CN113539904A - Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding - Google Patents

Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding Download PDF

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Publication number
CN113539904A
CN113539904A CN202110815402.7A CN202110815402A CN113539904A CN 113539904 A CN113539904 A CN 113539904A CN 202110815402 A CN202110815402 A CN 202110815402A CN 113539904 A CN113539904 A CN 113539904A
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China
Prior art keywords
cleaning
cleaning device
particles
grooves
lower fixed
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Pending
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CN202110815402.7A
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Chinese (zh)
Inventor
王超玮
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Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
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Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
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Priority to CN202110815402.7A priority Critical patent/CN113539904A/en
Publication of CN113539904A publication Critical patent/CN113539904A/en
Priority to TW111126432A priority patent/TW202300286A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The embodiment of the invention discloses a cleaning device, a system and a method for a groove of a lower fixed disc in double-sided grinding, wherein the cleaning device comprises: the device comprises a plurality of brushes, a plurality of cleaning devices and a control device, wherein the brushes are distributed in a row and can move along a set direction to clean particles in grooves distributed on a lower fixed disc transversely or longitudinally; wherein each brush consists of a brush handle and a brush head; and each high-pressure water spray pipe is correspondingly arranged right behind the moving direction of each brush so as to flush the particles in the groove by spraying high-pressure pure water in the process of cleaning the particles by the plurality of brushes.

Description

Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding
Technical Field
The embodiment of the invention relates to the technical field of semiconductor manufacturing, in particular to a device, a system and a method for cleaning a groove of a lower fixed plate in double-sided grinding.
Background
In the process of processing a silicon wafer, in order to remove line marks and a mechanical damage layer on the surface of the silicon wafer after linear cutting, a double-sided grinding process is carried out on the silicon wafer, grinding slurry containing high-hardness grinding agents (such as silicon oxide and aluminum oxide) is contacted with the surface of the silicon wafer clamped between an upper fixed disc and a lower fixed disc in the process, and then the upper fixed disc and the lower fixed disc carry out thinning grinding on the silicon wafer at a certain pressure and a certain rotating speed; the two-sided grinding process can produce byproducts such as a large amount of silicon slag and grinding slurry residues, the byproducts can be discharged from the groove of the lower fixed plate, but after multiple times of processing, a large amount of solid byproducts can be accumulated in the groove to cause the drainage in the groove to be blocked, and the silicon slag and the grinding slurry residues remained between the fixed plates can scratch the surface of the silicon wafer in the two-sided grinding process, so that the quality of the silicon wafer is reduced, and therefore the groove of the lower fixed plate needs to be cleaned regularly. The main cleaning mode at present is to clean the groove by a thin blade and then wash the lower fixed disc by a water gun. However, the existing cleaning method not only consumes a lot of manpower and time and is not efficient, but also the thin blade may damage the lower fixed plate during the cleaning process.
Disclosure of Invention
In view of the above, embodiments of the present invention are directed to a cleaning apparatus, system and method for cleaning grooves of a lower platen in double-side polishing; the cleaning efficiency of the groove of the lower fixed plate can be improved, and meanwhile, particles in the groove can be thoroughly removed to ensure the quality of the silicon wafer in the double-sided grinding process.
The technical scheme of the embodiment of the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a cleaning apparatus for a groove of a lower fixed disk in double-side polishing, where the cleaning apparatus includes:
the device comprises a plurality of brushes, a plurality of cleaning devices and a control device, wherein the brushes are distributed in a row and can move along a set direction to clean particles in grooves distributed on a lower fixed disc transversely or longitudinally; wherein each brush consists of a brush handle and a brush head;
and each high-pressure water spray pipe is correspondingly arranged right behind the moving direction of each brush so as to flush the particles in the groove by spraying high-pressure pure water in the process of cleaning the particles by the plurality of brushes.
In a second aspect, an embodiment of the present invention provides a cleaning system for a groove of a lower fixed disk in double-side polishing, the cleaning system including:
the driving mechanism is used for controlling the cleaning device to move at a certain speed along a set direction so as to clean the particles in the grooves which are distributed on the lower fixed disc transversely or longitudinally;
and the rotating mechanism is used for controlling the cleaning device to rotate 90 degrees clockwise around the central axis of the rotating mechanism in sequence so as to finish the cleaning work of all the grooves in the set direction.
