CN109702326A - A kind of devices and methods therefor improving laser boring depth - Google Patents
A kind of devices and methods therefor improving laser boring depth Download PDFInfo
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- CN109702326A CN109702326A CN201910040482.6A CN201910040482A CN109702326A CN 109702326 A CN109702326 A CN 109702326A CN 201910040482 A CN201910040482 A CN 201910040482A CN 109702326 A CN109702326 A CN 109702326A
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Abstract
The invention discloses a kind of devices and methods therefors for improving laser boring depth, including processing platform, fixture, workpiece, double focusing lens, acousto-optic Zoom lens, dichronic mirror, beam expander, laser, laser controller, acousto-optic Zoom lens controller, computer, processing platform controller and CCD camera.The present invention is focused light beam using bifocal focus lamp, so that focus on light beam is obtained two focuses, and realize that the fast reciprocating of two focuses in vertical direction is mobile by the continuous fast zoom ability of acousto-optic Zoom lens.The present invention can obviously increase laser micropore working depth, increase depth in millimeter magnitude, and can get through thicker material.In addition, the present invention can influence to avoid energy concentrations to microvia quality, reduce heat affecting, improve drilling quality.
Description
Technical field
The invention belongs to laser boring fields, more particularly to a kind of devices and methods therefor for improving laser boring depth.
Background technique
Laser boring is to obtain the temperature of several thousand degrees celsius in focal position by being focused to high energy laser beam, from
And make workpiece material that can eventually form micropore by rapid fusing, vaporization under the action of this high temperature.Laser drilling tool
Have the advantages that trepanning velocity is fast, high financial profit, rapidoprint range is wide, pollution-free, especially in the laser of aerospace industries
There is apparent advantage in group's hole machined.
But with the further development of industry, high aspect ratio micropore using more and more, it is especially important in national defence etc.
Field, the depth for how further increasing laser boring have become an important research problem in the field.Publication No.
CN104907712A Chinese patent " it is a kind of increase stainless steel laser punching depth new method " by stainless steel surface from
Gold nano metal particle layer is assembled, subsequent laser treatment increases punch position temperature sharply, and then increases punching depth.But
The method that the patent proposes is complicated for operation, and suitable material is limited, and limited to the increase of micropore depth.Publication No.
The Chinese patent " laser processing device " of CN102825382A provides change and changes for efficiency present in chip processing
The thickness of matter layer modifies the laser processing device of layer to be formed.It can be in semiconductor and with pulse laser light run-down
The inside of chip forms the modification layer of expectation thickness (such as 50~200 μm).Although obtaining modification thickness degree using the present apparatus
It increases, but if being applied in laser boring, corresponding micropore depth value added will be in micron dimension, and due to laser boring
Usually removal material forms micropore, modifies relative to chip, and depth increase is more difficult, so practical increased depth can be more
Small, for the micropore of laser boring millimeter magnitude depth, increased thickness is too small for this.
Summary of the invention
To solve the above problems, the invention proposes a kind of devices and methods therefor for improving laser boring depth, the device
The depth of laser boring can be significantly improved by using double focusing lens and acousto-optic Zoom lens, in addition, double focusing lens with
The combined use of acousto-optic Zoom lens so that focus will not same position of the long duration of action on workpiece, and then reduce heat
It influences, improves drilling quality.
The present invention is achieved by following technical solution:
A kind of device improving laser boring depth, including processing platform, fixture, workpiece, double focusing lens, acousto-optic are variable
Focus lens, dichronic mirror, beam expander, laser, laser controller, acousto-optic Zoom lens controller, computer, processing platform control
Device processed and CCD camera；
The CCD camera be located at the top and with calculate mechatronics, be sequentially placed dichronic mirror, sound immediately below CCD camera
Light Zoom lens, double focusing lens and workpiece；The workpiece is fixed on fixture, and the processing that is fixed on of the fixture is put down
On platform；
The laser, beam expander and dichronic mirror are sequentially located in same optical path；One end of the laser controller and swash
The electrical connection of light device, the other end and calculating mechatronics；
One end of the processing platform controller is electrically connected with processing platform, the other end and calculating mechatronics.
