CN113539882A - Binding device - Google Patents

Binding device Download PDF

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Publication number
CN113539882A
CN113539882A CN202011153910.5A CN202011153910A CN113539882A CN 113539882 A CN113539882 A CN 113539882A CN 202011153910 A CN202011153910 A CN 202011153910A CN 113539882 A CN113539882 A CN 113539882A
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CN
China
Prior art keywords
panel
circuit board
display panel
driving module
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011153910.5A
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Chinese (zh)
Inventor
朴钟德
李相源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of CN113539882A publication Critical patent/CN113539882A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present invention relates to a binding apparatus, which may include: a fixing member disposed above the object panel to fix the object panel, the object panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion and coupled to at least one of the driving module and the circuit board; a supporting member disposed below the object panel and supporting the object panel in a process of bonding the driving module and the circuit board to the object panel; and a heat insulating member disposed on the third portion and blocking heat generated in a coupling process of the driving module and the circuit board from being transferred to the first portion and the second portion, the third portion including a first region adjacent to the second portion and a second region coupled with the driving module and the circuit board, the heat insulating member being disposed on the first region. Therefore, the invention can improve the reliability of the binding process.

Description

Binding device
Technical Field
The present invention relates to a binding apparatus, and more particularly, to a binding apparatus with improved reliability while reducing failures.
Background
Recently, various electronic devices using a Liquid Crystal Display (LCD) or an Organic Light Emitting Diode (OLED) as a display device, such as a mobile phone, a navigation device, a digital camera, an electronic book, a portable game machine, and various terminals, have been used.
Recently, with the development of electronic devices having curved surfaces, the necessity for ensuring durability and reliability of each part of a display device included in the electronic device while having a curved surface has increased.
Disclosure of Invention
The invention aims to provide a binding device which can prevent the badness of a display panel and improve the reliability of the process.
In an embodiment, the binding means comprises: a fixing member disposed above a target panel to fix the target panel, the target panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion and coupled to at least one of a driving module and a circuit board; a supporting member disposed below the object panel and supporting the object panel in a process of bonding the driving module and the circuit board to the object panel; and a heat insulating member disposed on the third portion and blocking heat generated in a process of coupling the driving module and the circuit board from being transferred to the first portion and the second portion, the third portion including a first region adjacent to the second portion and a second region coupling the driving module and the circuit board, the heat insulating member being disposed on the first region.
The object panel may include a display panel and a window disposed on the display panel, and the driving module and the circuit board may be disposed on the display panel.
The support member may comprise metal.
The support member may include a first surface in contact with the first portion of the object panel, a second surface in contact with the second portion, and a third surface in contact with the third portion, and a plurality of holes may be defined in the third surface.
The plurality of holes may overlap the second region.
It may be that each of the plurality of holes is in a vacuum state and reinforces a contact force between the third portion and the third face.
The curvature of the second face of the support member may be the same as the curvature of the second portion of the object panel.
The binding apparatus may further include: and a pressing member for pressing the driving module and the circuit board to be combined with the third portion.
The heat insulating member may be in the form of a film, and an adhesive member may be disposed between the heat insulating member and the third portion.
The heat insulating member may be attached to the support member, and the third portion of the object panel may be disposed between the heat insulating member and the support member.
(Effect of the invention)
The invention can carry out the process of hot-pressing the driving module and/or the circuit board on the display panel after the laminating process of combining the window and the display panel. Therefore, the invention can eliminate the possibility of generating the bad driving module and/or the circuit board in the laminating process of the window and the display panel. In addition, the present invention can prevent the display panel from being defective due to heat generation and improve the reliability of the process by disposing the support member below the display panel and the heat insulating member on the display panel for the hot press process of the driving module and/or the circuit board.
Drawings
Fig. 1 is a perspective view of a binding apparatus according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention.
Fig. 4 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention.
Fig. 5 is a perspective view of a support member according to an embodiment of the present invention.
Figure 6a is a cross-sectional view of a support member according to an embodiment of the present invention.
Fig. 6b is a cross-sectional view of a binding apparatus according to an embodiment of the invention.
Fig. 7a and 7b are sequence diagrams illustrating a method of manufacturing a display device according to an embodiment of the invention.
Fig. 8a to 8d are sectional views illustrating a method of manufacturing a display device according to an embodiment of the present invention.
