CN113504397A - Intelligent probe card based on 32-bit MCU chip test - Google Patents
Intelligent probe card based on 32-bit MCU chip test Download PDFInfo
- Publication number
- CN113504397A CN113504397A CN202110799908.3A CN202110799908A CN113504397A CN 113504397 A CN113504397 A CN 113504397A CN 202110799908 A CN202110799908 A CN 202110799908A CN 113504397 A CN113504397 A CN 113504397A
- Authority
- CN
- China
- Prior art keywords
- substrate
- probe
- baffle
- mcu chip
- card based
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 94
- 238000012360 testing method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 61
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000000007 visual effect Effects 0.000 claims abstract description 9
- 239000012943 hotmelt Substances 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 abstract description 10
- 230000004927 fusion Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention discloses an intelligent probe card based on 32-bit MCU chip test, wherein a micro electromagnet is fixedly arranged at the middle end in a substrate from top to bottom, a relay is fixedly arranged at the lower side of the front end of the substrate, visual detectors are fixedly arranged at the left side and the right side of the front end of the substrate, probes are slidably arranged at the left side and the right side in the substrate from top to bottom, a baffle is fixedly arranged on the outer wall of the probe, a spring is fixedly arranged on the side wall of the baffle, an insulating sleeve is fixedly arranged at the port at the inner side of the probe, an iron core is fixedly arranged in the insulating sleeve, firstly, the probe can detect signals of the chip, secondly, the visual detectors can scan the model of the chip to be detected, and finally, the micro electromagnet and the relay are favorably controlled according to the detection result, so that the iron core drives the insulating sleeve to link the probe and the baffle to overcome the resilience of the spring to slide, and the probes at corresponding positions can be matched according to the model of the chip to be detected, the test of satisfying a plurality of model chips also reaches intelligent regulation and control purpose simultaneously.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to an intelligent probe card based on 32-bit MCU chip testing.
Background
In the manufacture of Integrated Circuits (ICs), a probe card is used to test the ICs on a wafer before the ICs are packaged. Probe cards are typically electrically connected to a tester (tester) and a test object (DUT) including integrated circuits and the like. The stable connection between each pin (pad) on the integrated circuit and the tester is achieved through the probe card, so that the defective products are screened out, the yield of the integrated circuit is tested, and then packaging is carried out. Probe cards are a critical tool in monitoring yield of finished products, and are therefore of great importance in the design and manufacture of integrated circuits.
According to the above, the probe card in the prior art is generally simple in structure, and a probe card with one structure type can only detect corresponding chips, so that when chips of multiple models need to be detected, a probe card with a new structure needs to be newly developed, so that the test cost is increased, and the time for producing and manufacturing the chips is greatly prolonged. Therefore, in view of the above drawbacks, it is actually necessary to design an intelligent probe card based on 32-bit MCU chip test.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the intelligent probe card based on 32-bit MCU chip test is provided to solve the problems in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows: an intelligent probe card based on 32-bit MCU chip testing comprises a substrate, a plurality of micro electromagnets, a relay, a vision detector, probes, a baffle, a spring, an insulating sleeve and an iron core, wherein the number of the micro electromagnets is a plurality, the micro electromagnets are fixedly arranged at the middle end in the substrate from top to bottom, the front and back ends of each micro electromagnet are in hot melt connection with the substrate, the relay is fixedly arranged at the lower side of the front end of the substrate and is in hot melt connection with the substrate, the relay and the substrate are in hot melt connection, the relay and the micro electromagnets are electrically connected, the vision detector is fixedly arranged at the left side and the right side of the front end of the substrate, the vision detector and the substrate are in hot melt connection, the vision detector and the relay are electrically connected, the number of the probes is a plurality, the probes are arranged at the left side and the right side in the substrate from top to bottom in a sliding manner, the utility model discloses an insulation cover, including probe and base plate, baffle, spring and base plate, the probe adopt horizontal sliding connection, the baffle set firmly in the probe outer wall, baffle and probe adopt hot melt to be connected, just baffle and base plate adopt horizontal sliding connection, the spring set firmly in the baffle lateral wall, spring and baffle adopt hot melt to be connected, just spring and base plate adopt hot melt to be connected, insulation cover set firmly in probe inside port, insulation cover and probe adopt hot melt to be connected, the iron core set firmly inside the insulation cover, iron core and insulation cover adopt hot melt to be connected.
