attracting force capable of attracting the wafer to the attracting pickup end.
As an example of the present invention, the moving the mechanical arm to make the arm body enter the gap includes: and moving the mechanical arm to enable the adsorption picking end to reach the position above the placing area, aligning the arm body to the notch, and translating the adsorption picking end and the arm body downwards to a set position.
As an example of the present invention, the suction pickup end is provided in a circular ring shape.
As an example of the present invention, the adsorption pickup end is provided as an electrostatic adsorption device having a plurality of electrostatic electrodes, and the magnitude of the adsorption force is changed by changing the voltage of the electrostatic electrodes.
As an example of the present invention, the adsorption pickup end is provided as an electrostatic adsorption device having a plurality of electrostatic electrodes, and the magnitude of the adsorption force is changed by changing the on/off of the electrostatic electrodes.
As an example of the present invention, the adsorption pickup end is provided as a vacuum adsorption device having a plurality of suction holes, and the magnitude of the adsorption force is changed by controlling the opening degree of a valve on a vacuum adsorption gas path.
The invention provides a mechanical arm for taking and placing a wafer in a packaging box, wherein the packaging box is provided with a plurality of cards protruding upwards, the wafer is placed in a placing area defined by the cards, protective paper covers the wafer, the mechanical arm is provided with an adsorption picking end which can move downwards into the placing area and has adjustable adsorption force, and the mechanical arm is also provided with an arm body which can move downwards along with the adsorption picking end to a gap between the cards.
As an example of the present invention, the adsorption pickup end includes an annular carrier, an electrostatic charging and discharging device, a connection line, and a plurality of electrostatic electrodes, the plurality of electrostatic electrodes are embedded in the annular carrier, and the electrostatic electrodes are connected to the electrostatic charging and discharging device through the connection line.
As an example of the present invention, the adsorption pickup end includes a disc, a vacuum suction device, a pipe, and a valve, the disc having a plurality of suction holes formed on a lower surface thereof, one end of the pipe being connected to the plurality of suction holes, the other end being connected to a suction port of the suction device, the valve being disposed on the pipe.
As an example of the invention, the outer diameter of the annular carrier and/or the disc is 190-200 mm, and the inner diameter of the ring is 170-180 mm.
A third aspect of the present invention provides a wafer processing apparatus, which includes a machine platform, wherein the machine platform is provided with a protection paper box positioning structure capable of positioning and placing a protection paper box and a packaging box positioning structure capable of positioning and placing a wafer packaging box.
As an example of the present invention, the positioning structure is disposed on a supporting plate that can be pulled to the outside of the machine.
As an example of the present invention, the positioning structures are two grooves disposed on the upper surface of the carrying plate and respectively matched with the protection paper box and the bottom of the packing box.
As an example of the present invention, the positioning structure is a positioning body that is installed on the bearing plate and protrudes upward.
As an example of the present invention, the positioning structure further includes a clamping device, and the clamping device presses the protection paper box and the packing box against the positioning body.
As an example of the present invention, the positioning structure further includes a detection device for detecting whether the packing box and/or the protection paper box are in place.
The method for taking and placing the wafer in the packaging box, the mechanical arm and the wafer processing equipment can realize that the wafer is taken out from the anti-static wafer packaging box by the mechanical arm and is placed in the equipment, so that the wafer is not easy to fragment, and the protective paper is not easy to wrinkle and pollute.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and not to be construed as limiting the invention in any way, and in which:
FIG. 1 is a schematic flow diagram of the process of the present invention;
FIG. 2 is a schematic view of a robot according to an embodiment of the present invention;
FIG. 3 is a top view of the arm of the present invention entering a card slot of a package;
FIG. 4 is a schematic view of a robot arm according to another embodiment of the present invention;
FIG. 5 is a schematic view of a robot arm according to another embodiment of the present invention;
FIG. 6 is a schematic view of a wafer processing apparatus according to an embodiment of the present invention;
FIG. 7 is a schematic view showing the positions of a protective paper placing case and a packing case after they are installed in the wafer processing apparatus according to the present invention;
FIG. 8 is a schematic view illustrating a clamping structure of a packing box or a protection box in an embodiment of a wafer processing apparatus according to the present invention;
fig. 9 is a schematic three-dimensional structure of a conventional wafer packaging box.
