CN113492440A - Die cutting process for copper foil assembly and die cutting product production line - Google Patents
Die cutting process for copper foil assembly and die cutting product production line Download PDFInfo
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- CN113492440A CN113492440A CN202110718643.XA CN202110718643A CN113492440A CN 113492440 A CN113492440 A CN 113492440A CN 202110718643 A CN202110718643 A CN 202110718643A CN 113492440 A CN113492440 A CN 113492440A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/003—Cutting
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Abstract
The application discloses a die cutting process for a copper foil assembly and a die cutting product production line. The die cutting process for the copper foil assembly at least has the following beneficial effects: in the third semi-finished product, be provided with first process from the type membrane between PET membrane and copper foil, first process can be completely cut off PET membrane and copper foil from the type membrane. In addition, the first process is formed with the through-hole from the type membrane, because the PET membrane is softer, the first structure of PET membrane is crooked in through-hole department, and the first structure of PET membrane can contact through the second structure of through-hole and copper foil. When the third semi-finished product is wasted, the first structure cannot be taken away in the process of removing the waste due to the fact that the viscosity between the first structure and the second structure is strong, and the problem that the single-blade forming copper foil assembly is difficult to waste is solved.
Description
Technical Field
The application relates to a die-cutting production process, in particular to a die-cutting process for a copper foil assembly and a die-cutting product production line.
Background
The traditional die cutting process mainly comprises two processes of circular knife die cutting and flat plate die cutting. The flat-plate die cutting process is a single-stroke processing mode, the online condition of equipment is complex, the equipment needs to be debugged for many times in the die cutting process, and the die cutting efficiency is low.
The copper foil composite member has a simpler structure, generally comprises a layer of PET film and a layer of copper foil, and is formed by a circular knife die cutting process aiming at the copper foil composite member in order to improve the production efficiency. In the related art, since the adhesion between the PET film and the copper foil is strong, and waste is not easily discharged during single-blade molding, a product is generally formed by a multi-blade sleeve cutting method, but the position tolerance between the PET film and the copper foil in the formed copper foil assembly is large due to deviation of the material belt during transmission, and the product yield is low.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a die cutting process for a copper foil assembly, and the copper foil assembly formed by the process has high precision and is convenient to discharge waste.
The application also provides a die-cutting product production line capable of realizing the die-cutting process for the copper foil assembly.
The die cutting process for the copper foil assembly according to the embodiment of the first aspect of the application comprises the following steps:
forming a third semi-finished product, wherein the third semi-finished product comprises a PET film, a first process release film, a copper foil and a first low-adhesive film which are sequentially compounded, a first structure is formed on the PET film, a through hole is formed on the first process release film, the copper foil is provided with a second structure, the first structure, the through hole and the second structure are correspondingly arranged, and the middle part of the first structure sags under the action of self gravity and penetrates through the through hole to be in contact adhesion with the second structure;
and discharging the third semi-finished product to form a fifth semi-finished product.
The die cutting process for the copper foil assembly according to the embodiment of the application has at least the following beneficial effects: in the third semi-finished product, be provided with first process from the type membrane between PET membrane and copper foil, first process can be completely cut off PET membrane and copper foil from the type membrane. In addition, the first process is formed with the through-hole from the type membrane, because the PET membrane is softer, the first structure of PET membrane is crooked in through-hole department, and the first structure of PET membrane can contact through the second structure of through-hole and copper foil. When the third semi-finished product is wasted, the first structure cannot be taken away in the process of removing the waste due to the fact that the viscosity between the first structure and the second structure is strong, and the problem that the single-blade forming copper foil assembly is difficult to waste is solved.
According to some embodiments of the application, said rejecting of said third semi-finished product to form a fifth semi-finished product comprises the steps of:
removing the outer frame waste of the third semi-finished product;
and removing the inner frame waste of the third semi-finished product to form a fifth semi-finished product.
