CN113488397A - Glue sealing assembly, glue sealing device and glue sealing method - Google Patents

Glue sealing assembly, glue sealing device and glue sealing method Download PDF

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Publication number
CN113488397A
CN113488397A CN202110736304.4A CN202110736304A CN113488397A CN 113488397 A CN113488397 A CN 113488397A CN 202110736304 A CN202110736304 A CN 202110736304A CN 113488397 A CN113488397 A CN 113488397A
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China
Prior art keywords
sealing
glue
opening
assembly
molding
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CN202110736304.4A
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Chinese (zh)
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CN113488397B (en
Inventor
向昌明
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TCL Huaxing Photoelectric Technology Co Ltd
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TCL Huaxing Photoelectric Technology Co Ltd
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Priority to CN202110736304.4A priority Critical patent/CN113488397B/en
Publication of CN113488397A publication Critical patent/CN113488397A/en
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Publication of CN113488397B publication Critical patent/CN113488397B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The application discloses a glue sealing assembly, a glue sealing device and a glue sealing method. The glue sealing assembly comprises a support plate, a limiting part, a glue sealing mold and a cover plate. The limiting piece is located on one side of the carrier plate. The limiting part comprises a first opening for accommodating the piece to be sealed. The glue sealing mold is located on one side of the limiting part far away from the carrier plate. The glue sealing mold comprises a second opening and a glue overflow hole for containing the packaging glue. The second opening is opposite to the first opening. The glue overflow hole is arranged adjacent to the second opening. The cover plate is positioned on one side of the glue sealing mould away from the limiting part. The cover plate and the carrier plate are arranged oppositely. The sealant assembly provided by the application can prevent the sealant from overflowing in the pressing process.

Description

Glue sealing assembly, glue sealing device and glue sealing method
Technical Field
The application relates to the technical field of packaging, in particular to a glue sealing assembly, a glue sealing device and a glue sealing method.
Background
Before leaving the factory, a part of industrial products need to be packaged, so that the purposes of isolating water and oxygen and prolonging the service life of the industrial products are achieved. The molding process is one of the commonly used packaging methods. The encapsulation process generally places the corresponding industrial product and the encapsulation glue in the package assembly, and the encapsulation of the industrial product by the encapsulation glue is realized by pressing the package assembly. At present, carry out the in-process of pressfitting at the encapsulation subassembly, the encapsulation is glued and is spilled over the encapsulation subassembly easily, leads to industrial product's the encapsulation effect relatively poor.
Disclosure of Invention
An object of the present application is to provide a sealing assembly, a sealing device and a sealing method, so as to solve the problem in the prior art that the sealing glue easily overflows the sealing assembly.
An embodiment of the present application provides a sealant assembly, including:
a carrier plate;
the limiting piece is positioned on one side of the carrier plate and comprises a first opening for accommodating a piece to be sealed;
the glue sealing mold is positioned on one side of the limiting piece away from the carrier plate and comprises a second opening and a glue overflow hole, the second opening is used for containing packaging glue, the second opening is arranged opposite to the first opening, and the glue overflow hole is arranged adjacent to the second opening;
the cover plate is positioned on one side, away from the limiting part, of the glue sealing mold, and the cover plate and the carrier plate are arranged oppositely.
In some embodiments, the molding compound mold includes a plurality of the glue overflow holes, and the glue overflow holes are disposed along the edge of the second opening.
In some embodiments, the glue overflow holes are evenly distributed along the circumferential direction of the second opening.
In some embodiments, the molding compound assembly further includes a protective film, the protective film is located between the to-be-molded compound and the molding compound mold, and the protective film covers a non-molding compound region of the to-be-molded compound.
In some embodiments, the flash hole is located on one side of the non-molding region of the to-be-molded member.
In some embodiments, a gap is formed between the packaging adhesive and the inner wall of the second opening.
In some embodiments, the molding compound assembly further includes a release film located between the molding compound mold and the cover plate, and the release film covers the second opening and the glue overflow hole.
In some embodiments, the molding compound assembly further includes a connector, and the carrier plate, the stopper, the molding compound mold, and the cover plate are detachably connected through the connector.
An embodiment of the present application further provides a sealant device, including the sealant assembly as described above, the sealant device further includes:
the vacuum chamber comprises a bottom plate and a side wall, the side wall forms a containing cavity around the edge of the bottom plate, and the glue sealing assembly is located in the containing cavity;
a sealing plate, an edge of the sealing plate being in contact with the side wall;
and the sealing glue component is positioned between the bottom plate and the pressing component.
In some embodiments, the molding compound device further includes a sealing member, one end of the sealing member is in contact with one end of the side wall away from the bottom plate, and the other end of the sealing member is in contact with one side of the sealing plate close to the molding compound assembly.
The embodiment of the present application further provides a sealing method, which uses the sealing assembly as described above to seal the sealant, and the sealing method includes:
attaching a protective film to the non-sealing glue area of the piece to be sealed;
packaging the piece to be sealed by using the sealing assembly;
removing the protective film;
and curing the piece to be sealed.
