CN113314942A - Power-on device of laser component - Google Patents
Power-on device of laser component Download PDFInfo
- Publication number
- CN113314942A CN113314942A CN202110571004.5A CN202110571004A CN113314942A CN 113314942 A CN113314942 A CN 113314942A CN 202110571004 A CN202110571004 A CN 202110571004A CN 113314942 A CN113314942 A CN 113314942A
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- Prior art keywords
- positive
- laser
- circuit board
- supporting seat
- power
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000523 sample Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention discloses a power-up device of a laser component, which is used for powering up the laser component in the laser processing process and comprises a supporting seat, a circuit board, positive and negative electrodes and a plurality of positive and negative conductive pieces; the bottom of the supporting seat is provided with a groove, the groove is matched with the shape of the laser component, and the supporting seat covers the laser component; the circuit board is fixedly arranged on the supporting seat, the positive and negative electrodes are arranged at one end of the supporting seat, the circuit board is provided with leads connected with the positive and negative electrodes, and the positive and negative conductive pieces are respectively electrically connected with the positive and negative electrodes through the leads; the number of pairs of positive and negative conductive pieces is consistent with the number of rows of tube cores on the laser assembly, each positive and negative conductive piece is respectively connected with the tube cores at the head and tail ends of each row of tube cores, and the tube cores in each row are connected in series. The power-up device can realize the continuous and stable power-on of the laser tube core, shortens the processing flow of the laser, saves the manufacturing cost, has simple structure and is easy to assemble on the laser.
Description
Technical Field
The invention belongs to the technical field of laser manufacturing, and particularly relates to a power-on device of a laser assembly.
Background
During the laser machining manufacturing process, the laser needs to be powered up to realize the detection and use of the laser. The conventional laser is powered up in a pin power-up mode, namely, the pin of the laser is connected with the electrode strip, the electrode strip is connected with the tube core of the laser through a gold wire, and then the pin of the laser is connected with power supply equipment to realize the power-on of the tube core of the laser.
However, in the subsequent processing of the laser, the gold wire is easily damaged and broken, and the damaged gold wire needs to be removed and then bonded again, which results in complex processing procedure and high manufacturing cost of the laser.
Disclosure of Invention
In view of the above, the present invention discloses a power up device for a laser assembly to overcome or at least partially solve the above problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention discloses a power-up device of a laser component, which is used for powering up the laser component in the laser processing process and comprises a supporting seat, a circuit board, positive and negative electrodes and a plurality of positive and negative conductive pieces;
the bottom of the supporting seat is provided with a groove, the groove is matched with the shape of the laser assembly, and the supporting seat covers the laser assembly;
the circuit board is fixedly arranged on the supporting seat, the positive and negative electrodes are arranged at one end of the supporting seat, a lead is arranged on the circuit board and is connected with the positive and negative electrodes, and the positive and negative conductive parts are respectively electrically connected with the positive and negative electrodes through the lead;
the number of pairs of the positive and negative conductive pieces is consistent with the number of rows of the tube cores on the laser assembly, each positive and negative conductive piece is respectively connected with the tube cores at the head and tail ends of each row of the tube cores, and the tube cores in each row are connected in series.
Furthermore, through holes corresponding to the positions are respectively arranged on the supporting seat and the circuit board, and the positive and negative conductive pieces can detachably penetrate through the through holes to be combined with the tube core.
Further, the power-up device further comprises an electrode cover plate;
the electrode cover plate is fixed at the end part of one end of the positive and negative electrodes on the supporting seat, and the electrode cover plate and the supporting seat are clamped and fixed with the positive and negative electrodes.
Further, the positive and negative conductive pieces are probes.
Further, the circuit board is a PCB circuit board.
Furthermore, a plurality of first screw holes are uniformly formed in the circuit board, and the circuit board is fixed on the supporting seat through the first screw holes and the screws.
Further, the circuit board is fixed on the supporting seat through gluing.
Furthermore, a plurality of second screw holes are formed in two ends of the supporting seat, and the supporting seat is fixed on the laser assembly through the second screw holes and screws.