According to some embodiments of the present application, said forming said third semi-finished product comprises the steps of:
forming a second semi-finished product, wherein the second semi-finished product comprises the PET film, the first process release film, the copper foil and the first low-adhesive film which are sequentially compounded, and the through hole is formed in the first process release film;
and cutting the second semi-finished product to enable the PET film to form the first structure and enable the copper foil to form the second structure, wherein the size of the first structure is larger than that of the through hole, and the size of the second structure is larger than that of the first structure.
According to some embodiments of the present application, said forming said second semi-finished product comprises the steps of:
forming a first semi-finished product, wherein the first semi-finished product comprises the first process release film, the copper foil and the first low adhesive film which are sequentially compounded, and the through hole is formed in the first process release film;
and compounding the first semi-finished product and the PET film.
According to some embodiments of the application, said forming the first semi-finished product comprises the steps of:
compounding the copper foil and the first low-adhesive film;
forming the first process release film having the through hole;
and compounding the copper foil and the first process release film.
According to some embodiments of the present application, further comprising forming a seventh semi-finished product, the forming the seventh semi-finished product comprising the steps of:
forming a sixth semi-finished product, wherein the sixth semi-finished product comprises a second process release film and a second low adhesive film which are sequentially compounded, the second process release film is formed with a third structure, and the third structure is arranged corresponding to the second structure;
and compounding the fifth semi-finished product and the sixth semi-finished product.
According to some embodiments of the present application, said forming said sixth semi-finished product comprises the steps of:
compounding the second low-adhesive film and the second process release film;
cutting the second process release film to form a third structure by the second process release film;
and discharging waste from the release film in the second process.
According to some embodiments of the present application, further comprising forming a finished article, the forming a finished article comprising the steps of:
rolling the first low-adhesive film of the seventh semi-finished product;
rolling the second low-viscosity film of the seventh semi-finished product;
and compounding the seventh semi-finished product and the separation paper.
According to the die-cut product production line of the embodiment of the second aspect of the present application, the above-mentioned die-cutting process for the copper foil assembly can be realized.
According to the die-cut product production line of the embodiment of the application, at least the following beneficial effects are achieved: including all the benefits of the above-described die cutting process for copper foil assemblies, are not described herein in detail.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The present application is further described with reference to the following figures and examples, in which:
fig. 1 is a flow chart of a die-cutting process for a copper foil assembly according to an embodiment of the first aspect of the present application;
FIG. 2 is a flow chart illustrating the process of rejecting the third semi-finished product to form a fifth semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 3 is a flow chart of forming a third semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 4 is a flow chart of forming a second semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 5 is a flow chart of forming a first semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 6 is a flow chart of a seventh semi-finished product formed in accordance with an embodiment of the first aspect of the present application;
FIG. 7 is a flow chart of forming a sixth semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 8 is a flow chart of forming a finished product according to an embodiment of the first aspect of the present application;
FIG. 9 is a schematic view of the structure of a copper foil assembly in a finished article according to an embodiment of the first aspect of the present application;
FIG. 10 is a schematic structural view of a third semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 11 is a schematic view of a third semi-finished product after the frame has been rejected from the waste of the first aspect of the present application;
FIG. 12 is a schematic diagram of a fifth semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 13 is a schematic diagram of a second semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 14 is a schematic structural view of a first semi-finished product according to an embodiment of the first aspect of the present application;
FIG. 15 is a schematic structural view of a sixth semi-finished product in accordance with an embodiment of the first aspect of the present application;
FIG. 16 is a top view of a portion of a seventh semi-finished product in accordance with an embodiment of the first aspect of the present application;
FIG. 17 is a schematic structural view of a seventh semi-finished product in accordance with an embodiment of the first aspect of the present application;
fig. 18 is a schematic structural diagram of a finished product according to an embodiment of the first aspect of the present application.
Reference numerals:
the first process is release film 200, through hole 210;
a first low-adhesive film 400, an outer frame waste 410, and an inner frame waste 420;
in the second process, a release film 500, a positioning knife line 510 and an outer frame knife line 520 are arranged;
a second low mucosa 600;
a paper barrier 700.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, front, rear, left, right, etc., referred to herein are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present application.
