CN113510369A - Laser material reduction machining device and method based on temperature control - Google Patents
Laser material reduction machining device and method based on temperature control Download PDFInfo
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- CN113510369A CN113510369A CN202110912622.1A CN202110912622A CN113510369A CN 113510369 A CN113510369 A CN 113510369A CN 202110912622 A CN202110912622 A CN 202110912622A CN 113510369 A CN113510369 A CN 113510369A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser material reduction processing device and method based on temperature control, which comprises the following steps: the device comprises a light path selection system, a forming chamber, an inert gas source, a non-contact temperature sensor, a computer control device and the like; the surface temperature of a sample to be processed is regulated and controlled by utilizing an infrared laser, a non-contact temperature sensor and inert gas, after the target temperature is reached, a material reducing laser is started to carry out material reducing processing on the sample, and after the material reducing processing is finished, the inert gas source is controlled to carry out cooling processing on the surface of the sample. The invention combines the laser material reducing processing technology with rapid temperature rise/heat preservation, can provide a higher temperature field during the laser material reducing processing, greatly improves the material reducing processing efficiency of the laser, and realizes high efficiency and energy saving; the laser material reducing processing method can meet the requirement of laser material reducing processing of various metal materials, and ensures that a stable temperature field is only provided at the position to be processed of the material, thereby realizing the high-efficiency laser material reducing processing of various metal materials.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a laser material reducing processing device and method based on temperature control.
Background
The laser material reducing processing technology is a laser manufacturing technology corresponding to laser material increase manufacturing, and particularly utilizes the high energy density characteristic of laser to instantly melt or vaporize a material so as to finish the material reducing processing processes of cutting, punching, carving and the like.
For the traditional laser material reducing processing technology such as cutting or punching, the removal rate of the material is improved by changing laser parameters (laser energy density, repetition frequency) or processing parameters (scanning speed, defocusing amount, feeding speed and the like), but the change of the parameters has certain limitation, and when the parameters are modified to a certain degree, the removal rate of the material is hardly influenced, so that the laser material reducing processing efficiency does not meet the requirement expected by a user.
Therefore, it is a topic of great interest for researchers to realize high-efficiency laser material reduction processing by using a laser material reduction processing technology based on temperature control.
Disclosure of Invention
The invention aims to provide a laser material reducing machining device and method based on temperature control, and solves the problem that high-efficiency machining is difficult to realize in the existing laser material reducing machining of metal materials.
In order to achieve the above object, the present invention provides a laser material reducing processing apparatus based on temperature control, comprising: the device comprises a light path selecting system, a forming chamber, an inert gas source, a non-contact temperature sensor, a computer control device, a first port plug, a second port plug, a third port plug and a communicating pipe;
the first port plug, the second port plug and the third port plug are arranged outside the forming chamber; the first port plug, the second port plug and the third port plug are all provided with holes; a cavity is arranged in the forming chamber; the light path selecting system is used for generating laser, and the laser enters the cavity through the hole of the third port plug; the non-contact temperature sensor is inserted into the cavity through the hole of the first port plug; one end of the communicating pipe is inserted into the cavity through the hole of the second port plug, and the other end of the communicating pipe is connected with the inert gas source; the optical path selecting system, the inert gas source, the forming chamber and the non-contact temperature sensor are electrically connected with the computer control device.
Preferably, the optical path selecting system includes: the device comprises a material reduction laser, a material reduction laser beam expander, a material reduction scanning galvanometer, an infrared heating scanning galvanometer, an infrared laser beam expander and an infrared laser;
the material reducing laser is used for generating a femtosecond pulse laser beam; the femtosecond pulse laser beam sequentially passes through the material reduction laser beam expander, the material reduction scanning galvanometer and the hole of the third port plug to enter the cavity; the infrared laser is used for generating an infrared laser beam; the infrared laser beam sequentially passes through the infrared laser beam expander, the infrared heating scanning galvanometer and the hole of the third port plug and enters the cavity; the material reduction laser, the material reduction scanning galvanometer, the infrared heating scanning galvanometer and the infrared laser are all electrically connected with the computer control device.