Fig. 9a and 9b are cross-sectional views of a binding apparatus according to an embodiment of the present invention.
Fig. 10 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention.
(description of reference numerals)
BD: binding device
SB: object panel
DP: display panel
WD: window opening
SM: support member
HM: heat insulation component
WJ: fixing member
10: driving module
20: circuit board
Detailed Description
In the present specification, when a certain constituent element (or a region, a layer, a portion, or the like) "is referred to as being" on "," connected to "or" coupled to "another constituent element," it means that the certain constituent element may be directly arranged, connected, or coupled to the another constituent element, or a third constituent element may be arranged therebetween.
Like reference numerals refer to like constituent elements. In the drawings, the thickness, the ratio, and the size of constituent elements are enlarged for effectively explaining the technical contents. "and/or" includes all of one or more combinations that can be defined by the associated constituent elements.
The terms first, second, etc. may be used to describe various elements, but the elements are not limited by the terms. The above terms are only used to distinguish one constituent element from another constituent element. For example, a first constituent element may be named a second constituent element, and similarly, a second constituent element may also be named a first constituent element, without departing from the scope of the present invention. Except where otherwise expressly indicated herein, singular expressions include plural expressions.
Terms such as "below", "lower", "upper", "upside" and the like are used to explain the relationship of the respective constituent elements shown in the drawings. The above terms are relative concepts and are described with reference to the directions shown in the drawings.
It will be understood that terms such as "comprises" or "comprising," when used in this specification, specify the presence of stated features, integers, steps, acts, elements, components, or groups thereof, and are not intended to preclude the presence or addition of one or more other features, integers, steps, acts, elements, components, or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms that are the same as terms defined in commonly used dictionaries should be interpreted as having the same meaning as they are contextually equivalent in the relevant art, unless interpreted in an ideal or excessively formal sense, which is clearly defined herein.
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 is a perspective view of a binding apparatus according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention. Fig. 2 is a sectional view taken along line I to I' of fig. 1.
Referring to fig. 1 and 2, the binding apparatus BD includes a fixing member WJ, a supporting member SM, and a heat insulating member HM.
The binding apparatus BD may be a device that combines various electronic parts on the object panel SB. For example, the binding apparatus BD may be a device that binds at least one of the driving module 10 and the circuit board 20 on the object panel SB.
The object panel SB may include a window WD and a display panel DP. The object panel SB may correspond to a display module (not shown) of a display device (not shown). Electronic parts for driving the display panel DP may be bound on the object panel SB. In this embodiment, the electronic component may include the driving module 10 and the circuit board 20. The electronic parts coupled to the display panel DP are not limited thereto.
In this embodiment, the driving module 10 and the circuit board 20 may be bound to the display panel DP. The object panel SB may include a first portion DP-1P, a second portion DP-2P, and a third portion DP-3P. It may be that the object panel SB includes a display panel DP including a first portion DP-1P, a second portion DP-2P bent from an edge EZ of the first portion DP-1P, and a third portion DP-3P extended from the second portion DP-2P. Accordingly, in the following description, the first, second and third portions DP-1P, DP-2P and DP-3P of the object panel SB may mean the first, second and third portions DP-1P, DP-2P and DP-3P of the display panel DP.
The object panel SB may include a flat portion and a curved portion. In one embodiment, the first portion DP-1P of the object panel SB may correspond to a flat portion, and the second portion DP-2P may correspond to a curved portion. The object panel SB may include more than 1 and less than 4 second portions DP-2P. For example, the display panel DP of the object panel SB may be a 4-sided curved display panel (or a 4-sided edge display panel) including 4 second portions DP-2P. The third portion DP-3P may be a portion extending from one of the at most 4 second portions DP-2P.
In an embodiment, the object panel SB may include an anti-reflection plate (not shown) between the window WD and the display panel DP.
Here, the driving module 10 may include a driving chip (driving IC), and the circuit board 20 may include a flexible circuit board (FPCB).
The driving module 10 may generate a driving signal required for the operation of the display panel DP based on a control signal transmitted from the outside. The driving module 10 may be disposed in a pad region (not shown) in a non-display region (not shown) at an edge of the display panel DP. In this embodiment, the driving module 10 may be disposed on the third portion DP-3P of the display panel DP. In one embodiment, the driving module 10 may provide signals for controlling the pixels of the display panel DP.
