WO2013132815A1 - Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components - Google Patents

Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components Download PDF

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Publication number
WO2013132815A1
WO2013132815A1 PCT/JP2013/001293 JP2013001293W WO2013132815A1 WO 2013132815 A1 WO2013132815 A1 WO 2013132815A1 JP 2013001293 W JP2013001293 W JP 2013001293W WO 2013132815 A1 WO2013132815 A1 WO 2013132815A1
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WO
WIPO (PCT)
Prior art keywords
resin
wiring board
module
electronic component
region
Prior art date
Application number
PCT/JP2013/001293
Other languages
French (fr)
Japanese (ja)
Inventor
西村　望
三上　伸弘
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Publication of WO2013132815A1 publication Critical patent/WO2013132815A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Definitions

  • the present invention relates to an electronic component built-in module, an electronic device, and an electronic component built-in module manufacturing method.
  • an electronic device that is required to be thin such as a mobile phone, has a casing composed of an upper casing and a lower casing made of synthetic resin and a plurality of electronic components housed in the casing. It consists of a plurality of module substrates, displays, batteries, and the like.
  • a casing composed of an upper casing and a lower casing made of synthetic resin and a plurality of electronic components housed in the casing. It consists of a plurality of module substrates, displays, batteries, and the like.
  • a configuration in which a module board in which electronic components are mounted on a wiring board is built in at least a part of a resin casing.
  • this configuration by incorporating at least one of the multiple module boards in the resin casing, it is possible to reduce the space inside the casing composed of the upper casing and the lower casing, thereby further reducing the thickness. It is.
  • the module substrate is completely sealed in the resin, the wiring for electrical connection is exposed when trying to make an electrical connection to a plurality of module substrates, displays, batteries, etc. housed in the housing. There is no connection.
  • FIG. 18A is a plan view of the IC card described in Patent Document 1.
  • FIG. 18B is a cross-sectional view of the IC card described in Patent Document 1.
  • the IC card 400 includes a printed wiring board 401 having a wiring 402 printed on its upper surface, a semiconductor device 403 mounted on the printed wiring board 401, a wire 404 that connects the wiring 402 and the semiconductor device 403 to each other, It is composed of a resin 405 encapsulating the semiconductor device 403 and the wire 404 and a terminal 406 for connecting to an external device.
  • the terminal 406 is drawn out in the surface direction of the printed wiring board, so that it is electrically connected to the semiconductor device in the resin 405.
  • the terminals 406 are drawn out in the surface direction of the printed wiring board 401, and the printed wiring board 401 is outside the region sealed with resin. For this reason, there is a possibility that the terminal 406 may interfere with other modules inside the housing, and there are restrictions on the installation position of the substrate drawer and other modules inside the housing, and the resin sealing portion There is a problem that the size of the printed wiring board 401 needs to be large.
  • An object of the present invention is to provide a component built-in module that can be mounted in a space-saving manner in a component built-in module in which a wiring board on which electronic components are mounted is resin-sealed.
  • a component built-in module according to the present invention is a component built-in module having a wiring board, an electronic component provided on the wiring board, and a resin that seals at least a part of the electronic component together with a part of the wiring board. And at least a resin-sealed region sealed on one surface of the wiring board and a non-sealed resin non-sealed region, and a boundary between the resin sealed region and the resin non-sealed region. At least a part of the wiring board is located inside the outer edge of the resin as viewed from the other surface side of the wiring board.
  • a component built-in module that can be mounted in a space-saving manner is provided in a component built-in module obtained by resin-sealing a wiring board on which electronic components are mounted.
  • the component built-in module is a cross-sectional view showing an example in which an electronic component is provided in a resin non-sealing region. It is sectional drawing which shows the component built-in module which concerns on the 2nd Embodiment of this invention. It is a top view which shows the component built-in module which concerns on the 2nd Embodiment of this invention. It is the graph which showed the result of having performed the peeling test for measuring adhesive strength with resin and a base material, and resin and an insulating layer. It is an example of the direct contact area
  • FIG. 1 is a sectional view showing a component built-in module according to the first embodiment of the present invention.
  • FIG. 2 is a plan view showing the component built-in module according to the first embodiment of the present invention.
  • FIG. 1 shows an AA ′ cross section in FIG. 2, and
  • FIG. 2 is a plan view when viewed from the direction of the arrow shown in FIG.
  • the electronic component built-in module 100 includes a wiring board 110 formed of a base material and wiring formed on a part of the base material, an electronic component 120 mounted on the wiring board 110, and the electronic component 120. It is made of a resin 130 that is sealed with a part of the wiring board.
  • the wiring board 110 has at least a resin sealing region 201 sealed with a resin 130 and a resin non-sealing region 202 not sealed with the resin 130 on one surface. At least a part of the boundary 203 (the thick line portion in FIG. 2) of the resin non-sealing region 202 is an outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring board. Inside. In FIG. 2, since the electronic component 120 is mounted on the opposite surface and cannot be seen when viewed from the direction of the arrow, it is indicated by a broken line.
  • the boundary 203 is “inside the outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring board” as described in FIG. This means that the boundary 203 is inside the outer edge of the resin 130 when viewed from the direction of the arrow.
  • the boundary 203 represented by a thick line is located inside the outer edge of the resin 130 that seals the resin sealing region 201.
  • the term “inside” does not include the case where the outer edge of the resin 130 and the boundary 203 coincide with each other.
  • FIG. 3 shows a plan view of a variation of the relationship between the resin 130 and the wiring board 110.
  • the boundary 203 is inside the resin 130 as in (a) to (d)
  • Either is acceptable.
  • the wiring substrate 110 for example, a flexible substrate is used.
  • polyimide having a thickness of about 12.5 to 100 ⁇ m can be used as a base material.
  • a wiring having a thickness of about 18 to 36 ⁇ m is formed on the substrate.
  • the resin non-sealing region 202 of the wiring substrate 110 can be bent into a free shape.
  • it can also be set as the structure which has an adhesive bond layer between the base material and the wiring formed in a part on base material.
  • the electronic component 120 As the electronic component 120 , a memory chip, LED (Light Emitting Diode), optical sensor, temperature sensor, RFID (Radio Frequency Frequency IDentification) circuit component, image sensor, primary battery, secondary battery, and the like are assumed.
  • the electronic component 120 is mounted on the wiring board 110.
  • the electronic component 120 may be mounted only on one surface of the wiring board 110 or may be mounted on both surfaces.
  • the resin 130 for sealing the surface on which the electronic component 120 of the wiring board 110 is mounted acrylic resin, ABS (Acrylonitrile Butadiene Styrene) resin, polycarbonate resin, epoxy resin, urethane resin, silicon resin, or the like is used depending on the purpose. It is done.
  • a light emitting device such as an optical sensor or LED
  • FIG. 4 shows a cross-sectional view of variations of the electronic component 120 and resin sealing.
  • the resin 130 may be provided so as to seal the electronic component 120 on one surface of the wiring board 110 as shown in FIG. 4A, or the resin 130 may be electronic on both sides of the wiring board 110 as shown in FIG.
  • the component 120 may be sealed. Further, the surface on which the electronic component 120 is not mounted may be resin-sealed as in (b), or all the electronic components 120 may not be sealed as in (c) and (e). Good.
  • the thickness of the resin 130 is preferably such that the electronic component 120 mounted on the wiring board 110 is covered. For example, when the thickness of the electronic component 120 is 0.4 mm, the thickness of the resin 130 is 0.7 mm. It can be.
  • the resin sealing region 201 indicates a region sealed with the resin 130 on at least one surface of the wiring board 110.
  • the resin non-sealing region 202 refers to a region that is not sealed with the resin 130 on the surface having the resin sealing region 201. Since the wiring is continuously formed from the resin sealing region 201 to the resin non-sealing region 202, the electronic component 120 sealed in the resin can be connected to other electronic components outside the resin.
  • External connection terminals and electronic parts can be provided in the resin non-sealing region 202.
  • FIG. 5 is a cross-sectional view of the electronic component built-in module 100 showing an example in which the external connection terminal 121 is provided in the resin non-sealing region 202, and another module in which the electronic component is mounted by the external connection terminal 121. It can be electrically connected to a substrate or the like.
