CN113395875A - Heat conducting component - Google Patents
Heat conducting component Download PDFInfo
- Publication number
- CN113395875A CN113395875A CN202110569882.3A CN202110569882A CN113395875A CN 113395875 A CN113395875 A CN 113395875A CN 202110569882 A CN202110569882 A CN 202110569882A CN 113395875 A CN113395875 A CN 113395875A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting
- compressible
- base layer
- flexible insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 35
- 238000007789 sealing Methods 0.000 claims abstract description 35
- 238000010521 absorption reaction Methods 0.000 claims abstract description 24
- 230000002745 absorbent Effects 0.000 claims description 23
- 239000002250 absorbent Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 15
- 238000012546 transfer Methods 0.000 claims description 13
- 239000011231 conductive filler Substances 0.000 claims description 6
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 5
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract description 8
- 238000007906 compression Methods 0.000 abstract description 8
- 238000011049 filling Methods 0.000 abstract description 6
- 229920000049 Carbon (fiber) Polymers 0.000 description 10
- 239000004917 carbon fiber Substances 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002323 Silicone foam Polymers 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000013514 silicone foam Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat-conducting component, which comprises a first flexible insulating heat-conducting base layer, a compressible sealing ring, a compressible absorption piece and a heat-conducting medium, wherein the first flexible insulating heat-conducting base layer is provided with a first sealing ring; the compressible sealing ring is arranged on the first flexible insulating heat-conducting base layer and is matched with the first flexible insulating heat-conducting base layer to form an accommodating cavity, and a first accommodating area and a second accommodating area are formed in the accommodating cavity; the compressible absorption piece is arranged in the first containing area and is provided with a porous structure; the heat conducting medium is filled in the second accommodating area and comprises liquid metal. The heat-conducting member has good heat conductivity and insulativity, good flexibility and interface filling property, small influence of external force compression on heat-conducting performance and high performance stability.
Description
Technical Field
The invention relates to the technical field of heat conduction, in particular to a heat conduction component.
Background
At present, many high-performance intelligent devices adopt a passive heat dissipation mode, which is based on a good interface heat conduction material, so that heat of a heating part (such as a CPU/GPU) is led to a heat dissipation part, and then the heat dissipation part uniformly spreads the heat, thereby avoiding local heat concentration. The heat-conducting interface material plays a role of a basic bridge between the heating interface and the heat-radiating interface, and determines subsequent heat-radiating efficiency and product performance. If the heat conduction treatment is improper, the power of the equipment is lowered due to overheating, and the performance of hardware and the long-term reliability of the product are affected.
The current ultrahigh-performance heat-conducting interface materials (the heat conductivity coefficient is more than 10W/m.k) are mainly divided into: carbon fiber heat-conducting fins and a liquid metal coating. The carbon fiber heat conducting fin has the advantages that the vertical heat conducting coefficient is very high through the mode that the high heat conducting carbon fibers are vertically and directionally arranged in the silica gel, but the high heat conducting carbon fibers are imported and limited in supply, the cost is very high, the industrial application is restricted, the carbon fiber heat conducting fin is mainly applied to the fields of military industry and base stations, and the field of mobile phones is occasionally applied; in addition, in order to ensure the heat conductivity of the carbon fiber heat conducting strip, the compression amount of the carbon fiber heat conducting strip is greatly limited, and if the carbon fiber heat conducting strip is compressed too much, the carbon fiber is likely to deform and break, and the heat conductivity coefficient is reduced. The liquid metal mainly utilizes the characteristic that certain alloy metals can keep liquid at room temperature and the high heat conduction characteristic of the metal per se to realize gap filling and high heat conduction, is currently applied to some high-end game machines and special purposes, can resist high temperature, and for the existing liquid metal coating heat conduction interface material, because the liquid metal per se is conductive, once exposed, a circuit is easy to be short-circuited; and the liquid metal itself is liquid and is difficult to compress once completely sealed; therefore, the filling space requires precise calculation and is extremely invariant. Meanwhile, the liquid metal itself has certain corrosiveness to aluminum alloy (conventional radiator material).
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a heat conducting member.