In a third aspect, an embodiment of the present invention provides a method for cleaning a groove of a lower fixed disk in double-side polishing, where the method can be applied to the cleaning system of the second aspect, and the method includes:
the cleaning device is driven by the driving mechanism to move at a certain speed along a set direction so as to clean particles in the grooves which are distributed on the lower fixed disc transversely or longitudinally;
after the cleaning device finishes the cleaning work in one set direction, the cleaning device is controlled by the rotating mechanism to rotate 90 degrees clockwise around the central axis of the rotating mechanism in sequence, so that the cleaning device rotates to the next set direction and starts to clean the groove;
after the cleaning device finishes the cleaning work of the groove along all the set directions, the cleaning device is controlled to rotate to the original position of the cleaning device through a rotating mechanism.
The embodiment of the invention provides a cleaning device, a system and a method for a groove of a lower fixed disc in double-sided grinding; the cleaning device mainly utilizes a plurality of brushes distributed in a row to clean all grooves on the lower fixed disc in the transverse direction or the longitudinal direction at the same time, and meanwhile, in the process of cleaning the grooves by the plurality of brushes, a high-pressure water spray pipe arranged right behind the moving direction of each brush can spray high-pressure pure water so as to wash the particles in the grooves by the high-pressure pure water in the process of cleaning the particles in the grooves by the plurality of brushes; through this clean system not only can improve the clean efficiency of slot, can thoroughly get rid of the particulate matter in the slot moreover, improved the clean degree of slot.
Drawings
Fig. 1 is a schematic cross-sectional view of a double-side polishing apparatus for a silicon wafer according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a groove on a lower fixed plate according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a cleaning device for a groove of a lower fixed plate in double-side polishing according to an embodiment of the present invention.
FIG. 4 is a schematic diagram illustrating a position relationship between a high pressure water spraying pipe and a brush according to an embodiment of the present invention.
Fig. 5 is a schematic view of an included angle between a direction of spraying high-pressure pure water from the high-pressure spray pipe and a moving direction of the brush according to the embodiment of the present invention.
Fig. 6 is a diagram illustrating data of minimum distances between the bottom positions of bristles and the lower surface of a groove according to an embodiment of the present invention.
FIG. 7 is a graph illustrating data on the changed distance between the bottom position of a bristle and the lower surface of a groove according to an embodiment of the present invention.
Fig. 8 is a schematic position diagram of a cleaning device for cleaning a groove along the direction 1 and the direction 2 according to an embodiment of the present invention.
Fig. 9 is a schematic position diagram of a cleaning device for cleaning a trench along direction 3 according to an embodiment of the present invention.
Fig. 10 is a schematic view of a cleaning device for cleaning a trench along direction 4 according to an embodiment of the present invention.
Fig. 11 is a flowchart illustrating a method for cleaning a groove of a lower fixed plate in a double-side polishing according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, which shows a schematic cross-sectional view of a double-side polishing apparatus 1 commonly used for silicon wafers, the double-side polishing apparatus 1 may include a fixed plate 101, wherein the fixed plate 101 includes an upper fixed plate 101A and a lower fixed plate 101B, a carrier plate 102 and a control mechanism (not shown in the figure). Referring to fig. 2, a plurality of transverse and longitudinal vertically staggered grooves 201 are shown in the lower surface plate 101B. As can be understood, in the double-side polishing apparatus 1, the upper fixed platen 101A and the lower fixed platen 101B are oppositely disposed, the carrier platen 102 is disposed between the upper fixed platen 101A and the lower fixed platen 101B and the carrier platen 102 is provided with a plurality of carrier platen holes 103, wherein the silicon wafer to be polished is placed in the carrier platen holes 103; under the action of the control mechanism, the carrier plate 102 can rotate around the axis thereof and revolve around the central axis of the lower fixed plate 101B to move relative to the upper fixed plate 101A and the lower fixed plate 101B to grind the silicon wafers to be ground. In addition, a plurality of bearing discs 102 can be arranged between the upper fixed disc 101A and the lower fixed disc 101B, each bearing disc 102 is provided with a plurality of bearing disc holes 103, and each bearing disc hole 103 can be used for placing one silicon wafer to be ground, so that the double-side grinding equipment 1 can grind a plurality of silicon wafers to be ground at the same time. It should be noted that the structure of the double-side polishing apparatus 1 shown in fig. 1 is not particularly limited, and other components required for double-side polishing a silicon wafer are omitted for clarity of illustrating the technical solution of the embodiment of the present invention.