  • an electrical connection method for example, an external connection terminal 121 installed in the resin non-sealing region 202 of the electronic component built-in module 100 of the present invention is connected to an FPC (Flexible Printed Circuits) connector or the like mounted on another module substrate. Connect by inserting.
  • FIG. 6 is a cross-sectional view of the electronic component built-in module 100 showing an example in which the electronic component 120 is provided in the resin non-sealing region 202.
  • the wiring board 110, the resin 130, the resin sealing region 201, and the resin non-sealing region 202 are shown as having rectangular shapes. However, as long as the above conditions are satisfied. It is also possible to have a shape other than a rectangle.
  • FIG. 7 to FIG. 13 With reference to FIG. 7 to FIG. 13, the form of the component built-in module according to the second embodiment of the present invention will be described.
  • the second embodiment is the same as the first embodiment except that the insulating layer 111 is provided, and the numbers shown in FIGS. 7 to 13 indicate the same configurations in FIGS. 1 to 6. .
  • FIG. 7 is a sectional view showing a component built-in module according to the second embodiment of the present invention.
  • FIG. 8 is a plan view showing a component built-in module according to the second embodiment of the present invention.
  • FIG. 7 shows a BB ′ cross section in FIG. 8
  • FIG. 8 is a plan view when viewed from the direction of the arrow shown in FIG.
  • the electronic component built-in module in the present embodiment has an insulating layer 111 in addition to the first embodiment.
  • a region (direct contact region) 204 where the wiring substrate 110 and the resin 130 are in direct contact is formed in the resin sealing region 201 at least on the resin sealing surface side.
  • a solder resist for the insulating layer 111, a solder resist, a coverlay, an overcoat or the like can be used depending on the type of the base material.
  • the direct contact region 204 can suppress peeling of the wiring board 110 and the resin 130.
  • FIG. 9 shows the results of a peel test performed to measure the adhesive strength between the resin 130 and the substrate of the wiring board 110 and the resin 130 and the insulating layer 111.
  • a resin 130, a base material (polyimide base material), and an insulating layer 111 are prepared as adherents, and an adhesive assembly of the resin 130 and the base material, and an adhesive assembly of the resin 130 and the insulating layer 111 are prepared.
  • the base material and the insulating layer 111 are peeled off from the open ends of the bonded portions, respectively, and peeled off at a substantially constant speed so that the separation proceeds along the longitudinal direction of the adherend. Peeling is performed by fixing the base material or the insulating layer 111 with a jig of a tensile tester and lifting the jig in a direction substantially perpendicular to the bonding surface and peeling it off.
  • “Peel strength (N / cm)” on the vertical axis in FIG. 9 represents an average load per unit width required for peeling the substrate or the insulating layer 111 from the resin 130.
  • the “displacement (mm)” on the horizontal axis represents the amount of lifting (tensile distance) of the jig.
  • the solid line shows the case where the substrate is peeled off, and the broken line shows the case where the insulating layer 111 is peeled off.
  • the sloped part (from 0 mm to about 2.0 mm) is strong because the base material is loosened when the base material is fixed with a jig. Is not taken into account when calculating the average weight.
  • a flat portion having a displacement of about 2.0 mm or more is a substantial peel strength.
  • the peel strength of the base material exceeds the peel strength of the insulating layer 111. That is, the adhesive force between the resin 130 and the base material is higher than the adhesive force between the resin 130 and the insulating layer 111. This is considered to be due to a difference in surface state between the base material and the insulating layer 111.
  • the direct contact region 204 can be formed in contact with the boundary 203 in the resin sealing region 201. By forming the direct contact region 204 in this way, it is possible to suppress the resin sealing region 201 and the resin 130 of the wiring board 110 from being separated from the boundary 203 as a base point.
  • the direct contact region 204 can also have a substantially trapezoidal shape with the boundary 203 as the upper base and the side longer than the boundary 203 as the lower base.
  • a resin non-sealing region 202 including a substantially trapezoidal shape having a boundary 203 as a lower base and a side shorter than the boundary 203 as an upper base is provided, and the resin sealing is in contact with the boundary 203.
  • a direct contact region 204 can also be provided in the region 201. By forming the direct contact region 204 in this way, stress concentration can be prevented, and peeling can be more effectively prevented.
  • the direct contact region 204 in this way, it is possible to prevent the resin sealing region 201 of the wiring board 110 from being peeled from the resin 130, and the electrons mounted on the resin sealing region 201 of the wiring substrate 110. The effect of improving the reliability of the component 120 is obtained.
  • the direct contact region 204 may be formed so as to be surrounded by an insulating layer 111 (not shown) between the resin 130 and the wiring substrate 110.
  • the resin sealing region 201 of the wiring board 110 can be prevented from being peeled off from the resin 130, and the reliability of the electronic component 120 mounted on the resin sealing region 201 of the wiring board 110 is improved. Effect is obtained.
  • the direct contact region 204 may be configured such that no wiring is formed.
  • the third embodiment is characterized in that the electronic component built-in module 100 according to the present invention is incorporated in a part of the casing of the electronic device 101.
  • FIG. 14 is a cross-sectional view showing an electronic apparatus according to the third embodiment of the present invention.
  • the electronic device 101 is, for example, a mobile phone, an electronic dictionary, or a portable information terminal.
  • the resin 130 of the electronic component built-in module 100 is used as at least a part of the external casing of the electronic device 101.
  • the external housing is not limited to the housing of the electronic device 101 itself, and can be incorporated into a part of the housing that is removable from the electronic device 101, such as a removable battery cover.
  • the wiring substrate 110 has at least a resin sealing region 201 sealed with a resin 130 and a resin non-sealing region 202 not sealed with the resin 130 on one surface. At least a part of the boundary 203 of the non-sealing region 202 is inside the outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring substrate 110.
  • the electronic component 120 provided in the resin sealing region 201 is connected to the external connection terminal 121 installed in the resin non-sealing region 202 through wiring, and the external connection terminal 121 is mounted on another module substrate in the housing.
  • the inserted FPC connector 122 is inserted. With this configuration, it is possible to connect not with the surface direction of the electronic component built-in module 100 but with other modules inside the housing of the electronic device 101, reducing the space in the housing of the electronic device and reducing the thickness. Can be realized.
  • the function of the electronic device can be easily changed by exchanging the casing.
  • the direct contact region 204 can be formed in contact with the boundary 203.
  • the direct contact region 204 it is possible to suppress the resin sealing region 201 and the resin 130 of the wiring board 110 from being separated from the boundary 203 as a base point.
  • a device in which a plurality of electronic components 120 are mounted on at least one surface of the wiring board 110 is prepared.
  • a step of preparing the wiring board 110 and mounting the electronic component 120 on one surface of the wiring board 110 may be included.
  • the wiring board 110 on which the electronic component 120 is mounted is placed in the mold 310.
  • a thermoplastic resin such as an acrylic resin, an ABS resin, or a polycarbonate resin
  • the temperature of the mold 310 is preferably set to about 60 to 120 ° C.
  • the mold 310 is clamped and a resin for forming the resin 130 is injected into the mold 310.
  • the resin-sealed wiring board 110 is taken out from the mold 310.
  • the wiring substrate 110 is peeled from the resin 130 to form the resin non-sealing region 202, and the electronic component built-in module 100 of the present invention is completed.
  • FIG. 17 shows a modification of the fourth embodiment of the present invention.
  • an insulating layer 111 is provided.
  • a direct contact region 204 is formed in the resin sealing region 201.
  • the region where the insulating layer 111 of the wiring board 110 is formed has an extremely low adhesive force to the resin as shown in FIG. 9 and can be easily peeled off, while the direct contact region 204 is peeled off. Is suppressed.
  • the peeling step it serves as a stopper that prevents the peeling from proceeding directly beyond the contact area 204, and the resin sealing region 201 and the resin 130 of the wiring board 110 are used. Can be prevented from peeling.