In a first aspect of the present invention, a heat conductive member is provided, including:
a first flexible, insulating, thermally conductive base layer,
the compressible sealing ring is arranged on the first flexible insulating heat-conducting base layer and matched with the first flexible insulating heat-conducting base layer to form an accommodating cavity, and a first accommodating area and a second accommodating area are formed in the accommodating cavity;
the compressible absorption piece is arranged in the first containing area; the compressible absorbent member has a porous structure;
the heat-conducting medium is filled in the second accommodating area; the heat transfer medium includes a liquid metal.
The heat conducting component according to the embodiment of the invention has at least the following beneficial effects: adopt flexible insulating heat conduction basic unit as the basic unit among this heat conduction component, enclose through compressible sealing washer and flexible insulating heat conduction basic unit and close and construct the holding cavity to set up compressible absorption piece and fill heat-conducting medium in the holding cavity. The flexible insulating heat-conducting base layer can provide a high-flexibility, heat-conducting and insulating foundation for the heat-conducting member; the periphery of the sealing ring is sealed by a compressible sealing ring, so that the functions of limiting and shock absorption protection can be achieved; the heat-conducting medium containing liquid metal is filled in the accommodating cavity, the liquidity of the liquid metal can deform together with the flexible insulating heat-conducting base layer, the liquid metal can be tightly attached to a contact interface during assembly and use, the attaching effect is good, and the heat-conducting component has good interface filling performance; the porous compressible absorption piece is arranged in the accommodating cavity, and in the assembling and using process, after the area of the heat conduction member outside the compressible absorption piece in the accommodating cavity is filled with the liquid metal under the action of pressure, the liquid metal can enter the pores of the compressible absorption piece, so that the adjusting capacity of the gap can be increased, and the contact with the contact interface is kept fully; in addition, liquid metal is used as a main heat conducting medium, the state is uniform and continuous, a heat conducting path can be complete, the influence of the compression state on the heat conducting performance in the direction vertical to the surface of the flexible insulating heat conducting base layer is small, and the performance stability is high.
In some embodiments of the invention, the compressible absorbent member comprises at least one of a porous polyurethane sponge, a porous melamine sponge.
In some embodiments of the invention, the compressible absorbent member has a volume that is less than or equal to 80% of the volume of the receiving cavity.
In some embodiments of the invention, the compressible absorbent member is a metallized compressible absorbent member having a porous structure.
In some embodiments of the invention, the compressible sealing ring and/or the compressible absorbent member has a compressibility of more than 50%.
In some embodiments of the present invention, the compressible sealing ring is made of silicone.
In some embodiments of the present invention, the heat transfer medium further comprises a first heat transfer filler.
In some embodiments of the invention, the heat conducting member further comprises a second flexible, insulating, heat conducting base layer disposed on the compressible sealing ring opposite the first flexible, insulating, heat conducting base layer sealing cover.
In some embodiments of the present invention, the first flexible, insulating, thermally conductive base layer and the second flexible, insulating, thermally conductive base layer include a flexible, insulating base material and a second thermally conductive filler filled inside the flexible, insulating base material.
In some embodiments of the invention, the flexible insulating substrate is selected from at least one of Polymethylmethacrylate (PMMA), rubber, thermoplastic polyurethane, polyethylene.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic structural diagram of a heat-conducting member according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of a heat-conducting member according to the present invention;
fig. 3 is an operational schematic diagram of the heat conductive member shown in fig. 2.
Reference numerals: first flexible insulating heat-conducting base layer 110, compressible sealing ring 120, compressible absorbent member 130, heat-conducting medium 140, receiving cavity 150, first receiving area 151, second receiving area 152, first flexible insulating heat-conducting base layer 210, compressible sealing ring 220, compressible absorbent member 230, heat-conducting medium 240, receiving cavity 250, first receiving area 251, second receiving area 252, and second flexible insulating heat-conducting base layer 260.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1, fig. 1 is a schematic structural diagram illustrating a heat conducting member according to an embodiment of the invention. As shown in fig. 1, the heat conductive member of the present embodiment includes a first flexible, insulating, heat conductive base layer 110, a compressible sealing ring 120, a compressible absorbent member 130, and a heat conductive medium 140. The compressible sealing ring 120 is disposed on the first flexible insulating and heat conducting base layer 110, and cooperates with the first flexible insulating and heat conducting base layer 110 to form an accommodating cavity 150, and the accommodating cavity 150 has a first accommodating area 151 and a second accommodating area 152 therein; the compressible absorption member 130 is disposed in the first accommodation region 151 and has a porous structure; the heat conducting medium 140 is filled in the second accommodating area 152, and the heat conducting medium 140 includes liquid metal.
