CN113471242B - Display panel and spliced display screen - Google Patents
Display panel and spliced display screen Download PDFInfo
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- CN113471242B CN113471242B CN202111026044.8A CN202111026044A CN113471242B CN 113471242 B CN113471242 B CN 113471242B CN 202111026044 A CN202111026044 A CN 202111026044A CN 113471242 B CN113471242 B CN 113471242B
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- display panel
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- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000012360 testing method Methods 0.000 claims description 45
- 239000010410 layer Substances 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
Abstract
The invention provides a display panel and a spliced display screen, wherein the display panel comprises a display structure, a flexible circuit board and a supporting substrate; the supporting base plate is fixed on the lower surface of the substrate through a first bonding layer and comprises a first side surface and a second side surface which are opposite, wherein the first side surface is flush with the first boundary of the substrate, and the second side surface is embedded inwards from the second boundary of the substrate to form an embedded concave part; the flexible wiring board includes a first horizontal portion configured in a U-shape, a bent portion protruding outward from a first boundary of the substrate, and a second horizontal portion, wherein the bent portion protrudes by a distance equal to a distance in which the embedded recess is embedded. The display screen spliced by the display panel can enable the side face of the display structure to be spliced seamlessly.
Description
Technical Field
The invention relates to the field of light emitting diode display, in particular to a display panel and a spliced display screen.
Background
With the increasing diversification of the display requirements, the display made of the micro LED display panel made of inorganic materials has the characteristics of low energy consumption, long service life and strong stability. In the prior art, due to the limitation of huge transfer, a plurality of display panels are required to be spliced to form a large-area display. But current tiled display screen often has the clearance between a plurality of display panel, can lead to the shadow like this, and the test pad is difficult for arranging, arranges and is unfavorable for the test in display panel upper surface.
Disclosure of Invention
In order to solve the above problems, the present invention provides a display panel including a display structure, a flexible circuit board, and a support substrate;
the display structure has opposing first and second boundaries and includes: a substrate; a driving layer disposed on the substrate; the micro LED chips are arranged on the driving layer and are electrically connected to the driving layer;
the supporting base plate is fixed on the lower surface of the substrate through a first bonding layer and comprises a first side surface and a second side surface which are opposite, wherein the first side surface is flush with the first boundary, and the second side surface is embedded inwards from the second boundary to form an embedded concave part;
the flexible circuit board comprises a first horizontal part, a bent part and a second horizontal part, wherein the first horizontal part is attached to the lower surface of the substrate and embedded in the first bonding layer, and the second horizontal part is attached to the lower surface of the support substrate through a second bonding layer; the bent portion protrudes outward from the first boundary, wherein the bent portion protrudes by a distance equal to a distance in which the embedded recess is embedded.
Specifically, the driver layer has therein a driver/test circuit near the first boundary, the driver/test circuit being electrically connected to the flexible wiring board through a via in the substrate.
Specifically, a first contact pad is arranged at a position where the bending portion is farthest from the first boundary in the vertical direction, and a second contact pad arranged corresponding to the first contact pad is arranged on the second side surface of the support substrate.
Specifically, the supporting substrate further comprises a testing pad, and the testing pad is electrically connected with the second contact pad through a circuit layer in the supporting substrate.
Specifically, the thickness of the first adhesive layer is greater than the thickness of the flexible circuit board.
The invention also provides a spliced display screen which comprises a plurality of display panels;
wherein the bent portion of the flexible wiring board of each display panel is inserted into the embedded recess of an adjacent display panel, and the first contact pad is made to fit the second contact pad.
Specifically, the first boundary of the display structure of each display panel is seamlessly attached to the second boundary of the display structure of the adjacent display panel.
Specifically, the test pad is used for testing the attachment reliability of the adjacent display panels.
Specifically, the test pad of each display panel is also used for testing the display condition of the display panel adjacent to the test pad.
The invention utilizes the through hole structure to lead out the driving circuit and the testing circuit to the lower surface of the substrate, so that the bending part can be just inserted into the embedded concave part, and the side surface of the display structure can be seamlessly spliced. And moreover, the first contact pad of the bending part and the second contact pad of the supporting substrate are utilized to carry out butt joint test splicing reliability, and the test end is led out to the test pad on the lower surface of the supporting substrate, so that the test convenience and the wiring flexibility can be ensured.
Drawings
FIG. 1 is a cross-sectional view of a display panel according to the present invention;
fig. 2 is a cross-sectional view of a tiled display screen of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
The display panel can realize seamless butt joint during splicing, prevent shadow generation and facilitate detection. Referring to fig. 1, the display panel 100 includes a substrate 10, a driving layer 12 and a display layer DA sequentially disposed on the substrate 10. The display layer comprises a plurality of micro LED chips 13 encapsulated by an encapsulation layer 14.