When adopting above-mentioned double-side lapping equipment 1 to carry out double-side lapping to a plurality of silicon chips, because the mechanical reaction of a plurality of silicon chips and grinding thick liquids and the friction of fixed plate 101 and silicon chip, can form by-products such as a large amount of silicon chip residues and grinding thick liquids particulate matter in grinding process, these by-products are mostly solid particulate matter, are difficult to directly follow the edge discharge of lower fixed plate 101B through slot 201. With the recycling of the grinding slurry, the solid particles can be continuously recycled or accumulated in the grooves 201 of the lower fixed plate 101B, so that the grooves 201 are not smooth in circulation, more and more silicon wafer residues and grinding slurry particles can be accumulated in the grooves 201 due to the problem, and the surface of a silicon wafer can be scratched in the double-side grinding process, so that the quality of the silicon wafer after double-side grinding is reduced.
Based on the above explanation, with reference to fig. 3 and fig. 4, there is shown a cleaning device 3 for grooves 201 of a middle and lower fixed plate 101B in double-sided grinding according to an embodiment of the present invention, where the cleaning device 3 specifically includes:
a plurality of hairbrushes 301 distributed in a row, wherein the hairbrushes 301 can move along a set direction to clean the particles in the grooves 201 distributed on the lower fixed disc 101B in the transverse direction or the longitudinal direction; wherein each brush 301 consists of a brush handle 301A and a brush head 301B;
a plurality of water spray pipes 302, each of the water spray pipes 302 being disposed right behind a moving direction of each of the brushes 301 (schematically shown by a chain-dotted arrow in fig. 4) to wash the particles in the groove 201 by spraying high-pressure pure water during the cleaning of the particles by the plurality of brushes 301.
It will be appreciated that the bristle handle 301B is fixedly arranged at one end of the bristle handle 301A, while the other end of the bristle handle 301A may be fixedly arranged on the housing 303, as shown in fig. 3.
The cleaning device 3 provided by the embodiment of the invention can utilize a plurality of brushes 301 distributed in a row to simultaneously move according to a set direction so as to clean all particles in the grooves 201 distributed on the lower fixed disc 101B transversely or longitudinally, and spray high-pressure pure water through the high-pressure spray pipe 302 to flush the particles in the grooves 201 in the process that the brushes 301 clean the particles in the grooves 201, so that the particles in the grooves 201 are discharged out of the lower fixed disc 101B along the grooves 201 under the combined action of the brushes 301 and the high-pressure pure water. Therefore, the cleaning device 3 utilizes the row of brushes 301 and the high-pressure pure water to simultaneously clean the particles in the groove 201, thereby shortening the cleaning time of the groove 201 and improving the cleaning efficiency of the groove 201; meanwhile, the brush 301 is adopted to clean particles in the groove 201, so that the lower fixed plate cannot be damaged, and the production cost is saved.
With respect to the cleaning device 3, in some examples, the length of the bristles 301B is greater than the depth of the channel 201, and the bristles 301B are trapezoidal in shape to thoroughly clean the accumulated particles from the bottom and side walls of the channel 201.
Preferably, for the above example, in some specific implementations, the material of the bristle 301B is polyetheretherketone.
It should be noted that, as shown in fig. 4, the high-pressure water spray pipe 302 is composed of a high-pressure water spray port 302A and a high-pressure water spray pipe 302B, wherein the high-pressure water spray pipe 302B is connected to a pure water supply device (not shown).