In the description of the present application, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present number, and the above, below, within, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless otherwise expressly limited, terms such as set, mounted, connected and the like should be construed broadly, and those skilled in the art can reasonably determine the specific meaning of the terms in the present application by combining the detailed contents of the technical solutions.
In the description of the present application, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
As shown in fig. 9, the copper foil assembly in the finished product includes the first structure 110 of the PET film 100 and the second structure 310 of the copper foil 300.
As shown in fig. 1, a die cutting process for a copper foil assembly according to an embodiment of the first aspect of the present application includes the steps of:
s100, a third semi-finished product is formed, the third semi-finished product comprises a PET film 100, a first process release film 200, a copper foil 300 and a first low-adhesive film 400 which are sequentially compounded, wherein a first structure 110 is formed on the PET film 100, a through hole 210 is formed on the first process release film 200, a second structure 310 is formed on the copper foil 300, the first structure 110, the through hole 210 and the second structure 310 are correspondingly arranged, and the middle part of the first structure 110 sags under the action of self gravity and penetrates through the through hole 210 to be in contact adhesion with the second structure 310.
As shown in fig. 10, the third semi-finished product includes a PET film 100, a first process release film 200, a copper foil 300, and a first low-adhesive film 400, which are sequentially laminated from top to bottom. The first process release film 200 between the PET film 100 and the copper foil 300, the first process release film 200 being capable of insulating the PET film 100 and the copper foil 300.
In addition, the first structure 110 is formed on the PET film 100, the through hole 210 is formed on the first process release film 200, the copper foil 300 is formed with the second structure 310, and the first structure 110, the through hole 210 and the second structure 310 are correspondingly arranged, meanwhile, because the PET film 100 is soft, under the action of gravity, the first structure 110 of the PET film 100 is bent at the through hole 210, and the first structure 110 of the PET film 100 can be in contact with the second structure 310 of the copper foil 300 through the through hole 210.
Second, the first low adhesive film 400 is used to support the above materials and transfer.
And S200, discharging the third semi-finished product to form a fifth semi-finished product.
It can be understood that, because the first structure 110 is in contact with the second structure 310, the viscosity between the PET film 100 and the copper foil 300 is strong, and when the third semi-finished product is wasted, the first structure 110 cannot be taken away, so that the problem that the single-blade forming copper foil assembly is difficult to waste is solved.
As shown in fig. 2, according to some embodiments of the present application, the step of wasting the third semi-finished product to form the fifth semi-finished product includes the steps of:
s210, removing the outer frame waste 410 of the third semi-finished product.
As shown in fig. 10, the outer frame scrap 410 of the third semi-finished product refers to a portion of the scrap formed when the second structure 310 is formed. Specifically, in the third semi-finished product, when the second structure 310 is formed, waste materials are wasted between the PET film 100, the first process release film 200, and the knife line formed by the copper foil 300, and the boundary of the above materials of the respective layers.
It is understood that the frame waste 410 of the third product is directly removed by directly rolling the frame waste 410, and the fourth semi-finished product is formed.
The third semi-finished product from which the outer frame waste 410 is removed as shown in fig. 11 can be formed by removing the outer frame waste 410 of the third semi-finished product, and the copper foil 300 has only the second structure 310 portion left after removing the outer frame waste 410 of the third semi-finished product.
And S220, removing the inner frame waste 420 of the third semi-finished product to form a fifth semi-finished product.
As shown in fig. 10 to 11, the inner frame scrap 420 of the third semi-finished product refers to a partial scrap formed when the second structure 310 and the first structure 110 are formed. Specifically, when the second structure 310 is formed, the second structure 310 wastes between the knife lines formed on the PET film 100 and the first process release film 200 and the first structure 110 and the through hole 210.
Specifically, after the outer frame waste 410 of the third semi-finished product is removed, the inner frame waste 420 of the third semi-finished product is adhered by the waste paper, and since the first structure 110 is connected to the second structure 310 through the through hole 210 of the first process release film 200 and the adhesion between the first structure 110 and the second structure 310 is strong, when the waste paper adheres to remove the inner frame waste 420 of the first process release film 200, the first structure 110 will pass through the through hole 210 and still be connected to the second structure 310.