Furthermore, the upper side of the front end of the substrate is fixedly provided with a programmable control module, the programmable control module is connected with the substrate in a hot melting manner, and the programmable control module is electrically connected with the micro electromagnet, the relay and the visual detector.
Furthermore, a transmission interface is fixedly arranged at the top end inside the substrate and is connected with the substrate in a hot melting mode.
Furthermore, the upper end in the substrate is fixedly provided with an A/D converter, the A/D converter is connected with the substrate in a hot melting mode, and the A/D converter is electrically connected with the transmission interface.
Furthermore, the middle end in the substrate is also provided with a first avoidance cavity which is a rectangular cavity.
Furthermore, the left side and the right side inside the substrate are also provided with second avoidance cavities which are rectangular cavities.
Furthermore, the first cavity inner wall of keeping away still set firmly the probe cover from last to the left and right sides down, probe cover and base plate adopt hot melt to be connected, just probe cover and probe adopt side to side sliding connection, probe cover and AD converter adopt electric connection.
Compared with the prior art, the intelligent probe card based on 32-bit MCU chip test has the following advantages:
1. firstly, the probe can contact a pin interface on the 32-bit MCU chip, and signal detection on the 32-bit MCU chip is facilitated subsequently.
2. Secondly, before detection, the vision detector can scan the chip model or the corresponding pin interface position to be detected.
3. At last, the micro-electromagnet and the relay are controlled favorably according to the detection result of the vision detector, so that the iron core drives the insulating sleeve linkage probe and the baffle to overcome the resilience of the spring to slide.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a front view of an intelligent probe card based on 32-bit MCU chip testing;
FIG. 2 is a top view of an intelligent probe card based on 32-bit MCU chip testing;
FIG. 3 is a sectional view of an intelligent probe card based on 32-bit MCU chip test in the A direction;
FIG. 4 is an enlarged cross-sectional view of the probe site;
FIG. 5 shows an intelligent probe card based on 32-bit MCU chip testPerspective view 1；
FIG. 6 is a diagram of an intelligent probe card based on 32-bit MCU chip testA perspective view of fig. 2;
FIG. 7 isA separation state perspective view of an intelligent probe card based on 32-bit MCU chip test;
fig. 8 is an enlarged perspective view of the probe.
The device comprises a substrate 1, a micro electromagnet 2, a relay 3, a vision detector 4, a probe 5, a baffle 6, a spring 7, an insulating sleeve 8, an iron core 9, a programmable control module 101, a transmission interface 102, an A/D converter 103, a first cavity 104, a second cavity 105 and a probe sleeve 106.
The following detailed description will be further described in conjunction with the above-identified drawings.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments, however, it will be apparent to one skilled in the art that the described embodiments may be practiced without some or all of these specific details, and in other cases well-known process steps have not been described in detail.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the invention.
As shown in fig. 1, 2, 3, 4, 5, 6, 7, 8, an intelligent probe card based on 32-bit MCU chip test comprises a substrate 1, a micro-electromagnet 2, a relay 3, a vision detector 4, a probe 5, a baffle 6, a spring 7, an insulating sleeve 8, and an iron core 9, wherein the number of the micro-electromagnet 2 is several, the micro-electromagnet 2 is fixedly arranged at the middle end inside the substrate 1 from top to bottom, the front and rear ends of the micro-electromagnet 2 are connected with the substrate 1 by thermal fusion, the relay 3 is fixedly arranged at the lower side of the front end of the substrate 1, the relay 3 is connected with the substrate 1 by thermal fusion, the relay 3 is electrically connected with the micro-electromagnet 2, the vision detector 4 is fixedly arranged at the left and right sides of the front end of the substrate 1, the vision detector 4 is connected with the substrate 1 by thermal fusion, and the vision detector 4 is electrically connected with the relay 3, the number of the probes 5 is a plurality of pieces, the probes 5 are arranged on the left side and the right side inside the substrate 1 in a sliding mode from top to bottom, the probes 5 are connected with the substrate 1 in a sliding mode from left to right, the baffle 6 is fixedly arranged on the outer wall of the probes 5, the baffle 6 is connected with the probes 5 in a hot melting mode, the baffle 6 is connected with the substrate 1 in a sliding mode from left to right, the spring 7 is fixedly arranged on the side wall of the baffle 6, the spring 7 is connected with the baffle 6 in a hot melting mode, the spring 7 is connected with the substrate 1 in a hot melting mode, the insulating sleeve 8 is fixedly arranged on an inner end opening of the probes 5, the insulating sleeve 8 is connected with the probes 5 in a hot melting mode, the iron core 9 is fixedly arranged inside the insulating sleeve 8, and the iron core 9 is connected with the insulating sleeve 8 in a hot melting mode;
it should be noted that the intelligent probe card based on 32-bit MCU chip test has the following functions;
A. the probe 5 can contact a pin interface on the 32-bit MCU chip, so that the subsequent signal detection of the 32-bit MCU chip is facilitated;
B. before detection, the vision detector 4 can scan the chip type to be detected or the corresponding pin interface position;