Reference numerals
10 mechanical arm
101 suction pick-up end
1011a circular carrier
1011b round disc
10111b adsorption hole
102 arm body
103 electrostatic electrode
104 electrostatic charging and discharging device
105 connecting wire
106 pipeline
106a protective paper suction pipe
106b wafer suction pipe
107 vacuum suction device
108/108a/108b valve
20 wafer processing equipment
201 machine
202 bearing plate
2021 protective paper box groove
2022 groove of packing box
2023 convex part
2024 positioning body
2025 Cylinder
203 stop
30 packing box
301 card
302 gap
40 protection carton
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses preferred embodiments of the present invention, with reference to the accompanying drawings, illustrated in fig. 1 to 9. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
In an embodiment of the present invention, as shown in fig. 1, a method for picking and placing a wafer in a packing box 30 is provided, as shown in fig. 9, a plurality of cards 301 protruding upward are disposed on the packing box 30, the wafer is placed in a placement area enclosed by the plurality of cards 301, and a protection paper covers the wafer, the method includes the following processes of taking the wafer out of the packing box 30:
providing a movable mechanical arm 10, so that the mechanical arm 10 has an absorption picking end 101 capable of moving downwards into the placing area and adjustable absorption force, and also has an arm body 102 capable of moving downwards along with the absorption picking end 101 into a gap 302 between the cards 301;
moving the mechanical arm 10 to make the arm body 102 enter the notch 302 and make the adsorption picking end 101 reach a set position above the protective paper;
adsorbing the protection paper, and transferring the protection paper to a set protection paper placing position;
moving the robot arm 10 to make the arm body 102 enter the notch 302 and make the suction pick-up end 101 reach a set position above the wafer;
and adsorbing the wafer, and transferring the wafer to a set wafer placing position.
In the method for taking and placing the wafer in the packaging box 30, the mechanical arm 10 is used for taking the wafer from the anti-static wafer packaging box 30 and placing the wafer into equipment, so that the wafer is not easy to fragment, and the protective paper is not easy to wrinkle and pollute.
As an example of the present invention, the method further includes the following process of putting the wafer back into the packing box 30:
moving the adsorption pick-up end 101 to above the wafer placement position;
adsorbing the wafer, moving the robot arm 10 to make the arm body 102 enter the notch 302, and placing the wafer into the placing area of the packing box 30;
moving the adsorption picking end 101 to a position above the protection paper placing position;
adsorbing the protection paper, moving the robot arm 10 to enable the arm body 102 to enter the notch 302, and placing the protection paper on the upper portion of the wafer in the placement area.
The process of transferring the protective paper to the set protective paper placing position in the method comprises the steps of upwards translating the arm body 102 and the adsorption picking end 101 to a certain height after adsorbing the protective paper, translating the arm body 102 and the adsorption picking end 101 to enable the protective paper to be above the protective paper placing position, downwards moving the arm body 102 and the adsorption picking end 101 to the set height above the protective paper placing position, eliminating adsorption force, and placing the protective paper to the protective paper placing position.
As an example of the present invention, the process of adsorbing the protection paper includes providing an adsorption force for the adsorption pickup end 101, where the adsorption force is capable of adsorbing the protection paper and is incapable of adsorbing the wafer, that is, the adsorption force is greater than the gravity of the protection paper and is less than the gravity of the wafer.
As an example of the present invention, the process of attracting the wafer includes providing the attraction pickup end 101 with an attraction force capable of attracting the wafer, and making the attraction force greater than the gravity of the wafer and less than the sum of the gravity of the wafer and the protection paper.
As an example of the present invention, as shown in fig. 3, the process of moving the robot arm 10 to make the arm body 102 enter the notch 302 includes: the process of moving the robot 10 to make the suction pick-up end 101 reach above the placing area, and simultaneously aligning the arm 102 with the notch 302, and translating the suction pick-up end 101 and the arm 102 downward to a set position can be realized by setting the moving track of the robot 10.
The adsorption picking end 101 in the present invention may also be configured as a conventional picking structure capable of adsorbing the upper portion of the wafer, and the shape may not be limited too much, for example, a U shape, a disc shape, etc. it should be noted that the adsorption picking end 101 should be capable of translating in the up-down direction into the placing area, that is, the maximum outer diameter of the adsorption picking end 101 should be smaller than the minimum inner diameter of the placing area surrounded by the card 301, and considering the fragility of the wafer, as an example of the present invention, the adsorption picking end 101 is configured as a ring shape made of ceramic material in the method of the present embodiment. The outer diameter D of the ring is 190-200 mm, the inner diameter D is 170-180 mm, the width w of the arm body 102 is 40-45mm and smaller than the width y of the notch 302, the thickness of the arm body 102 is 2-3mm, and the arrangement is suitable for 12-inch wafers and 8-inch wafers and TYVEK protection paper.