In the fifth semi-finished product shown in fig. 12, after the inner frame waste 420 of the third semi-finished product is removed, the first process release film 200 is completely removed, and the PET film 100 only remains the first structure 110 and is still connected to the second structure 310, i.e. the structure corresponding to the copper foil assembly in the finished product shown in fig. 9 is formed.
As shown in fig. 3, according to some embodiments of the present application, forming the third semi-finished product includes the steps of:
s110, forming a second semi-finished product, wherein the second semi-finished product comprises a PET film 100, a first process release film 200, a copper foil 300 and a first low-adhesive film 400 which are sequentially compounded, and a through hole 210 is formed in the first process release film 200.
As shown in fig. 13, the second semi-finished product is sequentially combined with a PET film 100, a first process release film 200, a copper foil 300, and a first low-adhesive film 400 from top to bottom, wherein the first process release film 200 has a through hole 210 formed therein.
And S120, cutting the second semi-finished product to enable the PET film 100 to form a first structure 110 and the copper foil 300 to form a second structure 310, wherein the size of the first structure 110 is larger than that of the through hole 210, and the size of the second structure 310 is larger than that of the first structure 110.
It will be appreciated that the second semi-finished product is cut by means of single-blade forming. After the second semi-finished product is cut, a third semi-finished product as shown in fig. 10 is formed, the PET film 100 is formed with the first structure 110, and the copper foil 300 is formed with the second structure 310.
Since the size of the second structure 310 is larger than that of the first structure 110, the cutting lines corresponding to the second structure 310 will form the outer frame scraps 410 and the inner frame scraps 420.
Next, in order to form the first structures 110 on the PET film 100 when the cutter cuts the PET film 100, the first structures 110 are larger than the through holes 210, so that the first release film 200 can support the positions corresponding to the first structures 110 on the PET film 100 during the cutting process. Meanwhile, in order to prevent the first structure 110 from being too large in size to pass through the through-hole 210 when the inner frame scraps 420 are removed, the first structure 110 is larger than the through-hole 210 by 0.1mm to 0.3 mm.
As shown in fig. 4, according to some embodiments of the present application, forming the second semi-finished product includes the steps of:
and S111, forming a first semi-finished product, wherein the first semi-finished product comprises a first process release film 200, a copper foil 300 and a first low-adhesive film 400 which are sequentially compounded, and a through hole 210 is formed in the first process release film 200.
As shown in fig. 14, the first semi-finished product includes a first process release film 200, a copper foil 300, and a first low-adhesive film 400, which are sequentially combined from top to bottom, wherein the first process release film 200 has a through hole 210 formed thereon.
And S112, compounding the first semi-finished product and the PET film 100.
The PET film 100 is compounded on the first semi-finished product, and the PET film 100 is located at one side of the release film 200 in the first process, so as to form a second semi-finished product as shown in fig. 13.
As shown in fig. 5, according to some embodiments of the present application, forming the first semi-finished product includes the steps of:
s1111, composite copper foil 300, and first low adhesive film 400.
It is understood that the copper foil 300 is compounded on the upper side of the first low adhesive film 400.
S1112, forming a first process release film 200 having a through hole 210.
It can be understood that the through-hole 210 is formed on the first process release film 200 by a circular cutter and then waste is discharged, resulting in the first process release film 200 having the through-hole 210.
S1113, the composite copper foil 300 and the first process release film 200.
It can be understood that the first process release film 200 having the through-hole 210 is laminated on one side of the copper foil 300 to form a first semi-finished product as shown in fig. 14.
As shown in fig. 6, according to some embodiments of the present application, the method further includes a step S300 of forming a seventh semi-finished product, and the step S300 of forming the seventh semi-finished product includes the steps of:
s310, forming a sixth semi-finished product, wherein the sixth semi-finished product comprises a second process release film 500 and a second low adhesive film 600 which are sequentially compounded, the second process release film 500 is provided with a third structure, and the third structure and the second structure 310 are arranged correspondingly.
