CN113306227B - 一种高频超低介质损耗微波陶瓷覆铜板及制备方法 - Google Patents

一种高频超低介质损耗微波陶瓷覆铜板及制备方法 Download PDF

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CN113306227B
CN113306227B CN202110579176.7A CN202110579176A CN113306227B CN 113306227 B CN113306227 B CN 113306227B CN 202110579176 A CN202110579176 A CN 202110579176A CN 113306227 B CN113306227 B CN 113306227B
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temperature
clad plate
sheet
parts
dielectric loss
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CN113306227A (zh
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陈功田
陈建
李海林
彭灿
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Chenzhou Gongtian Electronic Ceramics Technology Co ltd
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Chenzhou Gongtian Electronic Ceramics Technology Co ltd
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Abstract

本发明公开一种高频超低介质损耗微波陶瓷覆铜板及制备方法，包括有以下质量份的组分：陶瓷粉体30‑75份、聚四氟乙烯分散树脂粉25‑70份、溶剂油15‑25份、无水乙醇5‑10份；通过将陶瓷粉体填充聚四氟乙烯分散树脂粉，配以烷烃类溶剂油、适量无水乙醇，经配料、气流热混、片状挤出、轧模成片、低温烘焙和高温真空成型等工序后，获得具有超低介质损耗、稳定可调的介电常数、优良的尺寸稳定性及耐候性，并且能够满足高频的高频超低介质损耗微波陶瓷覆铜板。本发明工艺简单、环保以及可大批量工业化生产，产品性能优越具有超低介质损耗、稳定的介电常数、优良的尺寸稳定性及耐候特性等，非常适合应用于无线毫米波通信等相关设备。

Description

一种高频超低介质损耗微波陶瓷覆铜板及制备方法
技术领域
本发明涉及覆铜板领域技术，尤其是指一种高频超低介质损耗微波陶瓷覆铜板及制备方法。
背景技术
在当前5G通信材料需求愈演愈烈的情况下，信息电子产品向着高频化、高速化、高精度、高可靠性方向发展，无线毫米波通信等相关设备需求迅猛增长。聚四氟乙烯覆铜板主要以乳液和切膜为主料具有比目前国内主流碳氢类覆铜板、环氧树脂类覆铜板、PPO类覆铜板等拥有更优良的电气性能。原材料及制作过程成本高导致其应用受限，且所制的覆铜板介电常数可调范围窄、不稳定，介质损耗相对较高，低尺寸稳定性，低耐候性和低可靠性。因此，有必要提出一种新的方案对现有的覆铜板进行改进。
发明内容
有鉴于此，本发明针对现有技术存在之缺失，其主要目的是提供一种高频超低介质损耗微波陶瓷覆铜板及制备方法，其能有效解决现有之覆铜板生产成本高，介电常数可调范围窄、不稳定，介质损耗相对较高，低尺寸稳定性，低耐候性和低可靠性的问题。
为实现上述目的，本发明采用如下之技术方案：
一种高频超低介质损耗微波陶瓷覆铜板的制备方法，包括有以下质量份的组分：陶瓷粉体30-75份、聚四氟乙烯分散树脂粉25-70份、溶剂油15-25份、无水乙醇5-10份；包括有以下步骤：
（1）配料：将聚四氟乙烯分散树脂粉和陶瓷粉体分别过筛后,按上述比例混合，得到初混料；
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入溶剂油和无水乙醇，在温度45-65℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为5-25kg/次；
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为30-50℃，片状挤出模具口的温度为50-60℃；
（4）轧模成片：通过开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，开炼机温度为60℃；
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除溶剂油和无水乙醇，得到烘焙粘接片，烘焙温度为160-240℃/10min/m；
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为90-100Kpa，于料温温度为380-405℃、压力为5-15MPa、保压时间为1h的条件下完成制得。
作为一种优选方案，所述陶瓷粉体的结构为球形、球形团聚体或中空球形，陶瓷粉体的球形度≥90%，粒径为0.5-40μm。
作为一种优选方案，所述陶瓷粉体为二氧化钛、二氧化硅、钛酸钡、钛酸锶、氧化铝和稀土中的一种或几种混合物。
作为一种优选方案，所述溶剂油为无味煤油、白油、异构烷烃中的一种或几种混合物。
作为一种优选方案，所述步骤（6）中料温温度为400℃。
作为一种优选方案，所述步骤（3）的片状挤出模具的挤出口宽20cm。
作为一种优选方案，所述步骤（4）的开炼机为多辊开炼机。
一种高频超低介质损耗微波陶瓷覆铜板，由前述的高频超低介质损耗微波陶瓷覆铜板的制备方法制备而成。