Preferably, the forming chamber comprises: the device comprises a nozzle, a workbench, a first supporting plate, a processing platform and a second supporting plate;
the processing platform is embedded in the middle of the workbench; the workbench is provided with the first supporting plate and the second supporting plate which are positioned at two sides of the processing platform; the nozzle is fixedly connected with the first supporting plate; the nozzle is also communicated with the communicated inert gas source through the communicating pipe; the second support plate is provided with a hole for the non-contact temperature sensor to pass through the hole of the first port plug and the hole of the second support plate for supporting and fixing; the workbench and the processing platform are electrically connected with the computer control device.
Preferably, the infrared laser is used for generating an infrared laser beam; the wavelength of the infrared laser beam is less than or equal to 1.6 mu m, the heating temperature is 200-700 ℃, the heat preservation time is 10-500 s, and the scanning range is circular, square or elliptical.
Preferably, the material reducing laser is used for generating a femtosecond pulse laser beam; the pulse width of the femtosecond pulse laser beam is 190fs-10ps, the frequency is 1 kHz-1 MkHz, the power is 0-20W, the scanning speed is 1-10 mm/s, and the wavelength is 1030 nm.
A laser material reducing processing method based on temperature control specifically comprises the following steps:
s1, preprocessing a sample to be processed and placing the sample on a position to be processed;
s2, heating the surface of the preprocessed sample to be processed; simultaneously monitoring the temperature of the surface of the pretreated sample to be processed, and regulating the temperature of the position to be processed to a target temperature;
s3, performing material reduction processing on the heated sample;
and S4, cooling the sample after the material reducing processing to room temperature, moving the sample to another position to be processed, and repeating S1-S4 until the material reducing processing of all the positions to be processed is completed.
Preferably, the S2 is specifically:
starting an infrared laser, and controlling the infrared laser and an infrared heating scanning galvanometer of a light path selection system by using a computer control device to convey an infrared laser beam to a forming chamber to heat the surface of a sample to be processed; and simultaneously, controlling a non-contact temperature sensor to monitor the surface temperature of the sample by a computer control device, controlling an inert gas source to deliver inert gas to the forming chamber through a nozzle to regulate the surface temperature of the sample, and controlling the surface temperature to be 200-700 ℃.
Preferably, the S3 is specifically:
and starting the material reducing laser, controlling the material reducing laser and the material reducing scanning galvanometer by using the computer control device to convey the femtosecond pulse laser beam into the forming chamber, and performing material reducing processing on the heated sample.
Preferably, the S4 is specifically:
after the material reducing processing is finished, the material reducing laser and the infrared laser are closed, the computer control device controls the inert gas source to cool the sample to room temperature through the nozzle, and then the inert gas source and the non-contact temperature sensor are closed; and then moving the sample to another position to be processed, and repeating S1-S2 until the material reducing processing of all the positions to be processed is completed.
Preferably, the specific method for monitoring the temperature of the surface of the sample comprises: and controlling the workbench to move horizontally by using a computer control device, controlling the processing platform to move vertically, and enabling the temperature measuring section of the non-contact temperature sensor to be close to the sample to monitor the surface temperature.
Compared with the prior art, the invention has the following technical effects:
(1) the invention combines the laser material reducing processing technology with rapid temperature rise/heat preservation, can provide a higher temperature field during the laser material reducing processing, greatly improves the material reducing processing efficiency of the laser, and realizes high efficiency and energy saving.
(2) The invention uses infrared laser for heating, has short heating time and small heat affected zone, only heats the area of the position to be processed, does not generate heat effect influence on materials at other positions, and does not influence the organization performance of metal materials at other positions.
(3) The laser material reducing processing method can meet the requirement of laser material reducing processing of various metal materials, and ensures that a stable temperature field is only provided at the position to be processed of the material, thereby realizing the high-efficiency laser material reducing processing of various metal materials.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic view of the apparatus of the present invention;
FIG. 2 is a schematic flow chart of the method of the present invention;
FIG. 3 is a graph of the material reduction manufacturing results of samples to be processed in different groove depths according to an embodiment of the present invention;
in the figure, 1-optical path selection system; 101-material reduction laser, 102-material reduction laser beam expander, 103-material reduction scanning galvanometer, 104-infrared heating scanning galvanometer, 105-infrared laser beam expander and 106-infrared laser; 2-forming chamber, 3-inert gas source, 4-nozzle, 5-workbench, 6-first supporting plate, 7-processing platform, 8-second supporting plate, 9-non-contact temperature sensor, 10-computer control device, 11-first port plug, 12-second port plug, 13-third port plug and 14-communicating pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example 1
Since the laser absorption rate of most materials is increased along with the temperature rise, the absorption rate is greatly increased to 40% -50% when the temperature rises to the melting point, and the higher absorption rate enables the materials to absorb more energy to form a deeper molten pool, so that more materials are removed. Based on the method, the non-contact heat source is utilized to provide a certain temperature field for the position of the material to be processed, and the external heating source is used for realizing high-efficiency laser material reduction processing.