  • the injection molding method is exemplified as the resin sealing method, but other methods can be selected according to the resin to be used.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

[Problem] To provide a module with embedded electronic components, wherein a wiring substrate on which electronic components are mounted is resin-sealed, and with which mounting is possible in a small space. [Solution] A module with embedded electronic components, comprising: a wiring substrate (110), comprising a substrate and wiring formed on a portion of the substrate; electronic components (120) mounted on the wiring substrate (110); and resin (130) that resin-seals the electronic components (120) together with a portion of the wiring substrate. On one surface of the wiring substrate (110) there is at least a resin-sealed region (201), which is sealed with the resin (130), and a non-resin-sealed region (202), which is not sealed with the resin (130), and when viewed from the other surface of the wiring substrate, at least a portion of the boundary (203) between the resin-sealed region (201) and the non-resin-sealed region (202) is inside of the outer edge of the resin that seals the resin-sealed region (201).

Description

電子部品内蔵モジュールおよび電子機器並びに電子部品内蔵モジュールの製造方法Electronic component built-in module, electronic device, and electronic component built-in module manufacturing method
　本発明は、電子部品内蔵モジュールおよび電子機器並びに電子部品内蔵モジュールの製造方法に関する。 The present invention relates to an electronic component built-in module, an electronic device, and an electronic component built-in module manufacturing method.
　携帯電話等を含む電子機器では、携帯性が求められる点から、電子機器の小型・薄型化への要求が高まっている。例えば、携帯電話のような薄型化が求められる電子機器は、合成樹脂よりなる上部筐体と下部筐体から構成される筐体と、この筐体内に収納される複数個の電子部品を実装した複数のモジュール基板、ディスプレイ、電池等から構成されている。しかし、あらかじめ準備した筐体にこれらの構成部品を収納する構造では、さらなる薄型化が困難である。 In electronic devices including mobile phones, there is an increasing demand for miniaturization and thinning of electronic devices because portability is required. For example, an electronic device that is required to be thin, such as a mobile phone, has a casing composed of an upper casing and a lower casing made of synthetic resin and a plurality of electronic components housed in the casing. It consists of a plurality of module substrates, displays, batteries, and the like. However, it is difficult to further reduce the thickness in a structure in which these components are housed in a case prepared in advance.
　そこで、樹脂筐体の少なくとも一部分に、電子部品を配線基板上に実装したモジュール基板を内蔵する構成が開示されている。この構成では複数のモジュール基板の少なくとも一つを樹脂筐体に内蔵することで、上部筐体と下部筐体から構成される筐体内部のスペースを削減することが出来るため、さらなる薄型化が可能である。しかしながら、モジュール基板を樹脂内に完全に封止してしまうと、筐体内に収納した複数のモジュール基板、ディスプレイ、電池などと電気的に接続しようとした際、電気接続用の配線が露出されていないため、接続ができない。 Therefore, a configuration is disclosed in which a module board in which electronic components are mounted on a wiring board is built in at least a part of a resin casing. In this configuration, by incorporating at least one of the multiple module boards in the resin casing, it is possible to reduce the space inside the casing composed of the upper casing and the lower casing, thereby further reducing the thickness. It is. However, if the module substrate is completely sealed in the resin, the wiring for electrical connection is exposed when trying to make an electrical connection to a plurality of module substrates, displays, batteries, etc. housed in the housing. There is no connection.
　そこで、外部接続端子を樹脂筐体で封止されたモジュール基板の面方向に出す構造が複数開示されている。その一例となるＩＣ（Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）カードが、特許文献１に記載されている。図１８（ａ）は、特許文献１に記載のＩＣカードの平面図である。図１８（ｂ）は、特許文献１に記載のＩＣカードの断面図である。このＩＣカード４００は、上面に配線４０２がプリントされたプリント配線基板４０１と、そのプリント配線基板４０１上に搭載された半導体装置４０３と、配線４０２と半導体装置４０３とを互いに接続するワイヤー４０４と、半導体装置４０３およびワイヤー４０４を封止した樹脂４０５と、外部機器と接続するための端子４０６から構成されている。この構造では、プリント配線基板の面方向に端子４０６が引き出されることによって、樹脂４０５内の半導体装置と電気的に接続する。 Therefore, a plurality of structures in which the external connection terminals are extended in the surface direction of the module substrate sealed with a resin casing are disclosed. An IC (Integrated Circuit) card as an example is described in Patent Document 1. FIG. 18A is a plan view of the IC card described in Patent Document 1. FIG. FIG. 18B is a cross-sectional view of the IC card described in Patent Document 1. The IC card 400 includes a printed wiring board 401 having a wiring 402 printed on its upper surface, a semiconductor device 403 mounted on the printed wiring board 401, a wire 404 that connects the wiring 402 and the semiconductor device 403 to each other, It is composed of a resin 405 encapsulating the semiconductor device 403 and the wire 404 and a terminal 406 for connecting to an external device. In this structure, the terminal 406 is drawn out in the surface direction of the printed wiring board, so that it is electrically connected to the semiconductor device in the resin 405.
特開２００１－３４４５８７JP 2001-344587
　しかし、特許文献１に記載された構造では、端子４０６がプリント配線基板４０１の面方向に引き出されており、プリント配線基板４０１が樹脂封止した領域の外側にある。このため、端子４０６が筐体内部の他のモジュールと干渉する可能性があり、基板引き出し部の設置位置や筐体内部の他のモジュールの設置位置に制約が発生するうえ、樹脂封止部よりプリント配線基板４０１のサイズが大きい必要があるという問題点があった。 However, in the structure described in Patent Document 1, the terminals 406 are drawn out in the surface direction of the printed wiring board 401, and the printed wiring board 401 is outside the region sealed with resin. For this reason, there is a possibility that the terminal 406 may interfere with other modules inside the housing, and there are restrictions on the installation position of the substrate drawer and other modules inside the housing, and the resin sealing portion There is a problem that the size of the printed wiring board 401 needs to be large.
　本発明の目的は、電子部品が実装された配線基板を樹脂封止した部品内蔵モジュールにおいて、省スペースで実装可能な部品内蔵モジュールを提供することを目的とする。 An object of the present invention is to provide a component built-in module that can be mounted in a space-saving manner in a component built-in module in which a wiring board on which electronic components are mounted is resin-sealed.
　本発明に係る部品内蔵モジュールは、配線基板と前記配線基板に設けられた電子部品と前記電子部品の少なくとも一部を前記配線基板の一部と共に封止する樹脂とを有する部品内蔵モジュールであって、前記配線基板の一方の面に封止されている樹脂封止領域と封止されていない樹脂非封止領域とを少なくとも有し、前記樹脂封止領域と前記樹脂非封止領域の境界のうち少なくとも一部は、前記配線基板の他方の面の側から見て、前記樹脂の外縁の内側にあることを特徴とする。 A component built-in module according to the present invention is a component built-in module having a wiring board, an electronic component provided on the wiring board, and a resin that seals at least a part of the electronic component together with a part of the wiring board. And at least a resin-sealed region sealed on one surface of the wiring board and a non-sealed resin non-sealed region, and a boundary between the resin sealed region and the resin non-sealed region. At least a part of the wiring board is located inside the outer edge of the resin as viewed from the other surface side of the wiring board.
　本発明によれば、電子部品が実装された配線基板を樹脂封止した部品内蔵モジュールにおいて、省スペースで実装可能な部品内蔵モジュールが提供される。 According to the present invention, a component built-in module that can be mounted in a space-saving manner is provided in a component built-in module obtained by resin-sealing a wiring board on which electronic components are mounted.