Furthermore, in the embodiment of the present invention, in order to thoroughly clean the particles in the groove 201 during the process of cleaning the particles in the groove 201 by the brush 301, for the cleaning device 3, in some examples, referring to fig. 4 and 5, an included angle between a direction (shown by a solid arrow in fig. 5) of spraying the high-pressure pure water by each of the high-pressure water spray pipes 302 and a moving direction (shown by a chain line arrow in the figure) of the corresponding brush 301 is an acute angle (α shown in fig. 5), so that as shown in fig. 4, the high-pressure pure water sprayed by the high-pressure water spray nozzles 302A forms an inclined water column, and the inclined water column can be sprayed forward and fall at the brush head 301B relative to the moving direction of the corresponding brush 301, so that the brush head 301B can clean the particles while the high-pressure pure water sprayed forward in the inclined direction can provide a certain thrust to move the particles forward, this facilitates the thorough discharge of the particulate matter in the grooves 201 out of the lower surface plate 101B along the grooves 201.
As to the cleaning device 3, in some examples, referring to fig. 3, the cleaning device 3 further includes: a plurality of sensors 304 and a control unit 305 connected to the plurality of sensors 304; wherein the content of the first and second substances,
said each sensor 304 is correspondingly arranged at a position above said each bristle 301B for sensing distance data between a position at the bottom of said each bristle 301B and a lower surface of said groove 201;
the control unit 305 is configured to determine whether to trigger the high-pressure water jet 302 corresponding to the bristle 301B to spray high-pressure pure water according to the distance data sensed by each sensor 304.
It should be noted that, as shown in fig. 6, in the embodiment of the present invention, the minimum distance data between the bottom position of the bristle 301B and the lower surface of the groove 201 is set to L. It can be understood that, as shown in fig. 7, when the bristle 301B enters the groove 201, the distance data L between the bottom position of the bristle 301B and the lower surface of the groove 201 changes, i.e. L is less than the minimum distance data L, therefore, in order to enable the high pressure water spray pipe 302 to be turned on to spray high pressure pure water when the bristle 301B enters the groove 201, in the embodiment of the present invention, a sensor is disposed at a position above each bristle 301B for sensing the distance data between the bottom position of the bristle 301B and the lower surface of the groove 201, and when the sensed distance data is less than the minimum distance data L, it can be determined that the bristle 301B starts to clean the groove 201, and at this time, the control unit 305 triggers the high pressure water spray pipe 302 to spray high pressure pure water; accordingly, when the cleaning operation of the bristle 301B is completed and the bristle is moved out of the groove 201, the distance data sensed by the sensor 304 will also change, and the control unit 305 can control the high pressure water spraying pipe 302 to stop spraying water, so that the production cost can be saved.
Preferably, for the cleaning device 3, in some examples, the sensor 304 is an eddy current sensor. It is understood that, in the embodiment of the present invention, the lower fixed plate 101B is made of cast iron, so that in the case that the sensor 304 is a metal-sensitive eddy current sensor, when the distance data between the bottom position of the bristle 301B and the lower surface of the groove 201 changes, the sensor 304 can receive a signal and send a signal to the control unit 305, so that the control unit 305 controls the high pressure water spraying pipe 302 to start or stop spraying water according to the signal sent by the sensor 304.
In addition, an embodiment of the present invention further provides a cleaning system 10 for a groove 201 of a middle and lower fixed plate 101B in double-sided polishing, where the cleaning system 10 specifically includes:
the cleaning device 3 according to the preceding claim;
a driving mechanism 4 shown in fig. 3, wherein the driving mechanism 4 is used for controlling the cleaning device 3 to move in a set direction and at a certain speed so as to clean the particles in the grooves distributed on the lower fixed plate in the transverse direction or the longitudinal direction;
a rotating mechanism 5 shown in fig. 8, wherein the rotating mechanism 5 is used for controlling the cleaning device 3 to rotate 90 ° clockwise around the central axis of the rotating mechanism 5 in sequence so as to complete the cleaning work of the grooves in all the set directions.