The application provides a sealant assembly. The glue sealing assembly comprises a support plate, a limiting part, a glue sealing mold and a cover plate. The limiting piece is located on one side of the carrier plate. The limiting part comprises a first opening for accommodating the piece to be sealed. The glue sealing mold is located on one side of the limiting part far away from the carrier plate. The glue sealing mold comprises a second opening and a glue overflow hole for containing the packaging glue. The second opening is opposite to the first opening. The glue overflow hole is arranged adjacent to the second opening. The cover plate is positioned on one side of the glue sealing mould away from the limiting part. The cover plate and the carrier plate are arranged oppositely. The glue overflow hole is formed in the glue sealing mold, and a containing space is provided for redundant packaging glue. In the process of pressing the packaging adhesive and the piece to be sealed, the redundant packaging adhesive can flow into the adhesive overflowing hole from the second opening, so that the phenomenon that the redundant packaging adhesive directly overflows from the second opening to the sealing adhesive component to influence the packaging effect of the piece to be sealed is avoided. Therefore, the glue sealing assembly provided by the application can improve the packaging effect of the piece to be sealed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments and implementations of the application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package assembly provided in the present application.
Fig. 2 is a schematic structural diagram of a limiting element provided in the present application.
Fig. 3 is a schematic view of a first structure of a molding die provided in the present application.
Fig. 4 is a schematic view of a second structure of the molding die provided in the present application.
Fig. 5 is a schematic view of a third structure of a molding die provided in the present application.
FIG. 6 is a schematic view of a first structure of a molding apparatus provided in the present application.
FIG. 7 is a flowchart illustrating a process of the molding apparatus of the present application.
FIG. 8 is a diagram illustrating a second structure of a molding apparatus according to the present application.
FIG. 9 is a flowchart illustrating a molding method according to the present disclosure.
Fig. 10 is a schematic structural diagram of a to-be-encapsulated member in steps B10 to B30 of the encapsulation method provided by the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the use of ordinal numbers such as first and second herein does not denote any order, quantity, or importance, but rather the terms first, second, etc. are used to distinguish one element from another. The directional terms used in this application, such as upper, lower, left and right, are used solely in reference to the orientation of the appended drawings. The positional relationship of [ one side ] and [ other side ] mentioned in the present application is used only for distinguishing different portions. Accordingly, the use of ordinal, directional and positional terms is to be taken as an illustration and understanding of the application and is not intended to limit the application. In the application, unless otherwise expressly stated or limited, a first feature "on" or "under" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in contact not in direct contact but via another feature in between. Like reference numerals refer to like elements throughout the specification. Because the dimensions and thicknesses of the various components illustrated in the drawings are presented for ease of illustration, the present disclosure is not necessarily limited to the illustrated dimensions and thicknesses of the various components.
The application provides a sealant assembly. As shown in fig. 1, the molding compound assembly 100 includes a carrier 101, a limiting member 102, a molding compound mold 103, a cover plate 104, a protective film 105, a release film 106, and a connecting member 107.
The carrier 101 is used for carrying the member to be sealed 20. The to-be-sealed member 20 is located at one side of the carrier 101, and the to-be-sealed member 20 directly contacts the carrier 101.
The limiting member 102 is located at one side of the carrier plate 101. Specifically, the position-limiting member 102 is located on one side of the carrier 101 carrying the member to be sealed 20. The limiting member 102 contacts the carrier 101. The limiting member 102 includes a first opening 1021. The member to be sealed 20 is located in the first opening 1021. The shape of the first opening 1021 is matched with the shape of the member 20 to be sealed, and the edge of the member 20 to be sealed contacts the inner wall of the first opening 1021. As shown in fig. 2, when the cross-section of the member to be sealed 20 is rectangular, the first opening 1021 is rectangular. The area of the cross section of the member to be sealed 20 is equal to the area of the first opening 1021. The above arrangement is favorable for placing the member to be sealed 20 in the first opening 1021 and realizing the contact between the edge of the member to be sealed 20 and the inner wall of the first opening 1021. The edge of the limiting member 102 corresponds to the edge of the carrier 101. Since the relative position between the limiting member 102 and the carrier 101 is not changed, when the to-be-sealed member 20 is located in the first opening 1021 of the limiting member 102, the limiting member 102 can limit the position of the to-be-sealed member 20 on the carrier 101, thereby preventing the package effect of the package 20 from being affected by the change of the relative position between the to-be-sealed member 20 and the carrier 101.
It is understood that a gap may exist between the member to be sealed 20 and the inner wall of the first opening 1021. When the package adhesive 30 needs to be heated to a predetermined value for pressing, the to-be-sealed member 20 is easily expanded by heating. A certain gap exists between the to-be-sealed member 20 and the inner wall of the first opening 1021 to provide a certain deformation space for the to-be-sealed member 20, so that damage to the to-be-sealed member 20 caused by excessive attachment of the to-be-sealed member 20 and the limiting member 102 can be avoided.
It is understood that the shape of the first opening 1021 may be a regular polygon, a circle, an ellipse, or other irregular shapes. The shape of the first opening 1021 is matched with the shape of the member 20 to be sealed, and the shape of the first opening 1021 is not limited in this application.