C. the relay 3 is triggered according to the chip model or the pin interface position detected by the vision detector 4, namely the relay 3 is favorable for controlling the micro electromagnet 2 at the corresponding position to generate magnetism, namely the iron core 9 at the matched position can be attracted towards the inside of the substrate 1 under the action of magnetic attraction, so that the iron core 9 drives the insulating sleeve 8 to link the probe 5 and the baffle 6 to overcome the resilience of the spring 7 to slide, through the operation, the probe 5 at the corresponding position can be matched according to the chip model or the corresponding pin interface position to be detected, the test requirements of a plurality of models of chips are finally well met, and meanwhile, the intelligent regulation and control purpose is also achieved;
the upper side of the front end of the substrate 1 is fixedly provided with a programmable control module 101, the programmable control module 101 is in hot-melt connection with the substrate 1, and the programmable control module 101 is electrically connected with the micro electromagnet 2, the relay 3 and the visual detector 4;
it should be noted that the programmable control module 101 can be programmed to set control commands for the micro-electromagnet 2, the relay 3 and the visual detector 4, which is beneficial to the visual detection and analysis of the visual detector 4 on a target object during use, and the relay 3 can trigger the switch of the micro-electromagnet 2 at the corresponding position according to the received high and low levels sent by the visual detector 4, that is, the micro-electromagnet 2 at the corresponding position is electrified to magnetically attract the iron core 9;
the top end in the substrate 1 is also fixedly provided with a transmission interface 102, and the transmission interface 102 is connected with the substrate 1 by hot melting;
it should be noted that the transmission interface 102 can electrically connect the intelligent probe card with an interface on a testing machine in the prior art, so as to facilitate subsequent transmission of detection digital signals;
the upper end in the substrate 1 is also fixedly provided with an A/D converter 103, the A/D converter 103 is connected with the substrate 1 by hot melting, and the A/D converter 103 is electrically connected with the transmission interface 102;
it should be noted that the a/D converter 103 can convert the received analog electrical signal into a digital signal and send the digital signal to the transmission interface 102, which is convenient for subsequent digital detection and analysis;
a first cavity avoiding 104 is further arranged at the middle end in the substrate 1, and the first cavity avoiding 104 is a rectangular cavity;
it should be noted that the first avoiding cavity 104 can avoid the micro-electromagnet 2, the insulating sleeve 8, the iron core 9 and the probe sleeve 106, thereby facilitating electromagnetic control;
a second cavity 105 is further arranged on the left side and the right side inside the substrate 1, and the second cavity 105 is a rectangular cavity;
it should be noted that the second avoiding cavity 105 can avoid the baffle 6 and the spring 7, so that the spring 7 can be compressed and rebounded conveniently, and the probe 5 can be regulated and controlled by sliding left and right;
the inner wall of the first avoiding cavity 104 is fixedly provided with probe sleeves 106 from top to bottom and on the left and right sides, the probe sleeves 106 are connected with the substrate 1 in a hot melting manner, the probe sleeves 106 are connected with the probes 5 in a left-right sliding manner, and the probe sleeves 106 are electrically connected with the A/D converter 103;
it should be noted that the probe sleeve 106 can facilitate the probe 5 to slide left and right on the inner wall, does not affect the regulation of the probe 5, and can transmit the analog electrical signal detected by the probe 5 to the a/D converter 103, thereby achieving the detection purpose of the probe 5.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (7)
1. An intelligent probe card based on 32-bit MCU chip testing is characterized by comprising a substrate, a plurality of micro electromagnets, a relay, a vision detector, probes, a baffle, a spring, an insulating sleeve and an iron core, wherein the number of the micro electromagnets is a plurality of pieces, the micro electromagnets are fixedly arranged at the middle end in the substrate from top to bottom, the front end and the rear end of each micro electromagnet are in hot-melt connection with the substrate, the relay is fixedly arranged at the lower side of the front end of the substrate and is in hot-melt connection with the substrate, the relay is electrically connected with the substrate, the vision detector is fixedly arranged at the left side and the right side of the front end of the substrate, the vision detector is in hot-melt connection with the substrate, the vision detector is electrically connected with the relay, the number of the probes is a plurality of pieces, and the probes are arranged at the left side and the right side in the substrate in a sliding manner from top to bottom, the utility model discloses an insulation cover, including probe and base plate, baffle, spring and base plate, the probe adopt horizontal sliding connection, the baffle set firmly in the probe outer wall, baffle and probe adopt hot melt to be connected, just baffle and base plate adopt horizontal sliding connection, the spring set firmly in the baffle lateral wall, spring and baffle adopt hot melt to be connected, just spring and base plate adopt hot melt to be connected, insulation cover set firmly in probe inside port, insulation cover and probe adopt hot melt to be connected, the iron core set firmly inside the insulation cover, iron core and insulation cover adopt hot melt to be connected.