The substrate 10 may be made of an inorganic material such as silicon or silicon nitride, or may be made of a polymer material such as glass, Polycarbonate (PC), polyether sulfone (PES), polyethylene terephthalate (PET), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP). In the present invention, the substrate 11 may be transparent or translucent, or may be opaque.
The driving layer 12 has a plurality of insulating layers and driving devices (e.g., thin film transistors TFT) therein. The plurality of insulating layers may include a gate dielectric layer, an interlayer insulating layer, and a planarization layer, wherein a wiring layer is also formed in the multi-layered insulating layer, and the plurality of micro LED chips 13 are electrically connected to the wiring layer to enable driving of the plurality of micro LED chips 13.
The plurality of micro LED chips 13 are flip chips, and the micro LED chips 13 may be GaN-based LED chips including at least three LED chips of different colors, for example, may include a plurality of red LEDs, a plurality of green LEDs, and a plurality of blue LEDs.
For the sealing effect, the plurality of micro LED chips 13 are covered with a sealing resin layer 14, and the sealing resin layer 14 may be a light curing resin or a heat curing resin, such as a modified epoxy resin material. The sealing resin layer 14 is disposed on the driving layer 12 and should have a relatively flat upper surface.
As a special design of the present invention, the flexible wiring board 14 of the present invention is disposed on the lower surface of the substrate 10, i.e., the electrical connection position of the flexible wiring board 14 and the driving layer 12 is located on the lower surface of the substrate 10. The driver layer 12 has terminals, i.e., driver or test circuitry 23, therein, the driver or test circuitry 23 being a parallel arrangement of a plurality of conductive traces that are electrically connected to the flexible wiring board 14 through vias 24 in the substrate 10. The circuit layer in the flexible circuit board 14 can realize electric driving, and the invention also has a test circuit to realize test function.
Referring to fig. 1, the flexible wiring board 14 has a U-shaped structure and includes two horizontal portions and a bent portion connecting the two horizontal portions. The upper horizontal portion is directly attached to the lower surface of the substrate 10, and the lower horizontal portion is located on the lower surface of the support plate 15. One side surface of the support plate 15 is inserted into a U-shaped structure of the flexible wiring board 14, and the support plate 15 is fixed to the lower surface of the substrate 10 by a first adhesive layer 16, wherein an upper horizontal portion of the flexible wiring board 14 is embedded in the first adhesive layer 16, and wherein the thickness of the first adhesive layer 16 is greater than that of the flexible wiring board 14. The lower horizontal portion of the flexible circuit board 14 is fixed to the lower surface of the supporting plate 15 by a second adhesive layer 17, wherein the first adhesive layer 16 and the second adhesive layer 17 may be made of the same material or different materials.
The supporting board 15 may be a ceramic substrate or a silicon substrate with good heat dissipation, and one side of the supporting board 15 is flush with one side of the display structure (including the substrate 10, the driving layer 12 and the display layer DA), so that the bending portion of the flexible circuit board 14 protrudes from the side of the supporting board 15. In addition, the opposite side surfaces of the supporting plate 15 are embedded from the opposite side surfaces of the display structure to form the embedded concave portion 19, in order to ensure the seamless splicing of the plurality of display panels, the distance S of the protruding part from one side surface of the supporting plate 15 is equal to the embedded depth of the embedded concave portion 19, so that the boundaries of the adjacent display layers DA, the driving layer 12 and the substrate 10 can be seamlessly butted when the plurality of display panels 100 are spliced.
The flexible circuit board is provided with a first contact pad 18 at the most edge part of the bending part, and the first contact pad 18 can be any contact functional area, such as a contact plug. Since the bent portion has elasticity, the first contact pad 18 can be elastically contacted to the second contact pad 20 on the side of the support plate 15 when it is inserted into the embedded recess 19 of the adjacent display panel. Inside the support plate 15 there is a wiring layer 22 which electrically leads the second contact pads 20 out to test pads 21 at the bottom surface of the support plate 15, which test pads 21 are located at the bottom surface of the support plate 15 for facilitating the electrical testing.
The test pads 21 are arranged on the bottom surface of the supporting plate 15 in an array manner, and in a display screen structure formed by splicing, the test pads 21 are used for testing the attaching reliability of the adjacent display panels 100, can be used for detecting the splicing effect of the display panels 100, and particularly can be realized by testing whether the test pads 21 have electric signals or not. In addition, the test pad 21 of each display panel 100 is also used to test the display condition of the display panel 100 adjacent thereto, such as the soldering reliability of the micro LED chip 13, whether the driving circuit is open, and the like.
The present invention also provides a display screen, which is formed by sequentially splicing a plurality of the display panels 100. The bending part of the flexible circuit board 14 of one of the two adjacent display panels 100 is inserted into the embedded concave part 19 of the other one, so that the boundaries of the display structure on the upper part of the support plate 15 are completely attached, and a display screen in seamless butt joint is formed.