As shown in fig. 15, the sixth semi-finished product includes a second process release film 500 and a second low adhesive film 600 which are sequentially combined, wherein the second process release film 500 is formed with a third structure.
As shown in fig. 16, the third structure includes a positioning knife line 510 and an outer frame knife line 520.
The positioning knife line 510 is an unclosed knife line, and the positioning knife line 510 corresponds to a partial outline of the second structure 310, so that when the positioning knife line 510 is used, whether each layer of material deviates in the forming process of a finished product can be judged, if the deviation occurs, the positioning knife line 510 cannot be aligned to the outline of the second structure 310, namely, the finished product is a defective product, and the product scrapping of a customer due to the fact that the customer uses the defective product is avoided.
In addition, outer frame knife line 520 is used for reducing the width that the second process leaves type membrane 500, and the compound paper 700 back that separates in the later stage of being convenient for, the second process can not break away from the width scope that separates paper 700 from type membrane 500, makes and separates paper 700 can more effective protection product.
And S320, compounding the fifth semi-finished product and the sixth semi-finished product to form a seventh semi-finished product.
It is understood that the fifth semi-finished product and the second low adhesive film 600 are combined to form a seventh semi-finished product as shown in fig. 17, and the seventh semi-finished product includes the second low adhesive film 600, the second process release film 500, the first structure 110, the second structure 310, and the first low adhesive film 400, which are combined in sequence from top to bottom.
As shown in fig. 7, according to some embodiments of the present application, forming the sixth semi-finished product includes the steps of:
s311, a composite second low adhesive film 600, and a second process release film 500.
S312, cutting the second process release film 500 to form a third structure on the second process release film 500.
It is understood that the second process is cut from the film 500 to form the positioning blade lines 510 and the outer frame blade lines 520.
S313, the release film 500 in the second process is discharged.
It will be appreciated that the positioning knife line 510, as shown in figure 15, is a non-enclosed knife line and so will not produce waste. As shown in fig. 15 to 16, the outer frame knife line 520 will generate two strips of waste material on the second process release film 500.
As shown in fig. 8, according to some embodiments of the present application, the die-cutting process for a copper foil assembly according to the first aspect of the present application further includes a step S400 of forming a finished product, the step S400 of forming the finished product including the steps of:
and S410, rolling the seventh semi-finished first low-viscosity film 400.
And S420, rolling a seventh semi-finished second low-viscosity film 600.
And S430, compounding the seventh semi-finished product and the separation paper 700 to form a finished product.
It is understood that after the first low adhesive film 400 and the second low adhesive film 600 of the first semi-finished product are rolled, the separation paper 700 is compounded on the seventh semi-finished product, and the separation paper 700 is compounded on the second process release film 500 to form the finished product as shown in fig. 18.
In addition, after the finished product is formed, the finished product is rolled.
As shown in fig. 1 to 8, the die cutting process for the copper foil assembly according to the embodiment of the present application is described as a specific example. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
As shown in fig. 5, a first semi-finished product is formed by the following steps S1111 to S1113:
s1111, composite copper foil 300, and first low adhesive film 400.
S1112, forming a first process release film 200 having a through hole 210.
S1113, the composite copper foil 300 and the first process release film 200.
It can be understood that the first process release film 200 having the through hole 210 is laminated on one side of the copper foil 300 to form a first semi-finished product as shown in fig. 14, the first semi-finished product comprising the first process release film 200, the copper foil 300, and the first low adhesive film 400 laminated in this order, wherein the through hole 210 is formed on the first process release film 200.
As shown in fig. 4, after the first semi-finished product is formed, a second semi-finished product is formed by the following step S112:
and S112, compounding the first semi-finished product and the PET film 100.
The PET film 100 is compounded on the first semi-finished product to form a second semi-finished product as shown in fig. 13, the second semi-finished product includes the PET film 100, the first process release film 200, the copper foil 300, and the first low adhesive film 400, which are compounded in sequence, wherein the first process release film 200 is formed with a through hole 210.
