CN113497175A - High-heat-conduction refrigeration chip - Google Patents
High-heat-conduction refrigeration chip Download PDFInfo
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- CN113497175A CN113497175A CN202010253375.4A CN202010253375A CN113497175A CN 113497175 A CN113497175 A CN 113497175A CN 202010253375 A CN202010253375 A CN 202010253375A CN 113497175 A CN113497175 A CN 113497175A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 79
- 239000004020 conductor Substances 0.000 claims abstract description 7
- 239000012212 insulator Substances 0.000 claims description 122
- 239000004065 semiconductor Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
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- 229910052802 copper Inorganic materials 0.000 claims description 7
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- 239000000203 mixture Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
Abstract
The invention discloses a high-temperature-conduction refrigeration chip, which comprises: a refrigeration chip, a first temperature-conducting module and a second temperature-conducting module. The invention has high heat-conducting material and weldability, the heat-conducting efficiency of heat penetration can be increased due to the metal welding spot, the heat-conducting coefficient is far larger than that of heat-conducting paste and the like, the heat-radiating area of the surface contacted with air can be increased due to the rough heat-radiating surface of the heat-radiating fin, the larger the surface area is, the better the heat-radiating efficiency is, and the better the cooling and heat-radiating effects are further provided, the invention is matched with an AI intelligent heat-radiating fan with wireless induction to be arranged on a window, can also prevent rain, and solves the inconvenience that a heat-radiating pipe needs to be arranged on mobile cold air.
Description
Technical Field
The present invention relates to a high thermal conductivity cooling chip, and more particularly to a cooling chip with high thermal conductivity.
Background
The refrigerating chip (thermal cooler) has the advantages of high refrigerating or heating speed, small volume, high temperature control accuracy, no use of refrigerant and no environmental protection problem, gradually replaces the traditional heating device or heat radiating device, and is widely applied to computer central arithmetic processors, medical equipment, aerospace industry and laser light emitting heads.
As shown in fig. 1A, a conventional refrigeration chip 10 includes: a first substrate 11 and a second substrate 12 opposite to the first substrate 11, wherein a plurality of N-type semiconductor dies 13 and a plurality of P-type semiconductor dies 14 are disposed between the first substrate 11 and the second substrate 12, and the plurality of N-type semiconductor dies 13 and the plurality of P-type semiconductor dies 14 are connected by a plurality of metal conductors 15 to form a complete circuit 16, when a predetermined current is applied, the plurality of N-type semiconductor dies 13 and the plurality of P-type semiconductor dies 14 generate a peltier effect, so that a temperature difference is generated between the first substrate 11 and the second substrate 12.
As shown in fig. 1B, the second substrate 12 is soldered with a heat sink (S) to form an adhesive layer (L) between the second substrate 12 and the heat sink (S), and the heat sink (S) is combined with a fan (F), and the first substrate 11 and the second substrate 12 are usually made of pure ceramic materials in the industry, which can be used for heat dissipation and provide a low thermal resistance cooling path, and the pure ceramic materials have good insulation properties. However, the heat conductivity coefficient of pure ceramic material is only 1.22W/MK, which not only affects the heat dissipation effect of the refrigeration chip, but also relatively affects the refrigeration function.
Furthermore, the ductility of pure ceramic materials is very low, and when forming, processing and assembling, it is fragile and easy to generate micro cracks, so that when the second substrate 12 is welded and adhered to the heat sink (S), it is fragile and easy to generate micro cracks, and the adhesive layer (L) can affect the heat temperature of the second substrate 12 to the heat sink (S), so as to affect the heat dissipation, and the thermal conductivity of the thermal conductive paste is low, thereby affecting the cooling and heat dissipation effects, resulting in the existing cooling chip, which can only be used in a small number of goods with low cooling requirement, and cannot be widely used in portable or mobile cooling products with high cooling requirement and not too large volume, for example: the portable small air conditioner, the indoor movable air conditioner, the movable small refrigerator, the dual-purpose water activating machine for pet cooling and heating, the pet movable backpack, the movable pet car, the dual-purpose pet nest for cooling and heating, the aquarium cooling and heating constant temperature exchanger and other commodities can achieve the cooling and radiating effects only by discharging the generated waste heat to the outdoor no matter the refrigeration chip and the compressor are used for refrigeration, and the portable air conditioner is also the most important reason that the mobile air conditioner cannot be popularized and is suspected by consumers at present, and cannot move and is not attractive due to the fact that the heat discharging pipe occupies space when the air conditioner is abandoned; therefore, the refrigerating chip still has room for improvement, which is also the subject to be solved by the present invention.