The method of the present invention can adjust the suction force of the suction pickup end 101 in various ways. As shown in fig. 2, in an embodiment of the method of the present invention, the adsorption pickup end 101 is configured as an electrostatic adsorption device having a plurality of electrostatic electrodes 103, the plurality of electrostatic electrodes 103 are uniformly distributed in the adsorption pickup end 101 in a circumferential array, and the magnitude of the adsorption force is changed by changing the voltage of the electrostatic electrodes 103. In another embodiment of the method of the present invention, the switch of the electrostatic electrode 103 in different placement areas can be controlled to change the magnitude of the attraction force, and it should be noted that the placement areas of the electrostatic electrode 103 in different placement areas are switched to follow a uniform distribution, so as to avoid uneven attraction force. In still other embodiments of the present invention, the vacuum pickup head 101 is configured as a vacuum suction device having a plurality of suction holes, and the opening of the valve 108 on the vacuum suction path is controlled to change the magnitude of the suction force.
As shown in fig. 2 to 5, in another embodiment of the present invention, a robot 10 for picking and placing a wafer in a packaging box 30 is provided, the packaging box 30 is provided with a plurality of cards 301 protruding upward, the wafer is placed in a placement area defined by the cards 301, and is covered with a protective paper, the robot 10 has an absorption pickup end 101 capable of moving downward into the placement area and having an adjustable absorption force, and also has an arm 102 capable of moving downward into a gap 302 between the cards 301 along with the absorption pickup end 101.
The mechanical arm 10 can enable the arm body 102 to enter the gap 302 between the cards 301 of the packaging box 30, so that the adsorption picking end 101 can be close to an object to be adsorbed, and the transfer of the wafer between the packaging box 30 and the equipment is guaranteed.
As long as the card 301 can be translated downward into the placement area surrounded by the card 301, the shape of the adsorption pickup end 101 may not be limited as long as the adsorption pickup end 101 can be translated downward into the placement area, as shown in fig. 2, in an embodiment of the robot 10 of the present invention, the adsorption pickup end 101 includes a ring-shaped carrier 1011a, an electrostatic charging and discharging device 104, a connection line 105, and a plurality of electrostatic electrodes 103, the plurality of electrostatic electrodes 103 are embedded in the ring-shaped carrier 1011a, and the electrostatic electrodes 103 are connected to the electrostatic charging and discharging device 104 through the connection line 105. The electrostatic attraction structure can change the attraction force by adjusting the voltage of the electrostatic electrode 103, or can change the attraction force by changing the switch of the electrostatic electrode 103. However, as shown in fig. 4, in another embodiment of the robot arm 10 of the present invention, the adsorption pick-up end 101 includes a disc 1011b, a vacuum suction device 107, a pipe 106 and a valve 108, wherein a hollow chamber is disposed in the disc 1011b, a plurality of suction holes 10111b penetrating through a lower wall of the hollow chamber and communicating with the hollow chamber are disposed at a lower portion of the hollow chamber, one end of the pipe 106 communicates with the hollow chamber, the other end of the pipe is connected to a suction port of the suction device, and the valve 108 is disposed on the pipe 106, and the opening of the valve 108 is controlled to change the magnitude of the adsorption force. However, as shown in fig. 5, in some embodiments of the present invention, there are two ducts, which are a protective paper suction duct 106a and a wafer suction duct 106b, respectively, and one end of the protective paper suction duct 106a and one end of the wafer suction duct 106b are connected to the hollow chamber, and the other end is connected to the vacuum suction device 107. The set valve 108a is installed on the protective paper suction pipe 106a, the set valve 108b is installed on the wafer suction pipe 106b, the valve 108b is closed when the protective paper is adsorbed, the protective paper can be adsorbed by opening the valve 108a, the valve 108a is closed when the wafer is adsorbed, and the valve 108b is opened so that the wafer can be adsorbed. It should be noted that the circuit or gas circuit configuration not described in detail in the robot arm of the present invention may be implemented by using the existing wafer robot arm, for example, the vacuum pumping device 107 may be mounted on the robot arm, and the pipeline and the electric wire may be configured as a flexible structure and fixed on the robot arm, which will not be described in detail again.
As shown in fig. 6 to 8, in another embodiment of the present invention, a wafer processing apparatus 20 is provided, and the wafer processing apparatus 20 may be a quality inspection apparatus, a processing apparatus, a testing apparatus or a transmission apparatus, and includes a machine 201, wherein the machine 201 is provided with a positioning structure for positioning a protection paper box 40 and a positioning structure for positioning a packing box 30, which are capable of positioning the wafer packing box 30. After the protection paper box 40 and the packing box 30 are positioned and placed on the machine 201, the moving track and the motion parameters of the robot arm 10 can be set according to the position coordinates of the protection paper box 40 and the packing box 30.