The driving module 10 may be electrically connected to the display panel DP by ultrasonic bonding. The driving module 10 may be electrically connected to the display panel DP through an adhesive film. Here, the adhesive Film may be an Anisotropic Conductive Film (ACF).
The driving module 10 may be mounted on the display panel DP in various ways. There are a COG (Chip On Glass) system directly attached to a hard Glass substrate of the display panel DP, a COF (Chip On Film) system as a system of adding another flexible Film to the display panel DP, and a COP (Chip On Plastic) system directly attached to a flexible display panel. In this embodiment, the driving module 10 can be directly attached to the display panel DP by COP. In this embodiment, the display panel DP may include a flexible Polyimide (PI).
The circuit board 20 may be disposed on the display panel DP. The circuit board 20 may correspond to an electronic part that connects a main circuit board (not shown) that drives the display panel DP with the display panel DP. The circuit board 20 may be disposed on the display panel DP by an ultrasonic bonding method or an Anisotropic Conductive Film (ACF).
The driving module 10 and the circuit board 20 may be attached to the display panel DP through a thermal compression process. In this embodiment, the driving module 10 and the circuit board 20 may be respectively disposed on the target panel SB. In other embodiments, the driving module 10 may be disposed on the circuit board 20. In this case, although not shown, the circuit board 20 may be thermally pressed on the display panel DP of the target panel SB, and the driving module 10 may be thermally pressed on the circuit board 20.
The fixing member WJ may fix the window WD. The fixing part WJ may fix the object panel SB combined with the window WD and the display panel DP. The fixing member WJ may contact the upper surface of the window WD to fix the target panel SB. The shape of the fixing member WJ is shown to be the same as that of the window WD, but is not limited thereto, and the shape of the fixing member WJ may be various shapes covering the window WD. For example, the fixing member WJ may correspond to a window jig (window jigs). Here, the window jig may include various shapes of molds or stages (stages) for fixing the window WD combined with the display panel DP.
The support member SM may support the subject panel SB. The support member SM may support the subject panel SB fixed to the fixing member WJ at a lower side. The support member SM may support the first, second, and third portions DP-1P, DP-2P and DP-3P of the subject panel SB. The support members SM may support the first portion DP-1P in the third direction DR3 and the third portion DP-3P in the first direction DR 1. The support member SM may include metal. The support member SM may have a fixed shape.
In one embodiment, the support member SM may support the subject panel SB during the process of bonding the driving module 10 and/or the circuit board 20 to the subject panel SB. For example, the support member SM may support the underside of the third portion DP-3P of the display panel DP during the thermocompression bonding of the driving module 10 and/or the circuit board 20 to the third portion DP-3P of the display panel DP.
In an embodiment, the support member SM may include a first face SM-1S, a second face SM-2S, and a third face SM-3S. The first side SM-1S may contact the first portion DP-1P of the object panel SB, the second side SM-2S may contact the second portion DP-2P, and the third side SM-3S may contact the third portion DP-3P. In one embodiment, the third face SM-3S may support the third portion DP-3P of the subject panel SB during the thermocompression bonding of the driving module 10 and/or the circuit board 20.
In fig. 2, the third portion DP-3P may define a first region 1A and a second region 2A. The first region 1A is a region adjacent to the second portion DP-2P and the second region 2A is a region not adjacent to the second portion DP-2P. The driving module 10 and/or the circuit board 20 may be bonded on the second area 2A.
In an embodiment, the curvature CR of the second face SM-2S of the support member SM may be substantially the same as the curvature CR of the second portion DP-2P of the subject panel SB.
The heat insulating member HM may be disposed on the third portion DP-3P of the target panel SB. The heat insulating member HM may include a heat insulating material that blocks heat. The heat insulating member HM may be disposed in the first region 1A of the target panel SB. The heat insulating member HM may be disposed closer to the first portion DP-1P of the display panel DP than the second area 2A to which the driving module 10 and/or the circuit board 20 are attached. Accordingly, the heat insulating member HM may prevent heat generated during the thermal compression of the driving module 10 and/or the circuit board 20 to the second region 2A from being transferred to the pixel region defined by the first portion DP-1P of the display panel DP.
In an embodiment, the binding apparatus BD may comprise a pressing member PM. The pressing member PM may thermally press the driving module 10 and/or the circuit board 20 on the third portion DP-3P of the subject panel SB.