Disclosure of Invention
The main objective of the present invention is to provide a high thermal conductivity cooling chip, wherein a first non-insulator or a first non-insulating plate is cold-welded to a first non-insulating surface, and a second non-insulator or a second non-insulating plate is cold-welded to a second non-insulating surface, because of solderability, and the metal solder joint can increase the heat conduction efficiency of thermal penetration, the heat conduction coefficient thereof is much larger than that of a thermal conductive paste, and the heat conduction area of the surface contacting with air can be increased by matching the shapes of the first non-insulator and the second non-insulator to be fin-shaped and rough in surface, and the larger the surface area is, the better the heat dissipation efficiency is, and further, the cooling and heat dissipation effects are good.
Another objective of the present invention is to provide a high thermal conductivity cooling chip, which combines with an AI intelligent heat dissipation fan, and the AI intelligent heat dissipation fan and the high thermal conductivity cooling chip have wireless induction therebetween, so as to discharge the waste heat generated by the high thermal conductivity cooling chip to the outside, thereby improving the cooling and heat dissipation effects.
It is another object of the present invention to provide a high thermal conductivity cooling chip, which has a small size to achieve excellent cooling and heat dissipation effects, and can be widely used in portable or mobile cooling products with high cooling and heat dissipation requirements and not too large in size.
To achieve the above object, the present invention adopts a technical means comprising: the refrigeration chip is provided with a first insulating layer and a second insulating layer on the opposite side, the first insulating layer and the second insulating layer are made of high-heat-conductivity materials, the first insulating layer generates a cold temperature and the second insulating layer generates a hot temperature, and a first non-insulating surface is embedded and plated at the edge of the first insulating layer and a second non-insulating surface is embedded and plated at the edge of the second insulating layer; the first temperature conduction module is provided with a first non-insulator and a first fan, the first non-insulator is cold-welded to the first non-insulating surface, the lower surface of the first non-insulator is in contact with the upper surface of the first insulating layer, the cold temperature is formed between the first insulating layer and the first non-insulator, the first insulating layer can rapidly lead out the cold temperature, and the first fan blows out the cold temperature; and a second heat conducting module, which is provided with a second non-insulator and a second fan, and the second non-insulator is cold-welded to the second non-insulating surface, and the lower surface of the second non-insulator contacts the upper surface of the second insulating layer, so that the heat temperature is formed between the second insulating layer and the second non-insulator, the second insulating layer can rapidly lead out the heat temperature, and the heat temperature is discharged by the second fan.
In an embodiment of the present invention, the first non-insulating surface and the second non-insulating surface are made of copper; the first non-insulator and the second non-insulator are made of aluminum.
In an embodiment of the present invention, the first non-insulator and the second non-insulator are fin-shaped, the first non-insulator and the second non-insulator have rough surfaces, and the first fan is located on the first non-insulator and the second fan is located on the second non-insulator.
In an embodiment of the present invention, the first non-insulator and the second non-insulator are shaped as a shell, and the first fan is located in the first non-insulator and the second fan is located in the second non-insulator.
In an embodiment of the present invention, the first non-insulator is shaped like a shell and the second non-insulator is shaped like a sheet, the first fan is located in the first non-insulator and the second fan is located on the second non-insulator, and the first fan and the second fan face in the same direction.
Another technical means adopted by the present invention comprises: the refrigeration chip is provided with a first insulating layer and a second insulating layer on the opposite side, the first insulating layer and the second insulating layer are made of high-heat-conductivity materials, the first insulating layer generates a cold temperature and the second insulating layer generates a hot temperature, and a first non-insulating surface is embedded and plated at the edge of the first insulating layer and a second non-insulating surface is embedded and plated at the edge of the second insulating layer; a first heat conducting module, which is provided with a first non-insulating body, a first fan and a first non-insulating plate, wherein the first non-insulating body is positioned on the first non-insulating plate, the first non-insulating plate is cold-welded on the first non-insulating surface, the lower surface of the first non-insulating plate is contacted with the upper surface of the first insulating layer, so that the cold temperature is formed among the first insulating layer, the first non-insulating plate and the first non-insulating body, the first insulating layer can rapidly conduct the cold temperature, and then the cold temperature is blown out by the first fan; and a second temperature-conducting module, which is provided with a second non-insulating body, a second fan and a second non-insulating plate, wherein the second non-insulating body is positioned on the second non-insulating plate, the second non-insulating plate is cold-welded to the second non-insulating surface, the lower surface of the second non-insulating plate is contacted with the upper surface of the second insulating layer, so that the heat temperature is formed among the second insulating layer, the second non-insulating plate and the second non-insulating body, the second insulating layer can rapidly conduct the heat temperature out, and the second fan discharges the heat temperature.