Referring to fig. 1, the invention provides a temperature control-based laser material reduction processing device, which comprises a light path selecting system 1, a forming chamber 2, an inert gas source 3, a non-contact temperature sensor 9, a computer control device 10, a first port plug 11, a second port plug 12, a third port plug 13 and a communicating pipe 14;
the first port plug 11, the second port plug 12 and the third port plug 13 are arranged outside the forming chamber 2; holes are formed in the first port plug 11, the second port plug 12 and the third port plug 13; a cavity is arranged in the forming chamber 2; the light path selecting system 1 is used for generating laser, and the laser enters the cavity through the hole of the third port plug 13; the non-contact temperature sensor 9 is inserted into the cavity through the hole of the first port plug 11; one end of the communicating pipe 14 is inserted into the cavity through the hole of the second port plug 12, and the other end is connected with the inert gas source 3; the optical path selecting system 1, the inert gas source 3, the forming chamber 2 and the non-contact temperature sensor 9 are all electrically connected with the computer control device 10.
The optical path selecting system 1 includes: a material reduction laser 101, a material reduction laser beam expander 102, a material reduction scanning galvanometer 103, an infrared heating scanning galvanometer 104, an infrared laser beam expander 105 and an infrared laser 106;
the material reducing laser 101 is used for generating a femtosecond pulse laser beam; the femtosecond pulse laser beam sequentially passes through the material reduction laser beam expander 102, the material reduction scanning galvanometer 103 and the holes of the third port plug 13 to enter the cavity; the infrared laser 106 is used for generating an infrared laser beam; the infrared laser beam sequentially passes through the infrared laser beam expander 105, the infrared heating scanning galvanometer 104 and the holes of the third port plug 13 to enter the cavity; the material reducing laser 101, the material reducing scanning galvanometer 103, the infrared heating scanning galvanometer 104 and the infrared laser 106 are electrically connected with the computer control device 10.
The forming chamber 2 comprises: the device comprises a nozzle 4, a workbench 5, a first supporting plate 6, a processing platform 7 and a second supporting plate 8;
the processing platform 7 is embedded in the middle of the workbench 5 and used for placing a sample; the workbench 5 is provided with the first supporting plate 6 and the second supporting plate 8 which are both positioned at two sides of the processing platform 7; the nozzle 4 is fixedly connected with the first supporting plate 6; the nozzle 4 is also communicated with the communicated inert gas source 3 through the communicating pipe 14 and is used for inputting inert gas into the forming chamber 2; a hole is formed in the second support plate 8, and the non-contact temperature sensor 9 penetrates through the hole of the first port plug 11 and the hole of the second support plate 8 to be supported and fixed; the workbench 5 and the processing platform 7 are electrically connected with the computer control device 10.
The infrared laser 106 is used for generating an infrared laser beam; the wavelength of the infrared laser beam is less than or equal to 1.6 mu m, the heating temperature is 200-700 ℃, the heat preservation time is 10-500 s, and the scanning range is circular, square or elliptical.
The material reducing laser 101 is used for generating a femtosecond pulse laser beam; the pulse width of the femtosecond pulse laser beam is 190fs-10ps, the frequency is 1 kHz-1 MkHz, the power is 0-20W, the scanning speed is 1-10 mm/s, and the wavelength is 1030 nm.
Referring to fig. 2, the invention provides a laser material reduction processing method based on temperature control, which specifically comprises the following steps:
s1, preprocessing a sample to be processed and placing the sample on a position to be processed;
carrying out pretreatment such as polishing, cleaning, drying and the like on the surface of a sample to be processed, and placing the sample on a position to be processed of a processing platform 7;
s2, heating the surface of the preprocessed sample to be processed; simultaneously monitoring the temperature of the surface of the pretreated sample to be processed, and regulating the temperature of the position to be processed to a target temperature;
starting an infrared laser to heat the surface of a sample to be processed: the computer control device 10 is used for controlling the infrared laser 106 and the infrared heating scanning galvanometer 104 of the light path selecting system 1 to convey infrared laser beams into the forming chamber 2 to heat the surface of the workpiece; meanwhile, the computer control device 10 controls the non-contact temperature sensor 9 to monitor the surface temperature of the sample, controls the inert gas source 3 to deliver inert gas into the forming chamber 2 through the nozzle 4 to regulate the surface temperature of the sample, and controls the surface temperature to be 200-700 ℃;
and (3) monitoring the temperature of the surface of the sample: the computer control device 10 is used for controlling the workbench 5 to move horizontally and controlling the processing platform 7 to move vertically, and the temperature measuring section of the non-contact temperature sensor 9 is close to the sample to monitor the surface temperature.