In above scheme, the dichronic mirror and horizontal direction are in 45 degree of angles；The laser of the laser transmitting passes sequentially through
Beam expander, dichronic mirror, acousto-optic Zoom lens and bifocal focus lamp act on workpiece.
In above scheme, the laser that the dichronic mirror only issues wavelength to laser is totally reflected, and to other wavelength
Light can be saturating.
In above scheme, the acousto-optic Zoom lens are controlled by the way of acousto-optic, focus axial reciprocating moving distance
In millimeter magnitude, moving back and forth frequency may be up to 1000KHz.
In above scheme, the double focusing lens include outer curved surface and median curved surface, and outer curved surface wraps centre
Curved surface, the focal length of middle section is longer (referred to as descending focal length, focus is lower focus), exterior portion focal length it is shorter (referred to as upper focal length,
Focus is upper focus)；The focal length of median curved surface is greater than outer curved surface focal length.
A method of laser boring depth is improved, light beam is focused using bifocal focus lamp, obtains focus on light beam
Two focuses, and realize two focuses in vertical direction quick by the continuous fast zoom ability of acousto-optic Zoom lens
It moves back and forth.
Specifically includes the following steps:
S1, the workpiece handled well is fixed on fixture, fixture is fixed on processing platform；
S2, CCD camera monitoring under, using processing platform controller control processing platform, adjust workpiece position carry out
Tool setting position has been recorded to knife, and by computer；
S3, output parameter of the laser output for the laser beam of laser processing is set by laser controller；
S4, the running parameter that acousto-optic Zoom lens are set by acousto-optic Zoom lens controller；
S5, pass through the good all Working positions of computer settings, and workpiece is moved to initial manufacture position；
S6, it opens simultaneously laser and acousto-optic Zoom lens process workpiece, is formed in work pieces process region small
Hole；
After S7, aperture process finishing, laser is first closed, is then turned off acousto-optic Zoom lens；
Processing platform is moved to next Working position by S8, benefit the processing platform controller that computerizeds control；
S9, above step S6~S8 is repeated, the next position of workpiece is processed, until all hole machineds finish.
In above scheme, it is on the upper focal point to workpiece by bifocal focus lamp to knife mode described in the step S2,
And this position is set as 0 point of Z-direction, workpiece surface is not necessarily in 0 position of Z-direction in actual processing.Actual processing
It is Z=1mm that the location of workpiece, which can be set, i.e. workpiece surface 1mm on focus on bifocal focus lamp；It may also set up workpiece position
It is set to Z=-1mm, i.e. workpiece surface 1mm under focus on bifocal focus lamp.
In above scheme, acousto-optic Zoom lens are set by acousto-optic Zoom lens controller described in the step S4
The parameter of running parameter, setting mainly includes acousto-optic Zoom lens focus axial reciprocating moving distance (Z-direction), back and forth
Travel frequency.After each acousto-optic Zoom lens work, restore initial setting up automatically, at this point, laser beam can by acousto-optic
Focal position after zoom lens and bifocal focus lamp focus is focus initial position, and focus is in the axis moved back and forth at this time
To extreme higher position.
In above scheme, the laser can be continuous wave laser or pulse laser；When laser is pulse laser
When device, laser pulse repetition frequency has to the reciprocating movement frequency greater than acousto-optic Zoom lens in the machined parameters of setting.
Compared with prior art, the beneficial effects of the present invention are:
1. being focused using bifocal focus lamp to light beam, focus on light beam is set to obtain two focuses, and variable by acousto-optic
The continuous fast zoom ability of focus lens realizes that the fast reciprocating of two focuses in vertical direction is mobile, can obviously increase micropore
Working depth increases depth in millimeter magnitude, and can get through thicker material.
2. bifocal focus lamp is used, since there are two focuses, the energy of each focal point does not have common focus lamp single
The energy of focal point is concentrated, and influence of the energy concentrations to microvia quality is avoided.In addition, acousto-optic Zoom lens may make
Focus fast moves so that focus will not same position of the long duration of action on workpiece, and then reduce heat affecting, improve punching
Quality.
3. the degree of automation of the present invention is higher, workpiece need to only be had good positioning, can be realized automatically by computer programming
Change processing.