As shown in fig. 1, the protection film 105 is located on a side of the to-be-sealed device 20 away from the carrier 101. The protection film 105 is located between the member to be sealed 20 and the sealing mold 103. The protection film 105 covers the non-molding region 20b of the to-be-molded article 20. Specifically, the side of the protection film 105 close to the member to be sealed 20 has adhesiveness. The protection film 105 is bonded to the non-molding region 20b of the to-be-molded member 20 and the edge of the limiting member 102 near the first opening 1021.
It is understood that the protection film 105 can be adhered to only the non-molding region 20b of the to-be-molded member 20.
In the present application, the protection film 105 is disposed in the package assembly, and the protection film 105 covers the non-sealing area of the to-be-sealed member 20, so as to prevent the to-be-sealed member 20 and the sealing glue 30 from contacting the non-sealing area of the to-be-sealed member 20 during the pressing process, thereby ensuring the performance of the to-be-sealed member 20.
It is understood that the to-be-sealed device 20 provided by the present application includes a sealing area 20a and a non-sealing area 20 b. The molding area 20a is an area where the package member 20 is to be bonded with the molding compound 30. The non-molding region 20b is a region of the to-be-molded object 20 except the molding region 20 a. In the present application, the non-molding compound region 20b is located at the edge of the molding compound region 20 a. The non-molding region 20b of the to-be-molded component 20 can be located at other positions of the molding region 20 a. The to-be-sealed device 20 may not be provided with the non-sealing region 20b, i.e., the surface of the to-be-sealed device 20 needs to be sealed. The application is not particularly limited to the sealant 20.
In the present application, the to-be-encapsulated device 20 may be a substrate provided with an led chip. The substrate includes a light-emitting region and a non-light-emitting region. The light emitting region is provided with a light emitting diode chip. The substrate except the light-emitting region is a non-light-emitting region. The non-light-emitting area is used for arranging the wiring, so that the light-emitting diode chip is controlled to be turned on. The light emitting region may be disposed at a central region of the substrate. The non-light emitting region is disposed around the light emitting region. In a conventional display panel using a light emitting diode chip as a light source. After the light emitting diode chip is connected with the substrate, the light emitting diode chip needs to be sealed, so that water and oxygen are prevented from entering the light emitting diode chip. In the present application, a hot-pressing adhesive is used as the packaging adhesive 30. And pressing the substrate provided with the light-emitting diode chip through hot-pressing glue, thereby realizing the glue sealing of the light-emitting diode chip. Therefore, in the present application, the light emitting region of the substrate is the molding region 20 a. The non-light emitting region of the substrate is the non-molding region 20 b. During the molding process, the led chip located in the molding region 20a is molded by the hot-press molding, so as to prevent water and oxygen from entering the led chip.
The molding compound mold 103 is located on a side of the limiting member 102 away from the carrier 101. The molding die 103 includes a second opening 1031 and a flash hole 1032. The second opening 1031 is disposed opposite to the first opening 1021. The packaging adhesive 30 is located in the second opening 1031. The second opening 1031 defines a sealing position of the sealing compound 30. As shown in fig. 1, when the to-be-sealed device 20 includes a sealing area 20a and a non-sealing area 20b, the second opening 1031 is located above the sealing area 20a of the to-be-sealed device 20. Because the member 20 to be sealed is located in the first opening 1021, the sealing compound 30 is located in the second opening 1031, and the second opening 1031 and the first opening 1021 are oppositely arranged to define the position where the sealing compound 30 is attached to the member 20 to be sealed. As shown in fig. 1, the width of the second opening 1031 is smaller than the width of the first opening 1021. The width of the second opening 1031 is smaller than the width of the first opening 1021, so that the packaging adhesive 30 is only attached to one side of the member 20 to be sealed, and the influence of excessive sealing of the packaging adhesive 30 on the performance of the member 20 to be sealed is avoided.
It is understood that, in the present embodiment, the width of the second opening 1031 may be equal to the width of the first opening 1021. The width of the second opening 1031 is equal to the width of the first opening 1021, so that the performance of the member to be sealed 20 is not affected by excessive sealing of the sealing compound 30. The present application does not specifically limit the width of the second opening 1031 and the width of the first opening 1021.
The shape of the second opening 1031 is adapted to the shape of the sealing area 20a of the member to be sealed 20. Specifically, when the molding compound area 20a is rectangular, the second opening 1031 is rectangular. And the edge of the second opening 1031 corresponds to the edge of the sealing area 20 a.
A gap is formed between the sealing adhesive 30 and an inner wall of the second opening 1031. When the packaging adhesive 30 needs to be heated to a preset value for pressing, the packaging adhesive 30 is easily expanded when heated. There is certain clearance for the encapsulation to glue 30 and provides certain deformation space between the inner wall of encapsulation glue 30 and second opening 1031, can release the pressure of encapsulation glue 30 when encapsulation glue 30 carries out the pressfitting, avoids waiting to glue the damage of piece 20 because of the too big pressure of encapsulation glue 30 in the in-process of carrying out the pressfitting. Meanwhile, a certain gap is formed between the encapsulation adhesive 30 and the inner wall of the second opening 1031, so that the encapsulation effect of the to-be-encapsulated member 20 is further prevented from being influenced by the overflow of the encapsulation adhesive 30 over the encapsulation component 100.