本発明の第１の実施形態に係る部品内蔵モジュールを示す断面図である。It is sectional drawing which shows the component built-in module which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る部品内蔵モジュールを示す平面図である。It is a top view which shows the component built-in module which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る部品内蔵モジュールの、電子部品と樹脂封止のバリエーションを示す平面図である。It is a top view which shows the variation of an electronic component and resin sealing of the component built-in module which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る部品内蔵モジュールの、電子部品と樹脂封止のバリエーションを示す断面図である。It is sectional drawing which shows the electronic component and the variation of resin sealing of the component built-in module which concerns on the 1st Embodiment of this invention. 本発明の第１の実施形態に係る部品内蔵モジュールにおいて、樹脂非封止領域に外部接続端子が設けられている例を示す断面図である。In the component built-in module which concerns on the 1st Embodiment of this invention, it is sectional drawing which shows the example by which the external connection terminal is provided in the resin non-sealing area | region. 本発明の第１の実施形態に係る部品内蔵モジュールにおいて、樹脂非封止領域に電子部品が設けられている例を示す断面図である。In the component built-in module according to the first embodiment of the present invention, it is a cross-sectional view showing an example in which an electronic component is provided in a resin non-sealing region. 本発明の第２の実施形態に係る部品内蔵モジュールを示す断面図である。It is sectional drawing which shows the component built-in module which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る部品内蔵モジュールを示す平面図である。It is a top view which shows the component built-in module which concerns on the 2nd Embodiment of this invention. 樹脂及び基材、並びに樹脂及び絶縁層との接着強度を測定するための剥離試験を実施した結果を示したグラフである。It is the graph which showed the result of having performed the peeling test for measuring adhesive strength with resin and a base material, and resin and an insulating layer. 本発明の第２の実施形態に係る部品内蔵モジュールにおける、直接接触領域の一の例である。It is an example of the direct contact area | region in the component built-in module which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る部品内蔵モジュールにおける、直接接触領域の一の例である。It is an example of the direct contact area | region in the component built-in module which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る部品内蔵モジュールにおける、直接接触領域の一の例である。It is an example of the direct contact area | region in the component built-in module which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施形態に係る部品内蔵モジュールにおける、直接接触領域の一の例である。It is an example of the direct contact area | region in the component built-in module which concerns on the 2nd Embodiment of this invention. は、本発明の第３の実施形態に係る電子機器を示す断面図である。These are sectional drawings which show the electronic device which concerns on the 3rd Embodiment of this invention. は、本発明の第３の実施形態に係る電子機器を示す断面図である。These are sectional drawings which show the electronic device which concerns on the 3rd Embodiment of this invention. 本発明の第４の実施形態に係る部品内蔵モジュールの製造法を示す断面図である。It is sectional drawing which shows the manufacturing method of the component built-in module which concerns on the 4th Embodiment of this invention. 本発明の第４の実施形態に係る部品内蔵モジュールの製造法を示す断面図である。It is sectional drawing which shows the manufacturing method of the component built-in module which concerns on the 4th Embodiment of this invention. 従来の技術を示す断面図及び平面図である。It is sectional drawing and a top view which show the prior art.
　（第１の実施形態）
　以下、図１から図６を参照し、本発明の第１実施形態に係る電子部品内蔵モジュールの形態について説明する。 (First embodiment)
Hereinafter, the configuration of the electronic component built-in module according to the first embodiment of the present invention will be described with reference to FIGS.
　図１は、本発明の第１の実施形態に係る部品内蔵モジュールを示す断面図である。図２は、本発明の第１の実施形態に係る部品内蔵モジュールを示す平面図である。図１は図２におけるＡＡ´断面を表したものであり、図２は図１に記載の矢印の方向から見たときの平面図である。本実施の形態における電子部品内蔵モジュール１００は、基材と基材上の一部に形成された配線からなる配線基板１１０と、配線基板１１０に実装された電子部品１２０と、前記電子部品１２０を前記配線基板の一部と共に樹脂封止する樹脂１３０からなる。前記配線基板１１０は、一方の面において、樹脂１３０で封止された樹脂封止領域２０１と、樹脂１３０で封止されていない樹脂非封止領域２０２を少なくとも有し、樹脂封止領域２０１と樹脂非封止領域２０２の境界２０３（図２太線部）の少なくとも一部は、前記配線基板の他方の面の側から見て、前記樹脂封止領域２０１を封止している樹脂１３０の外縁の内側にある。図２において、電子部品１２０は、矢印の方向から見たときには反対の面に実装されていて見えないため、破線で示している。 FIG. 1 is a sectional view showing a component built-in module according to the first embodiment of the present invention. FIG. 2 is a plan view showing the component built-in module according to the first embodiment of the present invention. FIG. 1 shows an AA ′ cross section in FIG. 2, and FIG. 2 is a plan view when viewed from the direction of the arrow shown in FIG. The electronic component built-in module 100 according to the present embodiment includes a wiring board 110 formed of a base material and wiring formed on a part of the base material, an electronic component 120 mounted on the wiring board 110, and the electronic component 120. It is made of a resin 130 that is sealed with a part of the wiring board. The wiring board 110 has at least a resin sealing region 201 sealed with a resin 130 and a resin non-sealing region 202 not sealed with the resin 130 on one surface. At least a part of the boundary 203 (the thick line portion in FIG. 2) of the resin non-sealing region 202 is an outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring board. Inside. In FIG. 2, since the electronic component 120 is mounted on the opposite surface and cannot be seen when viewed from the direction of the arrow, it is indicated by a broken line.
　ここで、境界２０３が「前記配線基板の他方の面の側から見て、前記樹脂封止領域２０１を封止している樹脂１３０の外縁の内側にある」とは、図１に記載されている矢印の方向から見たときに、境界２０３が、樹脂１３０の外縁よりも内側にあることを意味する。例えば、図１に記載されている矢印の方向から見た図２において、太線であらわされる境界２０３が、前記樹脂封止領域２０１を封止している樹脂１３０の外縁より内側に位置している。ただし、ここで「内側」とは、樹脂１３０の外縁と境界２０３が一致している場合を含まない。 Here, the boundary 203 is “inside the outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring board” as described in FIG. This means that the boundary 203 is inside the outer edge of the resin 130 when viewed from the direction of the arrow. For example, in FIG. 2 as viewed from the direction of the arrow shown in FIG. 1, the boundary 203 represented by a thick line is located inside the outer edge of the resin 130 that seals the resin sealing region 201. . However, the term “inside” does not include the case where the outer edge of the resin 130 and the boundary 203 coincide with each other.
　また、境界２０３はすべてが樹脂１３０の内側にある必要は無く、樹脂封止領域２０１と樹脂非封止領域２０２の境界２０３のうち、少なくとも一部が樹脂１３０の内側にあればよい。図３は、樹脂１３０と配線基板１１０の関係のバリエーションの平面図を表したものであるが、例えば（ａ）～（ｄ）のように境界２０３が樹脂１３０の内側にあるものであれば、いずれでもよい。また、（ｅ）～（ｇ）のように、樹脂１３０から配線基板１１０がはみ出ている構造の場合、複数の境界２０３が存在するが、そのうち少なくとも一部の境界２０３が樹脂１３０の内側にあるものであればよい。 Further, it is not necessary for the boundary 203 to be entirely inside the resin 130, and at least a part of the boundary 203 between the resin sealing region 201 and the resin non-sealing region 202 may be inside the resin 130. FIG. 3 shows a plan view of a variation of the relationship between the resin 130 and the wiring board 110. For example, if the boundary 203 is inside the resin 130 as in (a) to (d), Either is acceptable. Further, in the case of the structure in which the wiring board 110 protrudes from the resin 130 as in (e) to (g), there are a plurality of boundaries 203, but at least some of the boundaries 203 are inside the resin 130. Anything is acceptable.
　配線基板１１０としては、例えばフレキシブル基板が用いられ、フレキシブル基板の場合は、厚さが１２．５～１００μｍ程度のポリイミドを基材として用いることができる。基材上には、厚さ１８～３６μｍ程度の配線が形成されている。フレキシブル基板を使用した場合は、配線基板１１０の樹脂非封止領域２０２は自由な形状に曲げることが出来る。また、基材と基材上の一部に形成された配線の間に接着剤層がある構造とすることも出来る。 As the wiring substrate 110, for example, a flexible substrate is used. In the case of the flexible substrate, polyimide having a thickness of about 12.5 to 100 μm can be used as a base material. A wiring having a thickness of about 18 to 36 μm is formed on the substrate. When a flexible substrate is used, the resin non-sealing region 202 of the wiring substrate 110 can be bent into a free shape. Moreover, it can also be set as the structure which has an adhesive bond layer between the base material and the wiring formed in a part on base material.