The first flexible insulating and heat conducting base layer 110 may be prepared by mixing a flexible insulating base material and a second heat conducting filler, and then coating, curing and hot-pressing the mixture to obtain the first flexible insulating and heat conducting base layer 110 including the flexible insulating base material and the second heat conducting filler filled in the flexible insulating base material. In effect, the higher the thermal conductivity perpendicular to the surface of the first flexible insulating and heat conducting base layer 110 is, the better the thermal conductivity is, but if the thermal conductivity is too high, the more the second thermal conductive filler needs to be filled, which may affect the tensile property of the first flexible insulating and heat conducting base layer 110, causing it to be easily broken, and therefore, the content of the second thermal conductive filler in the first flexible insulating and heat conducting base layer 110 is generally controlled to be 10% to 40%. In addition, in order to ensure the insulation property of the layer body, so as to avoid the risk of electric leakage or short circuit in the using process, the breakdown strength of the first flexible insulating and heat conducting base layer 110 is generally required to be at least 5 KV/mm. The flexible insulating base material can be selected from one or more of polymethyl methacrylate (PMMA), rubber, Thermoplastic Polyurethane (TPU) and polyethylene; the second heat-conducting filler can adopt granular heat-conducting fillers or other forms of heat-conducting fillers, and specifically can adopt boron nitride, artificial diamond, graphene and the like. In addition, during the research process, the inventors have conducted a lot of research and tests on the preparation of the first flexible insulating and heat conducting base layer 110 and the performance thereof by combining various flexible insulating base materials and the second heat conducting filler, including: the flexible insulating heat-conducting base layer is prepared by mixing TPU and boron nitride, wherein the addition amount of the boron nitride is 20-40%; tests show that the heat conductivity coefficient of the prepared flexible insulating heat-conducting base layer in the direction vertical to the surface of the flexible insulating heat-conducting base layer can reach 0.5-1.0W/m.k, the heat conductivity coefficient in the direction parallel to the surface of the flexible insulating heat-conducting base layer can reach 10-30W/m.k, the tensile rate can reach 150%, the breakdown strength can reach 5KV/mm, and the flexible insulating heat-conducting base layer has high stretchability, high heat conductivity, corrosion resistance and high insulativity. Similarly, other flexible insulating base materials can be mixed with the second heat-conducting filler to prepare the flexible insulating heat-conducting base layer.
The compressible sealing ring 120 is disposed on the first flexible insulating and heat-conducting base layer 110, and specifically may be disposed at an edge of the first flexible insulating and heat-conducting base layer 110; and can be hermetically bonded with the first flexible, insulating and heat-conducting base layer 110 by means of glue, adhesive tape or ultrasonic welding. Compressible seal ring 120 is typically a seal ring having a compressibility of greater than 50%, where compressibility is specifically defined as the ratio of the thickness after compression to the thickness before compression. By controlling the compressibility of the compressible sealing ring 120, the component and the assembly tolerance are absorbed corresponding to a larger working interval, and when the compressible sealing ring is used for conducting the heat of a heating electronic device (such as a chip) to a radiator for heat dissipation treatment, the compression on the heating electronic device can be reduced, and the welding of the heating electronic device can not be damaged; and when meeting vibrations, still can play the shock attenuation effect to a certain extent, avoid the radiator to cause the damage with the electron device contact that generates heat. The compressible sealing ring 120 may be made of a silicone material, such as a silicone foam or a flexible silicone sheet.