The specific positions of the positioning structure of the protective paper box 40 and the positioning structure of the packing box 30 in the processing device of the present invention are not limited as long as the openings of the protective paper box 40 and the packing box 30 can be placed upward, and the positioning structure is disposed on a supporting plate 202 which can be drawn to the outside of the machine 201 as an example of the processing device of the present invention in view of the compactness of the device. The drawable installation of the bearing plate 202 on the machine 201 can be realized by various means, such as the rail-mounted installation between the keyboard tray and the desk, and the combination of the clamping groove and the pulley, etc. in this embodiment, two parallel guide rails are arranged on the machine 201, rollers or sliders matched with the guide rails are arranged on two sides of the bearing plate 202, and the rollers and sliders on two sides of the bearing plate 202 are respectively installed on the two guide rails. It should be noted that, in order to ensure the accurate positioning of the robot 10, the machine table 201 of the embodiment of the processing apparatus is further provided with a positioning structure of the loading plate 202, and the positioning structure may be any structure capable of fixing the position of the loading plate 202 on the machine table 201, such as a protrusion 2023 installed on the inner side of the loading plate 202 and a stopper 203 installed on the machine table 201, where the loading plate 202 reaches a set position when the protrusion 2023 abuts against the stopper 203.
As an example of the processing apparatus of the present invention, the positioning structure of the packing box 30 and the protective paper box 40 is a protective paper box groove 2021 and a packing box groove 2022 disposed on the upper surface of the supporting plate 202 and respectively matched with the protective paper box 40 and the bottom of the packing box 30. The protection paper box 40 and the packaging box 30 are correspondingly placed into the corresponding grooves, so that the packaging box 30 and the protection paper box 40 can be positioned conveniently and quickly. In other embodiments of the treatment apparatus of the present invention, the positioning structure is a positioning body 2024, such as a round pin, a stop 203, etc., which is mounted on the loading plate 202 and protrudes upwards.
In some other embodiments of the wafer processing apparatus 20 of the present invention, the positioning structure further comprises a clamping device for pressing the protective paper box 40 and the packing box 30 against the positioning body 2024 to prevent the protective paper box 40 and the packing box 30 from being displaced in consideration of the influence of vibration. The tightening structure may be any tightening structure capable of adjusting the length, such as a bolt screwed on the bracket, in an embodiment of the present invention, the tightening structure is a cylinder 2025 installed at the side of the protective paper box 40 and the packing box 30, and the end of the main shaft of the cylinder 2025 tightens the protective paper box 40 and the packing box 30 against the positioning body 2024.
In order to prevent the robot from operating without placing the protection paper box 40 and the packing box 30, as an example of the present invention, the positioning structure further includes a detection device (not shown) such as a proximity switch, a light sensor, etc. for detecting whether the protection paper box 40 and the packing box 30 are in place, and the installation position of the detection device is not limited as long as it can detect whether the protection paper box 40 and the packing box 30 are in place, as an example of the present invention, the detection device is two light sensors installed on the carrying plate corresponding to the placement position of the packing box 30 and the placement position of the protection paper box 40, the placement of the packing box 30 and the placement of the protection paper box 40 are shielded from light, and the sensors transmit a signal to the controller of the robot 10 to start the operation of the robot 10.
In conclusion, the method for taking and placing the wafer in the packaging box, the mechanical arm and the wafer processing equipment can realize that the wafer is taken out from the anti-static wafer packaging box by the mechanical arm and is placed in the equipment, so that the wafer is not easy to fragment, and the protective paper is not easy to wrinkle and pollute. Therefore, the invention effectively overcomes some practical problems in the prior art, thereby having high utilization value and use significance.
The foregoing embodiments are merely illustrative of the principles of this invention and its efficacy, rather than limiting it, and various modifications and variations can be made by those skilled in the art without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (15)
1. A method for taking and placing a wafer in a packaging box, wherein a plurality of cards protruding upwards are arranged on the packaging box, the wafer is placed in a placement area defined by the cards, and protective paper covers the wafer, and the method is characterized by comprising the following steps of:
providing a movable mechanical arm, enabling the mechanical arm to be provided with an adsorption picking end which can move downwards into the placing area and has adjustable adsorption force, and meanwhile, the mechanical arm is provided with an arm body which can move downwards along with the adsorption picking end to a gap between the cards;
moving the mechanical arm to enable the arm body to enter the gap and enable the adsorption picking end to reach a set position above the protective paper;
adsorbing the protection paper, and transferring the protection paper to a set protection paper placing position;
moving the mechanical arm to enable the arm body to enter the gap, and enabling the adsorption picking end to reach a set position above the wafer;
and adsorbing the wafer, and transferring the wafer to a set wafer placing position.
