CN113270527B - Mini-LED packaging and cooling device and method - Google Patents
Mini-LED packaging and cooling device and method Download PDFInfo
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- CN113270527B CN113270527B CN202110534321.XA CN202110534321A CN113270527B CN 113270527 B CN113270527 B CN 113270527B CN 202110534321 A CN202110534321 A CN 202110534321A CN 113270527 B CN113270527 B CN 113270527B
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- 238000001816 cooling Methods 0.000 title claims abstract description 45
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 102
- 239000000463 material Substances 0.000 claims abstract description 38
- 239000003292 glue Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 11
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 5
- 230000005484 gravity Effects 0.000 claims description 5
- 238000007605 air drying Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a Mini-LED packaging cooling device, which comprises an upper die and a lower die which are hemispherical, wherein the upper die and the lower die can be spliced in a sealing manner to form a complete sphere; a plurality of positioning grooves are arranged on the lower die in a matrix manner; the upper die is provided with a plurality of sealing plates; the peripheral side of the positioning groove is communicated with a glue overflow groove; the Mini-LED packaging cooling device also comprises a spiral water channel, a material receiving net, a water receiving tank, a water pump assembly, a heating assembly, an assembling assembly and a material moving assembly; by the adoption of the mode, the cooling process can be slowed down, the packaging glue is fully shaken up, the uniformity of the packaged fluorescent particles is greatly improved, the light emitting uniformity of a finished product Mini-LED is further improved, and the product quality is improved.
Description
Technical Field
The invention relates to the technical field of Mini-LED packaging, in particular to a device and a method for cooling a Mini-LED package.
Background
Mini-LEDs are a relatively special class of LEDs, which commonly employ a structure: the substrate is provided with an LED chip and an outer frame surrounding the LED chip, when packaging is carried out, a mixture of packaging glue and fluorescent particles is injected into the outer frame to cover the LED chip, and then cooling is carried out; the existing standing cooling processing mode has poor dispersion uniformity of fluorescent particles, and directly influences the light-emitting uniformity of a Mini-LED finished product.
Disclosure of Invention
The present invention is directed to a Mini-LED package cooling apparatus and method, which are used to solve the above-mentioned problems of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
constructing a Mini-LED packaging cooling device, wherein the Mini-LED packaging cooling device comprises an upper die and a lower die which are hemispherical, and the upper die and the lower die can be spliced in a sealing manner to form a complete sphere; a plurality of positioning grooves for placing Mini-LEDs to be packaged are arranged on the lower die in a matrix manner; the upper die is provided with a plurality of sealing plates which are in one-to-one correspondence with the positioning grooves and cover the glue injection grooves of the Mini-LEDs to be packaged; the circumferential side of the positioning groove is communicated with an annular glue overflow groove; the Mini-LED packaging cooling device further comprises a spiral water channel, a material receiving net, a water receiving box, a water pump assembly, a heating assembly, an upper mold and a lower mold, wherein the material receiving net is positioned below a lower end water outlet of the water channel, the water receiving box is positioned at the lower end of the material receiving net, the water pump assembly is used for pumping water in the water receiving box back to an upper end water inlet of the water channel, the heating assembly is used for heating the water entering the water receiving box, the upper mold and the lower mold are spliced to form a complete sphere assembling assembly, and the assembled complete sphere is placed into the material moving assembly in the upper end water inlet of the water channel.
According to the Mini-LED packaging cooling device, the material receiving net is in a strip shape, and the middle of the upper surface of the material receiving net is concave; connect the material net to be the slant setting and be close to the lower extreme delivery port one end of water course is higher.
According to the Mini-LED packaging cooling device, the air knife assembly for air-drying the complete sphere is arranged at the tail end of the material receiving net.
The Mini-LED packaging cooling device comprises a water pump, wherein the water inlet end of the water pump is communicated with a water receiving tank through a water inlet pipe, and the water outlet end of the water pump is communicated with a water inlet at the upper end of a water channel through a water outlet pipe.
The Mini-LED packaging cooling device is characterized in that a water inlet at the upper end of the water channel is connected with a receiving hopper for receiving the complete sphere.