The compressible absorption member 130 can be a porous metalized sponge with low density, and the density can be controlled to be 100-400 kg/m3. Specifically, at least one of a porous polyurethane sponge and a porous melamine sponge may be used. In order to make the compressible absorption material itself have a certain thermal conductivity and to improve the thermal conductivity of the whole member, the compressible absorption material 130 may be metallized, specifically, the compressible absorption material 130 may be metallized and has a porous structure by immersing the compressible absorption material 130 in a plating solution and performing water plating or chemical plating. In addition, the volume ratio of the compressible absorption member 130 in the accommodating cavity 150 can be controlled to be less than or equal to 80% (specifically, 50% -60%), so as to avoid that the too large volume ratio affects the contact ratio of the heat-conducting medium 140, and further affects the heat-conducting effect. Compressible absorbent member 130Is generally controlled to be more than 50%, and the compressibility of the sealing ring is generally greater than or equal to that of the compressible sealing ring 120; while maintaining a sufficiently small spring back stress to protect against crushing of the heat-generating electronic components. The position of the compressible absorbent member 130 in the receiving cavity 150 (i.e. the first receiving area 151 for receiving the compressible absorbent member 130) can be designed according to the requirement, for example, the compressible absorbent member can be fixedly disposed at one side or the middle of the receiving cavity 150, or can be separately disposed in the receiving cavity 150.
The heat conducting medium 140 is filled in the second accommodating area 152 of the accommodating cavity 150, and may be specifically configured to be filled or not filled in the second accommodating area 152; in the embodiment, the heat-conducting medium 140 does not fill the second accommodation region 152; the heat conducting medium 140 is liquid metal, and generally, liquid metal having a heat conductivity greater than 20W/m · k and capable of maintaining a liquid state at room temperature for a long time, for example, gallium indium tin alloy, gallium indium alloy, gallium alloy, or the like may be used. In other embodiments, the heat-conducting medium 140 may also be formed by mixing liquid metal with the first heat-conducting filler, and the first heat-conducting filler may be cubic boron nitride (thermal conductivity coefficient)>300W/m.K), synthetic diamond (thermal conductivity coefficient)>1000W/m.K), graphene (thermal conductivity coefficient)>1000W/m · K), etc., and the overall thermal conductivity can be more effectively improved and the cost can be reduced by adding the above first thermal conductive filler. If the liquid metal is mixed with the first heat-conducting filler, the density of the liquid metal in the heat-conducting medium 140 is generally controlled to be 6-7 g/cm3To reduce the possibility of the first heat conductive filler settling; in addition, the first heat-conducting filler can be uniformly dispersed in the liquid metal by optimizing the size and modifying the surface of the first heat-conducting filler, so that the heat-conducting property of the first heat-conducting filler is improved.
The above heat conducting member can be applied to a case where at least one side of the contact interface (heat generating electronic device or heat sink) is non-metal, and in use, the side of the compressible sealing ring 120 facing away from the first flexible insulating and heat conducting base layer 110 can be hermetically assembled with the non-metal contact interface for heat conduction between the heat generating electronic device and the heat sink.
The arrangement of the first flexible, insulating and heat-conducting base layer 110 in the above heat-conducting member can provide a high stretchability, heat conductivity and insulating base for the heat-conducting member; the compressible sealing ring 120 is used for sealing around, so that the functions of limiting and shock absorption protection can be achieved; the heat-conducting medium 140 containing liquid metal is filled in the accommodating cavity 150, the liquidity of the liquid metal can deform together with the first flexible insulating heat-conducting base layer 110, and the liquid metal can be tightly attached to a contact interface during assembly and use, so that the attaching effect is good, and the heat-conducting component has good interface filling performance; in addition, the containing cavity 150 is internally provided with the compressible absorption piece 130 with a porous structure, and under the condition that the liquid metal in the containing cavity 150 is in a liquid state, due to the action of surface tension of the liquid metal, the liquid metal only slightly infiltrates into the inner edge of the compressible absorption piece 130 under the condition of no external force, and is basically negligible, and has higher fluidity under the pressure of the external force; therefore, in the assembling and using process, the heat conducting member is under the pressure effect, and after the space outside the compressible absorption piece 130 in the accommodating cavity 150 is filled with the liquid metal, the liquid metal can enter the pores of the compressible absorption piece 130, so that the adjusting capability of the gap can be increased, and the heat conducting member is kept in full contact with the contact interface; moreover, liquid metal is used as a heat-conducting medium, the state is uniform and continuous, a heat-conducting path can be complete, the influence of the compression state on the heat-conducting performance in the direction perpendicular to the surface of the first flexible insulating heat-conducting base layer is small, the performance stability is high, the heat-conducting path is different from the conventional heat-conducting path in which heat-conducting particles or carbon fiber wires can be completely conducted only through enough pressing contact, and the influence on the heat-conducting performance is caused if the pressure is insufficient or excessive.