2. The method of claim 1, further comprising the process of placing the wafer back into the package:
moving the adsorption picking end to be above the wafer placing position;
adsorbing the wafer, moving the mechanical arm to enable the arm body to enter the notch, and placing the wafer into the placing area of the packaging box;
moving the adsorption picking end to be above the protective paper placing position;
and adsorbing the protection paper, moving the mechanical arm to enable the arm body to enter the gap, and placing the protection paper on the upper part of the wafer in the placement area.
3. The method of claim 1 or 2, wherein the adsorption pickup end is provided as an electrostatic adsorption device having a plurality of electrostatic electrodes, and the magnitude of the adsorption force is changed by changing a voltage of the electrostatic electrodes.
4. The method according to claim 1 or 2, wherein the adsorption pickup end is provided as an electrostatic adsorption device having a plurality of electrostatic electrodes, and the magnitude of the adsorption force is changed by changing the on/off of the electrostatic electrodes.
5. The method of claim 1 or 2, wherein the adsorption pick-up end is provided as a vacuum adsorption device having a plurality of suction holes, and the magnitude of the adsorption force is changed by controlling the opening degree of a valve on a vacuum adsorption gas path.
6. A mechanical arm for taking and placing a wafer in a packaging box is provided, the packaging box is provided with a plurality of cards protruding upwards, the wafer is placed in a placing area defined by the cards, and protective paper covers the wafer, and the mechanical arm is characterized in that,
the mechanical arm is provided with an adsorption picking end which can move downwards into the placing area and has adjustable adsorption force, and is also provided with an arm body which can move downwards along with the adsorption picking end into the gap among the plurality of cards.
7. The robot arm according to claim 6, wherein the adsorption pickup end comprises a ring-shaped carrier, an electrostatic charging and discharging device, a connecting wire, and a plurality of electrostatic electrodes, the plurality of electrostatic electrodes are embedded in the ring-shaped carrier, and the electrostatic electrodes are connected to the electrostatic charging and discharging device through the connecting wire.
8. The robot arm as claimed in claim 6, wherein the suction pick-up end comprises a disc, a vacuum suction device, a pipe and a valve, the disc having a plurality of suction holes formed on a lower surface thereof, the pipe having one end connected to the plurality of suction holes and the other end connected to a suction port of the suction device, the valve being disposed on the pipe.
9. A robot arm as claimed in claim 7 or 8, wherein the annular carrier and/or the disc has an outer diameter of 190-200 mm and the inner diameter of the ring is 170-180 mm.
10. The utility model provides a wafer processing equipment, includes the board, its characterized in that, be provided with one on the board and can be with the protection carton location structure that the protection carton location was placed and one can be with the packing carton location structure that the wafer packing carton location was placed.
11. The apparatus of claim 10, wherein the positioning structure is disposed on a carrier plate that is retractable to an outside of the platen.
12. The apparatus of claim 11, wherein the positioning structure is two grooves disposed on the upper surface of the carrier plate and respectively matching with the protective paper box and the bottom of the packing box.
13. The wafer processing apparatus of claim 11, wherein the positioning structure is an upwardly projecting positioning body mounted on the carrier plate.
14. The wafer processing apparatus of claim 13, wherein the positioning structure further comprises a clamping device that abuts the protective paper cassette and the packing box against the positioning body.
15. The wafer processing apparatus of claim 13, wherein the positioning structure further comprises a detection device for detecting whether the packing box and/or the protection paper box are/is in place.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010295604.9A CN113539910A (en) | 2020-04-15 | 2020-04-15 | Method for picking and placing wafer in packaging box, mechanical arm and wafer processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010295604.9A CN113539910A (en) | 2020-04-15 | 2020-04-15 | Method for picking and placing wafer in packaging box, mechanical arm and wafer processing equipment |
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| CN113539910A true CN113539910A (en) | 2021-10-22 |
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| CN202010295604.9A Pending CN113539910A (en) | 2020-04-15 | 2020-04-15 | Method for picking and placing wafer in packaging box, mechanical arm and wafer processing equipment |
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| CN115252137A (en) * | 2022-07-25 | 2022-11-01 | 江西脑虎科技有限公司 | Electrode adsorption device |
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