CN113394239A - 图像传感器、指纹识别模组及电子装置 - Google Patents
图像传感器、指纹识别模组及电子装置 Download PDFInfo
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- CN113394239A CN113394239A CN202110505855.XA CN202110505855A CN113394239A CN 113394239 A CN113394239 A CN 113394239A CN 202110505855 A CN202110505855 A CN 202110505855A CN 113394239 A CN113394239 A CN 113394239A
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- 238000009792 diffusion process Methods 0.000 claims abstract description 80
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 230000003071 parasitic effect Effects 0.000 claims description 45
- 230000000694 effects Effects 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
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Priority Applications (1)
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CN202110505855.XA CN113394239B (zh) | 2021-05-10 | 2021-05-10 | 图像传感器、指纹识别模组及电子装置 |
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CN202110505855.XA CN113394239B (zh) | 2021-05-10 | 2021-05-10 | 图像传感器、指纹识别模组及电子装置 |
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CN113394239A true CN113394239A (zh) | 2021-09-14 |
CN113394239B CN113394239B (zh) | 2023-08-18 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023039840A1 (zh) * | 2021-09-17 | 2023-03-23 | 迪克创新科技有限公司 | 比较器及相关图像传感器及电子装置 |
Citations (12)
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JP2006261411A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | フォトダイオード領域を埋め込んだイメージセンサ及びその製造方法 |
JP2008091788A (ja) * | 2006-10-04 | 2008-04-17 | Sony Corp | 固体撮像装置及びその製造方法 |
US20080283885A1 (en) * | 2007-05-14 | 2008-11-20 | Magnachip Semiconductor, Ltd. | Small pixel for CMOS image sensors with vertically integrated set and reset diodes |
EP2234387A1 (en) * | 2009-03-24 | 2010-09-29 | Sony Corporation | Solid-state imaging device, driving method of solid-state imaging device, and electronic apparatus |
US20140022427A1 (en) * | 2012-07-23 | 2014-01-23 | Sony Corporation | Solid state imaging apparatus, signal reading method, and electronic apparatus |
US20150288900A1 (en) * | 2014-04-08 | 2015-10-08 | Samsung Electronics Co., Ltd. | Linear-Logarithmic Image Sensors and Electronic Devices Including the Same |
CN205142377U (zh) * | 2014-11-26 | 2016-04-06 | 半导体元件工业有限责任公司 | 成像***与图像传感器像素 |
US20160150174A1 (en) * | 2014-11-25 | 2016-05-26 | Semiconductor Components Industries, Llc | Image sensor pixels having built-in variable gain feedback amplifier circuitry |
CN108270981A (zh) * | 2017-12-19 | 2018-07-10 | 思特威电子科技(开曼)有限公司 | 像素单元及其成像方法和成像装置 |
CN110313068A (zh) * | 2018-10-09 | 2019-10-08 | 深圳市汇顶科技股份有限公司 | 动态电荷域取样的图像传感器 |
US20190327438A1 (en) * | 2018-04-24 | 2019-10-24 | SK Hynix Inc. | Ramp signal generator and cmos image sensor using the same |
CN111757026A (zh) * | 2020-08-05 | 2020-10-09 | 锐芯微电子股份有限公司 | 图像传感器像素结构 |
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2021
- 2021-05-10 CN CN202110505855.XA patent/CN113394239B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006261411A (ja) * | 2005-03-17 | 2006-09-28 | Fujitsu Ltd | フォトダイオード領域を埋め込んだイメージセンサ及びその製造方法 |
JP2008091788A (ja) * | 2006-10-04 | 2008-04-17 | Sony Corp | 固体撮像装置及びその製造方法 |
US20080283885A1 (en) * | 2007-05-14 | 2008-11-20 | Magnachip Semiconductor, Ltd. | Small pixel for CMOS image sensors with vertically integrated set and reset diodes |
EP2234387A1 (en) * | 2009-03-24 | 2010-09-29 | Sony Corporation | Solid-state imaging device, driving method of solid-state imaging device, and electronic apparatus |
US20140022427A1 (en) * | 2012-07-23 | 2014-01-23 | Sony Corporation | Solid state imaging apparatus, signal reading method, and electronic apparatus |
US20150288900A1 (en) * | 2014-04-08 | 2015-10-08 | Samsung Electronics Co., Ltd. | Linear-Logarithmic Image Sensors and Electronic Devices Including the Same |
US20160150174A1 (en) * | 2014-11-25 | 2016-05-26 | Semiconductor Components Industries, Llc | Image sensor pixels having built-in variable gain feedback amplifier circuitry |
CN205142377U (zh) * | 2014-11-26 | 2016-04-06 | 半导体元件工业有限责任公司 | 成像***与图像传感器像素 |
CN108270981A (zh) * | 2017-12-19 | 2018-07-10 | 思特威电子科技(开曼)有限公司 | 像素单元及其成像方法和成像装置 |
US20190327438A1 (en) * | 2018-04-24 | 2019-10-24 | SK Hynix Inc. | Ramp signal generator and cmos image sensor using the same |
CN110313068A (zh) * | 2018-10-09 | 2019-10-08 | 深圳市汇顶科技股份有限公司 | 动态电荷域取样的图像传感器 |
CN111757026A (zh) * | 2020-08-05 | 2020-10-09 | 锐芯微电子股份有限公司 | 图像传感器像素结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023039840A1 (zh) * | 2021-09-17 | 2023-03-23 | 迪克创新科技有限公司 | 比较器及相关图像传感器及电子装置 |
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CN113394239B (zh) | 2023-08-18 |
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