CN113488456A - Display device and manufacturing method thereof - Google Patents
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- CN113488456A CN113488456A CN202110708494.9A CN202110708494A CN113488456A CN 113488456 A CN113488456 A CN 113488456A CN 202110708494 A CN202110708494 A CN 202110708494A CN 113488456 A CN113488456 A CN 113488456A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000002096 quantum dot Substances 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000007639 printing Methods 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000010408 film Substances 0.000 claims description 28
- 239000010409 thin film Substances 0.000 claims description 15
- 230000008021 deposition Effects 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to the technical field of display devices, in particular to a display device and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: providing a substrate; attaching a plurality of first blue light LED chips on a substrate, wherein the first blue light LED chips are provided with first surfaces, and the first surfaces are provided with first areas; arranging a printing plate above the plurality of first blue light LED chips, wherein the printing plate comprises a plurality of meshes in one-to-one correspondence with the plurality of first blue light LED chips, the meshes have a second area, and the second area is larger than or equal to the first area; and printing quantum dot materials on the plurality of first blue light LED chips through the printing plate, wherein the quantum dot materials at least cover the first surfaces of the corresponding plurality of first blue light LED chips through a plurality of meshes so as to form quantum dot films on the first surfaces of the plurality of first blue light LED chips. The manufacturing method of the display device provided by the invention realizes the deposition of the quantum dot material on the LED array by a simple process.
Description
Technical Field
The invention relates to the technical field of display devices, in particular to a display device and a manufacturing method thereof.
Background
Due to the rapid development of LED chip miniaturization, new display devices based on minileds (submillimeter LEDs) have been produced. In such a display device, the miniLED may be used as a direct display unit or a backlight unit. The QD-miniLED display uses a blue miniLED as backlight, combines red or green Quantum Dots (QDs) as a color conversion film, and utilizes high-energy photons generated by blue light to excite the quantum dots to generate corresponding red light or green light, thereby realizing full-color display. Compared with miniLED direct display, the QD-miniLED display device only uses a blue chip and does not need a red chip or a green chip, so that the circuit design of an epitaxial process and a panel is simplified, and the difficulty of transfer and die bonding processes is reduced.
However, one of the manufacturing difficulties of the QD-miniLED display device is the deposition process of the QDs on the miniLED array and the optical crosstalk problem. Common fabrication methods are photolithography, dispensing, and inkjet printing processes. For the photolithography process, an expensive photomask and QD photoresist are required, and a coating-exposure-development process is required to implement, so that the process is complicated, and the light emitting performance of QD is reduced by a baking process; for the dispensing process, the precision of the dispenser is low, so that the resolution requirement required by display is difficult to meet; for inkjet printing processes, the demands on the printing equipment and QD inks are very high, the printing rates are generally slow and problems of instability of successive printed drops often arise. Therefore, the deposition process of the QD on the miniLED array and the optical crosstalk problem need to be solved.
Disclosure of Invention
The invention provides a display device and a manufacturing method thereof, which realize the deposition of quantum dot materials on an LED array by a simple process and solve the problem of optical crosstalk.
The invention provides a manufacturing method of a display device, which comprises the following steps:
providing a substrate;
attaching a plurality of first blue light LED chips on the substrate, wherein the first blue light LED chips are provided with first surfaces, and the first surfaces are provided with first areas;
arranging a printing plate above the plurality of first blue LED chips, wherein the printing plate comprises a plurality of meshes in one-to-one correspondence with the plurality of first blue LED chips, the meshes have a second area, and the second area is larger than or equal to the first area;
and printing quantum dot materials on the plurality of first blue light LED chips through the printing plate, wherein the quantum dot materials at least cover the first surfaces of the corresponding plurality of first blue light LED chips through the plurality of meshes so as to form quantum dot films on the first surfaces of the plurality of first blue light LED chips.
Preferably, the step of attaching the plurality of first blue LED chips to the substrate further includes:
and attaching a plurality of second blue light LED chips to the substrate to emit blue light.
Preferably, when the second area of the plurality of meshes is larger than the first area, the quantum dot material is printed, and after passing through the plurality of meshes, the quantum dot material covers the first surfaces and the side surfaces of the corresponding plurality of first blue light LED chips to form quantum dot thin films on the first surfaces and the side surfaces of the plurality of first blue light LED chips.
Preferably, when the second area of the plurality of meshes is equal to the first area, before disposing the printing plate, the method further comprises:
and filling a black oil layer in gaps between the plurality of first blue light LED chips and the plurality of second blue light LED chips.