Furthermore, a plurality of third screw holes are formed in the electrode cover plate, and the electrode cover plate is fixed to the supporting seat through the third screw holes.
Further, the supporting seat and the electrode cover plate are subjected to deburring and sharp-edge obtuse-angle chamfering.
The invention has the advantages and beneficial effects that:
in the power-up device, one end of the positive and negative conductive elements is directly jointed with the laser tube core, and the other end is connected with an external power supply through the circuit board and the positive and negative electrodes, so that the laser tube core can be continuously and stably electrified, the condition that a wire is damaged in the subsequent processing process of the laser is avoided, the processing flow of the laser is shortened, the manufacturing cost is saved, and the power-up device has a simple structure and is easy to assemble on the laser.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a perspective view of a power device according to an embodiment of the present invention;
FIG. 2 is a left side view of a power up device in an embodiment of the present invention;
FIG. 3 is a rear view of a power up device in an embodiment of the present invention;
FIG. 4 is a top view of a power up device in an embodiment of the invention.
In the figure: 1. a supporting seat; 2. a circuit board; 3. positive and negative electrodes; 4. positive and negative conductive members; 5. an electrode cover plate; 6. a first screw hole; 7. a second screw hole; 8. and a third screw hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and fully with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In one embodiment of the present invention, a power-up device for a laser module is disclosed, the power-up device is used for powering up the laser module in a laser processing process, as shown in fig. 1-4, the power-up device comprises a supporting base 1, a circuit board 2, positive and negative electrodes 3 and a plurality of pairs of positive and negative conductive members 4. Wherein, the supporting seat 1 is made of insulating material.
The bottom of supporting seat 1 is provided with the recess, and the recess makes supporting seat 1 stably cover on the laser instrument subassembly with the shape adaptation of laser instrument subassembly, realizes wholly adding the support of electric installation.
The circuit board 2 is fixedly arranged on the supporting seat 1, the positive and negative electrodes 3 are arranged at one end of the supporting seat 1, the circuit board 2 is provided with leads and is connected with the positive and negative electrodes 3, the positive and negative conductive pieces 4 are respectively electrically connected with the positive and negative electrodes 3 through leads, and the positive and negative electrodes 3 are electrically connected with an external power supply.
The number of pairs of positive and negative conductive pieces 4 is the same as the number of rows of die on the laser assembly, for example, when two rows of die are on the laser assembly, two pairs of positive and negative conductive pieces 4 are needed to be respectively jointed with the die at the head and tail ends of the two rows of die. The positive and negative conductive pieces 4 are respectively connected with the tube cores at the head and tail ends of each tube core, the tube cores in each tube are connected in series, and the tube cores are usually connected in series through gold wires.
The electrifying principle of the electrifying device is as follows: the current in the external power supply flows to the tube cores connected in series sequentially through the positive electrode, the circuit board and the positive conductive piece and then flows to the external power supply sequentially through the negative conductive piece, the circuit board and the negative electrode.
In summary, in the power-up device of the embodiment, one end of the positive and negative conductive elements is directly connected to the laser die, and the other end is connected to the external power supply through the circuit board and the positive and negative electrodes, so that the laser die can be continuously and stably powered on, the situation that wires are damaged in the subsequent processing process of the laser is avoided, the manufacturing cost is saved, and the power-up device is simple in structure and easy to assemble on the laser. After the laser finishes all processing procedures, the power-on device is removed, the laser can be formed only by direct routing once, and the pressing gold wire does not need to be removed and then routing is carried out again, so that the production time is saved, and the processing flow is shortened.
In one embodiment, through holes are respectively arranged on the supporting base 1 and the circuit board 2 in corresponding positions, and the positive and negative conductive pieces 4 can be detachably connected with the tube core through the through holes, so that the positive and negative conductive pieces 4 can be replaced periodically, and the service life of the power-on device is prolonged.
In one embodiment, as shown in figures 1-4, the powered device further comprises an electrode cover plate 5.
The electrode cover plate 5 is fixed at the end part of one end of the supporting seat 1, which is provided with the positive and negative electrodes 3, and the electrode cover plate 5 and the supporting seat 1 clamp and fix the positive and negative electrodes 3.