本发明与现有技术相比具有明显的优点和有益效果，具体而言，由上述技术方案可知：
通过将陶瓷粉体填充聚四氟乙烯分散树脂粉，配以烷烃类溶剂油、适量无水乙醇，经配料、气流热混、片状挤出、轧模成片、低温烘焙和高温真空成型等工序后，获得具有超低介质损耗、稳定可调的介电常数、优良的尺寸稳定性及耐候性，并且能够满足高频的高频超低介质损耗微波陶瓷覆铜板；并且，本发明工艺简单、环保以及可大批量工业化生产，产品性能优越具有超低介质损耗、稳定的介电常数、优良的尺寸稳定性及耐候特性等，非常适合应用于无线毫米波通信等相关设备。
附图说明
图1是本发明之较佳实施例2的介电常数3.0随频率关系特性曲线图；
图2是本发明之较佳实施例2的介电常数3.0随温度关系特性曲线图。
具体实施方式
本发明揭示一种高频超低介质损耗微波陶瓷覆铜板的制备方法，包括有以下质量份的组分：陶瓷粉体30-75份、聚四氟乙烯分散树脂粉25-70份、溶剂油15-25份、无水乙醇5-10份；包括有以下步骤：
（1）配料：将聚四氟乙烯分散树脂粉和陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入溶剂油和无水乙醇，在温度45-65℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为5-25kg/次；喷油瓶的作用是控制加油精度及喷雾，使混合更加均匀；在循环热风下定时定量喷雾，热风目的是为使溶剂油和聚四氟乙烯分散树脂粉及陶瓷粉体分子间充分润滑混合均匀为下一步做准备，同时，无水乙醇的配入使得混合熟化时间缩短，得到的混合均匀料更加均匀充分。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为30-50℃，片状挤出模具口的温度为50-60℃。
（4）轧模成片：通过开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，开炼机温度为60℃；行业内使用纯聚四氟乙烯挤出压延制作高性能膜材最大宽幅为30厘米，圆形挤出为棒条状使压延宽幅受限，而使用挤出压延制作陶瓷填充聚四氟乙烯覆铜板瓶颈为宽幅提升和陶瓷粉如何混合完全均匀分散挤出；宽幅提升的目的是为匹配后续线路板加工厂工艺，宽幅太小导致尺寸小将增加批量生产及后续加工成本。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除溶剂油和无水乙醇，得到烘焙粘接片，烘焙温度为160-240℃/10min/m；根据所制覆铜板的介电常数不同，烘焙过程中粘接片需纵向拉升定型，速度不宜过快，且温度过高会导致胶片过干，从而使下步层压后有孔洞缺陷，温度过低会导致溶剂油挥发不完全，导致出现层压气泡或介质损耗变大剥离降低的情况。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为90-100Kpa，于料温温度为380-405℃、压力为5-15MPa、保压时间为1h的条件下完成制得；典型选用18um电解铜箔。
所述陶瓷粉体的结构为球形、球形团聚体或中空球形，陶瓷粉体的球形度≥90%，粒径为0.5-40μm；球形填料可提供更高的填充比例及优良尺寸稳定性，搭配高密度高拉升强度聚四氟乙烯分散树脂粉最高可达80%填料比，并且不同填料使用复配粒径进一步提高填料比及电气性能；以每10μm分布为例，典型复配为4:2:3:1.即10μm以下粒径占比40%、10-20μm占比20%、20-30μm占比30%、30-40μm占比10%。根据所制介电常数不同选用不同密度和拉升强度聚四氟乙烯分散树脂粉。典型相对密度2.2g/cm³ ，拉升强度为24MPa。
所述陶瓷粉体为二氧化钛、二氧化硅、钛酸钡、钛酸锶、氧化铝和稀土中的一种或几种混合物。
所述溶剂油为无味煤油、白油、异构烷烃中的一种或几种混合物。
所述步骤（6）中料温温度为400℃，温度为400℃的油压真空压机比电热压机热板温度更均匀，在一定程度上使得板材性能更加稳定，批量生产更易控制。
所述步骤（3）的片状挤出模具的挤出口宽20cm。
所述步骤（4）的开炼机为多辊开炼机，有利于宽幅的提升。
本发明还揭示一种高频超低介质损耗微波陶瓷覆铜板，其由前述的高频超低介质损耗微波陶瓷覆铜板的制备方法制备而成。
下面以多个实施例对本发明作进一步详细说明：
实施例1：
（1）配料：将50份聚四氟乙烯分散树脂粉和30份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入22份无味煤油和5份无水乙醇，在温度45℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为15kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为40℃，片状挤出模具口的温度为56℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除无味煤油和无水乙醇，得到烘焙粘接片，烘焙温度为240℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为90Kpa，于料温温度为405℃、压力为10MPa、保压时间为1h完成制得。
实施例2：
（1）配料：将25份聚四氟乙烯分散树脂粉和50份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入15份无味煤油和8份无水乙醇，在温度55℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为25kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为45℃，片状挤出模具口的温度为50℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除无味煤油和无水乙醇，得到烘焙粘接片，烘焙温度为200℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为100Kpa，于料温温度为400℃、压力为15MPa、保压时间为1h完成制得。