Preferably, the quantum dot material covers the first surfaces of the corresponding first blue LED chips through the plurality of meshes, so as to form a quantum dot thin film on the first surfaces of the plurality of first blue LED chips.
The present invention also provides a display device including:
a substrate, a first electrode and a second electrode,
the first blue light LED chips are attached to the substrate and provided with first surfaces;
and the quantum dot film at least covers the first surfaces of the first blue LED chips.
Preferably, the display device further includes a plurality of second blue LED chips attached to the substrate to emit blue light.
Preferably, the quantum dot thin film covers the first surfaces and the side surfaces of the corresponding first blue light LED chips.
Preferably, a black oil layer is filled in gaps between the plurality of first blue light LED chips and the plurality of second blue light LED chips.
Preferably, the quantum dot thin film covers the first surfaces of the corresponding plurality of first blue light LED chips.
According to the display device and the manufacturing method thereof, quantum dot materials are printed on the plurality of first blue LED chips through the printing plates with different mesh areas, the quantum dot materials are deposited on the LED array through a simple process, and the problem that the quantum dot materials are difficult to deposit on the LED chips is solved.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
Fig. 1 is a flowchart of a method for manufacturing a display device according to an embodiment of the invention;
fig. 2a to 2c are schematic structural diagrams illustrating a display device manufactured by a method according to an embodiment of the invention;
fig. 3a to 3c are schematic structural diagrams illustrating a process of manufacturing another display device according to the method of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
The invention aims at solving the problems that the existing quantum dot material is difficult to deposit on an LED array and optical crosstalk exists, and the embodiment of the invention is used for solving the problems.
The present invention provides a method for manufacturing a display device, as shown in fig. 1, 2 a-2 c and 3 a-3 c, the method comprising the steps of:
s101, providing a substrate 101:
specifically, the substrate 101 is a TFT (thin film transistor) array substrate including a single glass plate.
S102, attaching a plurality of first blue LED chips 102 to the substrate 101, where the first blue LED chips 102 have a first surface, and the first surface has a first area:
specifically, a plurality of first blue LED chips 102 may be attached to the substrate 101 by a component-making process, i.e., by an SMT (surface mount technology) machine, or may be attached to the substrate 101 by an Anisotropic Conductive Film (ACF) process. Wherein a plurality of the first blue LED chips 102 have a first surface having a first area. The first surface is an upper surface far away from the substrate 101, and the plurality of first blue LED chips 102 further have a side surface.
The screen printing process is simple and quick to operate, high in utilization rate of raw materials, capable of adjusting and controlling printing size and patterns by changing the shapes of the printing plate 103 and the meshes 1031/1031', and suitable for large-scale preparation of micro-or sub-millimeter-sized QD film arrays. Therefore, in the embodiment of the present invention, the first blue LED chip 102 is preferably a mini blue LED chip.
Further, step S102 further includes: and attaching a plurality of second blue light LED chips to the substrate to emit blue light.
The plurality of first blue LED chips 102 are used as a backlight, the quantum dot thin films 104'/104 ″ formed on the first surfaces of the first blue LED chips 102 in the subsequent steps are used as color conversion films, and the two films are combined to emit red light or green light, and the plurality of second blue LED chips emit blue light, thereby realizing full-color display.
S103, disposing a printing plate 103 above the plurality of first blue LED chips 102, where the printing plate 103 includes a plurality of meshes 1031 corresponding to the plurality of first blue LED chips 102 one by one, and the meshes 1031 have a second area, where the second area is greater than or equal to the first area:
different said meshes 1031/1031' can be obtained by selecting different said printing plates 103. As shown in fig. 2a and 3b, the mesh 1031/1031' has a second area that is greater than or equal to the first area of the first blue LED chip 102. When the second area is larger than the first area, the size of the mesh 1031 is larger than the size of the corresponding first blue LED chip 102; when the second area is equal to the first area, the size of the mesh 1031' is equal to the size of the corresponding first blue LED chip 102.