The gap between the sealing adhesive 30 and the inner wall of the second opening 1031 needs to be set within a suitable range. Specifically, the width p1 of the gap between the packaging adhesive 30 and the inner wall of the second opening 1031 is between 2 mm and 3 mm. Specifically, the width p1 of the gap between the packaging adhesive 30 and the inner wall of the second opening 1031 may be 2 mm, 2.5 mm, or 3 mm. When the width p1 of the gap is smaller than 2 mm, the second opening 1031 cannot provide enough deformation space for the packaging adhesive 30, and the damage of the to-be-sealed adhesive member 20 caused by the excessive pressure of the packaging adhesive 30 cannot be effectively avoided. When the width p1 of the gap is greater than 3 mm, the second opening 1031 cannot effectively define the sealing position of the sealing compound 30. When the pressing is performed, the movement and deformation of the packaging adhesive 30 cannot be limited within an effective range, so that the packaging adhesive 30 deviates from a preset sealing position, thereby affecting the packaging effect of the member to be sealed 20. Therefore, in the present application, the width p1 of the gap between the encapsulation adhesive 30 and the inner wall of the second opening 1031 is set to be between 2 mm and 3 mm, so that the damage of the to-be-encapsulated member 20 caused by the excessive pressure of the encapsulation adhesive 30 can be avoided, and the encapsulation of the encapsulation adhesive 30 at the predetermined encapsulation position can be ensured.
It is understood that the shape of the second opening 1031 may be regular polygon, circle, ellipse or other irregular shape. The shape of the second opening 1031 is adapted to the edge of the sealing area 20a of the sealing compound 30. The shape of the second opening 1031 is not limited in this application.
As shown in fig. 1 and 3, the overflow hole 1032 is disposed adjacent to the second opening 1031. Specifically, the flash hole 1032 is disposed opposite to the non-molding region 20b of the to-be-molded member 20. The glue overflow hole 1032 is located at a side of the non-sealing area 20b of the to-be-sealed glue member 20. The orthographic projection of the glue overflow hole 1032 on the carrier board 101 overlaps with the orthographic projection of the non-glue sealing area 20b of the to-be-sealed glue piece 20 on the carrier board 101.
When the molding compound mold 103 includes a plurality of flash holes 1032, the flash holes 1032 are uniformly distributed along the circumference of the second opening 1031. The glue outflow holes 1032 are evenly distributed along the circumference of the second opening 1031, which means that a plurality of glue outflow holes 1032 are evenly distributed along the closed edge region of the second opening 1031. Specifically, as shown in fig. 3, the molding compound mold 103 includes four overflow holes 1032. The second opening 1031 is rectangular in shape. The four overflow holes 1032 are uniformly distributed on four sides of the second opening 1031. That is, the flash holes 1032 are provided at positions adjacent to each side of the second opening 1031. The shortest distance between the overflow hole 1032 and the edge of the second opening 1031 is equal. The width of the overflow hole 1032 on each side is equal to the length of the second opening 1031. This application is through setting up overflow and gluing hole 1032 along second opening 1031 circumference evenly distributed, can reserve accommodation space for unnecessary overflow to glue hole 1032 on the closed marginal a plurality of positions of second opening 1031, avoids encapsulating glue 30 directly to spill over to gluing subassembly 100 from second opening 1031.
It is understood that the shape of the second opening 1031 may be regular polygon, circle, ellipse or other irregular shape. The shape of flash hole 1032 in fig. 3 is illustrated as a regular polygon, but is not intended to limit the present application.
It is understood that, in the embodiment of the present application, when the molding compound mold 103 includes one flash hole 1032, the flash hole 1032 may be disposed only on one side of the second opening 1031.
As shown in fig. 4, in the embodiment of the application, when the molding compound mold 103 includes a plurality of glue overflow holes 1032, the plurality of glue overflow holes 1032 may be disposed around the edge of the second opening 1031, and the plurality of glue overflow holes 1032 extend from the edge of the second opening 1031 to the edge of the molding compound mold 103. In the present application, the plurality of glue overflow holes 1032 are provided to extend from the edge of the second opening 1031 to the edge of the glue sealing mold 103, so as to further increase the accommodating space of the excess glue overflow holes 1032. When the volume of the excess packaging adhesive 30 exceeds the accommodating space of the overflow hole 1032 close to the second opening 1031, the excess packaging adhesive 30 can further flow into the overflow hole 1032 far away from the edge of the second opening 1031, thereby further preventing the packaging adhesive 30 from overflowing the packaging assembly and ensuring the packaging effect of the to-be-sealed adhesive member 20.
As shown in fig. 5, in the embodiment of the present application, the molding compound mold 103 may include only one overflow hole 1032. The glue overflow hole 1032 is of a ring structure. The glue overflow hole 1032 is disposed around an edge of the second opening 1031. The glue overflow hole 1032 is disposed around the edge of the second opening 1031, so that an accommodating space can be reserved for the excess glue overflow hole 1032 on the edge of the second opening 1031, and the direct overflow of the packaging glue 30 from the second opening 1031 to the glue sealing assembly 100 is further avoided.