实施例3：
（1）配料：将68份聚四氟乙烯分散树脂粉和75份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入25份无味煤油和8份无水乙醇，在温度65℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为20kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为30℃，片状挤出模具口的温度为52℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除无味煤油和无水乙醇，得到烘焙粘接片，烘焙温度为160℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为97Kpa，于料温温度为380℃、压力为12MPa、保压时间为1h完成制得。
实施例4：
（1）配料：将70份聚四氟乙烯分散树脂粉和68份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入22份无味煤油和10份无水乙醇，在温度45℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为5kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为47℃，片状挤出模具口的温度为60℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除无味煤油和无水乙醇，得到烘焙粘接片，烘焙温度为200℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为100Kpa，于料温温度为390℃、压力为5MPa、保压时间为1h完成制得。
实施例5：
（1）配料：将40份聚四氟乙烯分散树脂粉和50份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入18份白油和6份无水乙醇，在温度55℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为18kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为50℃，片状挤出模具口的温度为52℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除白油和无水乙醇，得到烘焙粘接片，烘焙温度为180℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为93Kpa，于料温温度为388℃、压力为6MPa、保压时间为1h完成制得。
实施例6：
（1）配料：将46份聚四氟乙烯分散树脂粉和53份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入16份白油和5份无水乙醇，在温度55℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为16kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为45℃，片状挤出模具口的温度为56℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除白油和无水乙醇，得到烘焙粘接片，烘焙温度为186℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为93Kpa，于料温温度为386℃、压力为7MPa、保压时间为1h完成制得。
实施例7：
（1）配料：将48份聚四氟乙烯分散树脂粉和69份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入23份异构烷烃和8份无水乙醇，在温度58℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为23kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为43℃，片状挤出模具口的温度为54℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除异构烷烃和无水乙醇，得到烘焙粘接片，烘焙温度为198℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为93Kpa，于料温温度为396℃、压力为6MPa、保压时间为1h完成制得。
实施例8：
（1）配料：将30份聚四氟乙烯分散树脂粉和50份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入15份异构烷烃和9份无水乙醇，在温度50℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为16kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为40℃，片状挤出模具口的温度为58℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除异构烷烃和无水乙醇，得到烘焙粘接片，烘焙温度为235℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为93Kpa，于料温温度为398℃、压力为6MPa、保压时间为1h完成制得。