Preferably, the positive and negative conductive pieces 4 are probes, and the probes are elastic and can be tightly jointed with the die, so that the stability and the safety of the power-on of the die are improved.
In a preferred embodiment, the Circuit Board is a PCB (Printed Circuit Board) Circuit Board, which can implement the power-on insulation safety of the power-on device.
In one embodiment, as shown in fig. 1 and 4, a plurality of first screw holes 6 are uniformly formed on the circuit board 2, and the circuit board 2 is fixed on the supporting base 1 through the first screw holes 6 and screws.
In one embodiment, the circuit board 2 is fixed to the support base 1 by gluing.
In one embodiment, as shown in fig. 1-4, the supporting base 1 has a plurality of second screw holes 7 at both ends, and the supporting base 1 is fixed on the laser module through the second screw holes 7 and screws. Because the one end of supporting seat 1 is equipped with electrode cover plate 5, consequently second screw 7 runs through electrode cover plate 5, and the screw passes electrode cover plate 5 and supporting seat 1 in proper order, fixes on the laser instrument subassembly.
Preferably, as shown in fig. 1 to 4, a plurality of third screw holes 8 are formed in the electrode cover plate 5, and the electrode cover plate 5 is fixed on the support base 1 through the third screw holes 8, so that the electrode cover plate 5 and the support base 1 are firmly fixed, thereby ensuring the stability of the positive and negative electrodes 3.
In one embodiment, in order to make the outer surfaces of the support base 1 and the electrode cover plate 5 smoother, facilitate the assembly by workers, and prevent damage to the machined workpiece of the laser, the support base 1 and the electrode cover plate 5 are subjected to deburring and sharp-edged chamfering.
While the foregoing is directed to embodiments of the present invention, other modifications and variations of the present invention may be devised by those skilled in the art in light of the above teachings. It should be understood by those skilled in the art that the foregoing detailed description is for the purpose of better explaining the present invention, and the scope of the present invention should be determined by the scope of the appended claims.
Claims (10)
1. The power-on device of the laser component is characterized in that the power-on device is used for powering on the laser component in the laser processing process and comprises a supporting seat, a circuit board, positive and negative electrodes and a plurality of positive and negative conducting pieces;
the bottom of the supporting seat is provided with a groove, the groove is matched with the shape of the laser assembly, and the supporting seat covers the laser assembly;
the circuit board is fixedly arranged on the supporting seat, the positive and negative electrodes are arranged at one end of the supporting seat, a lead is arranged on the circuit board and is connected with the positive and negative electrodes, and the positive and negative conductive parts are respectively electrically connected with the positive and negative electrodes through the lead;
the number of pairs of the positive and negative conductive pieces is consistent with the number of rows of the tube cores on the laser assembly, each positive and negative conductive piece is respectively connected with the tube cores at the head and tail ends of each row of the tube cores, and the tube cores in each row are connected in series.
2. The power-up apparatus according to claim 1, wherein through holes are provided at corresponding positions on the support base and the circuit board, respectively, and the positive and negative conductive members are detachably engaged with the die through the through holes.
3. The charging device of claim 1, further comprising an electrode cover plate;
the electrode cover plate is fixed at the end part of one end of the positive and negative electrodes on the supporting seat, and the electrode cover plate and the supporting seat are clamped and fixed with the positive and negative electrodes.
4. The power-up apparatus of claim 2, wherein the positive and negative conducting members are probes.
5. A powered device according to any of claims 1-4 characterised in that the circuit board is a PCB circuit board.
6. The power-on device of claim 1, wherein a plurality of first screw holes are uniformly formed on the circuit board, and the circuit board is fixed on the supporting base through the first screw holes and screws.
7. The power-up apparatus according to claim 1, wherein the circuit board is fixed to the support base by gluing.
8. The power-on device of claim 3, wherein the supporting base has a plurality of second screw holes at two ends thereof, and the supporting base is fixed to the laser module by the second screw holes and screws.
