CN113310758A - Method and device for preparing microscopic test piece and recording medium - Google Patents

Method and device for preparing microscopic test piece and recording medium Download PDF

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CN113310758A
CN113310758A CN202010082608.9A CN202010082608A CN113310758A CN 113310758 A CN113310758 A CN 113310758A CN 202010082608 A CN202010082608 A CN 202010082608A CN 113310758 A CN113310758 A CN 113310758A
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test
sample
cutting
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洪世玮
李正中
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/2806—Means for preparing replicas of specimens, e.g. for microscopal analysis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/201—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials by measuring small-angle scattering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity

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Abstract

The invention provides a preparation method and a device of a microscopic test piece and a recording medium. The method comprises the following steps: capturing a test image of an object to be tested; identifying a plurality of test samples in the test image, and selecting an attention area from the test image according to an identification result; cutting the test sample in the region of interest with a laser to produce a plurality of target samples in a spaced arrangement; and cutting each target sample into a target shape by using the focused ion beam to prepare a microscopic test piece.

Description

Method and device for preparing microscopic test piece and recording medium
Technical Field
The embodiment of the disclosure relates to a method and a device for preparing a microscopic test piece and a recording medium.
Background
In semiconductor manufacturing, it is necessary to quantitatively analyze the concentration of specific elements (e.g., phosphorus, arsenic, boron, etc.) in the surface of a semiconductor device for micro-contamination, doping, ion implantation, etc., so as to control or adjust the process parameters, thereby maintaining device/epitaxial stability. For example, during the epitaxy (epitaxiy) of silicon phosphide, quantitative analysis (qualification) of phosphorus is required.
The current quantitative analysis techniques include Atom Probe Analysis (APT), Transmission Electron Microscope (TEM), etc., but when preparing a microscopic test piece for analysis, a tester needs to select a sample according to experience, and the sample needs to be subjected to various procedures such as transferring, welding, cutting, and cutting, etc., so as to prepare the microscopic test piece required for analysis.
Disclosure of Invention
The embodiment of the disclosure provides a preparation method of a microscopic test piece, which is suitable for an electronic device with a processor. The method comprises the following steps: capturing a test image of an object to be tested; identifying a plurality of test samples in the test image, and selecting a region of interest (ROI) from the test image according to an identification result; cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
An embodiment of the present disclosure provides a microscopic test piece preparation device, which includes an image capturing device, a cutting device and a processor. The image capturing device is used for capturing a test image of an object to be tested. The processor is coupled with the image capturing device, the cutting device and is configured to: identifying a plurality of test samples in the test image, and selecting an attention area from the test image according to an identification result; controlling a cutting device to cut the test sample in the region of interest using the laser to produce test samples arranged at intervals as a plurality of target samples; and controlling a cutting device to cut each target sample into a target shape by using a focused ion beam so as to prepare the microscopic test piece.
An embodiment of the present disclosure provides a computer-readable recording medium recording a program, the program being loaded by a processor to execute: capturing a test image of an object to be tested; identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result; cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
Drawings
Aspects of the disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that, according to standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
Fig. 1 is a block diagram of a microscope test piece device according to an embodiment of the disclosure.
Fig. 2 is a flowchart illustrating a method for preparing and analyzing a microscopic test piece according to an embodiment of the present disclosure.
Fig. 3A and 3B are diagrams illustrating examples of identifying a test sample and selecting a region of interest according to an embodiment of the disclosure.
Fig. 4 is an example of a method for preparing a microscopic test piece according to an embodiment of the present disclosure.
Fig. 5 is an example of a method for preparing a microscopic test piece according to an embodiment of the present disclosure.
Fig. 6 is an example of a mask pattern determination method according to an embodiment of the disclosure.
Fig. 7 is a block diagram of a microscope test piece device according to an embodiment of the disclosure.
Fig. 8 is a flowchart illustrating a method for preparing and analyzing a microscopic test strip according to an embodiment of the present disclosure.
Fig. 9 is an example of a method for preparing a microscopic test piece according to an embodiment of the present disclosure.
The reference numbers illustrate:
10. 70: microscopic test piece device
12. 72: image capturing device
14. 74: cutting device
16: cutting device
18. 82: processor with a memory having a plurality of memory cells
30: image forming method
32. 34: assembly
40. 50, 90: semiconductor chip
42. 52, 92: test specimen