As shown in fig. 3, after the second semi-finished product is formed, a third semi-finished product is formed by the following step S120:
and S120, cutting the second semi-finished product to enable the PET film 100 to form a first structure 110 and the copper foil 300 to form a second structure 310, wherein the size of the first structure 110 is larger than that of the through hole 210, and the size of the second structure 310 is larger than that of the first structure 110.
It will be appreciated that the second semi-finished product is cut by means of single-blade forming. After the second semi-finished product is cut, a third semi-finished product as shown in fig. 10 is formed, the third semi-finished product comprises a PET film 100, a first process release film 200, a copper foil 300 and a first low-adhesive film 400 which are sequentially compounded, wherein a first structure 110 is formed on the PET film 100, a through hole 210 is formed on the first process release film 200, a second structure 310 is formed on the copper foil 300, the first structure 110, the through hole 210 and the second structure 310 are correspondingly arranged, and the middle part of the first structure 110 sags under the action of self gravity and penetrates through the through hole 210 to be in contact adhesion with the second structure 310.
In addition, the cutting lines corresponding to the second structure 310 will form an outer frame scrap 410 and an inner frame scrap 420.
As shown in fig. 2, after the third semi-finished product is formed, the fifth semi-finished product is formed by discharging the third semi-finished product through the following steps S210 to S220:
s210, removing the outer frame waste 410 of the third semi-finished product.
It is understood that the frame waste 410 of the third product is directly removed by directly rolling the frame waste 410, and the fourth semi-finished product is formed.
And S220, removing the inner frame waste 420 of the third semi-finished product to form a fifth semi-finished product.
Specifically, after the outer frame waste 410 of the third semi-finished product is removed, the inner frame waste 420 of the third semi-finished product is adhered by the waste paper, and since the first structure 110 is adhered to the second structure 310 through the through hole 210 of the first process release film 200 and the adhesion between the first structure 110 and the second structure 310 is strong, when the waste paper adheres to the inner frame waste 420 of the first process release film 200, the first structure 110 will pass through the through hole 210 and still be connected to the second structure 310.
After the inner frame scrap 420 of the third semi-finished product is removed, a fifth semi-finished product as shown in fig. 12 is formed, and after the inner frame scrap 420 of the third semi-finished product is removed, a structure corresponding to the copper foil assembly in the finished product as shown in fig. 9 is formed.
As shown in fig. 7, while the fifth semi-finished product is formed, a sixth semi-finished product is formed through steps S311 to S313:
s311, a composite second low adhesive film 600, and a second process release film 500.
S312, cutting the second process release film 500 to form a third structure on the second process release film 500. As shown in fig. 16, the third structure includes a positioning knife line 510 and an outer frame knife line 520.
S313, the release film 500 in the second process is discharged.
As shown in fig. 6, after the fifth semi-finished product and the sixth semi-finished product are formed, a seventh semi-finished product is formed by the following step S320:
and S320, compounding the fifth semi-finished product and the sixth semi-finished product to form a seventh semi-finished product.
It is understood that the fifth semi-finished product and the second low adhesive film 600 are combined to form a seventh semi-finished product as shown in fig. 17, and the seventh semi-finished product includes the second low adhesive film 600, the second process release film 500, the first structure 110, the second structure 310, and the first low adhesive film 400, which are combined in sequence from top to bottom.
As shown in fig. 8, after the seventh semi-finished product is formed, a finished product is formed through the following steps S410 to S430:
and S410, rolling the seventh semi-finished first low-viscosity film 400.
And S420, rolling a seventh semi-finished second low-viscosity film 600.
And S430, compounding the seventh semi-finished product and the separation paper 700 to form a finished product.
It is understood that after the first low adhesive film 400 and the second low adhesive film 600 of the first semi-finished product are rolled, the separation paper 700 is compounded on the seventh semi-finished product, and the separation paper 700 is compounded on the second process release film 500 to form the finished product as shown in fig. 18.