In an embodiment of the present invention, the first non-insulating surface and the second non-insulating surface are made of copper; the first non-insulating plate and the second non-insulating plate are made of aluminum.
In an embodiment of the invention, the first non-insulator and the second non-insulator are fin-shaped, the surfaces of the first non-insulator and the second non-insulator are rough, the first fan is located on the first non-insulating plate, the second fan is located on the second non-insulating plate, and the position of the first fan corresponding to the second non-insulator and the position of the second fan corresponding to the first non-insulator are provided.
In an embodiment of the invention, the high thermal conductivity material is one of a silicon-based material, silicon carbide, a metal-based glass, or a mixture of ceramic and glass.
In an embodiment of the invention, the first insulating layer and the second insulating layer include a plurality of N-type semiconductor dies and a plurality of P-type semiconductor dies therebetween, the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are arranged in a staggered manner, and the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are connected by a plurality of metal conductors to form a complete circuit.
By the technical means, the first non-insulator or the first non-insulating plate is cold-welded on the first non-insulating surface, and the second non-insulator or the second non-insulating plate is cold-welded on the second non-insulating surface, so that the high-temperature-conduction refrigeration chip can increase the heat conduction efficiency of heat penetration due to weldability and metal welding spots, the heat conductivity coefficient is far larger than that of heat conducting paste and the like, and the heat radiating area of the surface contacting with air can be increased by matching the shapes of the first non-insulator and the second non-insulator to be fin-shaped and rough in surface, the larger the surface area is, the better the heat dissipation efficiency is, and the AI intelligent heat dissipation fan is combined, and the wireless induction is provided between the AI intelligent heat dissipation fan and the high-temperature-conduction refrigeration chip, the waste heat generated by the high-temperature-conduction refrigeration chip can be discharged to the outside, and further, the high-temperature-conduction refrigeration chip has small volume and can achieve good refrigeration and heat dissipation effects.
Drawings
Fig. 1A is a schematic diagram of a conventional refrigeration chip.
Fig. 1B is a schematic diagram of a conventional cooling chip in combination with a fan and a heat sink.
Fig. 2A is a perspective view of the refrigeration chip of the present invention.
Fig. 2B is another perspective view of the refrigeration chip of the present invention.
Fig. 3 is a cross-sectional view of a refrigeration chip of the present invention.
Fig. 4 is an exploded view of a high thermal conductivity and cooling chip according to a first embodiment of the present invention.
FIG. 5A is a combination diagram of a high thermal conductivity and cooling chip according to a first embodiment of the present invention.
FIG. 5B is a combination diagram of a high thermal conductivity and cooling chip according to a second embodiment of the present invention.
FIG. 5C is a combination diagram of a high thermal conductivity and cooling chip according to a third embodiment of the present invention.
FIG. 5D is a combination diagram of a high thermal conductivity and cooling chip according to a fourth embodiment of the present invention.
FIG. 5E is a schematic diagram of the AI intelligent control system formed by the high thermal conductivity and cooling chip according to the present invention.
FIG. 6 is a sectional view of a chip with high thermal conductivity and refrigeration according to a first embodiment of the present invention.
Fig. 7 is a partial enlarged view of fig. 6 at 7.
Fig. 8 is a reference diagram of the application state of the high thermal conductivity refrigeration chip of the present invention applied to a square type personal air conditioner.
Fig. 9A is a reference diagram of the application state of the high thermal conductivity refrigeration chip of the present invention in a personal transverse air conditioner.
Fig. 9B is a reference view of another usage state of the high thermal conductivity cooling chip of the present invention applied to a personal transverse air conditioner.
Fig. 10A is a reference diagram of the application state of the high thermal conductivity cooling chip of the present invention applied to a mobile air conditioner.
Fig. 10B is a reference view of another usage of the high thermal conductivity cooling chip of the present invention applied to a mobile air conditioner.
Fig. 10C is a reference view of another usage state of the high thermal conductivity cooling chip of the present invention applied to a mobile air conditioner.
FIG. 11 is a view showing the operation state of the high temperature conductive refrigerating chip applied to the mobile refrigerating container in accordance with the present invention.
FIG. 12 is a reference diagram of the usage of the high-thermal conductivity refrigeration chip applied to a water activating machine for both heating and cooling for pets.
Fig. 13 is a reference diagram of the usage status of the high thermal conductivity refrigeration chip of the present invention applied to a pet mobile backpack.
FIG. 14A is a reference diagram of the application of the high thermal conductivity refrigeration chip of the present invention to a mobile pet car.
FIG. 14B is a reference view of another usage state of the high temperature-conducting and refrigerating chip of the present invention applied to a mobile pet car.
FIG. 15A is a reference view of the high thermal conductivity cooling chip of the present invention applied to a pet nest for both cooling and heating purposes.