Fig. 3 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention. Fig. 3 is a sectional view taken along II to II' of fig. 1.
Referring to fig. 3, a third portion DP-3P of the display panel DP may be disposed on the third face SM-3S of the support member SM, and a heat insulating member HM may be disposed on the third portion DP-3P. In an embodiment, the heat insulating member HM may be provided in a film form. The heat insulating member HM may be bonded to the display panel DP by the bonding member AD. For example, the adhesive member AD may include a Pressure Sensitive Adhesive (PSA) or a clear adhesive (OCA). After the driving module 10 and/or the circuit board 20 are thermally pressed on the display panel DP, the heat insulating member HM may be removed from the display panel DP.
In an embodiment, the width WT1 of the heat insulating member HM may be the same as the width WT1 of the third portion DP-3P of the display panel DP. Here, the width WT1 may be a length of the second direction DR 2.
Fig. 4 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention. Fig. 4 is a sectional view taken along III to III' of fig. 1.
Referring to fig. 4, the third portion DP-3P may include a first region 1A and a second region 2A. The first region 1A may be adjacent to the second portion DP-2P and the second region 2A may be spaced from the second portion DP-2P. The heat insulating member HM may be attached to the first area 1A, and the drive module 10 and the circuit board 20 may be attached to the second area 2A. As mentioned above, although the driver module 10 and the circuit board 20 are shown to be disposed in the second area 2A in fig. 4, the present invention is not limited to this, and only the circuit board 20 may be attached to the second area 2A and the driver module 10 may be disposed on the circuit board 20.
Fig. 5 is a perspective view of a support member according to an embodiment of the present invention. Figure 6a is a cross-sectional view of a support member according to an embodiment of the present invention. Fig. 6b is a cross-sectional view of a binding apparatus according to an embodiment of the invention.
Referring to fig. 5 to 6b, the support member SM may include a plurality of holes (Hole) VH on the third face SM-3S. In the figure, 6 holes VH are shown in the second direction DR2, and 3 holes VH are shown in the third direction DR3, but the present invention is not limited thereto. The plurality of holes VH may be vacuum holes. In an embodiment, the plurality of holes VH may overlap the second region 2A of the third portion of the display panel DP. The plurality of holes VH may be arranged to overlap the second region 2A at the third face SM-3S so that the third face SM-3S and the third portion DP-3P of the display panel DP are closely attached.
A plurality of holes VH may be provided to enhance the contact force between the third portion DP-3P and the third face SM-3S in a vacuum state. Here, the contact force may mean a force that can be maintained in a contact state. That is, the plurality of holes VH in the vacuum state may maintain the third surface SM-3S and the second region 2A of the third portion DP-3P in a contact state.
In fig. 6b, a width WT2 of the second direction DR2 of the plurality of holes VH may be substantially the same as a width WT2 of the second direction DR2 of the third portion DP-3P of the display panel DP. The plurality of holes VH may be disposed on one surface of the third surface SM-3S of the support member SM that contacts the third portion DP-3P of the display panel DP.
Fig. 7a and 7b are sequence diagrams illustrating a method of manufacturing a display device according to an embodiment of the invention. Fig. 7a is a sequence diagram illustrating a manufacturing method of a display device, and fig. 7b is a sequence diagram illustrating a binding step of fig. 7 a.
In fig. 7a, a method of manufacturing a display device may include: a laminating step (S710) of combining the display panel and the window; and a binding step (S720) of combining the driving module and/or the circuit board on the display panel. Here, the display device is a concept including the subject panel SB shown in fig. 1 and 2, and the driving module 10 and the circuit board 20 combined with the subject panel SB.
In an embodiment, in the laminating step (S710), the window disposed on the display panel may overlap with the first portion and the second portion of the display panel. An adhesive may be disposed between the window and the display panel. The adhesive may correspond to a pressure sensitive adhesive or a clear adhesive. The laminating step (S710) may include a step of fixing the window by a fixing member. The laminating step (S710) may include the steps of disposing an adhesive under the window fixed to the fixing member and disposing the display panel on the adhesive. The laminating step (S710) may include the steps of disposing a pressure pad under the display panel and pressure-bonding the display panel under the window by expansion of the pressure pad.