The Mini-LED packaging and cooling device further comprises a processing table, wherein a placing groove for placing the lower die is formed in the processing table; the interior bottom of standing groove is provided with at least three first magnet that is horizontal annular distribution, wear to be equipped with on the lower mould a plurality of fore-and-aft with the adsorbed second magnet of first magnet one-to-one.
The Mini-LED packaging and cooling device is characterized in that a plurality of third magnets which correspond to the second magnets one by one are arranged on the lower surface of the upper die, and the magnetism of the third magnets is larger than that of the first magnets; the edge of the surface of one side, opposite to the upper die and the lower die, of the upper die is provided with a sealing ring, and the other side of the upper die is provided with an annular groove corresponding to the sealing ring; the second magnet is opposite to the inner hole of the sealing ring.
A Mini-LED packaging cooling method is provided according to the Mini-LED packaging cooling device, wherein the implementation method comprises the following steps:
when in processing, the Mini-LEDs to be packaged are placed on the positioning grooves on the lower die in batches for positioning, then, a mixture of the packaging glue and the fluorescent particles is injected into the glue injection groove of the Mini-LED to be packaged, then the assembly component moves the upper die to the lower die to assemble the complete sphere, then the material moving component moves the complete sphere to be placed into the water inlet at the upper end of the water channel, the force of water flow and the self gravity of the complete sphere are utilized to lead the complete sphere to fall spirally along the water channel, the complete sphere freely rolls and shakes evenly in the falling process, meanwhile, the water contacted with the complete sphere in the falling process can gradually reduce the temperature and slow down the glue cooling speed of the complete sphere, and finally the complete sphere falls on the material receiving net for blanking, and the cooling water from the water channel enters the water receiving tank, is heated by the heating assembly and is transported to the water inlet at the upper end of the water channel by the water pump assembly again to form water circulation.
The invention has the beneficial effects that: when in processing, the Mini-LEDs to be packaged are placed on the positioning grooves on the lower die in batches for positioning, then, a mixture of the packaging glue and the fluorescent particles is injected into a glue injection groove of the Mini-LED to be packaged, then the assembly component moves the upper die to the lower die to assemble the complete sphere, then the material moving component moves the complete sphere to be placed into the water inlet at the upper end of the water channel, the force of water flow and the self gravity of the complete sphere are utilized to lead the complete sphere to fall spirally along the water channel, the complete sphere freely rolls and shakes evenly in the falling process, meanwhile, the water contacted with the complete sphere in the falling process can gradually reduce the temperature and slow down the glue cooling speed of the complete sphere, and finally the complete sphere falls on the material receiving net for blanking, cooling water from the water channel enters the water receiving tank, is heated by the heating assembly and is transported to the water inlet at the upper end of the water channel again by the water pump assembly to form water circulation; by the adoption of the mode, the cooling process can be slowed down, the packaging glue is fully shaken up, the uniformity of the packaged fluorescent particles is greatly improved, the light emitting uniformity of a finished product Mini-LED is further improved, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a schematic view of an assembly structure of an upper mold and a lower mold of a Mini-LED package cooling device according to a preferred embodiment of the present invention;
fig. 2 is a schematic structural diagram of a water channel, a material receiving net, a water receiving tank and a water pump assembly of the Mini-LED package cooling device according to the preferred embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
The Mini-LED package cooling device according to the preferred embodiment of the present invention, as shown in fig. 1 and referring to fig. 2, includes an upper mold 1 and a lower mold 2 both having a hemispherical shape, wherein the upper mold 1 and the lower mold 2 are sealably spliced to form a complete sphere; a plurality of positioning grooves 20 for placing Mini-LEDs to be packaged are arranged on the lower die 2 in a matrix manner; the upper die 1 is provided with a plurality of sealing plates 10 which are in one-to-one correspondence with the positioning grooves 20 and are used for sealing the glue injection grooves of the Mini-LED to be packaged; the circumferential side of the positioning groove 20 is communicated with an annular glue overflow groove 21; the Mini-LED packaging cooling device also comprises a spiral water channel 3, a material receiving net 4 positioned below a water outlet at the lower end of the water channel 3, a water receiving tank 5 positioned at the lower end of the material receiving net 4, a water pump assembly 6 for pumping water in the water receiving tank 5 back to a water inlet at the upper end of the water channel, a heating assembly 50 for heating water entering the water receiving tank 5, an assembling assembly for assembling an upper die and a lower die to form a complete sphere, and a material moving assembly for placing the assembled complete sphere into the water inlet at the upper end of the water channel;