44. 56: cylindrical sample
46. 58: needle point shaped sample
54: mask and method for manufacturing the same
78: cleaning device
80: transfer device
S202 to S208, S802 to S812: step (ii) of
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these components and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features such that the first and second features may not be in direct contact. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Furthermore, for ease of description, spatially relative terms such as "below …," "below …," "lower," "above …," "upper," and the like may be used herein to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 is a block diagram of a microscope test piece device according to an embodiment of the disclosure. Referring to fig. 1, a microscope test piece device 10 of the present embodiment includes an image capturing device 12, a cutting device 14, a cutting device 16, and a processor 18 coupled to the image capturing device 12, the cutting device 14, and the cutting device 16, and its functions are as follows:
the image capturing device 12 is a microscopic observation device such as a Transmission Electron Microscope (TEM) or a Scanning Electron Microscope (SEM), and projects the accelerated and focused Electron beam onto the object to be measured or scans the surface of the object to be measured in a direction perpendicular to the semiconductor device region and parallel to the gate electrode, or in a direction perpendicular to the gate electrode and parallel to the semiconductor device region, or in any direction, to generate an image of the surface of the object, and the resolution of the image capturing device can reach 0.1 nm, for example. The object to be detected is, for example, a Static Random Access Memory (SRAM), a logic circuit, an Integrated Fan-out (InFO) structure, a Fin Field-effect transistor (FinFET), or other components, or an object to be detected or analyzed by a Thermal Conductivity Detector (TCD), an RO, a directional Circular dichrograph (OCD), a line-width Small-Angle X-ray scatterometer (CD-Small Angle X-ray scatterometer, CD-SAXS), and the size of the object to be detected is, for example, a square nanometer to a square centimeter at a wafer level, and 1 inch to 15 inches at a chip or wafer level, but is not limited thereto.
The cutting device 14 is, for example, a laser cutter dedicated to cutting a wafer or a die, and focuses a very short pulse (picosecond or femtosecond) laser beam having a focused beam diameter as small as 1 to 5 μm on a semiconductor material, for example, to cut a silicon wafer. In some embodiments, the cutting device 14 is used to directly cut the sample (e.g., die) and its support (e.g., substrate) on the silicon wafer.
The cutting device 16 is, for example, a focused ion beam system, which cuts the test sample from top to bottom by using a high-energy gallium ion beam (or helium ion beam, neon ion beam) to produce a nanostructure. The cutting device 16 cuts the test sample into a desired shape (e.g., a needle tip shape) by masking the focused ion beam with a patterned ion beam mask (mask) to retain the masked portion of the test sample and remove the unmasked portion. In one embodiment, the mask is patterned, for example, in a donut (donut) shape, having an inner diameter, for example, greater than or equal to the diameter of the sample to be produced. That is, the mask can protect the sample within the inner diameter range from being cut, and only cut the sample within the inner diameter to outer diameter range.
The processor 18 is, for example, a Central Processing Unit (CPU), a programmable general purpose or special purpose microprocessor, a Digital Signal Processor (DSP), a programmable controller, an Application Specific Integrated Circuit (ASIC), a Programmable Logic Device (PLD), other similar devices, or a combination thereof, and is configured to execute instructions stored in a computer readable recording medium such as a Random Access Memory (RAM), a read-only memory (ROM), a flash memory (flash memory), or a hard disk to implement the microscopic test piece preparation method according to the embodiment of the present disclosure.
In detail, fig. 2 is a flowchart illustrating a method for preparing and analyzing a microscopic test strip according to an embodiment of the present disclosure. Referring to fig. 1 and 2, the method of the present embodiment is applied to the microscopic test strip preparation device 10 shown in fig. 1, and the detailed steps of the method of the present embodiment are described below with reference to various components in the microscopic test strip preparation device 10.
In step S202, the processor 18 of the microscopic test strip preparation apparatus 10 captures a test image of the object to be tested by using the image capturing device 12. The test image is, for example, an SEM image of the object to be tested captured by SEM, or a microscopic image captured by other microscopic observation devices, and is not limited herein.
In step S204, the processor 18 identifies a plurality of test samples in the test image, and selects a region of interest (ROI) from the test image according to the identification result.
In some embodiments, the processor 18 identifies the test samples in the test image by using a learning model, for example, and obtains sample parameters of each test sample, and selects the test sample with the sample parameters meeting the requirements to determine the region of interest. The learning model is created by using a machine learning (machine learning) algorithm, and the learning model can learn the relationship between the sample images of the test samples and the corresponding sample parameters by inputting the sample images of the different test samples and the corresponding sample parameters. The sample parameter includes at least one of a sample yield, a sample size, or a sample shape, but is not limited thereto.