　電子部品１２０としては、メモリーチップ、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）、光センサ、温度センサ、ＲＦＩＤ（Ｒａｄｉｏ Ｆｒｅｑｕｅｎｃｙ ＩＤｅｎｔｉｆｉｃａｔｉｏｎ）用の回路部品、撮像素子、一次電池、二次電池などが想定される。本実施形態では、電子部品１２０が、配線基板１１０に実装されている。電子部品１２０は、配線基板１１０の一方の面のみに実装されていてもよく、両面に実装されていてもよい。 As the electronic component 120, a memory chip, LED (Light Emitting Diode), optical sensor, temperature sensor, RFID (Radio Frequency Frequency IDentification) circuit component, image sensor, primary battery, secondary battery, and the like are assumed. In the present embodiment, the electronic component 120 is mounted on the wiring board 110. The electronic component 120 may be mounted only on one surface of the wiring board 110 or may be mounted on both surfaces.
　配線基板１１０の電子部品１２０が実装される面を封止する樹脂１３０としては、アクリル樹脂やＡＢＳ（Ａｃｒｙｌｏｎｉｔｒｉｌｅ　Ｂｕｔａｄｉｅｎｅ　Ｓｔｙｒｅｎｅ）樹脂、ポリカーボネート樹脂、エポキシ樹脂、ウレタン樹脂、シリコン樹脂などが目的に応じて用いられる。なお、電子部品１２０として光センサやＬＥＤなどの発光デバイスが実装される場合には、光透過性の観点から透明の樹脂１３０を用いることが望ましい。図４は、電子部品１２０と樹脂封止のバリエーションの断面図を表したものである。樹脂１３０は、図４の（ａ）のように配線基板１１０の一方の面の電子部品１２０を封止するように設けられてもいいし、（ｄ）のように配線基板１１０の両面で電子部品１２０を封止していてもよい。また、（ｂ）のように電子部品１２０が実装されていない面を樹脂封止してもよいし、（ｃ）（ｅ）のように、すべての電子部品１２０を封止していなくてもよい。樹脂１３０の厚さは配線基板１１０に実装される電子部品１２０が覆われる厚さである方が好ましく、例えば電子部品１２０の厚さが０．４ｍｍの場合は樹脂１３０の厚さは０．７ｍｍとすることができる。 As the resin 130 for sealing the surface on which the electronic component 120 of the wiring board 110 is mounted, acrylic resin, ABS (Acrylonitrile Butadiene Styrene) resin, polycarbonate resin, epoxy resin, urethane resin, silicon resin, or the like is used depending on the purpose. It is done. When a light emitting device such as an optical sensor or LED is mounted as the electronic component 120, it is desirable to use a transparent resin 130 from the viewpoint of light transmittance. FIG. 4 shows a cross-sectional view of variations of the electronic component 120 and resin sealing. The resin 130 may be provided so as to seal the electronic component 120 on one surface of the wiring board 110 as shown in FIG. 4A, or the resin 130 may be electronic on both sides of the wiring board 110 as shown in FIG. The component 120 may be sealed. Further, the surface on which the electronic component 120 is not mounted may be resin-sealed as in (b), or all the electronic components 120 may not be sealed as in (c) and (e). Good. The thickness of the resin 130 is preferably such that the electronic component 120 mounted on the wiring board 110 is covered. For example, when the thickness of the electronic component 120 is 0.4 mm, the thickness of the resin 130 is 0.7 mm. It can be.
　樹脂封止領域２０１は、配線基板１１０の少なくとも一方の面において、樹脂１３０で封止されている領域を指す。樹脂非封止領域２０２は、樹脂封止領域２０１を有する面において、樹脂１３０で封止されていない領域を指す。配線が樹脂封止領域２０１から樹脂非封止領域２０２まで連続的に形成されているため、樹脂内に封止された電子部品１２０は樹脂外部の他の電子部品等と接続することができる。 The resin sealing region 201 indicates a region sealed with the resin 130 on at least one surface of the wiring board 110. The resin non-sealing region 202 refers to a region that is not sealed with the resin 130 on the surface having the resin sealing region 201. Since the wiring is continuously formed from the resin sealing region 201 to the resin non-sealing region 202, the electronic component 120 sealed in the resin can be connected to other electronic components outside the resin.
　樹脂非封止領域２０２には、外部接続端子や、電子部品を設けることが出来る。 External connection terminals and electronic parts can be provided in the resin non-sealing region 202.
　図５は、樹脂非封止領域２０２に外部接続端子１２１が設けられている例を示す電子部品内蔵モジュール１００の断面図であり、この外部接続端子１２１により、電子部品が実装された他のモジュール基板などと電気的に接続することができる。電気的な接続方法としては、例えば他のモジュール基板に実装されたＦＰＣ（Ｆｌｅｘｉｂｌｅ Ｐｒｉｎｔｅｄ Ｃｉｒｃｕｉｔｓ）コネクタ等に、本発明の電子部品内蔵モジュール１００の樹脂非封止領域２０２に設置された外部接続端子１２１を挿入することで接続する。図６は、樹脂非封止領域２０２に電子部品１２０が設けられている例を示す電子部品内蔵モジュール１００の断面図である。 FIG. 5 is a cross-sectional view of the electronic component built-in module 100 showing an example in which the external connection terminal 121 is provided in the resin non-sealing region 202, and another module in which the electronic component is mounted by the external connection terminal 121. It can be electrically connected to a substrate or the like. As an electrical connection method, for example, an external connection terminal 121 installed in the resin non-sealing region 202 of the electronic component built-in module 100 of the present invention is connected to an FPC (Flexible Printed Circuits) connector or the like mounted on another module substrate. Connect by inserting. FIG. 6 is a cross-sectional view of the electronic component built-in module 100 showing an example in which the electronic component 120 is provided in the resin non-sealing region 202.
　なお、本実施形態では、配線基板１１０、樹脂１３０、樹脂封止領域２０１、樹脂非封
止領域２０２ともに、矩形形状のものを用いた例を示したが、以上の条件を満たすものであれば、矩形以外の形状とすることも可能である。 In the present embodiment, the wiring board 110, the resin 130, the resin sealing region 201, and the resin non-sealing region 202 are shown as having rectangular shapes. However, as long as the above conditions are satisfied. It is also possible to have a shape other than a rectangle.
　以上の構成を採用することにより、樹脂１３０の面方向から引き出された構造に比べて、筐体内部の他のモジュールと干渉することを防ぐことができ、配線基板１１０の樹脂非封止領域２０２の配置自由度が向上し、省スペース性を実現できる。 By adopting the above configuration, it is possible to prevent interference with other modules inside the housing as compared with the structure drawn from the surface direction of the resin 130, and the resin non-sealing region 202 of the wiring board 110. The degree of freedom of arrangement can be improved and space saving can be realized.
　（第２の実施形態）
図７から図１３を参照し、本発明の第２の実施形態に係る部品内蔵モジュールの形態について説明する。第２の実施形態は、絶縁層１１１が設けられている点以外において、第１の実施形態と同様であり、図７から図１３に記載の番号は図１から図６においても同じ構成を示す。 (Second Embodiment)
With reference to FIG. 7 to FIG. 13, the form of the component built-in module according to the second embodiment of the present invention will be described. The second embodiment is the same as the first embodiment except that the insulating layer 111 is provided, and the numbers shown in FIGS. 7 to 13 indicate the same configurations in FIGS. 1 to 6. .
　図７は、本発明の第２の実施形態に係る部品内蔵モジュールを示す断面図である。図８は本発明の第２の実施形態に係る部品内蔵モジュールを示す平面図である。図７は図８におけるＢＢ´断面を表したものであり、図８は図７に記載の矢印の方向から見たときの平面図である。本実施の形態における電子部品内蔵モジュールは、第１の実施形態に加え、絶縁層１１１を有する。さらに、前記樹脂封止領域２０１には少なくとも樹脂封止面側において配線基板１１０と樹脂１３０が直接接する領域（直接接触領域）２０４が形成されている。 FIG. 7 is a sectional view showing a component built-in module according to the second embodiment of the present invention. FIG. 8 is a plan view showing a component built-in module according to the second embodiment of the present invention. FIG. 7 shows a BB ′ cross section in FIG. 8, and FIG. 8 is a plan view when viewed from the direction of the arrow shown in FIG. The electronic component built-in module in the present embodiment has an insulating layer 111 in addition to the first embodiment. Further, a region (direct contact region) 204 where the wiring substrate 110 and the resin 130 are in direct contact is formed in the resin sealing region 201 at least on the resin sealing surface side.