FIG. 15B is a reference view of another usage of the high thermal conductivity cooling chip of the present invention applied to a pet nest for both cooling and heating purposes.
FIG. 16 is a reference view showing the usage of the high thermal conductivity cooling chip of the present invention applied to an aquarium heat and cool constant temperature exchanger.
Fig. 17 is a reference diagram of the application state of the high thermal conductivity cooling chip applied to the external cold and hot air conditioner.
Fig. 18A is a reference diagram of the application state of the high thermal conductivity cooling chip in the mobile air conditioner.
Fig. 18B is a reference diagram of another usage status of the high thermal conductivity cooling chip of the present invention applied to a mobile air conditioner.
Description of reference numerals: 20-a refrigeration chip; 21-a first insulating layer; 211-a first non-insulating surface; 22-a second insulating layer; 221-a second non-insulating face; a 23-N type semiconductor die; a 24-P type semiconductor die; 25-a metal conductor; 26-line; 30-a first temperature conduction module; 31A, 31B, 31C-a first non-insulator; 32-a first fan; 33-a first non-insulating plate; 34-a first locking element; 35-a first air collection hood; 40-a second temperature conduction module; 41A, 41B, 41C — a second non-insulator; 42-a second fan; 43-a second non-insulating panel; 44-a second locking element; 45-a second wind-collecting cover; 50A, 50B, 50C, 50D-high temperature conduction refrigeration chip; 60-a housing; 61-blowholes; 62-heat removal holes; 63A, 63B-AI intelligent heat exhausting fan; 631-a second radio unit; 64-a window; 70A-personal square air conditioner; 70B-personal cross-bar air conditioner; 70C-mobile air conditioner; 70D-mobile refrigerator; 80A-pet mobile backpack; 80B-a water activating machine for both cooling and heating for pets; 80C-moving the pet car; 80D-a pet house with dual purposes of cooling and warming; 80E-an aquarium cold and warm constant temperature exchanger; 80F, an external cold and hot air conditioner; 81F-pet box; 80G-mobile cold and warm air conditioner; 81G-pet car; 82G-stroller; 90-AI intelligent control system; 91-a circuit board; 92-temperature control chip; 93-a fluorescent screen; 94-a first radio; c, cooling; h-heat temperature.
Detailed Description
The present invention may be practiced in other embodiments that depart from these specific details, and that other known steps or elements may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. It is noted that the drawings are for illustrative purposes only and do not represent actual sizes or quantities of elements, and some details may not be drawn completely to simplify the drawings.
First, referring to fig. 2A to fig. 18B, a preferred embodiment of a high thermal conductivity and cooling chip 50A, 50B, 50C, 50D according to the present invention includes: a refrigeration chip 20, which has a first insulation layer 21 and a second insulation layer 22 on the opposite side, wherein the first insulation layer 21 and the second insulation layer 22 are made of high thermal conductivity material, the first insulation layer 21 generates a cold temperature (C) and the second insulation layer 22 generates a hot temperature (H), the edge of the first insulation layer 21 is embedded with a first non-insulation surface 211, and the edge of the second insulation layer 22 is embedded with a second non-insulation surface 221, in this embodiment, a plurality of N-type semiconductor dies 23 and a plurality of P-type semiconductor dies 24 are included between the first insulation layer 21 and the second insulation layer 22, the plurality of N-type semiconductor dies 23 and the plurality of P-type semiconductor dies 24 are arranged in a staggered manner, and the plurality of N-type semiconductor dies 23 and the plurality of P-type semiconductor dies 24 are connected by a plurality of metal conductors 25 to form a complete circuit 26.
In the present embodiment, the high thermal conductivity material is one of a silicon-based material, silicon carbide, a metal-based glass, or a mixture of ceramic and glass, but is not limited thereto. Therefore, the pure ceramic chip is changed into a mixture of high thermal conductivity ceramic and glass, or a silicon-based material, silicon carbide or metal-based glass is changed, the thermal conductivity coefficient can be as high as 340W/MK, the insulation expansion coefficient is small and is far higher than the thermal conductivity coefficient (only 1.22W/MK) of the pure ceramic material, and the difference can reach hundreds of times huge, so after the pure ceramic chip is used, the efficacy of the refrigeration chip 20 is very large, the first non-insulating surface 211 and the second non-insulating surface 221 are matched with copper, and copper edges can be embedded, therefore, the high thermal conductivity material replaces the pure ceramic material commonly used in the industry, and the thermal conductivity coefficient of the high thermal conductivity material is far better than that of the pure ceramic material.