For example, fig. 3A and 3B are examples of identifying test samples and selecting a region of interest according to embodiments of the present disclosure. Referring to fig. 3A and 3B, an image 30 is a microscopic image of a Static Random Access Memory (SRAM) including a plurality of memory elements. Unlike the conventional method of manually selecting a test sample, which may select a memory device with a non-uniform surface thickness (e.g., the device 32 shown in fig. 3A), the method of the embodiment of the disclosure learns a large number of test images using a learning model, and can identify sample parameters of various test samples, thereby selecting a memory device with a uniform surface thickness (e.g., the device 34 shown in fig. 3B) as a test sample. In some embodiments, by identifying a plurality of test samples with satisfactory sample parameters in the image 30, an area including the satisfactory test samples in the image 30 can be selected as a region of interest for preparing a microscopic test piece.
In step S206, the processor 18 controls the cutting device 14 to cut the test sample in the region of interest with the laser to generate a test sample in a gap arrangement as a target sample. Specifically, unlike the method of transferring and welding the test sample to the sample support and then cutting, the method of the present embodiment directly cuts the test sample (including the protective layer on the sample surface and the substrate under the sample) in the region of interest on the test object by using the laser, so that the preparation procedure of the microscopic test piece can be simplified.
In some embodiments, the processor 18 uses a laser to cut off portions of the test sample in the region of interest, such that the test samples left after cutting are in a spaced or staggered arrangement to facilitate subsequent cutting into a particular shape. The cutting device 14 cuts the test sample into a desired shape by masking the laser with a patterned mask (mask), for example, to retain the masked portion of the test sample and remove the unmasked portion.
In some embodiments, the processor 18 further cuts each of the target samples into a specific shape suitable for subsequent cutting into a target shape, such as a cylindrical shape suitable for cutting into a needle point shape, without limitation. The cutting device 14 also uses a patterned mask to mask the laser, thereby cutting the test sample into a specific shape suitable for subsequent cutting into a target shape.
In step S208, the processor 18 controls the cutting device 16 to cut each target sample into a target shape by using the focused ion beam to prepare a microscopic test piece. The cutting device 16 cuts the target sample cut by the cutting device 14 into a desired target shape by shielding the focused ion beam with a patterned ion beam mask to retain the shielded portion of the test sample and remove the unshielded portion.
For example, fig. 4 is an example of a method for preparing a microscopic test piece according to an embodiment of the disclosure. Referring to fig. 4, the method of the present embodiment is to cut the semiconductor chip 40 by using a laser to prepare a microscopic test piece for analysis, wherein, for example, the semiconductor chip 40 is cut by using a mask with a first pattern (e.g. a rectangle with a dispersed arrangement) to obtain test samples 42 arranged at intervals, then the test samples 42 are cut into cylindrical samples 44 by using a mask with a second pattern (e.g. a circle), and finally each sample 44 is cut into a sample with a target shape (e.g. a needle-shaped sample 46 as shown in the figure) by using a focused ion beam, thereby preparing the microscopic test piece.
Fig. 5 is an example of a method for preparing a microscopic test piece according to an embodiment of the present disclosure. Referring to fig. 5, the method of the present embodiment is to cut the semiconductor chip 50 by laser to prepare a microscopic test piece for analysis, wherein, for example, a mask with a first pattern (such as a staggered chessboard pattern) is used to cut the semiconductor chip 50 to obtain staggered test samples 52. Then, the test specimen 52 is cut into cylindrical specimens 56 using a second pattern (e.g., circular) mask 54, and finally, each cylindrical specimen 56 is cut into a pin-shaped specimen 58 using a focused ion beam to prepare a microscopic test piece.
In some embodiments, the pattern of the mask 54 is determined according to the position of each test sample 52. For example, fig. 6 is an example of a method for determining a mask pattern according to an embodiment of the disclosure. Referring to fig. 6, for each test specimen 52, the pattern of the mask 54 is centered on the lower left corner of the test specimen 52 as the origin and the position after the translation (x, y). The values of x and y can be adjusted according to actual requirements (such as the relative positions of the components to be tested in the test sample), and are not limited to the positions shown in fig. 6.
In the above embodiment, the pre-learned model is used to identify the region of interest and directly perform laser processing, so that the procedure of transferring the sample to the sample support is omitted, and laser automatic cutting learning and automatic production are realized, thereby shortening the time required for preparing the microscopic test piece.
In some embodiments, after cutting the test sample with a laser, or after cutting the target sample with a focused ion beam, an etching or polishing process may be performed on the region of interest to remove surface particles generated by the laser cutting in the region of interest, and the cleaned sample may be transferred to a Transmission Electron Microscope (TEM) or the like for analysis.