4. the laser that dichronic mirror only issues wavelength to laser is totally reflected, and can be saturating to the light of other wavelength, make CCD
The picture of camera shooting is more clear.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the device of raising laser boring depth of embodiment of the present invention；
Fig. 2 is the bifocal focus lamp schematic diagram being related in figure of the present invention；
Fig. 3 be the present invention relates to a kind of raising laser boring depth method flow diagram.
Appended drawing reference is as follows:
1. processing platform, 2. fixtures, 3. workpiece, 4. double focusing lens, 5. acousto-optic Zoom lens, 6. dichronic mirrors, 7. expand
Beam device, 8. lasers, 9. laser controllers, 10. acousto-optic Zoom lens controllers, 11. computers, the control of 12 processing platforms
Device, 13.CCD camera；
Specific embodiment
Invention is further described in detail with reference to the accompanying drawings and detailed description, but protection scope of the present invention
It is not limited to this.
Embodiment one:
A kind of device improving laser boring depth, including processing platform 1, fixture 2, workpiece 3, double focusing lens 4, acousto-optic
Zoom lens 5, dichronic mirror 6, beam expander 7, laser 8, laser controller 9, acousto-optic Zoom lens controller 10, computer
11, processing platform controller 12 and CCD camera 13；The CCD camera 13 is located at the top and is electrically connected with computer 11, CCD
Dichronic mirror 6, acousto-optic Zoom lens 5, double focusing lens 4 and workpiece 3 are sequentially placed immediately below camera 13；The workpiece 3 is fixed
On fixture 2, the fixture 2 is fixed on processing platform 1；The laser 8, beam expander 7 and dichronic mirror 6 successively position
In in same optical path；One end of the laser controller 9 is electrically connected with laser 8, and the other end is electrically connected with computer 11；It is described
One end of processing platform controller 12 is electrically connected with processing platform 1, and the other end is electrically connected with computer 11.Using bifocal focus lamp
4 pairs of light beams are focused, and so that focus on light beam is obtained two focuses, and by the continuous fast zoom ability of acousto-optic Zoom lens 5
It realizes that the fast reciprocating of two focuses in vertical direction is mobile, capillary processing depth can be obviously increased, increase depth in milli
Rice magnitude, and thicker material can be got through.
The dichronic mirror 6 is in 45 ° with horizontal direction；The laser that the laser 8 emits passes sequentially through beam expander 7, color separation
Mirror 6, acousto-optic Zoom lens 5 and bifocal focus lamp 4 act on workpiece 3.
The laser that the dichronic mirror 6 only issues wavelength to laser 8 is totally reflected, and can be saturating to the light of other wavelength.
The acousto-optic Zoom lens 5 are controlled by the way of acousto-optic, and continuous fast zoom may be implemented, and focal axis is yearned for
Multiple moving distance is millimeter magnitude (can be more than 10mm), and reciprocating movement frequency may be up to 1000KHz, and (reciprocating movement frequency is focus
It moves back and forth once, is returned to the inverse the time required to initial position).
In conjunction with shown in attached drawing 2, the double focusing lens 4 are made of two different curves, and the focal length of middle section is longer (to be claimed
For lower focal length, focus is lower focus), exterior section focal length is shorter (referred to as upper focal length, focus are upper focus).It is intermediate by changing
(focus difference Δ F, Δ F are that millimeter magnitude generally sets it to work when getting through hole for partial diameter (2h), bifocal distance
The thickness of part 3) it can change Energy distribution of the laser energy on workpiece 3, and then reach optimal punching effect.