when in processing, the Mini-LEDs to be packaged are placed on the positioning grooves 20 on the lower die 2 in batch for positioning, then, a mixture of the packaging glue and the fluorescent particles is injected into the glue injection groove of the Mini-LED to be packaged, then the assembly component moves the upper die 1 to the lower die 2 to assemble the complete sphere, then the material moving component moves the complete sphere to be placed into the water inlet at the upper end of the water channel 3, the force of water flow and the gravity of the complete sphere are utilized to lead the complete sphere to fall spirally along the water channel, the complete sphere freely rolls and shakes evenly in the falling process, meanwhile, the water contacted with the complete sphere in the falling process can gradually reduce the temperature and slow down the cooling speed of the glue of the complete sphere, and finally the complete sphere falls on the material receiving net 4 for blanking, cooling water from the water channel 3 enters the water receiving tank 5, is heated by the heating assembly 50 and is transported to the water inlet at the upper end of the water channel 3 again by the water pump assembly 6 to form water circulation;
by adopting the method, the cooling process can be slowed down, the packaging glue is fully shaken up, the uniformity of the packaged fluorescent particles is greatly improved, the light-emitting uniformity of a finished product Mini-LED is improved, and the product quality is improved;
wherein, assemble the subassembly and move the material subassembly and all can directly adopt the manipulator to realize, the lower surface of shrouding 10 of preferred is provided with antiseized glutinous coating.
Preferably, the material receiving net 4 is strip-shaped, and the middle part of the upper surface is concave; the material receiving net 4 is obliquely arranged and one end of the material receiving net close to the lower water outlet of the water channel is higher; conveniently connect the material and most moisture of filtering.
Preferably, the tail end of the material receiving net 4 is provided with a wind knife assembly 40 for air-drying the complete sphere; the complete sphere is convenient to blow and dry, and the subsequent blanking operation is convenient to perform; preferably, the air blown out by the air duct assembly is hot air.
Preferably, the water pump assembly 6 comprises a water pump 60, the water inlet end of the water pump 60 is communicated with the water receiving tank 5 through a water inlet pipe 61, and the water outlet end of the water pump 60 is communicated with the water inlet at the upper end of the water channel 3 through a water outlet pipe 62; the device is simple in arrangement, good in integrity and low in cost.
Preferably, a receiving hopper 30 for receiving the complete sphere is connected to the water inlet at the upper end of the water channel 3; the feeding is convenient when moving the material.
Preferably, the Mini-LED package cooling device further comprises a processing table 9, and a placing groove 90 for placing a lower die is arranged on the processing table 9; at least three first magnets 91 which are distributed in a horizontal annular shape are arranged at the inner bottom of the placing groove 90, and a plurality of longitudinal second magnets 22 which are adsorbed to the first magnets 91 in a one-to-one correspondence manner are arranged on the lower die 2 in a penetrating manner; is convenient for magnetic attraction fixation and positioning.
Preferably, the lower surface of the upper die 1 is provided with a plurality of third magnets 11 corresponding to the second magnets one by one, and the magnetism of the third magnets 11 is greater than that of the first magnets 91; the edge of the surface of one side of the upper die 1, which is opposite to the edge of the surface of the lower die 2, is provided with a sealing ring 12, and the other side is provided with an annular groove 23 corresponding to the sealing ring; the second magnet 22 is opposite to the inner hole of the sealing ring 12; the magnetic attraction assembly is convenient to assemble into a complete sphere, and the sealing and the water proofing are completed in a mode of extruding the sealing ring during the assembly;
in addition, the three-layer magnet structure formed by the first magnet, the second magnet and the third magnet is reasonable and compact in structure, the complexity of material loading, positioning and material moving is greatly reduced, and the cost is reduced.