It is understood that in the embodiments of the present application, the molding compound mold 103 may include a plurality of ring-shaped glue overflow holes 1032 as shown in fig. 5. A plurality of annular glue wells 1032 are concentrically disposed around the edge of the second opening 1031.
As shown in fig. 1, the thickness of the encapsulation adhesive 30 is greater than the thickness of the encapsulation mold 103. Specifically, the difference p2 between the thickness of the encapsulant 30 and the thickness of the encapsulant mold 103 is between 1 mm and 2 mm. The difference p2 between the thickness of the encapsulation glue 30 and the thickness of the glue mold 103 may be 1 mm, 1.5 mm, or 2 mm. In the process of pressing the package adhesive 30 and the to-be-sealed member 20, the difference p2 between the thickness of the package adhesive 30 and the thickness of the sealing mold 103 is smaller than 1 mm, which may cause the package adhesive 30 to be unable to effectively seal the to-be-sealed member 20, and further cause the sealing effect of the to-be-sealed member 20 to be poor. The difference p2 between the thickness of the packaging adhesive 30 and the thickness of the sealing mold 103 is greater than 2 mm, so that a large amount of redundant packaging adhesive 30 is generated in the process of pressing the packaging adhesive 30 and the to-be-sealed adhesive 20, the excessive packaging adhesive 30 cannot be accommodated in the excessive packaging adhesive hole 1032, the excessive packaging adhesive 30 easily overflows the packaging assembly, and the sealing effect of the to-be-sealed adhesive 20 is affected. Therefore, the difference p2 between the thickness of the molding compound 30 and the thickness of the molding compound mold 103 is set between 1 mm and 2 mm to ensure the molding effect of the member to be molded 20.
The release film 106 is located on a side of the molding die 103 away from the to-be-molded object 20. The release film 106 is located between the encapsulation adhesive 30 and the cover plate 104. The release film 106 covers the second opening 1031 and the flash hole 1032.
The release film 106 refers to a film having a film surface energy distinction. The release film 106 is not sticky, or slightly sticky, after exposure to certain materials under limited conditions. The release film 106 exhibits an extremely light and stable release force to the encapsulation adhesive 30. In the present application, the adhesion force of the release film 106 to the encapsulation adhesive 30 is smaller than the adhesion force of the cover plate 104 to the encapsulation adhesive 30. After the sealing compound 30 and the to-be-sealed member 20 are pressed, the release film 106 can be directly peeled off from the surface of the sealing compound 30 in the sealing compound region 20a and the surface of the sealing compound 30 in the flash hole 1032, and the release film 106 is not easy to remain on the surface of the sealing compound 30.
According to the application, the release film 106 is arranged between the packaging adhesive 30 and the cover plate 104, so that the packaging adhesive 30 can be prevented from being directly adhered to the cover plate 104, and the cover plate 104 and the packaging adhesive 30 can be separated.
The cover plate 104 is located on a side of the release film 106 away from the encapsulation adhesive 30. The cover plate 104 is disposed opposite to the carrier plate 101. One end of the cover plate 104 is aligned with one end of the carrier plate 101. The orthographic projection of the encapsulation adhesive 30 on the carrier 101 is within the range of the orthographic projection of the cover plate 104 on the carrier 101. The encapsulant 30 and the member to be encapsulated 20 are stacked between the cover plate 104 and the carrier 101. When the pressing is performed, the distance between the cover plate 104 and the carrier plate 101 is shortened. The cover plate 104 applies pressure to one side of the encapsulation adhesive 30. The packaging adhesive 30 deforms, so that the sealing of the member to be sealed 20 is realized.
The connecting member 107 is located at the edges of the carrier 101, the limiting member 102, the molding compound mold 103, the release film 106 and the cover plate 104. The connecting member 107 connects the carrier 101, the limiting member 102, the molding compound mold 103, the release film 106 and the cover plate 104. Specifically, as shown in fig. 1, the connecting member 107 may be a screw. Threaded holes are formed in the edge of the carrier plate 101, the edge of the limiting member 102, the edge of the sealing mold 103, the edge of the release film 106 and the edge of the cover plate 104. The threaded holes of the carrier plate 101 correspond to the threaded holes of the limiting member 102, the threaded holes of the molding compound mold 103, and the threaded holes of the cover plate 104 one by one. The screws are detachably connected to the carrier plate 101, the limiting member 102, the molding die 103, the release film 106 and the cover plate 104 through the screw holes.
It is understood that in the present embodiment, the connecting member 107 may also be a clamping member (not shown). The clamping member clamps the carrier plate 101, the limiting member 102, the sealing mold 103, the release film 106 and the cover plate 104, which are stacked, so that the carrier plate 101, the limiting member 102, the sealing mold 103, the release film 106 and the cover plate 104 can be detachably connected. The connection member 107 is not particularly limited in this application.