　絶縁層１１１は、基材の種類に応じてソルダレジスト、カバーレイ、オーバーコートなどを使用することが出来る。 For the insulating layer 111, a solder resist, a coverlay, an overcoat or the like can be used depending on the type of the base material.
　直接接触領域２０４は、配線基板１１０と樹脂１３０の剥離を抑制することが出来る。図９は樹脂１３０及び配線基板１１０の基材、並びに樹脂１３０及び絶縁層１１１の接着強度を測定するため剥離試験を実施した結果を示している。剥離試験では、まず、被着剤として、樹脂１３０、基材（ポリイミド基材）、絶縁層１１１を準備し、樹脂１３０と基材の接着組立物、樹脂１３０と絶縁層１１１の接着組立物を準備する。接着部分の開放端から、基材、絶縁層１１１をそれぞれ剥離し、被着材の長手方向に沿って分離が進行するように実質的な定速度で引き剥がす。剥離は、基材又は絶縁層１１１を引張試験機の治具で固定し、接着面にほぼ垂直方向に治具を上昇させて引き剥がすことにより行う。 The direct contact region 204 can suppress peeling of the wiring board 110 and the resin 130. FIG. 9 shows the results of a peel test performed to measure the adhesive strength between the resin 130 and the substrate of the wiring board 110 and the resin 130 and the insulating layer 111. In the peel test, first, a resin 130, a base material (polyimide base material), and an insulating layer 111 are prepared as adherents, and an adhesive assembly of the resin 130 and the base material, and an adhesive assembly of the resin 130 and the insulating layer 111 are prepared. prepare. The base material and the insulating layer 111 are peeled off from the open ends of the bonded portions, respectively, and peeled off at a substantially constant speed so that the separation proceeds along the longitudinal direction of the adherend. Peeling is performed by fixing the base material or the insulating layer 111 with a jig of a tensile tester and lifting the jig in a direction substantially perpendicular to the bonding surface and peeling it off.
　図９の縦軸の「剥離強度（Ｎ／ｃｍ）」は、単位幅あたりの、樹脂１３０から、基材又は絶縁層１１１を剥離する際に必要な平均荷重を表す。横軸の「変位（ｍｍ）」は、治具の上昇量（引っ張り距離）を表す。実線は基材を剥離した場合を示し、破線は絶縁層１１１を剥離した場合を示している。 “Peel strength (N / cm)” on the vertical axis in FIG. 9 represents an average load per unit width required for peeling the substrate or the insulating layer 111 from the resin 130. The “displacement (mm)” on the horizontal axis represents the amount of lifting (tensile distance) of the jig. The solid line shows the case where the substrate is peeled off, and the broken line shows the case where the insulating layer 111 is peeled off.
　実線で示される、基材の、変位と剥離強度の関係のうち、傾斜部分（０ｍｍ～約２．０ｍｍまで）は、基材を治具で固定した際に基材が弛んでいるため、強度が低くなっているものであり、平均加重算出の際には考慮しない。変位が約２．０ｍｍ以降の平坦な部分が実質的な剥離強度である。図９に示されるように、基材の剥離強度は、絶縁層１１１の剥離強度を上回っている。すなわち、樹脂１３０と基材の接着力は、樹脂１３０と絶縁層１１１の接着力より高い。これは、基材と絶縁層１１１の表面状態の差によるものと考えられる。このため、配線基板１１０の境界２０３を起点に、配線基板１１０の樹脂封止領域２０１と樹脂１３０が剥離することを抑制できる。直接接触領域２０４は、例えば図７および図８に示すように、前記樹脂封止領域２０１において前記境界２０３と接して形成することが出来る。このように直接接触領域２０４を形成することにより、境界２０３を基点として配線基板１１０の樹脂封止領域２０１と樹脂１３０が剥離することを抑制できる。 Of the relationship between the displacement and peel strength of the base material indicated by the solid line, the sloped part (from 0 mm to about 2.0 mm) is strong because the base material is loosened when the base material is fixed with a jig. Is not taken into account when calculating the average weight. A flat portion having a displacement of about 2.0 mm or more is a substantial peel strength. As shown in FIG. 9, the peel strength of the base material exceeds the peel strength of the insulating layer 111. That is, the adhesive force between the resin 130 and the base material is higher than the adhesive force between the resin 130 and the insulating layer 111. This is considered to be due to a difference in surface state between the base material and the insulating layer 111. For this reason, it can suppress that the resin sealing area | region 201 and the resin 130 of the wiring board 110 peel from the boundary 203 of the wiring board 110. For example, as shown in FIGS. 7 and 8, the direct contact region 204 can be formed in contact with the boundary 203 in the resin sealing region 201. By forming the direct contact region 204 in this way, it is possible to suppress the resin sealing region 201 and the resin 130 of the wiring board 110 from being separated from the boundary 203 as a base point.
　また、配線基板１１０の樹脂封止領域２０１の幅に比べ、樹脂非封止領域２０２の幅が狭いため、境界２０３に応力が集中し、樹脂封止領域２０１にまで剥離が広がることがある。そこで、直接接触領域２０４を、図１０のように、境界２０３を上底とし、境界２０３よりも長い辺を下底とする、略台形形状とすることもできる。また、図１１のように、境界２０３を下底とし、境界２０３よりも短い辺を上底とする略台形形状を含む樹脂非封止領域２０２を設け、前記境界２０３と接して前記樹脂封止領域２０１に直接接触領域２０４を設けることも出来る。このように直接接触領域２０４を形成することにより、応力集中を防ぐことができ、さらに効果的に剥離を防止することが出来る。 Further, since the width of the resin non-sealing region 202 is narrower than the width of the resin sealing region 201 of the wiring substrate 110, stress concentrates on the boundary 203, and peeling may spread to the resin sealing region 201. Therefore, as shown in FIG. 10, the direct contact region 204 can also have a substantially trapezoidal shape with the boundary 203 as the upper base and the side longer than the boundary 203 as the lower base. Further, as shown in FIG. 11, a resin non-sealing region 202 including a substantially trapezoidal shape having a boundary 203 as a lower base and a side shorter than the boundary 203 as an upper base is provided, and the resin sealing is in contact with the boundary 203. A direct contact region 204 can also be provided in the region 201. By forming the direct contact region 204 in this way, stress concentration can be prevented, and peeling can be more effectively prevented.
　また、図１２のように、配線基板１１０の前記他方の面の側から見て、全ての電子部品１２０が直接接触領域２０４の内側にあるように形成することも出来る。このように直接接触領域２０４を形成することにより、配線基板１１０の樹脂封止領域２０１が樹脂１３０から剥離することを防止することができ、配線基板１１０の樹脂封止領域２０１に実装される電子部品１２０の信頼性を向上する効果が得られる。 Also, as shown in FIG. 12, it can be formed so that all the electronic components 120 are directly inside the contact area 204 when viewed from the other surface side of the wiring board 110. By forming the direct contact region 204 in this way, it is possible to prevent the resin sealing region 201 of the wiring board 110 from being peeled from the resin 130, and the electrons mounted on the resin sealing region 201 of the wiring substrate 110. The effect of improving the reliability of the component 120 is obtained.
　また、図１３に記載のように、直接接触領域２０４が樹脂１３０と配線基板１１０の間の図示されない絶縁層１１１に囲まれるように形成してもよい。この場合も、同様に配線基板１１０の樹脂封止領域２０１が樹脂１３０から剥離することを防止することができ、配線基板１１０の樹脂封止領域２０１に実装される電子部品１２０の信頼性を向上する効果が得られる。 Further, as shown in FIG. 13, the direct contact region 204 may be formed so as to be surrounded by an insulating layer 111 (not shown) between the resin 130 and the wiring substrate 110. In this case as well, the resin sealing region 201 of the wiring board 110 can be prevented from being peeled off from the resin 130, and the reliability of the electronic component 120 mounted on the resin sealing region 201 of the wiring board 110 is improved. Effect is obtained.