2. The intelligent probe card based on 32-bit MCU chip test of claim 1, characterized in that the upper side of the front end of the substrate is further fixedly provided with a programmable control module, the programmable control module is connected with the substrate by hot melting, and the programmable control module is electrically connected with the micro-electromagnet, the relay and the visual detector.
3. The intelligent probe card based on 32-bit MCU chip test of claim 1, characterized in that the top end in the substrate is further fixedly provided with a transmission interface, and the transmission interface and the substrate are connected by hot melting.
4. The intelligent probe card based on 32-bit MCU chip test of claim 3, wherein the upper end of the inside of the substrate is further fixedly provided with an A/D converter, the A/D converter and the substrate are connected by hot melting, and the A/D converter and the transmission interface are electrically connected.
5. The intelligent probe card based on 32-bit MCU chip test as claimed in claim 1, wherein the middle end in the substrate is further provided with a first cavity, and the first cavity is a rectangular cavity.
6. The intelligent probe card based on 32-bit MCU chip test as claimed in claim 2, wherein the substrate is further provided with second cavity avoiding chambers at left and right sides inside, the second cavity avoiding chambers are rectangular chambers.
7. The intelligent probe card based on 32-bit MCU chip test of claim 5, characterized in that the inner wall of the first clearance cavity is further fixedly provided with probe sleeves from top to bottom and from left to right, the probe sleeves are connected with the substrate by hot melting, the probe sleeves and the probes are connected by sliding left and right, and the probe sleeves are electrically connected with the A/D converter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110799908.3A CN113504397A (en) | 2021-07-15 | 2021-07-15 | Intelligent probe card based on 32-bit MCU chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110799908.3A CN113504397A (en) | 2021-07-15 | 2021-07-15 | Intelligent probe card based on 32-bit MCU chip test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113504397A true CN113504397A (en) | 2021-10-15 |
Family
ID=78012854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110799908.3A Pending CN113504397A (en) | 2021-07-15 | 2021-07-15 | Intelligent probe card based on 32-bit MCU chip test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113504397A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102116779A (en) * | 2004-04-21 | 2011-07-06 | 佛姆法克特股份有限公司 | Intelligent probe card architecture |
| CN102520332A (en) * | 2011-12-15 | 2012-06-27 | 无锡中星微电子有限公司 | Wafer testing device and method for the same |
| CN103760391A (en) * | 2014-01-29 | 2014-04-30 | 上海华力微电子有限公司 | Internally-arranged multi-probe module and probe station with same |
| CN108333395A (en) * | 2018-03-29 | 2018-07-27 | 无锡品测科技有限公司 | A kind of probe card substrate based on wafer test design |
| CN207730893U (en) * | 2017-12-01 | 2018-08-14 | 强一半导体（苏州）有限公司 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
| KR101981653B1 (en) * | 2018-06-29 | 2019-05-24 | 한국알프스 주식회사 | PCB test apparatus |
| CN209961806U (en) * | 2019-03-28 | 2020-01-17 | 珠海市运泰利自动化设备有限公司 | Probe structure and automatic needle plate mechanism |
| CN211785799U (en) * | 2020-01-19 | 2020-10-27 | 天津丘山仪器科技有限公司 | Scanning probe resistance test system |
| CN213210358U (en) * | 2020-07-31 | 2021-05-14 | 河南省申福电子科技有限公司 | Multistage push-down chip detector |
| CN113009324A (en) * | 2021-05-24 | 2021-06-22 | 中国电子科技集团公司第二十九研究所 | Curved surface multi-probe test fixture |
-
2021
- 2021-07-15 CN CN202110799908.3A patent/CN113504397A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102116779A (en) * | 2004-04-21 | 2011-07-06 | 佛姆法克特股份有限公司 | Intelligent probe card architecture |
| CN102520332A (en) * | 2011-12-15 | 2012-06-27 | 无锡中星微电子有限公司 | Wafer testing device and method for the same |