Embodiment two:
A kind of drilling method for the device improving laser boring depth, is focused light beam using bifocal focus lamp 4, makes
Focus on light beam obtains two focuses, and realizes two focuses vertical by the continuous fast zoom ability of acousto-optic Zoom lens 5
Fast reciprocating on direction is mobile.Flow chart as shown in figure 3, specifically includes the following steps:
S1, the workpiece 3 handled well is fixed on fixture 2, fixture 2 is fixed on processing platform 1；
S2, CCD camera 13 monitoring under, utilize processing platform controller control processing platform 1, adjust workpiece 3 position
It carries out to knife, and tool setting position has been recorded by computer 11；
S3, output parameter of the output of laser 8 for the laser beam of laser processing is set by laser controller 9；
S4, the running parameter that acousto-optic Zoom lens 5 are set by acousto-optic Zoom lens controller 10；
S5, all Working positions are set by computer 11, and workpiece 3 is moved to initial manufacture position；
S6, laser 8 is opened simultaneously and acousto-optic Zoom lens 5 process workpiece 3, in 3 machining area shape of workpiece
At aperture；
After S7, aperture process finishing, laser 8 is first closed, acousto-optic Zoom lens 5 are then turned off；
S8, processing platform 1 is moved to next Working position using the control processing platform controller 12 of computer 11；
S9, above step S6~S8 is repeated, the next position of workpiece 3 is processed, until all hole machineds finish.
It is on the upper focal point to workpiece 3 by bifocal focus lamp 4 to knife mode described in the step S2, and by this position
It is set as 0 point of Z-direction, 3 upper surface of workpiece is not necessarily in 0 position of Z-direction in actual processing.
The work ginseng of acousto-optic Zoom lens 5 is set described in the step S4 by acousto-optic Zoom lens controller 10
The parameter of number, setting mainly includes 5 focus axial reciprocating moving distance (Z-direction) of acousto-optic Zoom lens, is moved back and forth
Frequency.After each acousto-optic Zoom lens 5 work, restore initial setting up automatically, at this point, laser beam is varifocal by acousto-optic
Focal position after lens 5 and bifocal focus lamp 4 focus is focus initial position, and focus is in the axial direction moved back and forth at this time
Extreme higher position.
The laser 8 can be continuous wave laser or pulse laser；When laser 8 is pulse laser, setting
Machined parameters in laser pulse repetition frequency have to the reciprocating movement frequency greater than acousto-optic Zoom lens 5.
Above-mentioned technical proposal embodies the preferred embodiment of the invention patent, and those skilled in the art are to partial function
It modifies and embodies this patent principle, belong within the scope of this patent.
Claims (10)
1. it is a kind of improve laser boring depth device, which is characterized in that including processing platform (1), fixture (2), workpiece (3),
Double focusing lens (4), acousto-optic Zoom lens (5), beam expander (7), laser (8), laser controller (9), acousto-optic are varifocal
Lens controller (10), computer (11) and processing platform controller (12)；
Acousto-optic Zoom lens (5), double focusing lens (4) and workpiece (3) are set gradually from top to bottom；The workpiece (3) is solid
It is scheduled on fixture (2), the fixture (2) is fixed on processing platform (1)；
The laser (8), beam expander (7) are sequentially located in same optical path；One end of the laser controller (9) and laser
(8) it is electrically connected, the other end is electrically connected with computer (11)；
One end of the processing platform controller (12) is electrically connected with processing platform (1), and the other end is electrically connected with computer (11).
2. a kind of device for improving laser boring depth according to claim 1, which is characterized in that dichronic mirror (6) setting
In acousto-optic Zoom lens (5) top position, the dichronic mirror (6) and horizontal direction are in 45 ° of settings；It is set above dichronic mirror (6)
It is equipped with CCD camera (13)；It is varifocal that the laser of laser (8) transmitting passes sequentially through beam expander (7), dichronic mirror (6), acousto-optic
Lens (5) and bifocal focus lamp (4) act on workpiece (3).
3. a kind of device for improving laser boring depth according to claim 2, which is characterized in that the dichronic mirror (6)
The laser only issued to laser (8) is totally reflected, and can be saturating to the light of other wavelength.
4. a kind of device for improving laser boring depth according to claim 1, which is characterized in that the acousto-optic is varifocal
Lens (5) are controlled by sound and light.
5. a kind of device for improving laser boring depth according to claim 1, which is characterized in that the double focusing lens
It (4) include outer curved surface and median curved surface, and outer curved surface wraps median curved surface；Wherein, the focal length of median curved surface is greater than outer
Portion's curved surface focal length.