In addition, after the finished product is formed, the finished product is rolled.
According to the die-cut product production line of the embodiment of the second aspect of the present application, the above-mentioned die-cutting process for the copper foil assembly can be realized.
According to the die-cut product production line of the embodiment of the application, at least the following beneficial effects are achieved: including all the benefits of the above-described die cutting process for copper foil assemblies, are not described herein in detail.
The embodiments of the present application have been described in detail with reference to the drawings, but the present application is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present application. Furthermore, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
Claims (9)
1. The die cutting process for the copper foil assembly is characterized by comprising the following steps of:
forming a third semi-finished product, wherein the third semi-finished product comprises a PET film, a first process release film, a copper foil and a first low-adhesive film which are sequentially compounded, a first structure is formed on the PET film, a through hole is formed on the first process release film, the copper foil is provided with a second structure, the first structure, the through hole and the second structure are correspondingly arranged, and the middle part of the first structure sags under the action of self gravity and penetrates through the through hole to be in contact adhesion with the second structure;
and discharging the third semi-finished product to form a fifth semi-finished product.
2. The die cutting process for copper foil assembly according to claim 1, wherein said rejecting said third semi-finished product to form a fifth semi-finished product comprises the steps of:
removing the outer frame waste of the third semi-finished product;
and removing the inner frame waste of the third semi-finished product to form a fifth semi-finished product.
3. The die cutting process for copper foil assembly according to claim 2, wherein said forming said third semi-finished product comprises the steps of:
forming a second semi-finished product, wherein the second semi-finished product comprises the PET film, the first process release film, the copper foil and the first low-adhesive film which are sequentially compounded, and the through hole is formed in the first process release film;
and cutting the second semi-finished product to enable the PET film to form the first structure and enable the copper foil to form the second structure, wherein the size of the first structure is larger than that of the through hole, and the size of the second structure is larger than that of the first structure.
4. The die cutting process for copper foil assembly according to claim 3, wherein said forming said second semi-finished product comprises the steps of:
forming a first semi-finished product, wherein the first semi-finished product comprises the first process release film, the copper foil and the first low adhesive film which are sequentially compounded, and the through hole is formed in the first process release film;
and compounding the first semi-finished product and the PET film.
5. The die cutting process for copper foil assembly of claim 4, wherein said forming a first semi-finished product comprises the steps of:
compounding the copper foil and the first low-adhesive film;
forming the first process release film having the through hole;
and compounding the copper foil and the first process release film.
6. The die cutting process for a copper foil assembly according to claim 5, further comprising the steps of:
forming a sixth semi-finished product, wherein the sixth semi-finished product comprises a second process release film and a second low adhesive film which are sequentially compounded, the second process release film is formed with a third structure, and the third structure is arranged corresponding to the second structure;
and compounding the fifth semi-finished product and the sixth semi-finished product to form a seventh semi-finished product.
7. The die cutting process for copper foil assembly according to claim 6, wherein said forming said sixth semi-finished product comprises the steps of:
compounding the second low-adhesive film and the second process release film;
cutting the second process release film to form a third structure by the second process release film;
and discharging waste from the release film in the second process.
8. The die cutting process for a copper foil assembly of claim 7, further comprising the steps of:
rolling the first low-adhesive film of the seventh semi-finished product;
rolling the second low-viscosity film of the seventh semi-finished product;
and compounding the seventh semi-finished product and the separation paper to form a finished product.
9. A die-cut product production line capable of implementing the die-cutting process for a copper foil assembly according to any one of claims 1 to 8.
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| CN209989307U (en) * | 2019-05-26 | 2020-01-24 | 苏州玮俊电子科技有限公司 | Copper foil adhesive tape for mobile phone display screen |
| CN211710070U (en) * | 2019-10-09 | 2020-10-20 | 兰考裕德环保材料科技有限公司 | Die cutting device |
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| US20160360579A1 (en) * | 2013-09-26 | 2016-12-08 | Graphic Packaging International, Inc. | Laminates, And Systems And Methods For Laminating |
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