A first thermal module 30 having a first non-insulator 31A, 31B, 31C and a first fan 32, and the first non-insulating bodies 31A, 31B, 31C are cold-welded to the first non-insulating surface 211, the lower surfaces of the first non-insulators 31A, 31B, and 31C contact the upper surface of the first insulating layer 21, so that the temperature conduction between the first insulating layer 21 and the first non-insulators 31A, 31B, and 31C of the cold temperature (C) is high, and the cold temperature (C) can be quickly conducted out of the first insulating layer 21, and then blown out by the first fan 32, the first non-insulators 31A, 31B, and 31C are made of aluminum, so that the first non-insulators 31A, 31B, and 31C can be easily cold-welded to the first non-insulating surface 211 by laser welding or argon welding, thereby improving the temperature conduction efficiency of the temperature channel.
A second thermal module 40 having a second non-insulator 41A, 41B, 41C and a second fan 42, and the second non-insulating bodies 41A, 41B, 41C are cold-welded to the second non-insulating surface 221, the lower surfaces of the second non-insulators 41A, 41B, and 41C contact the upper surface of the second insulating layer 22, so that the thermal temperature (H) is formed in the thermal conduction between the second insulating layer 22 and the second non-insulators 41A, 41B, and 41C, and has high thermal conductivity, so that the thermal temperature (H) can be rapidly conducted out of the second insulating layer 22, and then the thermal temperature (H) is exhausted by the second fan 42, the second non-insulators 41A, 41B, and 41C are made of aluminum, so that the second non-insulators 41A, 41B, and 41C can be easily cold-welded to the second non-insulating surface 221 by laser or argon welding, thereby improving the temperature conduction efficiency of the temperature channel.
The present invention has the above-mentioned common technical features in the first to third embodiments, and therefore, for technical correlation and belonging to a broad inventive concept, it is consistent with the principle of unity, and will not be described again, but the differences are only the shapes of the first non-insulators 31A, 31B, 31C and the second non-insulators 41A, 41B, 41C, and mainly lie in that the first non-insulators 31A, 31B, 31C are cold-welded to the first non-insulating surface 211 and the second non-insulators 41A, 41B, 41C are cold-welded to the second non-insulating surface 221, so as to know which element and the related position the first non-insulators 31A, 31B, 31C and the second non-insulators 41A, 41B, 41C are.
As shown in fig. 5A, in the first embodiment, the first non-insulator 31A and the second non-insulator 41A disclosed by the high temperature conduction refrigeration chip 50A are fin-shaped, and the surfaces of the first non-insulator 31A and the second non-insulator 41A are rough, i.e., rough surfaces like sandpaper, so as to greatly increase the original fin area and increase the heat dissipation area, and the first fan 32 is located on the first non-insulator 31A and the second fan 42 is located on the second non-insulator 41A, and the first fan 32 is locked to the first non-insulator 31A and the second fan 42 is locked to the second non-insulator 41A by cooperating with a first locking element 34, but not limited thereto.
As shown in fig. 5B, in the second embodiment, the shapes of the first non-insulator 31B and the second non-insulator 41B disclosed by the high temperature conduction cooling chip 50B are shell-shaped, and the first fan 32 is located in the first non-insulator 31B and the second fan 42 is located in the second non-insulator 41B, but not limited thereto.
As shown in fig. 5C, in the third embodiment, the shape of the first non-insulator 31C and the shape of the second non-insulator 41C disclosed by the high temperature conduction cooling chip 50C are shell-shaped and sheet-shaped, the first fan 32 is located in the first non-insulator 31C and the second fan 42 is located on the second non-insulator 41C, and the first fan 32 and the second fan 42 face the same direction, but the invention is not limited thereto.