The connecting piece 107 is arranged in the sealing assembly 100, so that the carrier plate 101, the limiting piece 102, the sealing mold 103, the release film 106 and the cover plate 104 are detachably connected, the sealing assembly 100 is favorable for placing the to-be-sealed piece 20 and the packaging adhesive 30 in the sealing assembly, and sealing of the to-be-sealed piece 20 by the packaging adhesive 30 is realized.
The application provides a glue sealing assembly sets up excessive gluey hole in the glue sealing mould, and excessive gluey hole sets up with holding the second opening of encapsulation and gluing adjacently. When the to-be-sealed member is pressed against the packaging adhesive, the adhesive overflow hole provides a containing space for the redundant packaging adhesive, so that the situation that the redundant packaging adhesive directly overflows from the second opening to the sealing assembly 100 to affect the sealing effect of the to-be-sealed member can be avoided. The application provides a encapsulation subassembly can improve and treat the gluey effect of gluing of a piece. Meanwhile, the glue overflow hole is arranged opposite to the non-glue sealing area of the part to be sealed, so that the redundant packaging glue can be prevented from flowing to the non-glue sealing area of the part to be sealed, and the normal use of the related functions of the part to be sealed is ensured.
The present application further provides a molding apparatus 10. Referring to fig. 1 and 6, fig. 6 is a schematic structural diagram of a molding apparatus according to a first embodiment of the present disclosure.
As shown in fig. 6, the sealing device 10 includes the sealing assembly 100, the vacuum chamber 200, the sealing plate 300 and the pressing assembly 400 as described above.
The vacuum chamber 200 includes a floor 201 and sidewalls 202. The side wall 202 is disposed around the edge of the bottom plate 201 to form the receiving cavity 200 a. The receiving cavity 200a is used for receiving the sealant assembly 100. Specifically, the sealant assembly 100 is located on a side of the bottom plate 201 where the sidewall 202 is disposed. The vacuum chamber 200 and the sealing plate 300 form a sealed space. The sidewall 202 of the vacuum chamber 200 is provided with a pumping hole 203. One end of the suction hole 203 is connected to the receiving chamber 200a, and the other end of the suction hole 203 is connected to a vacuum pump (not shown). The vacuum chamber 200 may draw air of the receiving chamber 200a by a vacuum pump to make the vacuum degree of the receiving chamber 200a reach a preset vacuum degree.
The edge of the sealing plate 300 is in contact with the inner side of the sidewall 202. The sealing plate 300 forms a sealed space with the vacuum chamber 200. The sealing adhesive member 100 and the pressing member 400 are disposed between the base plate 201 and the sealing plate 300.
The compression assembly 400 is coupled to a side of the sealing plate 300 adjacent to the base plate 201. The compression assembly 400 includes a ram 401 and a platen 402. The ram 401 is connected at one side thereof to the sealing plate 300. The other side of the ram 401 is connected to a platen 402. The sealant assembly 100 is located between the press plate 402 and the bottom plate 201. The orthogonal projection of the package adhesive 30 in the adhesive package assembly 100 on the carrier 101 is within the range of the orthogonal projection of the pressing plate 402 on the carrier 101. In the process of pressing the package adhesive 30 and the to-be-sealed adhesive member 20, the above arrangement makes the force applied by the pressing plate 402 to the package adhesive 30 more uniform, so as to avoid the package effect from being affected by the local excessive stress on the package adhesive 30.
The operation of the molding apparatus 10 provided in the present application is described with reference to fig. 1, fig. 6, and fig. 7. When the sealing device 10 presses the to-be-sealed member 20 and the sealing glue 30, the method specifically includes the following steps:
step B701: and placing the glue sealing assembly in which the piece to be sealed and the packaging glue are placed in a glue sealing device.
In the present embodiment, a substrate connected with a light emitting diode chip is taken as the to-be-encapsulated device 20, and a hot-press adhesive is taken as the encapsulation adhesive 30.
Specifically, the substrate connected with the led chip is placed in the position-limiting member 102, and the hot-pressed adhesive is placed in the adhesive sealing mold 103. The placed substrate and the molding compound assembly 100 of the hot-pressed molding compound are placed in the molding compound apparatus 10.
Step B702: the sealing component is pressed by the pressing component so that the sealing glue is contacted with the piece to be sealed.
The sealing plate 300 is moved in a direction to approach the carrier plate 101. The distance between the seal plate 300 and the base plate 201 is shortened until the platen 402 is in contact with the cover plate 104 of the package assembly. The platen 402 presses the molding compound assembly 100. The hot-pressing adhesive in the adhesive sealing assembly 100 is deformed by stress, so that the hot-pressing adhesive seals the light-emitting diode chip.
It will be appreciated that in some embodiments, the hot-pressed adhesive needs to be within a certain temperature range to perform the bonding. Therefore, in the embodiment of the present application, a temperature control assembly may be disposed on one side of the pressing assembly 400, so that the pressing head 401 and the pressing plate 402 reach a predetermined temperature. During the bonding process, the heat of the bonding assembly 400 is transferred to the molding apparatus 10. The hot-pressing glue reaches the preset temperature, so that the glue sealing of the light-emitting diode chip is realized.