For example, fig. 7 is a block diagram of a microscope test strip device according to an embodiment of the disclosure. Referring to fig. 7, the microscope test piece device 70 of the present embodiment includes an image capturing apparatus 72, a cutting apparatus 74, a transferring apparatus 76, and a processor 82 coupled to the image capturing apparatus 72, the cutting apparatus 74, the cutting apparatus 76, a cleaning apparatus 78, and the transferring apparatus 80. The types and functions of the image capturing device 72, the cutting device 74, the cutting device 76 and the processor 82 are the same as or similar to those of the image capturing device 12, the cutting device 14, the cutting device 16 and the processor 18 of the previous embodiments, and therefore the details thereof are not repeated herein.
Unlike the previous embodiments, the microscope test strip device 70 of the present embodiment additionally includes a cleaning device 78 and a transferring device 80. The cleaning device 78 is used to etch or polish the surface of the test sample to remove surface particles generated by laser cutting. The etching process includes a dry or wet etching process, and the polishing process includes an electrode polishing process, which is not limited herein. The transfer device 80 is, for example, a Micromanipulator (Micromanipulator), and can transfer the cut and cleaned sample to a microscopic observation device such as a Transmission Electron Microscope (TEM) for observation.
In detail, fig. 8 is a flowchart illustrating a method for preparing and analyzing a microscopic test strip according to an embodiment of the present disclosure. Referring to fig. 7 and 8, the method of the present embodiment is applied to the microscopic test piece preparation device 70 shown in fig. 7, and the detailed steps of the method of the present embodiment are described below with reference to various components in the microscopic test piece preparation device 70.
In step S802, the processor 82 of the microscopic test strip preparation apparatus 70 captures a test image of the object to be tested by using the image capturing device 72.
In step S804, the processor 82 identifies a plurality of test samples in the test image, and selects a region of interest from the test image according to the identification result.
In step S806, the processor 82 controls the cutting device 74 to cut the test sample in the region of interest with the laser to generate the test sample having a specific shape and arranged at intervals as a plurality of target samples. In some embodiments, the processor 82 controls the cutting device 74 to cut the test samples in the area of interest to produce a spaced array of test samples, and controls the cutting device 74 to cut each test sample into a particular shape.
In step S808, the processor 82 controls the cleaning device 78 to perform an etching or polishing process on the region of interest to remove surface particles from the region of interest.
In step S810, the processor 82 controls the cutting device 76 to cut the test sample into a desired shape using the focused ion beam.
In step S812, the processor 82 controls the transfer device 80 to transfer each of the cut test samples as a microscopic test piece for analysis.
In some embodiments, the processor 82 controls the transfer device 80 to transfer the cut test sample to a microscopic observation device such as a transmission electron microscope or other carrier for subsequent observation and analysis.
For example, fig. 9 is an example of a method for preparing a microscopic test piece according to an embodiment of the disclosure. Referring to fig. 9, the method of the present embodiment is to cut a semiconductor chip 90 by using a laser to prepare a microscopic test piece for analysis, wherein, for example, a mask with a sheet pattern is used to cut the semiconductor chip 90 to obtain a test sample 92 with a sheet shape and a gap arrangement, then the test sample 92 is cleaned by a cleaning device, the test sample is subjected to detail cutting by a focused ion beam, and finally the cut test sample 92 is transferred to a Transmission Electron Microscope (TEM) by a transfer device to be used as a microscopic test piece for analysis.
By the method, the present disclosure provides the following advantages: (1) automatically identifying a sample and selecting an attention area through a pre-established learning model, and realizing automatic laser cutting learning and automatic production; (2) the laser cutting is used to replace the focused ion beam cutting process, thereby simplifying the cutting process and shortening the time required for preparing the microscopic test piece.
According to some embodiments, a method for preparing a microscopic test piece is provided, which is suitable for an electronic device with a processor. The method comprises the following steps: capturing a test image of an object to be tested; identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result; cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
According to some embodiments, a microscopic test piece preparation device is provided, which includes an image capturing apparatus, a cutting apparatus, and a processor. The image capturing device is used for capturing a test image of an object to be tested. The processor is coupled with the image capturing device, the cutting device and is configured to: identifying a plurality of test samples in the test image, and selecting an attention area from the test image according to an identification result; controlling a cutting device to cut the test sample in the region of interest using the laser to produce test samples arranged at intervals as a plurality of target samples; and controlling a cutting device to cut each target sample into a target shape by using a focused ion beam so as to prepare the microscopic test piece.
According to some embodiments, there is provided a computer-readable recording medium recording a program, the program being loaded by a processor to execute: capturing a test image of an object to be tested; identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result; cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.