9. The charging device according to claim 3 or 8, wherein said electrode cover plate has a plurality of third screw holes, and said electrode cover plate is fixed to said supporting base through said third screw holes.
10. The charging device of claim 3, wherein the supporting base and the electrode cover plate are processed by deburring and sharp-edged chamfering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110571004.5A CN113314942A (en) | 2021-05-25 | 2021-05-25 | Power-on device of laser component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110571004.5A CN113314942A (en) | 2021-05-25 | 2021-05-25 | Power-on device of laser component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113314942A true CN113314942A (en) | 2021-08-27 |
Family
ID=77374524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110571004.5A Pending CN113314942A (en) | 2021-05-25 | 2021-05-25 | Power-on device of laser component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113314942A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129022A (en) * | 2010-11-19 | 2011-07-20 | 无锡亮源激光技术有限公司 | Testing and ageing adapter for semiconductor laser |
| CN102646922A (en) * | 2012-04-26 | 2012-08-22 | 无锡亮源激光技术有限公司 | Tandem type semiconductor laser with circuit board |
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| CN104638510A (en) * | 2013-11-14 | 2015-05-20 | 山东浪潮华光光电子股份有限公司 | Device and method for testing and aging small stack cell of semiconductor laser |
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| US20180191130A1 (en) * | 2015-06-29 | 2018-07-05 | Hebei Hymax Optoelecttronics Inc. | Packaging structure for four-channel integrated tunable laser array chip |
| CN208314160U (en) * | 2018-04-24 | 2019-01-01 | 绍兴市上虞华腾电器有限公司 | A kind of LED lamp tube detection platform |
| CN111352024A (en) * | 2020-04-30 | 2020-06-30 | 镭神技术（深圳）有限公司 | High-power laser chip test aging clamp |
| CN211428570U (en) * | 2020-03-03 | 2020-09-04 | 大连优迅科技有限公司 | Coaxial laser coupling multichannel power supply and clamping device with refrigeration function |
| CN112240972A (en) * | 2020-09-23 | 2021-01-19 | 广东粤港澳大湾区硬科技创新研究院 | Aging test fixture |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
-
2021
- 2021-05-25 CN CN202110571004.5A patent/CN113314942A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102129022A (en) * | 2010-11-19 | 2011-07-20 | 无锡亮源激光技术有限公司 | Testing and ageing adapter for semiconductor laser |
| CN103323792A (en) * | 2012-03-19 | 2013-09-25 | 鸿富锦精密工业（深圳）有限公司 | LED light bar testing fixture |
| CN102646922A (en) * | 2012-04-26 | 2012-08-22 | 无锡亮源激光技术有限公司 | Tandem type semiconductor laser with circuit board |
| CN104638510A (en) * | 2013-11-14 | 2015-05-20 | 山东浪潮华光光电子股份有限公司 | Device and method for testing and aging small stack cell of semiconductor laser |
| US20180191130A1 (en) * | 2015-06-29 | 2018-07-05 | Hebei Hymax Optoelecttronics Inc. | Packaging structure for four-channel integrated tunable laser array chip |
| CN206057497U (en) * | 2016-09-29 | 2017-03-29 | 国网河南省电力公司电力科学研究院 | Suitable for the solid insulation electric life test device of Multi-example test |
| CN207133392U (en) * | 2017-08-31 | 2018-03-23 | 山东华光光电子股份有限公司 | A kind of semiconductor laser ageing test device |
| CN208314160U (en) * | 2018-04-24 | 2019-01-01 | 绍兴市上虞华腾电器有限公司 | A kind of LED lamp tube detection platform |
| CN211428570U (en) * | 2020-03-03 | 2020-09-04 | 大连优迅科技有限公司 | Coaxial laser coupling multichannel power supply and clamping device with refrigeration function |
| CN111352024A (en) * | 2020-04-30 | 2020-06-30 | 镭神技术（深圳）有限公司 | High-power laser chip test aging clamp |
| CN112240972A (en) * | 2020-09-23 | 2021-01-19 | 广东粤港澳大湾区硬科技创新研究院 | Aging test fixture |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
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Application publication date: 20210827 |
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