In addition, referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of the heat conducting member of the present invention, and the main differences of the heat conducting member compared with the heat conducting member shown in fig. 1 are as follows: a second flexible, insulating, thermally conductive base layer 260 is also included. The concrete structure comprises: a first flexible insulating thermal conductive base layer 210, a compressible sealing ring 220, a compressible absorbent member 230, a thermal conductive medium 240, and a second flexible insulating thermal conductive base layer 260. The compressible sealing ring 220 is disposed on the first flexible insulating and heat-conducting base layer 210, and cooperates with the first flexible insulating and heat-conducting base layer 210 to form a receiving cavity 250, and the receiving cavity 250 has a first receiving area 251 and a second receiving area 252 therein; a compressible absorbent member 230 is provided at the first receiving region 251, the compressible absorbent member 230 having a porous structure; the heat conducting medium 240 is filled in the second accommodating area 252, and the heat conducting medium 240 includes liquid metal; the second flexible thermal insulating base layer 260 is disposed on the compressible sealing ring 220 opposite to the first flexible thermal insulating base layer 210, so that the receiving cavity 250 becomes a sealed receiving cavity.
The above first flexible insulating and heat-conducting base layer 210, compressible sealing ring 220, compressible absorbing member 230 and heat-conducting medium 240 are substantially the same as the first flexible insulating and heat-conducting base layer 110, compressible sealing ring 120, compressible absorbing member 130 and heat-conducting medium 140 in the heat-conducting member shown in fig. 1, and thus, the description thereof is omitted. The second flexible insulating and thermally conductive base layer 260 is the same as or similar to the first flexible insulating and thermally conductive base layer 210.
Through the above structural arrangement, the heat conducting member of the present embodiment can be regarded as a heat conducting elastomer, and through the cooperation of the first flexible insulating heat conducting base layer 210 and the second flexible insulating heat conducting base layer 260, the heat conducting member is applicable to heat generating electronic devices and heat sinks of various types of contact interfaces. The working principle is shown in fig. 3, wherein the space outside the compressible absorption member 230 in the accommodating cavity 250 is filled with the heat-conducting medium 240 as the upper working limit, and the working process includes: applying pressure to the heat conducting member shown in fig. 3 (a), the compressible sealing ring 220 and the compressible absorption member 230 are deformed under pressure, until the liquid metal of the heat conducting medium 240 fills the space outside the compressible absorption member 230 in the receiving cavity 250, and reaches the upper limit of operation, as shown in fig. 3 (b); and then further compressed, the pressure forces the liquid metal into the pores of the compressible absorbent member 230, as shown in fig. 3 (c), to achieve expansion of the space occupied by the liquid metal, so that good interfacial contact can be maintained. By last, this heat conduction component heat conductivity and insulating nature are good, and have good pliability and interface filling nature, and the external force compression is little to the heat conductivility influence, and the stability of performance is high.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
1. A heat conductive member, comprising:
a first flexible, insulating, thermally conductive base layer,
the compressible sealing ring is arranged on the first flexible insulating heat-conducting base layer and matched with the first flexible insulating heat-conducting base layer to form an accommodating cavity, and a first accommodating area and a second accommodating area are formed in the accommodating cavity;
the compressible absorption piece is arranged in the first containing area; the compressible absorbent member has a porous structure;
the heat-conducting medium is filled in the second accommodating area; the heat transfer medium includes a liquid metal.
2. The heat conducting member according to claim 1, wherein the compressible absorbent member comprises at least one of a porous polyurethane sponge and a porous melamine sponge.
3. The heat conducting member according to claim 2, wherein the volume of the compressible absorbent member is less than or equal to 80% of the volume of the receiving cavity.
4. The heat conductive member according to claim 1, wherein the compressible absorbent member is a metallized compressible absorbent member having a porous structure.
5. The heat transfer member of claim 1, wherein the compressible sealing ring and/or the compressible absorbent member has a compressibility of 50% or more.
6. The heat transfer member of claim 5, wherein the compressible sealing ring is made of silicone.
7. The heat transfer member of claim 1, wherein the heat transfer medium further comprises a first heat conductive filler.