　また、直接接触領域２０４においては、配線が形成されていない構成とすることも出来る。 In addition, the direct contact region 204 may be configured such that no wiring is formed.
　（第３の実施形態）
　第３の実施形態は、本発明にかかる電子部品内蔵モジュール１００を電子機器１０１の筐体の一部に組み込んだことを特徴とする。 (Third embodiment)
The third embodiment is characterized in that the electronic component built-in module 100 according to the present invention is incorporated in a part of the casing of the electronic device 101.
　図１４は、本発明の第３の実施形態に係る電子機器を示す断面図である。 FIG. 14 is a cross-sectional view showing an electronic apparatus according to the third embodiment of the present invention.
　電子機器１０１は、例えば携帯電話・電子辞書・携帯情報端末などである。第３の実施形態では、電子部品内蔵モジュール１００の樹脂１３０が、電子機器１０１の外部筐体の少なくとも一部として用いられる。外部筐体は、電子機器１０１そのものの筐体に限らず、取り外し可能な電池カバー等、電子機器１０１から取り外し可能な筐体の一部に組み込むこともできる。 The electronic device 101 is, for example, a mobile phone, an electronic dictionary, or a portable information terminal. In the third embodiment, the resin 130 of the electronic component built-in module 100 is used as at least a part of the external casing of the electronic device 101. The external housing is not limited to the housing of the electronic device 101 itself, and can be incorporated into a part of the housing that is removable from the electronic device 101, such as a removable battery cover.
　配線基板１１０は、一方の面において、樹脂１３０で封止された樹脂封止領域２０１と、樹脂１３０で封止されていない樹脂非封止領域２０２を少なくとも有し、樹脂封止領域２０１と樹脂非封止領域２０２の境界２０３の少なくとも一部は、配線基板１１０の他方の面の側から見て、樹脂封止領域２０１を封止している樹脂１３０の外縁の内側にある。樹脂封止領域２０１に設けられた電子部品１２０は、配線を通じて樹脂非封止領域２０２に設置された外部接続端子１２１と接続し、外部接続端子１２１は、筐体内にある他のモジュール基板に実装されたＦＰＣコネクタ１２２に挿入される。このように構成することで、電子部品内蔵モジュール１００の面方向ではなく、電子機器１０１の筐体内部の他のモジュールと接続することができ、電子機器の筐体内のスペースを削減し、薄型化を実現することができる。 The wiring substrate 110 has at least a resin sealing region 201 sealed with a resin 130 and a resin non-sealing region 202 not sealed with the resin 130 on one surface. At least a part of the boundary 203 of the non-sealing region 202 is inside the outer edge of the resin 130 sealing the resin sealing region 201 when viewed from the other surface side of the wiring substrate 110. The electronic component 120 provided in the resin sealing region 201 is connected to the external connection terminal 121 installed in the resin non-sealing region 202 through wiring, and the external connection terminal 121 is mounted on another module substrate in the housing. The inserted FPC connector 122 is inserted. With this configuration, it is possible to connect not with the surface direction of the electronic component built-in module 100 but with other modules inside the housing of the electronic device 101, reducing the space in the housing of the electronic device and reducing the thickness. Can be realized.
　さらに、前記取り外し可能な筐体の一部に組み込んだ場合には、当該筐体を交換することで、電子機器の機能を容易に変更することが可能になる。 Furthermore, when it is incorporated into a part of the removable casing, the function of the electronic device can be easily changed by exchanging the casing.
　また、図１５のように、樹脂封止領域２０１において、境界２０３と接して直接接触領域２０４を形成することが出来る。このように直接接触領域２０４を形成することにより、境界２０３を基点として配線基板１１０の樹脂封止領域２０１と樹脂１３０が剥離することを抑制できる。 Further, as shown in FIG. 15, in the resin sealing region 201, the direct contact region 204 can be formed in contact with the boundary 203. By forming the direct contact region 204 in this way, it is possible to suppress the resin sealing region 201 and the resin 130 of the wiring board 110 from being separated from the boundary 203 as a base point.
　（第４の実施形態）
　図１６を参照し、本発明の第４の実施形態に係る部品内蔵モジュールの製造方法について説明する。図１６に記載の番号は、図１～図１５に記載の番号で示される構成と同じである。以下に第４の実施形態に係る部品内蔵モジュールの製造方法を示すが、他の実施形態についても同様の製造方法を用いることが出来る。 (Fourth embodiment)
With reference to FIG. 16, the manufacturing method of the component built-in module which concerns on the 4th Embodiment of this invention is demonstrated. The numbers described in FIG. 16 are the same as the configurations indicated by the numbers described in FIGS. Although the manufacturing method of the component built-in module which concerns on 4th Embodiment is shown below, the same manufacturing method can be used also about other embodiment.
　本実施形態の部品内蔵モジュールを製造する際には、図１６（ａ）に示すように、はじめに、複数の電子部品１２０が配線基板１１０の少なくとも一方の面に実装されているものを用意する。配線基板１１０を用意して、電子部品１２０を配線基板１１０の一方の面に実装する工程を含んでもよい。 When manufacturing the component built-in module of this embodiment, as shown in FIG. 16A, first, a device in which a plurality of electronic components 120 are mounted on at least one surface of the wiring board 110 is prepared. A step of preparing the wiring board 110 and mounting the electronic component 120 on one surface of the wiring board 110 may be included.
　次に図１６（ｂ）に示すように、配線基板１１０を樹脂１３０で封止するため、電子部品１２０を実装した状態の配線基板１１０を金型３１０内に設置する。配線基板１１０を封止する樹脂１３０としてアクリル樹脂やＡＢＳ樹脂、ポリカーボネート樹脂などの熱可塑性樹脂を使用する場合は金型３１０の温度を６０～１２０℃程度とすることが望ましい。次に図１６（ｃ）に示すように、金型３１０を型締めし、金型３１０の内部に樹脂１３０を形成する樹脂を射出する。つづいて、図１６（ｄ）に示すように金型３１０から樹脂封止した配線基板１１０を取り出す。最後に、図１６（ｅ）に示すように配線基板１１０を樹脂１３０から剥離することで樹脂非封止領域２０２を形成し、本発明の電子部品内蔵モジュール１００が完成する。 Next, as shown in FIG. 16B, in order to seal the wiring board 110 with the resin 130, the wiring board 110 on which the electronic component 120 is mounted is placed in the mold 310. When a thermoplastic resin such as an acrylic resin, an ABS resin, or a polycarbonate resin is used as the resin 130 for sealing the wiring substrate 110, the temperature of the mold 310 is preferably set to about 60 to 120 ° C. Next, as shown in FIG. 16C, the mold 310 is clamped and a resin for forming the resin 130 is injected into the mold 310. Subsequently, as shown in FIG. 16D, the resin-sealed wiring board 110 is taken out from the mold 310. Finally, as shown in FIG. 16E, the wiring substrate 110 is peeled from the resin 130 to form the resin non-sealing region 202, and the electronic component built-in module 100 of the present invention is completed.
　図１７は、本発明の第４の実施形態の変形例である。この変形例においては、絶縁層１１１を有する。さらに、前記樹脂封止領域２０１には直接接触領域２０４が形成されている。配線基板１１０の絶縁層１１１が形成されている領域は、図９に示すように樹脂との接着力が極めて低いため、容易に剥離することができるが、一方で直接接触領域２０４は剥離することを抑制される。このような構成を採用することにより、前記剥離の工程において、剥離が直接接触領域２０４より先に進むのを防ぐストッパーの役割を果たすことになり、配線基板１１０の樹脂封止領域２０１と樹脂１３０が剥離することを抑制できる。 FIG. 17 shows a modification of the fourth embodiment of the present invention. In this modified example, an insulating layer 111 is provided. Further, a direct contact region 204 is formed in the resin sealing region 201. The region where the insulating layer 111 of the wiring board 110 is formed has an extremely low adhesive force to the resin as shown in FIG. 9 and can be easily peeled off, while the direct contact region 204 is peeled off. Is suppressed. By adopting such a configuration, in the peeling step, it serves as a stopper that prevents the peeling from proceeding directly beyond the contact area 204, and the resin sealing region 201 and the resin 130 of the wiring board 110 are used. Can be prevented from peeling.