It can be understood that the temperature control assembly of the present application can also be disposed at one side of the vacuum chamber 200, and the temperature in the accommodating chamber 200a is adjusted, so that the temperature of the hot-pressing adhesive reaches the preset temperature.
It is understood that the temperature of the hot-pressing adhesive is related to the material of the hot-pressing adhesive and the property of the member 20 to be sealed, and the predetermined temperature is not particularly limited in this application.
Step B703: and extracting air in the vacuum chamber to enable the vacuum degree of the accommodating chamber to reach a preset vacuum degree.
Specifically, air of the accommodating chamber 200a is pumped by a vacuum pump so that the degree of vacuum of the accommodating chamber 200a reaches a preset value. In step 702, the thermal pressure adhesive and the substrate connected with the led chip are pressed together under atmospheric pressure, so that air bubbles are easily generated during the pressing of the thermal pressure adhesive on the led chip, thereby affecting the sealing effect of the thermal pressure adhesive on the led chip. The vacuum degree of the accommodating cavity 200a is set to reach a preset value, so that bubbles between the hot-pressing adhesives can be discharged, and the adhesive sealing effect of the hot-pressing adhesives on the light-emitting diode chip can be further improved.
It is understood that the preset vacuum degree can be set according to the actual production process, and the application is not limited.
Fig. 8 is a schematic structural diagram of a molding apparatus 10 according to a second embodiment of the present disclosure, as shown in fig. 8.
The sealing device 10 of the second embodiment differs from the sealing device 10 of the first embodiment in that: the molding apparatus 10 further includes a sealing member 500. The seal 500 is located at an end of the side wall 202 remote from the base plate 201. One end of the sealing member 500 is in contact with one end of the sidewall 202, and the other end of the sealing member 500 is in contact with the edge of the sealing plate 300. The vacuum chamber 200, the sealing member 500, and the sealing plate 300 are arranged to surround each other to form a sealed space. The seal 500 has deformability. When the sealing device 10 is pressed, the sealing element 500 can deform, so as to ensure the normal operation of the pressing process. In the step B703, the sealing member 500, the vacuum chamber 200, and the sealing plate 300 form a closed space, so as to prevent external air from entering, and ensure that the vacuum degree of the accommodating chamber 200a reaches a predetermined vacuum degree.
Other components of the molding apparatus 10 of the second embodiment are the same as the molding apparatus 10 of the first embodiment, and are not described herein again.
The application provides a sealing device, and a sealing component in the sealing device is provided with a glue overflow hole. When the piece to be sealed is pressed with the packaging adhesive, the adhesive overflow hole provides a containing space for the redundant packaging adhesive, so that the phenomenon that the redundant packaging adhesive directly overflows to the sealing adhesive assembly to influence the sealing adhesive effect of the piece to be sealed can be avoided. In addition, the glue sealing device of the application sets the vacuum degree in the containing cavity at the preset value in the process of pressing the packaging glue and the piece to be sealed, so that bubbles between the packaging glue and the piece to be sealed can be discharged, and the glue sealing effect of the hot-pressing glue on the light-emitting diode chip can be further improved.
Correspondingly, the application also provides a sealing method. As shown in fig. 9 and 10, fig. 9 is a flowchart of a molding method provided in the present application. Fig. 10 is a schematic structural diagram of a to-be-encapsulated member in steps B10 to B30 of the encapsulation method provided by the present application. The sealing method specifically comprises the following steps:
step B10: and attaching a protective film to the non-sealing area of the piece to be sealed.
In the present embodiment, a substrate connected with a light emitting diode chip is taken as the to-be-encapsulated device 20, and a hot-press adhesive is taken as the encapsulation adhesive 30.
As shown in the structure (a) of fig. 10, the region where the led chip is disposed is the molding region 20 a. The remaining portion is the non-molding compound region 20 b. In the prior art, the non-molding compound area 20b is typically used for disposing traces. And lighting the light emitting diode chip. In the embodiment of the present application, the non-molding compound region 20b is disposed around the edge of the molding compound region 20 a.
The non-molding region does not require the molding compound 30 to be attached, and therefore, the protection film 105 in the molding compound assembly 100 is attached to the non-molding region 20 b. The structure of the to-be-sealed member 20 after the protective film 105 is attached is shown as (b) in fig. 10. The protective film 105 covers the non-molding compound region 20 b. The protective film 105 is disposed around the edge of the molding region 20 a.
Step B20: and packaging the to-be-packaged rubber part by using the rubber sealing component.
Specifically, the to-be-sealed member 20 with the protective film 105 attached thereto is placed in the sealing assembly 100. The substrate connected with the led chip in the sealing assembly 100 and the hot-pressing adhesive are pressed by the sealing device 10, so as to seal the led chip by the hot-pressing adhesive.
After the sealing of the led chip is completed, the cover plate 104, the sealing mold 103, the limiting member 102 and the carrier plate 101 in the sealing assembly 100 are removed, and the structure obtained is as shown in fig. 10 (c).
Step B30: and removing the protective film.
After the cover plate 104, the molding compound mold 103, the limiting member 102 and the carrier 101 are removed, the protective film 105 in the non-molding compound region 20b is removed, and the structure is shown as (d) in fig. 10.