As shown in fig. 5D, a fourth embodiment has the same technical features as the first to third embodiments, therefore, the concept of the invention is a broad concept of technical relevance, which conforms to the principle of unity and is not repeated here, the difference is that the first thermal module 30 disclosed by the high thermal refrigerator chip 50D further includes a first non-insulating plate 33, the first non-insulating body 31A is placed on the first non-insulating plate 33, and the first non-insulating plate 33 is cold-welded to the first non-insulating face 211, the lower surface of the first non-insulating plate 33 contacts the upper surface of the first insulating layer 21 to form the cold temperature (C), which has high thermal conductivity among the first insulating layer 21, the first non-insulating plate 33 and the first non-insulating body 31A, so that the first insulating layer 21 can rapidly guide out the cold temperature (C), and the cold temperature (C) is blown out by the first fan 32; the second temperature-conducting module 40 further includes a second non-insulating plate 43, the second non-insulating plate 41A is located on the second non-insulating plate 43, and the second non-insulating plate 43 is cold-welded to the second non-insulating surface 221, and the lower surface of the second non-insulating plate 43 contacts the upper surface of the second insulating layer 22, so as to form the heat temperature (H) having a high temperature conductivity among the second insulating layer 22, the second non-insulating plate 43 and the second non-insulating plate 41A, so that the second insulating layer 22 can rapidly conduct the heat temperature (H), and the heat temperature (H) is then discharged by the second fan 42, in this embodiment, the first non-insulating surface 211 and the second non-insulating surface 221 are made of copper; the material of the first non-insulating plate 33 and the second non-insulating plate 43 is aluminum; the first non-insulator 31A and the second non-insulator 41A are fin-shaped, and the surfaces of the first non-insulator 31A and the second non-insulator 41A are rough, such as a rough surface like sandpaper, which greatly increases the original fin area and also increases the heat dissipation area, while the first fan 32 is located on the first non-insulator plate 33 and the second fan 42 is located on the second non-insulator plate 43, and the position of the first fan 32 is corresponding to the position of the second non-insulator 41B and the position of the second fan 42 is corresponding to the position of the first non-insulator 31A, and a first wind-collecting hood 35 is provided between the joint of the first fan 32 and the first non-insulator 31A, and a second wind-collecting hood 45 is provided between the joint of the second fan 42 and the second non-insulator 41A, so that, by using the first non-insulator plate 33 and the second non-insulator plate 43, the air flow channels of the cold temperature (C) and the hot temperature (H) are independent from each other without interfering with each other, but not limited thereto.
Further, the first non-insulator 31A, 31B, 31C or the first non-insulator plate 33 and the second non-insulator 41A, 41B, 41C or the second non-insulator plate 43 are not directly formed, processed and assembled on the first insulating layer 21 and the second insulating layer 22 to avoid micro-cracks generated on the first insulating layer 21 and the second insulating layer 22, and the first non-insulator 31A, 31B, 31C or the first non-insulator plate 33 and the second non-insulator 41A, 41B, 41C or the second non-insulator plate 43 are not bonded on the first insulating layer 21 and the second insulating layer 22 to only contact each other to avoid bonding and blocking heat conduction.
Based on such a structure, the first to fourth embodiments disclosed in the above-mentioned high temperature-conducting refrigeration chips 50A, 50B, 50C, 50D have a small volume to achieve excellent refrigeration and heat dissipation effects, and thus can be widely used in portable or mobile refrigeration products with high refrigeration requirements and not too large volume, and the high temperature-conducting refrigeration chips 50A, 50B, 50C, 50D can combine with a circuit board 91, a temperature control chip 92, a fluorescent screen 93 and a first wireless unit 94 to form an AI intelligent control system 90, and the AI is artificial intelligence, as shown in fig. 5E, so that the following embodiments can be applied to different goods, for example:
the high temperature guiding refrigeration chips 50A, 50B, 50C, 50D are applied to household appliances, and can be matched with a shell 60, and are provided with a plurality of air blowing holes 61 and a plurality of heat discharging holes 62, and the high temperature guiding refrigeration chips 50A, 50B, 50C, 50D can be fixed in the shell 60, and the first fans 32 of the high temperature guiding refrigeration chips 50A, 50B, 50C, 50D correspond to the air blowing holes 61 and the second fans 42 of the high temperature guiding refrigeration chips 50A, 50B, 50C, 50D correspond to the heat discharging holes 62, as follows:
1. as shown in fig. 8, it is a personal rectangular air conditioner 70A, and since the housing 60 is rectangular, it can be matched with fig. 5A, which is the first embodiment disclosed by the high thermal conductivity cooling chip 50A, and the high thermal conductivity cooling chip 50A can be applied to the personal rectangular air conditioner 70A, but is not limited thereto.
2. As shown in fig. 9A to 9B, it is a personal transverse air conditioner 70B, and since the housing 60 is transverse, it can be combined with fig. 5C, which is the third embodiment disclosed by the high thermal conductivity cooling chip 50C, or combined with fig. 5D, which is the fourth embodiment disclosed by the high thermal conductivity cooling chip 50D, and the high thermal conductivity cooling chips 50C, 50D can be applied to the personal transverse air conditioner 70B, but not limited thereto.
3. As shown in fig. 10A to 10C, it is a mobile air conditioner 70C, and since the housing 60 is upright, it can be matched with fig. 5B, which is a second embodiment disclosed by the high thermal conductivity cooling chip 50B, and the high thermal conductivity cooling chip 50B can be applied to the mobile air conditioner 70C. In addition, an AI intelligent heat exhausting fan 63A, 63B is combined to the inner side of the window 64, which can prevent rain, and also solves the inconvenience of installing a heat exhausting pipe on the mobile air conditioner 70C, so that the heat temperature (H) exhausted by the mobile air conditioner 70C is exhausted to the outside of the window 64 through the AI intelligent heat exhausting fan 63A, 63B, and the AI intelligent heat exhausting fan 63A, 63B has a second wireless unit 631 and wirelessly senses with the first wireless unit 94 of the AI intelligent control system 90, and the AI is an artificial intelligence, but is not limited thereto.