| CN103760391A (en) * | 2014-01-29 | 2014-04-30 | 上海华力微电子有限公司 | Internally-arranged multi-probe module and probe station with same |
| CN207730893U (en) * | 2017-12-01 | 2018-08-14 | 强一半导体（苏州）有限公司 | A kind of cantalever type probe card for testing CIS imaging sensor class chips |
| CN108333395A (en) * | 2018-03-29 | 2018-07-27 | 无锡品测科技有限公司 | A kind of probe card substrate based on wafer test design |
| KR101981653B1 (en) * | 2018-06-29 | 2019-05-24 | 한국알프스 주식회사 | PCB test apparatus |
| CN209961806U (en) * | 2019-03-28 | 2020-01-17 | 珠海市运泰利自动化设备有限公司 | Probe structure and automatic needle plate mechanism |
| CN211785799U (en) * | 2020-01-19 | 2020-10-27 | 天津丘山仪器科技有限公司 | Scanning probe resistance test system |
| CN213210358U (en) * | 2020-07-31 | 2021-05-14 | 河南省申福电子科技有限公司 | Multistage push-down chip detector |
| CN113009324A (en) * | 2021-05-24 | 2021-06-22 | 中国电子科技集团公司第二十九研究所 | Curved surface multi-probe test fixture |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104297536B (en) | probe module with feedback test function | |
| CN103477237B (en) | The device of automatic test and checking electronic component | |
| CN106383462B (en) | Intelligent controller and data processing method | |
| CN109725278A (en) | Verification system and method in a kind of contactless smart meter room | |
| CN103888885B (en) | Miniature microphone capacitance test method | |
| CN104569601B (en) | The apparatus and method that insulating properties detection is carried out to the high voltage control box of electric automobile | |
| CN106199091B (en) | Electrical functions test device, system and method | |
| CN113504397A (en) | Intelligent probe card based on 32-bit MCU chip test | |
| CN214174508U (en) | Multi-channel automatic testing device | |
| CN213023246U (en) | Wafer test probe card | |
| TWI719681B (en) | Probing apparatus and method of operating the same | |
| CN111537877A (en) | Pole-mounted switch control terminal test device | |
| CN205910312U (en) | Break -make of micro -gap switch subassembly detects frock | |
| CN109655741A (en) | Fast-wiring and line selecting device based on testing mechanical characteristic | |
| CN107340469B (en) | GIS combined electrical activity characteristic test instrument and use method | |
| CN208520921U (en) | Temperature rise test winding resistance value automatic detection device | |
| CN109581008A (en) | A kind of needle plate test device | |
| TWI339270B (en) | Socket boards with switch components on a testing apparatus | |
| CN219758485U (en) | Test device | |
| CN206848346U (en) | It is a kind of for the voltage of Switching Power Supply and/or the test device of testing current | |
| CN109696601A (en) | Needle bed aging and detection device | |
| CN212275936U (en) | Binding post detection device of accurate location | |
| CN209542676U (en) | A kind of needle plate test device | |
| CN213210208U (en) | A wiring conversion equipment for circuit breaker characteristic test | |
| CN203894282U (en) | Signal switching structure of probe type detection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20220623 Address after: 230000 Room 301 and 302, building 4, phase I, mechanical and Electrical Industrial Park, No. 767, Yulan Avenue, high tech Zone, Hefei City, Anhui Province Applicant after: Hefei Huayu Semiconductor Co.,Ltd. Address before: 6 / F, building B, public service and applied technology R & D Center for scientific and technological innovation, Hewu Beng Experimental Zone, 860 Wangjiang West Road, high tech Zone, Hefei City, Anhui Province, 230000 Applicant before: HEFEI HUADA SEMICONDUCTOR Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: 230000, No. 66 Tiantangzhai Road, High tech Zone, Hefei City, Anhui Province Applicant after: Hefei Huayu Semiconductor Co.,Ltd. Address before: 230000 Room 301 and 302, building 4, phase I, mechanical and Electrical Industrial Park, No. 767, Yulan Avenue, high tech Zone, Hefei City, Anhui Province Applicant before: Hefei Huayu Semiconductor Co.,Ltd. Country or region before: China |