The infrared laser is used for heating, the infrared laser with the wavelength of less than 1.6 mu m is output, the target temperature can be 200-700 ℃, the temperature can be kept for 10-500 s, and the scanning range can realize the circular shape, the square shape and the elliptical shape.
S3, starting a material reducing laser to carry out material reducing processing on the sample: controlling a material reducing laser and a material reducing scanning galvanometer by using a computer control device to perform laser material reducing processing;
the computer control device 10 controls the material reducing laser 101 and the material reducing scanning galvanometer 103 in the optical path selection system 1 connected with the computer control device through electric signals to convey the femtosecond pulse laser beam into the forming chamber 2, and the heated position to be processed is subjected to material reducing processing; the laser power is 1.5W, the spot size is 6.15 μm, the repetition frequency is 10kHz, and the scanning speed is 7 mm/s;
the laser adopted in the laser material reducing processing is a femtosecond pulse laser beam, the pulse width is 190fs-10ps, the frequency is 1 kHz-1 MkHz, the power is 0-20W, the scanning speed is 1-10 mm/s, and the wavelength is 1030 nm.
S4, after finishing the material reducing processing, closing the material reducing laser 101 and the infrared laser 106, and closing the inert gas source 3 and the non-contact temperature sensor 9 after the computer control device 10 controls the inert gas source 3 to cool the sample to room temperature through the nozzle 4; the sample is then moved to another station to be processed, and steps S1 and S2 are repeated until the subtractive processing is completed for all the positions to be processed.
Referring to FIGS. 1 and 2, the present invention will be described by taking Ti6Al4V alloy of 10mm × 10mm × 5mm as an example of a target for laser thinning processing, and selecting a laser power of 1.5W, a spot size of 6.15 μm, a repetition frequency of 10kHz, and a scanning speed of 7 mm/s.
Under the condition that the laser process parameters are not changed, the surface temperature of the sample to be processed is increased, the depth of a groove formed by laser material reduction processing is increased from 5.7 mu m to 6.18 mu m, and the material reduction manufacturing result is shown in figure 3.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention can be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are within the scope of the present invention defined by the claims.
Claims (10)
1. The utility model provides a laser subtracts material processingequipment based on temperature control which characterized in that includes: the device comprises a light path selecting system (1), a forming chamber (2), an inert gas source (3), a non-contact temperature sensor (9), a computer control device (10), a first port plug (11), a second port plug (12), a third port plug (13) and a communicating pipe (14);
the first port plug (11), the second port plug (12) and the third port plug (13) are arranged outside the forming chamber (2); holes are formed in the first port plug (11), the second port plug (12) and the third port plug (13); a cavity is arranged in the forming chamber (2); the light path selecting system (1) is used for generating laser, and the laser enters the cavity through a hole of the third port plug (13); the non-contact temperature sensor (9) is inserted into the cavity through a hole of the first port plug (11); one end of the communicating pipe (14) is inserted into the cavity through a hole of the second port plug (12), the other end of the communicating pipe is connected with the inert gas source (3), and the optical path selecting system (1), the inert gas source (3), the forming chamber (2) and the non-contact temperature sensor (9) are electrically connected with the computer control device (10).
2. The laser material reducing processing device based on temperature control as claimed in claim 1, wherein the optical path selecting system (1) comprises: the device comprises a material reduction laser (101), a material reduction laser beam expander (102), a material reduction scanning galvanometer (103), an infrared heating scanning galvanometer (104), an infrared laser beam expander (105) and an infrared laser (106);
the material reducing laser (101) is used for generating a femtosecond pulse laser beam; the femtosecond pulse laser beam sequentially passes through the material reduction laser beam expander (102), the material reduction scanning galvanometer (103) and the hole of the third port plug (13) to enter the cavity; the infrared laser (106) for generating an infrared laser beam; the infrared laser beam sequentially passes through the infrared laser beam expander (105), the infrared heating scanning galvanometer (104) and the holes of the third port plug (13) to enter the cavity; the material reducing laser (101), the material reducing scanning galvanometer (103), the infrared heating scanning galvanometer (104) and the infrared laser (106) are electrically connected with the computer control device (10).