In fig. 7b, the binding step (S720) may include the step of mounting a display panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion to the supporting member (S722). The binding step (S720) may include the step (S724) of arranging the driving module and/or the circuit board on the third portion of the display panel supported by one surface of the supporting member. The binding step (S720) may include the step of disposing a heat insulating member in a first region adjacent to the second portion in the third portion (S726). The binding step (S720) may include a step (S728) of pressing the driving modules and/or the circuit boards disposed in the second region except the first region in the third portion to be bound to the display panel. This is illustrated in detail in fig. 8a to 8 d.
Fig. 8a to 8d are sectional views illustrating a method of manufacturing a display device according to an embodiment of the present invention.
In fig. 8a, the manufacturing method of the display device may include a method of combining the driving module 10 and/or the circuit board 20 on the display panel DP by using a binding device. The support member SM may correspond to a table (stage) for supporting the target panel SB. The support member SM may contact the lower surface of the subject panel SB in order to support the subject panel SB fixed by the fixing member WJ. The support member SM is a metal fixed shape and can support the first portion DP-1P, the second portion DP-2P and the third portion DP-3P of the display panel DP of the target panel SB.
The third surface SM-3S of the support member SM contacting the third portion DP-3P of the display panel DP may be provided with a plurality of holes VH. The support member SM may firmly support the third portion DP-3P of the display panel DP through the plurality of holes VH.
In fig. 8b, the binding apparatus BD may comprise a heat insulating member HM. The heat insulating member HM may be disposed on the first region 1A of the third portion DP-3P of the display panel DP. The heat insulating member HM may block heat transfer from the second region 2A to the first portion DP-1P of the display panel DP.
In fig. 8c and 8d, the bonding apparatus BD can effectively attach the driving module 10 and/or the circuit board 20 to the display panel DP. In one embodiment, the supporting member SM of the binding apparatus BD may support the third portion DP-3P during the thermal compression of the driving module 10 and/or the circuit board 20 onto the second area 2A of the display panel DP so that the force pressed by the pressing member PM is sufficiently transmitted to the display panel DP. The heat insulating member HM of the binding apparatus BD can prevent the heat generated during the hot pressing from being transferred to the first portion DP-1P of the display panel DP to cause a defective pixel (not shown).
Fig. 9a and 9b are cross-sectional views of a binding apparatus according to an embodiment of the present invention. Fig. 9a and 9b illustrate a heat insulating member HM according to another embodiment of the present invention.
In fig. 9a, the heat insulating member HM is disposed on the third portion DP-3P. The heat insulating member HM may cover the third portion DP-3P. The heat insulating member HM may be provided in a jig (jigs) form. The heat insulating member HM may be attached to the support member SM. The heat insulating member HM may include a magnet to be engaged with the third face of the support member SM including metal. That is, the heat insulating member HM may be disposed on the third surface SM-3S of the support member so as to surround the third portion DP-3P of the display panel disposed on the support member SM.
In fig. 9b, the heat insulating member HM may include a first heat insulating member HM-1 and a second heat insulating member HM-2. The first heat insulating member HM-1 may be disposed on the supporting member SM. The first heat insulating member HM-1 may be disposed between the supporting member SM and the third portion DP-3P of the display panel. The second heat insulating member HM-2 may be disposed on the third portion DP-3P of the display panel. The first and second heat insulating members HM-1 and HM-2 may be combined with each other. The first and second heat insulating members HM-1 and HM-2 may surround the third portion DP-3P of the display panel in the second direction DR 2.
In an embodiment, the heat insulating member HM in the form of a jig may be removed from the display panel DP after the hot pressing process.
Fig. 10 is a cross-sectional view of a binding apparatus according to an embodiment of the present invention.
In fig. 10, the curvature CR of the second surface SM-2S of the support member SM is variably determined according to the curvature CR of the second portion DP-2P of the subject panel SB. In the present embodiment, the curvature CR of the second face SM-2S of the support member SM may be designed to be the same as the curvature CR of the second portion DP-2P of the subject panel SB. Thus, the third surface SM-3S of the support member SM can effectively support the third portion DP-3P of the subject panel SB. If the curvature CR of the second portion DP-2P of the subject panel SB is greater than or less than 90 degrees, the curvature CR of the second face SM-2S of the support member SM may be greater than or less than 90 degrees according to its design.