4. As shown in FIG. 11, it is a mobile refrigeration container 70D, and since the housing 60 is horizontal, it can be combined with the third embodiment disclosed by the high temperature-conductive refrigeration chip 50C shown in FIG. 5C, or combined with the fourth embodiment disclosed by the high temperature-conductive refrigeration chip 50D shown in FIG. 5D, and the high temperature- conductive refrigeration chips 50C, 50D can be applied to the mobile refrigeration container 70D and can contain insulin, but not limited thereto.
Secondly, the high-temperature- conduction refrigeration chips 50A, 50B, 50C and 50D are applied to pet products or infant products, and the description is as follows:
1. as shown in fig. 12, it is a water activating machine 80A for pet cooling and heating, which can be combined with fig. 5B, which is a second embodiment disclosed by the high thermal conductivity refrigeration chip 50B, and the high thermal conductivity refrigeration chip 50B can be applied to the water activating machine 80A for pet cooling and heating, but is not limited thereto.
2. Fig. 13 shows a pet mobile backpack 80B, which can be combined with fig. 5B, which is a second embodiment disclosed by the high thermal conductivity and cooling chip 50B, and the high thermal conductivity and cooling chip 50B can be applied to the pet mobile backpack 80B, but is not limited thereto.
3. As shown in fig. 14A and 14B, a mobile pet car 80C can be associated with fig. 5B, which is the second embodiment disclosed by the high thermal conductivity and cooling chip 50B, or can be associated with fig. 5D, which is the fourth embodiment disclosed by the high thermal conductivity and cooling chip 50D, and the high thermal conductivity and cooling chips 50B, 50D can be applied to the mobile pet car 80C, but not limited thereto.
4. As shown in fig. 15A and 15B, a dual-purpose pet nest 80D for cooling and heating can be combined with the first embodiment disclosed by the high thermal conductivity cooling chip 50A shown in fig. 5A, or can be combined with the fourth embodiment disclosed by the high thermal conductivity cooling chip 50D shown in fig. 5D, and the high thermal conductivity cooling chips 50A and 50D can be applied to the dual-purpose pet nest 80D for cooling and heating, but not limited thereto.
5. As shown in fig. 16, it is an aquarium heat and cool constant temperature exchanger 80E, which can be combined with fig. 5A, which is the first embodiment disclosed in the high thermal conductivity cooling chip 50A, and the high thermal conductivity cooling chip 50A can be applied to the aquarium heat and cool constant temperature exchanger 80E, but is not limited thereto.
6. As shown in fig. 17, it is an external cold-hot air conditioner 80F, which can be combined with fig. 5D, which is a fourth embodiment disclosed by the high temperature-conducting cooling chip 50D, and the high temperature-conducting cooling chip 50D can be applied to the external cold-hot air conditioner 80F, and the external cold-hot air conditioner 80F is hung on a pet box 81F, and the external cold-hot air conditioner 80F has the fluorescent screen 93 for displaying temperature, but is not limited thereto.
7. As shown in fig. 18A-18B, a mobile cooling and heating air conditioner 80G can be combined with fig. 5D, which is a fourth embodiment disclosed by the high temperature-conducting cooling chip 50D, and the high temperature-conducting cooling chip 50D can be applied to the mobile cooling and heating air conditioner 80G, and the mobile cooling and heating air conditioner 80G can be provided for a stroller 81G and a pet car 82G, but is not limited thereto.
By the technical means, the high-temperature- conduction refrigeration chips 50A, 50B, 50C and 50D have small volume, can achieve excellent refrigeration and heat dissipation effects, can be widely used in portable or mobile refrigeration products with higher refrigeration requirements and not too large volume, further expands the application range and improves the refrigeration/heating effects.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention.
Claims (12)
1. A high-temperature-conduction refrigeration chip is characterized by comprising:
the refrigeration chip is provided with a first insulating layer and a second insulating layer on the opposite side, the first insulating layer and the second insulating layer are made of high-heat-conductivity materials, the first insulating layer generates a cold temperature and the second insulating layer generates a hot temperature, and a first non-insulating surface is embedded and plated at the edge of the first insulating layer and a second non-insulating surface is embedded and plated at the edge of the second insulating layer;
the first temperature conduction module is provided with a first non-insulator and a first fan, the first non-insulator is cold-welded to the first non-insulating surface, the lower surface of the first non-insulator is in contact with the upper surface of the first insulating layer, the cold temperature is formed between the first insulating layer and the first non-insulator, the first insulating layer is enabled to rapidly conduct out the cold temperature, and then the first fan blows out the cold temperature; and
and the second heat conducting module is provided with a second non-insulator and a second fan, the second non-insulator is cold-welded to the second non-insulating surface, the lower surface of the second non-insulator is in contact with the upper surface of the second insulating layer, the high heat conducting temperature is formed between the second insulating layer and the second non-insulator, the second insulating layer is enabled to rapidly conduct the heat temperature out, and the second fan discharges the heat temperature.