　なお、樹脂に意匠性を向上させるため、加飾シートや塗装膜を形成することも可能である。また、本実施形態では樹脂封止工法として射出成形工法を例示したが、使用する樹脂に応じて他の工法を選択することも可能である。 In addition, in order to improve the designability of the resin, it is possible to form a decorative sheet or a coating film. In this embodiment, the injection molding method is exemplified as the resin sealing method, but other methods can be selected according to the resin to be used.
　本発明の電子部品内蔵モジュールおよび電子機器並びに電子部品内蔵モジュールの製造方法は、上記実施形態に基づいて説明されているが、上記実施形態に限定されることなく、本発明の範囲内において、かつ本発明の基本的技術思想に基づいて、上記実施形態に対し種々の変形、変更及び改良を含むことができることはいうまでもない。また、本発明の請求の範囲の枠内において、種々の開示要素の多様な組み合わせ・置換ないし選択が可能である。本発明のさらなる課題、目的及び展開形態は、請求の範囲を含む本発明の全開示事項からも明らかにされる。 The electronic component built-in module, the electronic device, and the electronic component built-in module manufacturing method of the present invention have been described based on the above embodiment, but are not limited to the above embodiment, and are within the scope of the present invention, and It goes without saying that various modifications, changes and improvements can be included in the above embodiment based on the basic technical idea of the present invention. Further, various combinations, substitutions, or selections of various disclosed elements are possible within the scope of the claims of the present invention. Further problems, objects, and developments of the present invention will become apparent from the entire disclosure of the present invention including the claims.
　以上、実施形態を参照して本願発明を説明したが、本願発明は上記実施形態に限定されるものではない。本願発明の構成や詳細には、本願発明のスコープ内で当業者が理解し得る様々な変更をすることができる。 The present invention has been described above with reference to the embodiments, but the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.
　この出願は、２０１２年３月９日に出願された日本出願特願２０１２－０５２５４２を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2012-052542 filed on March 9, 2012, the entire disclosure of which is incorporated herein.
　１００　　電子部品内蔵モジュール
　１０１　　電子機器
　１１０　　配線基板
　１１１　　絶縁層
　１２０　　電子部品
　１２１　　外部接続端子
　１２２　　ＦＰＣコネクタ
　１３０　　樹脂
　２０１　　樹脂封止領域
　２０２　　樹脂非封止領域
　２０３　　境界
　２０４　　直接接触領域
　３１０　　金型
　４００　　ＩＣカード
　４０１　　プリント配線基板
　４０２　　配線
　４０３　　半導体装置
　４０４　　ワイヤー
　４０５　　樹脂
　４０６　　端子 DESCRIPTION OF SYMBOLS 100 Electronic component built-in module 101 Electronic device 110 Wiring board 111 Insulating layer 120 Electronic component 121 External connection terminal 122 FPC connector 130 Resin 201 Resin sealing area 202 Resin non-sealing area 203 Boundary 204 Direct contact area 310 Mold 400 IC card 401 Printed wiring board 402 Wiring 403 Semiconductor device 404 Wire 405 Resin 406 Terminal

Claims (10)

  1. 配線基板と
    前記配線基板に設けられた電子部品と
    前記電子部品の少なくとも一部を前記配線基板の一部と共に封止する樹脂とを有する部品内蔵モジュールであって、
    前記配線基板の一方の面に封止されている樹脂封止領域と
    封止されていない樹脂非封止領域とを少なくとも有し、
    前記樹脂封止領域と前記樹脂非封止領域の境界のうち少なくとも一部は、
    前記配線基板の他方の面の側から見て、前記樹脂の外縁の内側にあることを特徴とする
    電子部品内蔵モジュール。     A component built-in module having a wiring board, an electronic component provided on the wiring board, and a resin that seals at least a part of the electronic component together with a part of the wiring board,
    Having at least a resin sealing region sealed on one surface of the wiring board and a resin non-sealing region not sealed;
    At least a part of the boundary between the resin sealing region and the resin non-sealing region is:
    An electronic component built-in module, wherein the module is inside the outer edge of the resin as viewed from the other surface side of the wiring board.
  2. 前記樹脂非封止領域の配線基板は、前記樹脂から離れる方向に曲がっている部分を含むことを特徴とする、請求項１に記載の電子部品内蔵モジュール。 The electronic component built-in module according to claim 1, wherein the wiring board in the resin non-sealing region includes a portion bent in a direction away from the resin.
  3. 前記樹脂非封止領域には、外部接続端子が設けられていることを特徴とする、請求項１乃至２に記載の電子部品内蔵モジュール。 The electronic component built-in module according to claim 1, wherein an external connection terminal is provided in the resin non-sealing region.
  4. 前記部品内蔵モジュールは、前記配線基板上にさらに絶縁層を有し、前記樹脂封止領域において前記配線基板と前記樹脂が直接接する領域が形成されていることを特徴とする、請求項１乃至３に記載の電子部品内蔵モジュール。 The component built-in module further includes an insulating layer on the wiring board, and an area where the wiring board and the resin are in direct contact is formed in the resin sealing area. The electronic component built-in module described in 1.
  5. 前記配線基板と前記樹脂が直接接する領域は、前記境界と接して形成されていることを特徴とする、請求項４に記載の電子部品内蔵モジュール。 5. The electronic component built-in module according to claim 4, wherein a region where the wiring board and the resin are in direct contact is formed in contact with the boundary.
  6. 前記配線基板と前記樹脂が直接接する領域は、前記樹脂封止領域の外縁部分に形成されていることを特徴とする、請求項４に記載の電子部品内蔵モジュール。 5. The electronic component built-in module according to claim 4, wherein a region where the wiring board and the resin are in direct contact is formed at an outer edge portion of the resin sealing region.
  7. 前記配線基板と前記樹脂が直接接する領域には、配線が形成されていないことを特徴とする請求項４乃至６に記載の電子部品内蔵モジュール。 7. The electronic component built-in module according to claim 4, wherein no wiring is formed in a region where the wiring board and the resin are in direct contact.
  8. 請求項１乃至７に記載の電子部品内蔵モジュールを電子機器の筐体の一部に組み込んだことを特徴とする、電子機器。 An electronic device comprising the electronic component built-in module according to claim 1 incorporated in a part of a casing of the electronic device.
  9. 配線基板の少なくとも一方の面に設けられた電子部品を樹脂で封止する工程と、
    前記配線基板を前記樹脂から剥離する工程と
    を有することを特徴とする電子部品内蔵モジュールの製造方法。     Sealing an electronic component provided on at least one surface of the wiring board with a resin;
    And a step of peeling the wiring board from the resin.
  10. 前記配線基板上にさらに絶縁層を有し、
    前記樹脂封止された領域には少なくとも樹脂封止面側に前記配線基板と前記樹脂が直接接する領域が形成されていて、
    前記配線基板を前記配線基板の端部から前記配線基板と前記樹脂が直接接する領域まで剥離する工程をさらに含むことを特徴とする、請求項９に記載の電子部品内蔵モジュールの製造方法。     Further comprising an insulating layer on the wiring board,
    In the resin-sealed region, at least a region where the wiring board and the resin are in direct contact is formed on the resin sealing surface side,
    10. The method for manufacturing an electronic component built-in module according to claim 9, further comprising a step of peeling the wiring board from an end portion of the wiring board to a region where the wiring board and the resin are in direct contact.
PCT/JP2013/001293 2012-03-09 2013-03-04 Module with embedded electronic components, electronic device, and method for manufacturing module with embedded electronic components WO2013132815A1 (en)

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US10057989B1 (en) * 2017-04-10 2018-08-21 Tactotek Oy Multilayer structure and related method of manufacture for electronics
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