It is understood that, as shown in fig. 8, during the cleaning of the groove 201, the moving direction of the cleaning device 3 is set to 4 directions, which are the direction 1, the direction 2, the direction 3, and the direction 4, respectively, and the 4 directions are sequentially spaced by 90 °. In the embodiment of the present invention, the original position of the cleaning device 3 is set as the position shown by the solid line in fig. 8, after the cleaning device 3 is started, firstly, the cleaning device 3 cleans the groove 201 along the direction 1, the driving mechanism 4 can drive the cleaning device 3 to move at a constant speed along the direction 1, after the cleaning device 3 finishes cleaning the groove 201 along the direction 1, the cleaning device 3 moves to the position shown by the lower dotted line in fig. 8, and at this time, the driving mechanism 4 stops to make the cleaning device 3 stop moving; thereafter, the rotation mechanism 5 controls the cleaning device 3 to rotate 90 ° clockwise, i.e. the cleaning device 3 rotates to the position shown by the dashed right-hand line in fig. 8, at which time the cleaning device 3 cleans the groove 201 in the direction 2 under the action of the driving mechanism 4.
Similarly, when the cleaning device 3 completes the cleaning operation of the groove 201 in the direction 2, the cleaning device 3 moves to the position shown by the left dotted line in fig. 9, and the driving mechanism 4 is braked to stop the advance of the cleaning device 3; thereafter, the rotation mechanism 5 controls the cleaning device 3 to rotate 90 ° clockwise, i.e. the cleaning device 3 rotates to the position shown by the lower broken line in fig. 9, at which time the cleaning device 3 cleans the groove 201 in the direction 3 by the driving mechanism 4.
Similarly, when the cleaning device 3 completes the cleaning work of the groove 201 in the direction 3, the cleaning device 3 moves to the position shown by the upper broken line in fig. 10, and the driving mechanism 4 is braked to stop the advance of the cleaning device 3; thereafter, the rotation mechanism 5 controls the cleaning device 3 to rotate 90 ° clockwise, i.e. the cleaning device 3 rotates to the position shown by the left dotted line in fig. 10, at which time the cleaning device 3 cleans the groove 201 in the direction 4 under the action of the driving mechanism 4.
It can be seen that, under the combined action of the driving mechanism 4 and the rotating mechanism 5, the cleaning device 3 cleans the groove 201 in the directions 1, 2, 3 and 4, and finally the cleaning device 3 can move to the original position (the position shown by the solid line in fig. 8) shown in fig. 8 by rotation, so that the cleaning device 3 completes one cycle of cleaning work on the groove 201. It will be appreciated that after the cleaning device 3 performs one cycle of cleaning operation on the grooves 201, it is equivalent to performing two cleaning operations on all the grooves 201 distributed laterally and/or longitudinally, respectively, so that the above-mentioned cleaning system 10 not only can improve the cleaning efficiency of the grooves 201, but also can completely remove the particles in the grooves 201, thereby improving the cleanliness of the grooves 201.
It should be noted that, during the cleaning of the groove 201 in the above four directions, the moving direction of the brush 301 is always consistent with the advancing direction of the cleaning device 3, and then, it can be understood that the water spraying direction of the high-pressure water spraying pipe 302 is always at an acute angle with the advancing direction of the cleaning device 3.
For cleaning system 10, in some examples, the movement speed of the cleaning device 3 is 0.02 meters per second (m/s).
Referring to fig. 11, a cleaning method for the grooves of the lower fixed plate in the double-side grinding according to an embodiment of the present invention is shown, and the cleaning method can be applied to the cleaning system 10 according to the foregoing technical solution, and the cleaning method includes:
s1101, driving a cleaning device to move at a certain speed along a set direction through a driving mechanism so as to clean particles in grooves which are distributed on a lower fixed disc transversely or longitudinally;
s1102, after the cleaning device finishes cleaning work in one set direction, the cleaning device is controlled by a rotating mechanism to rotate 90 degrees clockwise around the central axis of the rotating mechanism in sequence, so that the cleaning device rotates to the next set direction and starts to clean the groove;
and S1103, after the cleaning device finishes the cleaning work of the groove along all the set directions, controlling the cleaning device to rotate to the original position of the cleaning device through a rotating mechanism.