As above, embodiments are disclosed in the drawings and the specification. Although specific terms are used herein, they are used for the purpose of describing the present invention only, and are not used for the purpose of limiting the meaning or the scope of the present invention described in the claims. Various modifications and equivalent other embodiments can therefore be understood by those skilled in the art. Therefore, the true technical scope of the present invention should be determined by the technical idea of the appended claims.

Claims (10)

1. A binding apparatus, comprising:
a fixing member disposed above a target panel to fix the target panel, the target panel including a first portion, a second portion bent from an edge of the first portion, and a third portion extending from the second portion and coupled to at least one of a driving module and a circuit board;
a supporting member disposed below the object panel and supporting the object panel in a process of bonding the driving module and the circuit board to the object panel; and
a heat insulating member disposed on the third portion and blocking heat generated during a coupling process of the driving module and the circuit board from being transferred to the first portion and the second portion,
the third portion includes a first region adjacent to the second portion and a second region in which the driving module and the circuit board are combined, and the heat insulating member is disposed on the first region.
2. The binding apparatus of claim 1,
the object panel includes a display panel, a window disposed on the display panel,
the driving module and the circuit board are configured on the display panel.
3. The binding apparatus of claim 1,
the support member comprises metal.
4. The binding apparatus of claim 1,
the support member includes a first face in contact with the first portion of the object panel, a second face in contact with the second portion, and a third face in contact with the third portion,
a plurality of holes are defined in the third face.
5. The binding apparatus of claim 4,
the plurality of holes overlap the second region.
6. The binding apparatus of claim 5,
the plurality of holes are each in a vacuum state and enhance a contact force between the third portion and the third face.
7. The binding apparatus of claim 4,
the curvature of the second face of the support member is the same as the curvature of the second portion of the object panel.
8. The binding apparatus of claim 1,
the binding apparatus further comprises:
and a pressing member for pressing the driving module and the circuit board to be combined with the third portion.
9. The binding apparatus of claim 1,
the heat insulating member is in the form of a film, and an adhesive member is disposed between the heat insulating member and the third portion.
10. The binding apparatus of claim 1,
the heat insulating member is attached to the support member, and the third portion of the object panel is disposed between the heat insulating member and the support member.
CN202011153910.5A 2020-04-21 2020-10-26 Binding device Pending CN113539882A (en)

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KR10-2020-0048299 2020-04-21
KR1020200048299A KR20210130328A (en) 2020-04-21 2020-04-21 Bonding device and manufacturing method of display device using same

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CN103531103A (en) * 2012-06-29 2014-01-22 三星显示有限公司 Display device, and method and apparatus for manufacturing the same
CN106292004A (en) * 2016-08-19 2017-01-04 京东方科技集团股份有限公司 Chip on film and the binding device of display floater and binding method
CN208367362U (en) * 2018-07-27 2019-01-11 信利光电股份有限公司 A kind of binding device
CN109461382A (en) * 2018-12-03 2019-03-12 武汉华星光电半导体显示技术有限公司 Bent panel and preparation method thereof
US20190198476A1 (en) * 2017-12-27 2019-06-27 Samsung Display Co. Ltd. Bonding apparatus and method for using the same
CN110315836A (en) * 2019-07-05 2019-10-11 业成科技（成都）有限公司 Laminating apparatus and applying method
CN110730611A (en) * 2019-09-30 2020-01-24 云谷（固安）科技有限公司 Curved surface display screen binding device and curved surface display screen binding method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531103A (en) * 2012-06-29 2014-01-22 三星显示有限公司 Display device, and method and apparatus for manufacturing the same
CN106292004A (en) * 2016-08-19 2017-01-04 京东方科技集团股份有限公司 Chip on film and the binding device of display floater and binding method
US20190198476A1 (en) * 2017-12-27 2019-06-27 Samsung Display Co. Ltd. Bonding apparatus and method for using the same
CN208367362U (en) * 2018-07-27 2019-01-11 信利光电股份有限公司 A kind of binding device
CN109461382A (en) * 2018-12-03 2019-03-12 武汉华星光电半导体显示技术有限公司 Bent panel and preparation method thereof
CN110315836A (en) * 2019-07-05 2019-10-11 业成科技（成都）有限公司 Laminating apparatus and applying method
CN110730611A (en) * 2019-09-30 2020-01-24 云谷（固安）科技有限公司 Curved surface display screen binding device and curved surface display screen binding method

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