Step B40: and curing the piece to be sealed.
After the protective film 105 is torn off, the hot-pressed adhesive after pressing can be further subjected to curing treatment. Specifically, the substrate to which the hot-pressing adhesive is attached is subjected to heating treatment to realize curing of the hot-pressing adhesive.
It can be understood that the curing temperature and the curing time of the hot-pressing adhesive are related to the material of the hot-pressing adhesive, the thickness of the hot-pressing adhesive and the size of the substrate, and the curing temperature and the curing time of the hot-pressing adhesive are not limited in the present application.
The application provides a sealing method. The sealing method provided by the application adopts the sealing assembly to press the to-be-sealed piece and the packaging adhesive. The glue sealing method provided by the application is characterized in that glue overflowing holes are formed in the glue sealing assembly. When the piece to be sealed is pressed with the packaging adhesive, the adhesive overflow hole provides a containing space for the redundant packaging adhesive, so that the phenomenon that the redundant packaging adhesive directly overflows to the sealing adhesive assembly to influence the sealing adhesive effect of the piece to be sealed can be avoided. The glue sealing method provided by the application can improve the glue sealing effect of the part to be sealed. Meanwhile, the sealing method provided by the application covers the protective film on the non-sealing area, protects the non-sealing area of the to-be-sealed element, and avoids the influence on the performance of the sealing adhesive caused by the pressing of the sealing adhesive on the non-sealing area of the to-be-sealed element.
In summary, although the embodiments of the present application are described in detail above, the above-mentioned embodiments are not intended to limit the present application, and it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims (11)

1. A sealant assembly, comprising:
a carrier plate;
the limiting piece is positioned on one side of the carrier plate and comprises a first opening for accommodating a piece to be sealed;
the glue sealing mold is positioned on one side of the limiting piece away from the carrier plate and comprises a second opening and a glue overflow hole, the second opening is used for containing packaging glue, the second opening is arranged opposite to the first opening, and the glue overflow hole is arranged adjacent to the second opening;
the cover plate is positioned on one side, away from the limiting part, of the glue sealing mold, and the cover plate and the carrier plate are arranged oppositely.
2. The molding compound assembly of claim 1, wherein the molding compound mold comprises a plurality of the glue-overflow holes, the plurality of glue-overflow holes being disposed along an edge of the second opening.
3. The sealant assembly of claim 2, wherein the plurality of sealant overflow holes are evenly distributed along a circumferential direction of the second opening.
4. The molding compound assembly of claim 1, further comprising a protective film disposed between the to-be-molded compound and the molding compound mold, the protective film covering a non-molding compound region of the to-be-molded compound.
5. The molding compound assembly of claim 1, wherein the flash hole is located at a side of the non-molding compound region of the to-be-molded compound.
6. The molding compound assembly of claim 1, wherein a gap is provided between the encapsulant and an inner wall of the second opening.
7. The molding compound assembly of claim 1, further comprising a release film disposed between the molding compound mold and the cover plate, the release film covering the second opening and the glue overflow hole.
8. The molding assembly of claim 1, further comprising a connector, wherein the carrier plate, the retainer, the molding die and the cover plate are detachably connected via the connector.
9. A molding apparatus, comprising the molding assembly of any of claims 1-8, the molding apparatus further comprising:
the vacuum chamber comprises a bottom plate and a side wall, the side wall forms a containing cavity around the edge of the bottom plate, and the glue sealing assembly is located in the containing cavity;
a sealing plate, an edge of the sealing plate being in contact with the side wall;
and the sealing glue component is positioned between the bottom plate and the pressing component.
10. The molding compound device of claim 9, further comprising a sealing member, one end of the sealing member contacting an end of the sidewall distal from the bottom plate, another end of the sealing member contacting a side of the sealing plate proximate to the molding compound assembly.
11. A molding method, wherein the molding assembly of claims 1-8 is used for molding, the molding method comprising:
attaching a protective film to the non-sealing glue area of the piece to be sealed;
sealing the to-be-sealed piece by using the sealing component;
removing the protective film;
and curing the piece to be sealed.
CN202110736304.4A 2021-06-30 2021-06-30 Sealing assembly, sealing device and sealing method Active CN113488397B (en)

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CN111640737A (en) * 2020-06-02 2020-09-08 上海九山电子科技有限公司 Mold and backlight source packaging method
CN111865205A (en) * 2020-07-09 2020-10-30 江苏彩虹永能新能源有限公司 Photovoltaic module overflows gluey groove frame
CN112652249A (en) * 2021-01-07 2021-04-13 南京车栈口贸易有限公司 Waterproof and dustproof display panel processing device capable of being sealed permanently

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CN1652647A (en) * 2005-03-14 2005-08-10 悠景科技股份有限公司 Structure for packaging organic electroluminescence device
CN200972857Y (en) * 2006-09-30 2007-11-07 李洲科技股份有限公司 Chip sealing device of preventing adhesive spilling
CN203046420U (en) * 2012-11-29 2013-07-10 宸鸿科技(厦门)有限公司 Gluing fixture
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