3. The laser subtractive processing apparatus based on temperature control according to claim 1, wherein the forming chamber (2) comprises: the device comprises a nozzle (4), a workbench (5), a first supporting plate (6), a processing platform (7) and a second supporting plate (8);
the processing platform (7) is embedded in the middle of the workbench (5); the workbench (5) is provided with the first supporting plate (6) and the second supporting plate (8) which are positioned at two sides of the processing platform (7); the nozzle (4) is fixedly connected with the first supporting plate (6); the nozzle (4) is also communicated with the communicated inert gas source (3) through the communicating pipe (14); a hole is formed in the second support plate (8) and used for supporting and fixing the non-contact temperature sensor (9) after penetrating through the hole of the first port plug (11) and the hole of the second support plate (8); the workbench (5) and the processing platform (7) are electrically connected with the computer control device (10).
4. The laser subtractive processing apparatus based on temperature control according to claim 2, wherein the infrared laser (106) is adapted to generate an infrared laser beam; the wavelength of the infrared laser beam is less than or equal to 1.6 mu m, the heating temperature is 200-700 ℃, the heat preservation time is 10-500 s, and the scanning range is circular, square or elliptical.
5. The laser subtractive processing apparatus based on temperature control according to claim 2, wherein the subtractive laser (101) is adapted to generate a femtosecond pulsed laser beam; the pulse width of the femtosecond pulse laser beam is 190fs-10ps, the frequency is 1 kHz-1 MkHz, the power is 0-20W, the scanning speed is 1-10 mm/s, and the wavelength is 1030 nm.
6. A laser material reducing processing method based on temperature control is characterized by comprising the following steps:
s1, preprocessing a sample to be processed and placing the sample on a position to be processed;
s2, heating the surface of the preprocessed sample to be processed; simultaneously monitoring the temperature of the surface of the pretreated sample to be processed, and regulating the temperature of the position to be processed to a target temperature;
s3, performing material reduction processing on the heated sample;
and S4, cooling the sample after the material reducing processing to room temperature, moving the sample to another position to be processed, and repeating S1-S4 until the material reducing processing of all the positions to be processed is completed.
7. The laser material reducing processing method based on temperature control as claimed in claim 6, wherein the step S2 is specifically as follows:
starting an infrared laser (106), and controlling the infrared laser (106) and an infrared heating scanning galvanometer (104) of a light path selection system (1) by using a computer control device (10) to convey an infrared laser beam into a forming chamber (2) to heat the surface of a sample to be processed; meanwhile, the computer control device (10) controls the non-contact temperature sensor (9) to monitor the surface temperature of the sample, controls the inert gas source (3) to deliver inert gas into the forming chamber (2) through the nozzle (4) to regulate the surface temperature of the sample, and controls the surface temperature to be 200-700 ℃.
8. The laser material reducing processing method based on temperature control as claimed in claim 6, wherein the step S3 is specifically as follows:
and starting the material reducing laser (101), controlling the material reducing laser (101) and the material reducing scanning galvanometer (103) by using a computer control device (10) to convey the femtosecond pulse laser beam into the forming chamber (2), and performing material reducing processing on the heated sample.
9. The laser material reducing processing method based on temperature control as claimed in claim 6, wherein the step S4 is specifically as follows:
after the material reducing processing is finished, the material reducing laser (101) and the infrared laser (106) are closed, the computer control device (10) controls the inert gas source (3) to cool the sample to room temperature through the nozzle (4), and then the inert gas source (3) and the non-contact temperature sensor (9) are closed; and then moving the sample to another position to be processed, and repeating S1-S2 until the material reducing processing of all the positions to be processed is completed.
10. The laser material reducing processing method based on temperature control as claimed in claim 7, wherein the specific method for monitoring the temperature of the surface of the sample is as follows: the computer control device (10) is used for controlling the workbench (5) to move horizontally and controlling the processing platform (7) to move vertically, and the temperature measuring section of the non-contact temperature sensor (9) is close to the sample to monitor the surface temperature.
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