Claims (10)

1. A method for preparing a microscopic test piece suitable for an electronic device with a processor, the method comprising the steps of:
capturing a test image of an object to be tested;
identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result;
cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and
and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
2. The method of claim 1, wherein identifying the test sample in the test image and selecting the region of interest from the test image according to the identification comprises:
identifying the test samples in the test image by using a learning model and obtaining sample parameters of each test sample so as to select the test sample with the sample parameters meeting requirements to determine the region of interest, wherein
The learning model is established by utilizing a machine learning algorithm and learns the relation between the sample images of the different test samples and the corresponding sample parameters, wherein the sample parameters comprise at least one of the sample yield, the sample size or the sample shape.
3. The method of claim 1, wherein cutting the test sample in the region of interest with a laser to produce the test sample in a gap arrangement as a plurality of target samples comprises:
cutting the test sample in the region of interest to produce the staggered test sample as a plurality of target samples.
4. The method of claim 1, wherein after cutting the test sample in the region of interest with a laser to produce the test sample in a gap arrangement as a plurality of target samples, further comprising:
cutting each of the target samples with the laser into a specific shape suitable for cutting into the target shape.
5. The method of claim 1, further comprising, after cutting each of the target samples into a target shape using a focused ion beam:
transferring each of the cut test specimens as the microscopic test piece for analysis.
6. The method of claim 1, wherein after cutting the test sample in the region of interest with a laser to produce the test sample in a gap arrangement as a plurality of target samples, further comprising:
and carrying out an etching or polishing process on the region of interest so as to remove surface particles of the region of interest.
7. A microscopic test piece preparation device comprising:
the image capturing equipment is used for capturing a test image of the object to be tested;
a cutting device;
a cutting device; and
a processor, coupled to the image capture device, the cutting device, and the cutting device, configured to:
identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result;
controlling the cutting device to cut the test sample in the region of interest with a laser to produce the test sample in a spaced arrangement as a plurality of target samples; and
and controlling the cutting device to cut each target sample into a target shape by using a focused ion beam so as to prepare the microscopic test piece.
8. The microscopic test piece preparation device according to claim 7, further comprising:
and a transfer device for transferring each of the cut test samples as the microscopic test piece for analysis.
9. The microscopic test piece preparation device according to claim 7, further comprising:
and the cleaning device is used for carrying out etching or polishing process on the region of interest so as to remove surface particles in the region of interest.
10. A computer-readable recording medium recording a program, the program being loaded by a processor to execute:
capturing a test image of an object to be tested;
identifying a plurality of test samples in the test image, and selecting a region of interest from the test image according to an identification result;
cutting the test sample in the region of interest with a laser to produce a plurality of target samples of the test sample arranged in gaps; and
and cutting each target sample into a target shape by using a focused ion beam to prepare the microscopic test piece.
CN202010082608.9A 2020-02-07 2020-02-07 Method and device for preparing microscopic test piece and recording medium Pending CN113310758A (en)

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