In addition, the first contact pad 18 of one of the adjacent display panels may be directly physically contacted to the second contact pad 20, so that the test signal may be loaded into the test circuit of the adjacent display panel through the test pad 21, and the driving signal may be loaded through the lower horizontal portion of the flexible wiring board.
The display screen of the invention utilizes the first contact pad 18 of the bending part and the second contact pad 20 of the supporting substrate 15 to carry out butt joint test splicing reliability, and leads out the test end to the test pad 21 on the lower surface of the supporting substrate 15, thus ensuring the convenience of the test and the flexibility of wiring.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (9)
1. A display panel includes a display structure, a flexible wiring board, and a support substrate;
the display structure has opposing first and second boundaries and includes: a substrate; a driving layer disposed on the substrate; the micro LED chips are arranged on the driving layer and are electrically connected to the driving layer;
the supporting base plate is fixed on the lower surface of the substrate through a first bonding layer and comprises a first side surface and a second side surface which are opposite, wherein the first side surface is flush with the first boundary, and the second side surface is embedded inwards from the second boundary to form an embedded concave part;
the flexible circuit board comprises a first horizontal part, a bent part and a second horizontal part, wherein the first horizontal part is attached to the lower surface of the substrate and embedded in the first bonding layer, and the second horizontal part is attached to the lower surface of the support substrate through a second bonding layer; the bent portion protrudes outward from the first boundary, wherein the bent portion protrudes by a distance equal to a distance in which the embedded recess is embedded.
2. The display panel according to claim 1, characterized in that: the driver layer has therein driver/test circuitry proximate the first boundary, the driver/test circuitry being electrically connected to the flex circuit board through vias in the substrate.
3. The display panel according to claim 2, characterized in that: the bending part is provided with a first contact pad at the position farthest from the first boundary in the vertical direction, and the second side surface of the supporting substrate is provided with a second contact pad arranged corresponding to the first contact pad.
4. The display panel according to claim 3, wherein: the support substrate further comprises a test pad electrically connected with the second contact pad through a circuit layer in the support substrate.
5. The display panel according to claim 4, wherein: the thickness of the first adhesive layer is greater than that of the flexible circuit board.
6. A tiled display screen comprising a plurality of display panels according to claim 5;
wherein the bent portion of the flexible wiring board of each display panel is inserted into the embedded recess of an adjacent display panel, and the first contact pad is made to fit the second contact pad.
7. The tiled display screen of claim 6, wherein: the first boundary of the display structure of each display panel is seamlessly attached to the second boundary of the display structure of the adjacent display panel.
8. The tiled display screen of claim 7, wherein: the test pad is used for testing the attaching reliability of the adjacent display panels.
9. The tiled display screen of claim 8, wherein: the test pad of each display panel is also used for testing the display condition of the display panel adjacent to the test pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111026044.8A CN113471242B (en) | 2021-09-02 | 2021-09-02 | Display panel and spliced display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111026044.8A CN113471242B (en) | 2021-09-02 | 2021-09-02 | Display panel and spliced display screen |
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| Publication Number | Publication Date |
|---|---|
| CN113471242A CN113471242A (en) | 2021-10-01 |
| CN113471242B true CN113471242B (en) | 2021-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111026044.8A Active CN113471242B (en) | 2021-09-02 | 2021-09-02 | Display panel and spliced display screen |
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| Country | Link |
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| CN (1) | CN113471242B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115132091B (en) * | 2022-07-20 | 2023-05-09 | 武汉华星光电半导体显示技术有限公司 | Splice module and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978060A (en) * | 1995-11-20 | 1999-11-02 | Sharp Kabushiki Kaisha | Liquid crystal display apparatus and apparatus for manufacturing the same |
| CN102262842A (en) * | 2010-05-28 | 2011-11-30 | 曹嘉灿 | frameless display method and device |
| CN111584475A (en) * | 2020-05-15 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Spliced display panel and preparation method thereof |
| CN112289185A (en) * | 2020-10-26 | 2021-01-29 | 武汉华星光电半导体显示技术有限公司 | Display module |
-
2021
- 2021-09-02 CN CN202111026044.8A patent/CN113471242B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5978060A (en) * | 1995-11-20 | 1999-11-02 | Sharp Kabushiki Kaisha | Liquid crystal display apparatus and apparatus for manufacturing the same |
| CN102262842A (en) * | 2010-05-28 | 2011-11-30 | 曹嘉灿 | frameless display method and device |
| CN111584475A (en) * | 2020-05-15 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Spliced display panel and preparation method thereof |
| CN112289185A (en) * | 2020-10-26 | 2021-01-29 | 武汉华星光电半导体显示技术有限公司 | Display module |
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| CN113471242A (en) | 2021-10-01 |
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