S104, printing quantum dot material 104 on the plurality of first blue LED chips 102 through the printing plate 103, wherein the quantum dot material 104 covers at least the first surfaces of the corresponding plurality of first blue LED chips 102 through the plurality of meshes 1031/1031 'to form quantum dot films 104'/104 ″ on at least the first surfaces of the plurality of first blue LED chips 102:
as shown in fig. 2a to 2b and fig. 3b to 3c, in step S104, a plurality of meshes 1031/1031 ' are aligned with the centers of a plurality of first blue LED chips 102, quantum dot materials 104 are printed on the plurality of first blue LED chips 102 by the printing plate 103, and after the quantum dot materials 104 pass through the plurality of meshes 1031, the quantum dot materials are coated at least on the first surfaces of the corresponding plurality of first blue LED chips 102 to form the quantum dot films 104 '/104 ″ on at least the first surfaces of the plurality of first blue LED chips 102, that is, the quantum dot films 104 '/104 ″ are formed on at least the upper surfaces of the plurality of first blue LED chips 102.
Wherein the film thickness of the quantum dot thin film 104 '/104' is preferably 5-20 micrometers.
Referring to fig. 2a to 2c, when the second area of the plurality of meshes 1031 is larger than the first area, and the quantum dot material 104 is printed, after the quantum dot material 104 passes through the plurality of meshes 1031, due to the larger size of the meshes 1031, the quantum dot material 104 covers the first surfaces and the side surfaces of the corresponding plurality of first blue LED chips 102 to form the quantum dot thin films 104' on the first surfaces and the side surfaces of the plurality of first blue LED chips 102. The quantum dot thin film 104' formed on the side surface can serve as a retaining wall to prevent optical crosstalk between the first blue LED chips 102.
The method provided by the embodiment realizes the fabrication of the quantum dot film 104' on the first surface of the first blue LED chip 102 by providing a printing plate with a large aperture, and simultaneously solves the problem of optical crosstalk.
Referring to fig. 3 a-3 c, when the second area of the plurality of the meshes 1031' is equal to the first area, before disposing the printing plate 103, the method further comprises: a black oil layer 105 is filled in a gap between the plurality of first blue LED chips 102 and the plurality of second blue LED chips. The black oil layer 105 serves as a dam to prevent optical crosstalk. Then, the quantum dot material 104 is printed through the plurality of meshes 1031' to cover the first surfaces of the corresponding plurality of first blue LED chips 102, so as to form quantum dot thin films 104 ″ on the first surfaces of the plurality of first blue LED chips 102.
In order to realize a full-color display, it can be understood that the quantum dot material 104 includes a red quantum dot material and a green quantum dot material, the plurality of first blue LED chips 102 includes a plurality of first sub blue LED chips and a plurality of second sub blue LED chips, and when the quantum dot material 104 is printed, the patterns of the printing plates corresponding to the quantum dot materials 104 of different colors are different.
The red quantum dot material at least covers the upper surfaces of the corresponding first sub blue light LED chips through a plurality of meshes on the corresponding printing plate so as to form a red quantum dot film on the upper surfaces of the first sub blue light LED chips; the green quantum dot material at least covers the upper surfaces of the corresponding second sub blue light LED chips through a plurality of meshes on the corresponding printing plate, so that a green quantum dot film is formed on the upper surfaces of the second sub blue light LED chips. The first sub blue light LED chip, the second sub blue light LED chip and the second blue light LED chip constitute a light emitting unit, and the arrangement of the first sub blue light LED chip, the second sub blue light LED chip and the second blue light LED chip can refer to any known arrangement of pixels, which is not limited herein.
Further, after the printing is completed, the quantum dot film 104'/104 ″ is thermally cured or UV (ultraviolet) cured, and then subsequent processes such as packaging and Bonding are performed to obtain the QD-miniLED display device. Wherein the heat curing conditions are as follows: the temperature is 50-100 ℃, and the time is 10-30 minutes; the UV curing conditions were: the wavelength of the ultraviolet light is 365nm, and the time is 2-5 minutes.
An embodiment of the present invention further provides a display device manufactured by the above method, and referring to fig. 2c and 3c, the display device includes:
the substrate 101 is provided with a plurality of through holes,
a plurality of first blue LED chips 102 attached to the substrate 101, the first blue LED chips 102 having a first surface;
quantum dot films 104'/104 ″ cover at least the first surfaces of the first blue LED chips 102.
Further, the display device further includes a plurality of second blue LED chips (not shown) attached to the substrate 101 to emit blue light.
The plurality of first blue LED chips 102 are used as a backlight, the quantum dot thin films 104'/104 ″ formed on the first surfaces of the first blue LED chips 102 are used as color conversion films, and the two films are combined to emit red light or green light, and the plurality of second blue LED chips emit blue light, thereby realizing full-color display.