实施例9：
（1）配料：将65份聚四氟乙烯分散树脂粉和50份陶瓷粉体分别过筛后,按上述比例混合，得到初混料。
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入16份异构烷烃和6份无水乙醇，在温度55℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为20kg/次。
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为50℃，片状挤出模具口的温度为55℃。
（4）轧模成片：通过多辊开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，多辊开炼机温度为60℃。
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除异构烷烃和无水乙醇，得到烘焙粘接片，烘焙温度为180℃/10min/m。
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为93Kpa，于料温温度为400℃、压力为10MPa、保压时间为1h完成制得。
将上述实施例所得样品进行性能测试，测试结果如表1所示。
表1
测试方法：
1、厚度，使用厚度检测仪进行测定。
2、剥离强度，按照IPC-TM-650中2.4.8所规定的方法进行测定。
3、含铜漂锡，按照IPC-TM-650中2.6.8所规定的方法进行测定。
4、介电常数，使用SPDR(splite post dielectric resonator)法，测定1GHz和10GHz下的介电常数。
5、介质损耗，使用SPDR(splite post dielectric resonator)法，测定10GHz下的介质损耗。
6、热膨胀系数，使用IPC-TM-－650中2.4.41所规定的方法进行测定。
目前市场主流需求板材为DK3.0,本发明对应DK3.0-0.254mm基板最低损耗至0.00035，故对实施例2所得样品进行介电常数稳定性的测试，测试结果如图1和图2所示，图1证明在不同的频率下板材介电常数的稳定性，说明板材在频率中的固有稳定性,为线路设计提供便捷；图2证明在不同的温度下板材介电常数的稳定性,说明材料在较宽的温度变化范围内仍保持稳定的介电常数特性。图1和图2的曲线均通过带状线法测试所得。
根据上述结果可知，使用本发明制作的覆铜板具有高耐热性，超低介质损耗、稳定可调的介电常数、优良的尺寸稳定性及耐候特性等，能够满足高频传输***对印刷电路板不同的高要求。
以上所述，仅是本发明的较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (8)

1.一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于，包括有以下质量份的组分：陶瓷粉体30-75份、聚四氟乙烯分散树脂粉25-70份、溶剂油15-25份、无水乙醇5-10份；包括有以下步骤：
（1）配料：将聚四氟乙烯分散树脂粉和陶瓷粉体分别过筛后,按上述比例混合，得到初混料；
（2）气流热混：将步骤（1）得到的初混料倒入气流混合机中，按上述比例在喷油瓶中加入溶剂油和无水乙醇，在温度45-65℃下循环混合4h，得到混合均匀料，密封腔体内循环热气流为5-25kg/次；
（3）片状挤出：将步骤（2）得到的混合均匀料过筛倒入预压成型机中预压成圆柱型后，置于挤出机中，经加热腔体、片状基础模具口挤出宽10-30cm、厚1-5mm的可收卷胶片，加热腔体的温度为30-50℃，片状挤出模具口的温度为50-60℃；
（4）轧模成片：通过开炼机对步骤（3）得到的可收卷胶片进行一次或多次轧模成片，得到宽45-55cm、厚0.038-0.75mm的粘接片，开炼机温度为60℃；
（5）低温烘焙：将步骤（4）得到的粘接片经脱脂干燥烘箱烘焙去除溶剂油和无水乙醇，得到烘焙粘接片，烘焙温度为160-240℃/10min/m；
（6）高温真空成型：将步骤（5）得到的烘焙粘接片经裁剪后，根据所制覆铜板厚度的不同，进行叠层及双面敷铜，再通过油压真空高温压机进行热压成型，真空条件为90-100Kpa，于料温温度为380-405℃、压力为5-15MPa、保压时间为1h的条件下完成制得。
2.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述陶瓷粉体的结构为球形、球形团聚体或中空球形，陶瓷粉体的球形度≥90%，粒径为0.5-40μm。
3.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述陶瓷粉体为二氧化钛、二氧化硅、钛酸钡、钛酸锶、氧化铝和稀土中的一种或几种混合物。
4.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述溶剂油为无味煤油、白油、异构烷烃中的一种或几种混合物。
5.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述步骤（6）中料温温度为400℃。
6.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述步骤（3）的片状挤出模具的挤出口宽20cm。
7.根据权利要求1所述的一种高频超低介质损耗微波陶瓷覆铜板的制备方法，其特征在于：所述步骤（4）的开炼机为多辊开炼机。
8.一种高频超低介质损耗微波陶瓷覆铜板，其特征在于：由权利要求1-7任一项的一种高频超低介质损耗微波陶瓷覆铜板的制备方法制备而成。
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