2. The high thermal conductivity refrigerator chip of claim 1, wherein the first non-insulating surface and the second non-insulating surface are made of copper; the first non-insulator and the second non-insulator are made of aluminum.
3. The chip of claim 1, wherein the first non-insulator and the second non-insulator are fin-shaped, and the first non-insulator and the second non-insulator have rough surfaces, and the first fan is disposed on the first non-insulator and the second fan is disposed on the second non-insulator.
4. The high temperature conduction refrigeration chip as recited in claim 1 wherein said first non-insulator and said second non-insulator are in the shape of a shell, and said first fan is located within said first non-insulator and said second fan is located within said second non-insulator.
5. The chip of claim 1, wherein the first non-insulator is shaped like a shell and the second non-insulator is shaped like a sheet, the first fan is located in the first non-insulator and the second fan is located on the second non-insulator, and the first fan and the second fan face in the same direction.
6. The high thermal conductivity refrigeration chip of claim 1, wherein the high thermal conductivity material is one of silicon-based material, silicon carbide, metal-based glass or a mixture of ceramic and glass.
7. The high temperature conductive and cooling chip as claimed in claim 1, wherein the first insulating layer and the second insulating layer include a plurality of N-type semiconductor dies and a plurality of P-type semiconductor dies therebetween, the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are arranged in a staggered manner, and the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are connected by a plurality of metal conductors to form a complete circuit.
8. A high-temperature-conduction refrigeration chip is characterized by comprising:
the refrigeration chip is provided with a first insulating layer and a second insulating layer on the opposite side, the first insulating layer and the second insulating layer are made of high-heat-conductivity materials, the first insulating layer generates a cold temperature and the second insulating layer generates a hot temperature, and a first non-insulating surface is embedded and plated at the edge of the first insulating layer and a second non-insulating surface is embedded and plated at the edge of the second insulating layer;
a first temperature-conducting module, which is provided with a first non-insulating body, a first fan and a first non-insulating plate, wherein the first non-insulating body is positioned on the first non-insulating plate, the first non-insulating plate is cold-welded on the first non-insulating surface, the lower surface of the first non-insulating plate is contacted with the upper surface of the first insulating layer, so that the cold temperature is formed among the first insulating layer, the first non-insulating plate and the first non-insulating body, the first insulating layer is enabled to rapidly conduct out the cold temperature, and then the cold temperature is blown out by the first fan; and
and the second heat conducting module is provided with a second non-insulating body, a second fan and a second non-insulating plate, the second non-insulating body is positioned on the second non-insulating plate, the second non-insulating plate is cold-welded to the second non-insulating surface, the lower surface of the second non-insulating plate is contacted with the upper surface of the second insulating layer, the heat temperature is formed among the second insulating layer, the second non-insulating plate and the second non-insulating body, the second insulating layer is enabled to rapidly conduct out the heat temperature, and the second fan exhausts the heat temperature.
9. The high thermal conductivity refrigerator chip of claim 8, wherein the first non-insulating surface and the second non-insulating surface are made of copper; the first non-insulating plate and the second non-insulating plate are made of aluminum.
10. The high temperature conduction refrigeration chip as recited in claim 8, wherein the first non-insulator and the second non-insulator are fin-shaped, the surface of the first non-insulator and the surface of the second non-insulator are rough, the first fan is located on the first non-insulating plate, the second fan is located on the second non-insulating plate, and the position of the first fan corresponding to the position of the second non-insulator and the position of the second fan corresponding to the position of the first non-insulator are provided.
11. The high thermal conductivity refrigeration chip of claim 8 wherein the high thermal conductivity material is one of silicon-based material, silicon carbide, metal-based glass or a mixture of ceramic and glass.
12. The high temperature conductive and cooling chip as claimed in claim 8, wherein the first insulating layer and the second insulating layer include a plurality of N-type semiconductor dies and a plurality of P-type semiconductor dies therebetween, the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are arranged in a staggered manner, and the plurality of N-type semiconductor dies and the plurality of P-type semiconductor dies are connected by a plurality of metal conductors to form a complete circuit.
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