For the solution shown in fig. 11, in some examples, the driving the cleaning device by the driving mechanism to move in a set direction and at a certain speed to clean the particles in the grooves distributed transversely or longitudinally on the lower surface plate includes:
the driving mechanism controls a plurality of brushes to clean particles in the grooves which are distributed on the lower fixed plate transversely or longitudinally along the set direction;
and spraying high-pressure pure water through a high-pressure spray pipe to wash the particles in the groove in the process of cleaning the particles by the plurality of brushes.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A cleaning device for grooves of a lower fixed disc in double-sided grinding is characterized by comprising:
the device comprises a plurality of brushes, a plurality of cleaning devices and a control device, wherein the brushes are distributed in a row and can move along a set direction to clean particles in grooves distributed on a lower fixed disc transversely or longitudinally; wherein each brush consists of a brush handle and a brush head;
and each high-pressure water spray pipe is correspondingly arranged right behind the moving direction of each brush so as to flush the particles in the groove by spraying high-pressure pure water in the process of cleaning the particles by the plurality of brushes.
2. The cleaning apparatus as recited in claim 1, wherein a length of said bristle is greater than a depth of said channel, and a shape of said bristle is trapezoidal.
3. The cleaning device of claim 2, wherein the material of the bristles is polyetheretherketone.
4. The cleaning apparatus as claimed in claim 1, wherein an angle between a direction in which each of the high pressure spray pipes sprays the high pressure pure water and a moving direction of the corresponding brush is acute.
5. The cleaning device of claim 1, further comprising: a plurality of sensors and a control unit connected to the plurality of sensors; wherein the content of the first and second substances,
each sensor is correspondingly arranged at the position above each bristle so as to sense the distance data between the bottom position of each bristle and the lower surface of the groove;
the control unit is configured to determine whether to trigger the corresponding high-pressure water spray pipe of the bristle to spray high-pressure pure water according to the distance data sensed by each sensor.
6. The cleaning apparatus defined in claim 5, wherein the sensor is an eddy current sensor.
7. A system for cleaning grooves of a lower fixed plate in double-sided polishing, the system comprising:
the cleaning device according to any one of claims 1 to 6;
the driving mechanism is used for controlling the cleaning device to move at a certain speed along a set direction so as to clean the particles in the grooves which are distributed on the lower fixed disc transversely or longitudinally;
and the rotating mechanism is used for controlling the cleaning device to rotate 90 degrees clockwise around the central axis of the rotating mechanism in sequence so as to finish the cleaning work of all the grooves in the set direction.
8. The cleaning system of claim 7, wherein the cleaning device is moved at a speed of 0.02 meters per second.
9. A method for cleaning a lower fixed plate in double-side grinding, which can be applied to the cleaning system of claim 7 or 8, the method comprising:
the cleaning device is driven by the driving mechanism to move at a certain speed along a set direction so as to clean particles in the grooves which are distributed on the lower fixed disc transversely or longitudinally;
after the cleaning device finishes the cleaning work in one set direction, the cleaning device is controlled by the rotating mechanism to rotate 90 degrees clockwise around the central axis of the rotating mechanism in sequence, so that the cleaning device rotates to the next set direction and starts to clean the groove;
after the cleaning device finishes the cleaning work of the groove along all the set directions, the cleaning device is controlled to rotate to the original position of the cleaning device through a rotating mechanism.
10. The cleaning method according to claim 9, wherein the cleaning device is driven by the driving mechanism to move in a set direction and at a certain speed to clean the particles in the grooves distributed transversely and/or longitudinally on the lower surface plate, and the method comprises the following steps:
the driving mechanism controls a plurality of brushes to clean particles in the grooves which are distributed on the lower fixed plate transversely or longitudinally along the set direction;
and spraying high-pressure pure water through a high-pressure spray pipe to wash the particles in the groove in the process of cleaning the particles by the plurality of brushes.
CN202110815402.7A 2021-07-19 2021-07-19 Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding Pending CN113539904A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202110815402.7A CN113539904A (en) 2021-07-19 2021-07-19 Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding
TW111126432A TW202300286A (en) 2021-07-19 2022-07-14 Cleaning device, system and method for grooves of lower fixed disc in double-sided grinding

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