As shown in fig. 2c, in the display device provided in this embodiment, the quantum dot thin film 104' covers the first surfaces and the side surfaces of the corresponding first blue LED chips 102. The quantum dot film 104' covering the side surface can serve as a retaining wall to prevent optical crosstalk between the first blue LED chips 102.
As shown in fig. 3c, in another display device provided in this embodiment, a black oil layer 105 is filled in a gap between the first blue LED chips 102 and the second blue LED chips. At this time, the quantum dot thin film 104 ″ covers the first surfaces of the corresponding plurality of first blue LED chips 102. The black oil layer 105 serves as a dam to prevent optical crosstalk.
For realizing full-color display, it can be understood that the quantum dot films 104'/104 ″ include a red quantum dot film and a green quantum dot film, and the plurality of first blue LED chips 102 include a plurality of first sub blue LED chips and a plurality of second sub blue LED chips; the red quantum dot film at least covers the upper surfaces of the corresponding first sub blue LED chips; the green quantum dot film at least covers the upper surfaces of the corresponding second sub blue LED chips. The first sub blue light LED chip, the second sub blue light LED chip and the second blue light LED chip constitute a light emitting unit, and the arrangement of the first sub blue light LED chip, the second sub blue light LED chip and the second blue light LED chip can refer to any known arrangement of pixels, which is not limited herein.
The display device and the manufacturing method thereof provided by the embodiment of the invention are described in detail, a specific example is applied in the description to explain the principle and the embodiment of the invention, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for manufacturing a display device, comprising:
providing a substrate;
attaching a plurality of first blue light LED chips on the substrate, wherein the first blue light LED chips are provided with first surfaces, and the first surfaces are provided with first areas;
arranging a printing plate above the plurality of first blue LED chips, wherein the printing plate comprises a plurality of meshes in one-to-one correspondence with the plurality of first blue LED chips, the meshes have a second area, and the second area is larger than or equal to the first area;
and printing quantum dot materials on the plurality of first blue light LED chips through the printing plate, wherein the quantum dot materials at least cover the first surfaces of the corresponding plurality of first blue light LED chips through the plurality of meshes so as to form quantum dot films on the first surfaces of the plurality of first blue light LED chips.
2. The method of claim 1, wherein the step of attaching the plurality of first blue LED chips to the substrate further comprises:
and attaching a plurality of second blue light LED chips to the substrate to emit blue light.
3. The method of claim 1, wherein the quantum dot material is printed when the second area of the mesh holes is larger than the first area, and the quantum dot material passes through the mesh holes and covers the first surfaces and the side surfaces of the first blue LED chips to form quantum dot films on the first surfaces and the side surfaces of the first blue LED chips.
4. The method of manufacturing a display device according to claim 2, wherein when the second area of the plurality of meshes is equal to the first area, before disposing the printing plate, the method further comprises:
and filling a black oil layer in gaps between the plurality of first blue light LED chips and the plurality of second blue light LED chips.
5. The method of claim 4, wherein the quantum dot material covers the first surfaces of the corresponding first blue LED chips through a plurality of meshes to form quantum dot films on the first surfaces of the first blue LED chips.
6. A display device, comprising:
a substrate, a first electrode and a second electrode,
the first blue light LED chips are attached to the substrate and provided with first surfaces;
and the quantum dot film at least covers the first surfaces of the first blue LED chips.
7. The display device according to claim 6, further comprising a plurality of second blue LED chips attached to the substrate to emit blue light.
8. The display device according to claim 6, wherein the quantum dot thin film covers the first surfaces and side surfaces of the corresponding plurality of first blue LED chips.
9. The display device according to claim 7, wherein a black oil layer is filled in a gap between the plurality of first blue LED chips and the plurality of second blue LED chips.
10. The display device according to claim 9, wherein the quantum dot thin film covers the first surfaces of the corresponding plurality of first blue LED chips.
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| CN202110708494.9A CN113488456A (en) | 2021-06-25 | 2021-06-25 | Display device and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114447192A (en) * | 2022-01-20 | 2022-05-06 | 东莞市中麒光电技术有限公司 | Display module manufacturing method, display module and display screen |
| CN114447189A (en) * | 2022-01-21 | 2022-05-06 | 东莞市中麒光电技术有限公司 | Hole array forming method, light emitting structure, display module manufacturing method and display module |
| CN115469484A (en) * | 2022-10-21 | 2022-12-13 | 惠科股份有限公司 | Backlight module, display module and display device |
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