8. The heat transfer member of any one of claims 1 to 7, further comprising a second flexible thermally and electrically insulating base layer disposed on the compressible sealing ring opposite the first flexible thermally and electrically insulating base layer sealing cover.
9. The heat transfer member according to claim 8, wherein the first and second flexible insulating and heat transfer base layers comprise a flexible insulating base material and a second heat transfer filler filled inside the flexible insulating base material.
10. The heat transfer member of claim 9, wherein the flexible insulating substrate is selected from at least one of polymethylmethacrylate, rubber, thermoplastic polyurethane, polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110569882.3A CN113395875B (en) | 2021-05-25 | 2021-05-25 | Heat conducting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110569882.3A CN113395875B (en) | 2021-05-25 | 2021-05-25 | Heat conducting component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113395875A true CN113395875A (en) | 2021-09-14 |
| CN113395875B CN113395875B (en) | 2022-07-26 |
Family
ID=77618956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110569882.3A Active CN113395875B (en) | 2021-05-25 | 2021-05-25 | Heat conducting component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113395875B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114362841A (en) * | 2021-12-13 | 2022-04-15 | 深圳市卓汉材料技术有限公司 | Passive intermodulation test fixture and passive intermodulation test system |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5323294A (en) * | 1993-03-31 | 1994-06-21 | Unisys Corporation | Liquid metal heat conducting member and integrated circuit package incorporating same |
| TW200408666A (en) * | 2000-04-05 | 2004-06-01 | Bergquist Co | Thermal interface pad utilizing low melting metal with retention matrix |
| US20080068803A1 (en) * | 2006-09-18 | 2008-03-20 | Shyh-Ming Chen | Heat dissipating device holder structure with a thin film thermal conducting medium coating |
| US20090208722A1 (en) * | 2008-02-18 | 2009-08-20 | John Francis Timmerman | Oriented Members for Thermally Conductive Interface Structures |
| JP2013120814A (en) * | 2011-12-07 | 2013-06-17 | Satsuma Soken Kk | Heat radiation structure |
| CN104140786A (en) * | 2013-05-09 | 2014-11-12 | 中国科学院理化技术研究所 | Composite phase-change thermal storage material |
| JP2015130375A (en) * | 2014-01-06 | 2015-07-16 | 富士通株式会社 | Heat conduction sheet and electronic device |
| CN108808171A (en) * | 2018-08-07 | 2018-11-13 | 深圳市派客新能源有限公司 | A kind of heat dissipation cold belt and battery pack temperature control component |
| CN109894602A (en) * | 2019-03-07 | 2019-06-18 | 青岛科技大学 | A kind of high thermal conductivity composite heat interfacial material with two-phase co-continuous communicating structure |
| CN110010267A (en) * | 2019-04-30 | 2019-07-12 | 深圳市卓汉材料技术有限公司 | A kind of high heat-conductivity conducting elastomer |
| CN110034080A (en) * | 2017-12-26 | 2019-07-19 | 卓英社有限公司 | Conducting-heat elements |
| CN210047155U (en) * | 2019-06-05 | 2020-02-11 | 宁波石墨烯创新中心有限公司 | Three-dimensional network heat conduction structure and electronic equipment |
| CN210671097U (en) * | 2019-09-02 | 2020-06-02 | 深圳市傲川科技有限公司 | Radiating gasket and electronic component |
| CN213187044U (en) * | 2020-10-29 | 2021-05-11 | 西安易朴通讯技术有限公司 | Heat dissipation device and electronic equipment |
-
2021
- 2021-05-25 CN CN202110569882.3A patent/CN113395875B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5323294A (en) * | 1993-03-31 | 1994-06-21 | Unisys Corporation | Liquid metal heat conducting member and integrated circuit package incorporating same |
| TW200408666A (en) * | 2000-04-05 | 2004-06-01 | Bergquist Co | Thermal interface pad utilizing low melting metal with retention matrix |
| US20080068803A1 (en) * | 2006-09-18 | 2008-03-20 | Shyh-Ming Chen | Heat dissipating device holder structure with a thin film thermal conducting medium coating |