6. a kind of drilling method using the device for improving laser boring depth described in claim 1, which is characterized in that using double
Burnt focus lamp (4) is focused light beam, so that focus on light beam is obtained two focuses, and continuous by acousto-optic Zoom lens (5)
Fast zoom ability realizes that the fast reciprocating of two focuses in vertical direction is mobile；Specifically includes the following steps:
S1, the workpiece handled well (3) is fixed on fixture (2), fixture (2) is fixed on processing platform (1)；
S2, CCD camera (13) monitoring under, utilize processing platform controller control processing platform (1), adjust workpiece (3) position
It sets and carries out to knife, and recorded tool setting position by computer (11)；
S3, the output parameter by laser controller (9) setting laser (8) output for the laser beam of laser processing；
S4, pass through the running parameter of acousto-optic Zoom lens controller (10) setting acousto-optic Zoom lens (5)；
S5, all Working positions are set by computer (11), and workpiece (3) is moved to initial manufacture position；
S6, laser (8) is opened simultaneously and acousto-optic Zoom lens (5) process workpiece (3), in workpiece (3) processing district
Domain forms aperture；
After S7, aperture process finishing, laser (8) first are closed, are then turned off acousto-optic Zoom lens (5)；
S8, processing platform (1) is moved to next Working position using computer (11) control processing platform controller (12)；
S9, above step S6~S8 is repeated, workpiece (3) next position is processed, until all hole machineds finish.
7. the drilling method of the device according to claim 6 for improving laser boring depth, which is characterized in that in step S2
Be and this position to be set as 0 point of Z-direction on the upper focal point of bifocal focus lamp (4) to workpiece (3) to knife mode.
8. the drilling method of the device according to claim 6 for improving laser boring depth, which is characterized in that step S4 is logical
The running parameter of acousto-optic Zoom lens controller (10) setting acousto-optic Zoom lens (5) is crossed, the running parameter of setting is main
Distance is moved back and forth axially along Z-direction including acousto-optic Zoom lens (5) focus, moves back and forth frequency.
9. the drilling method of the device according to claim 6 for improving laser boring depth, which is characterized in that the laser
Device (8) is continuous wave laser or pulse laser.
10. the drilling method of the device according to claim 9 for improving laser boring depth, which is characterized in that work as laser
When device (8) is pulse laser, laser pulse repetition frequency is greater than the reciprocating movement frequency of acousto-optic Zoom lens (5).
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111843246A (en) * | 2020-08-05 | 2020-10-30 | 中国工程物理研究院激光聚变研究中心 | Laser longitudinal drilling method based on defocusing control technology |
| WO2021036270A1 (en) * | 2019-08-30 | 2021-03-04 | 温州大学 | Femtosecond laser-machining hole drilling device having controllable taper, and hole drilling process thereof |
| CN113210893A (en) * | 2021-05-20 | 2021-08-06 | 武汉锐科光纤激光技术股份有限公司 | Composite laser drilling method and laser drilling device |
| CN115008012A (en) * | 2022-07-05 | 2022-09-06 | 中国科学院力学研究所 | Zoom point laser welding method and device |
| CN116689950A (en) * | 2023-07-19 | 2023-09-05 | 苏州思萃声光微纳技术研究所有限公司 | Device for machining cooling film holes of aero-engine parts and real-time detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021036270A1 (en) * | 2019-08-30 | 2021-03-04 | 温州大学 | Femtosecond laser-machining hole drilling device having controllable taper, and hole drilling process thereof |
| US11865643B2 (en) * | 2019-08-30 | 2024-01-09 | Lyncwell Innovation Intelligent System (zhejiang) Co., Ltd. | Drilling device with controllable femtosecond laser processing taper and drilling process thereof |
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| CN113210893A (en) * | 2021-05-20 | 2021-08-06 | 武汉锐科光纤激光技术股份有限公司 | Composite laser drilling method and laser drilling device |
| CN115008012A (en) * | 2022-07-05 | 2022-09-06 | 中国科学院力学研究所 | Zoom point laser welding method and device |
| CN116689950A (en) * | 2023-07-19 | 2023-09-05 | 苏州思萃声光微纳技术研究所有限公司 | Device for machining cooling film holes of aero-engine parts and real-time detection method |
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Application publication date: 20190503 |