| US20090208722A1 (en) * | 2008-02-18 | 2009-08-20 | John Francis Timmerman | Oriented Members for Thermally Conductive Interface Structures |
| JP2013120814A (en) * | 2011-12-07 | 2013-06-17 | Satsuma Soken Kk | Heat radiation structure |
| CN104140786A (en) * | 2013-05-09 | 2014-11-12 | 中国科学院理化技术研究所 | Composite phase-change thermal storage material |
| JP2015130375A (en) * | 2014-01-06 | 2015-07-16 | 富士通株式会社 | Heat conduction sheet and electronic device |
| CN110034080A (en) * | 2017-12-26 | 2019-07-19 | 卓英社有限公司 | Conducting-heat elements |
| CN108808171A (en) * | 2018-08-07 | 2018-11-13 | 深圳市派客新能源有限公司 | A kind of heat dissipation cold belt and battery pack temperature control component |
| CN109894602A (en) * | 2019-03-07 | 2019-06-18 | 青岛科技大学 | A kind of high thermal conductivity composite heat interfacial material with two-phase co-continuous communicating structure |
| CN110010267A (en) * | 2019-04-30 | 2019-07-12 | 深圳市卓汉材料技术有限公司 | A kind of high heat-conductivity conducting elastomer |
| CN210047155U (en) * | 2019-06-05 | 2020-02-11 | 宁波石墨烯创新中心有限公司 | Three-dimensional network heat conduction structure and electronic equipment |
| CN210671097U (en) * | 2019-09-02 | 2020-06-02 | 深圳市傲川科技有限公司 | Radiating gasket and electronic component |
| CN213187044U (en) * | 2020-10-29 | 2021-05-11 | 西安易朴通讯技术有限公司 | Heat dissipation device and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114362841A (en) * | 2021-12-13 | 2022-04-15 | 深圳市卓汉材料技术有限公司 | Passive intermodulation test fixture and passive intermodulation test system |
| CN114362841B (en) * | 2021-12-13 | 2023-12-15 | 深圳市卓汉材料技术有限公司 | Passive intermodulation test jig and passive intermodulation test system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113395875B (en) | 2022-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6707671B2 (en) | Power module and method of manufacturing the same | |
| US20090103267A1 (en) | Electronic assembly and method for making the electronic assembly | |
| CN105742252B (en) | A kind of power module and its manufacturing method | |
| CN107249283B (en) | A kind of mobile terminal | |
| JP2013519987A (en) | Radiator and electrical energy storage | |
| CN210781834U (en) | High-heat-conductivity silicon-carbon composite buffering radiating fin | |
| EP2020683A1 (en) | Semiconductor device and method for manufacturing same | |
| CN107396592B (en) | Terminal device and heat radiation structure thereof | |
| KR101693159B1 (en) | Heat absorbing and/or thermally insulating composition | |
| CN113395875B (en) | Heat conducting component | |
| JP3233006U (en) | Heat dissipation device | |
| US20030178174A1 (en) | Thermal pouch interface | |
| CN107249284B (en) | A kind of mobile terminal | |
| CN216357907U (en) | Electronic equipment | |
| CN110379783A (en) | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance | |
| CN101319775B (en) | High thermal conductivity flexible sealant of power type LED lamp | |
| CN212064711U (en) | Heat dissipation circuit board and display device | |
| CN107249285B (en) | A kind of mobile terminal | |
| CN214102138U (en) | Composite heat-conducting gasket | |
| CN216775160U (en) | Electronic equipment heat dissipation shell subassembly | |
| CN219114932U (en) | Single-sided adhesive heat-conducting silica gel sheet | |
| CN220420327U (en) | VPX cold-conducting device and machine cage | |
| CN213327431U (en) | Silica gel insulating pad | |
| CN110098153A (en) | Electric power electronic module and the method for manufacturing electric power electronic module | |
| JP2015122430A (en) | Electronic apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 3001, Unit 1, Building 1, Lechuanghui Building, No. 1211 Guihua Community Sightseeing Road, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province, 518110 Patentee after: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. Address before: 518109 Room 501, building a11, silicon valley power and intelligent terminal Industrial Park, No. 20, Dafu Industrial Zone, Guanlan street, Longhua District, Shenzhen, Guangdong Province Patentee before: SHENZHEN JOHAN MATERIAL TECH. Co.,Ltd. |