A Mini-LED packaging cooling method is realized according to the Mini-LED packaging cooling device as follows:
when in processing, the Mini-LEDs to be packaged are placed on the positioning grooves on the lower die in batches for positioning, then, a mixture of the packaging glue and the fluorescent particles is injected into the glue injection groove of the Mini-LED to be packaged, then the assembly component moves the upper die to the lower die to assemble the complete sphere, then the material moving component moves the complete sphere to be placed into the water inlet at the upper end of the water channel, the force of water flow and the self gravity of the complete sphere are utilized to lead the complete sphere to fall spirally along the water channel, the complete sphere freely rolls and shakes evenly in the falling process, meanwhile, the water contacted with the complete sphere in the falling process can gradually reduce the temperature and slow down the glue cooling speed of the complete sphere, and finally the complete sphere falls on the material receiving net for blanking, cooling water from the water channel enters the water receiving tank, is heated by the heating assembly and is transported to the water inlet at the upper end of the water channel again by the water pump assembly to form water circulation;
by the adoption of the mode, the cooling process can be slowed down, the packaging glue is fully shaken up, the uniformity of the packaged fluorescent particles is greatly improved, the light emitting uniformity of a finished product Mini-LED is further improved, and the product quality is improved.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (8)
1. A Mini-LED packaging cooling device is characterized by comprising an upper die and a lower die which are hemispherical, wherein the upper die and the lower die can be spliced in a sealing manner to form a complete sphere; a plurality of positioning grooves for placing Mini-LEDs to be packaged are arranged on the lower die in a matrix manner; the upper die is provided with a plurality of sealing plates which are in one-to-one correspondence with the positioning grooves and cover the glue injection grooves of the Mini-LEDs to be packaged; the circumferential side of the positioning groove is communicated with an annular glue overflow groove; the Mini-LED packaging cooling device further comprises a spiral water channel, a material receiving net located below a lower end water outlet of the water channel, a water receiving box located at the lower end of the material receiving net, a water pump assembly used for pumping water in the water receiving box back to an upper end water inlet of the water channel, a heating assembly used for heating the water entering the water receiving box, an assembling assembly used for splicing the upper die and the lower die to form a complete sphere, and a material moving assembly used for placing the assembled complete sphere into the upper end water inlet of the water channel.
2. The Mini-LED package cooling device according to claim 1, wherein the receiving net is strip-shaped and the middle of the upper surface is concave; connect the material net to be the slant setting and be close to the lower extreme delivery port one end of water course is higher.
3. The Mini-LED packaging and cooling device as claimed in claim 2, wherein a wind knife assembly for air-drying the complete sphere is arranged at the tail end of the material receiving net.
4. The Mini-LED package cooling device of claim 1, wherein the water pump assembly comprises a water pump, a water inlet end of the water pump is communicated with the water receiving tank through a water inlet pipe, and a water outlet end of the water pump is communicated with a water inlet at the upper end of the water channel through a water outlet pipe.
5. The Mini-LED package cooling device of claim 1, wherein a receiving hopper is connected to the water inlet at the upper end of the water channel for receiving the complete spheres.
6. The Mini-LED package cooling device according to any one of claims 1 to 5, wherein the Mini-LED package cooling device further comprises a processing table, and the processing table is provided with a placing groove for placing the lower mold; the interior bottom of standing groove is provided with at least three first magnet that is horizontal annular distribution, wear to be equipped with a plurality of fore-and-aft on the lower mould with the adsorbed second magnet of first magnet one-to-one.
7. The Mini-LED package cooling device as claimed in claim 6, wherein the lower surface of the upper mold is provided with a plurality of third magnets corresponding to the second magnets one by one, and the third magnets have a magnetic property greater than that of the first magnets; the edge of the surface of one side, opposite to the upper die and the lower die, of the upper die is provided with a sealing ring, and the other side of the upper die is provided with an annular groove corresponding to the sealing ring; the second magnet is opposite to the inner hole of the sealing ring.
8. A method for cooling a Mini-LED package according to any one of claims 1 to 7, the method comprising:
when in processing, the Mini-LEDs to be packaged are placed on the positioning grooves on the lower die in batches for positioning, then, a mixture of the packaging glue and the fluorescent particles is injected into a glue injection groove of the Mini-LED to be packaged, then the assembly component moves the upper die to the lower die to assemble the complete sphere, then the material moving component moves the complete sphere to be placed into the water inlet at the upper end of the water channel, the force of water flow and the self gravity of the complete sphere are utilized to lead the complete sphere to fall spirally along the water channel, the complete sphere freely rolls and shakes evenly in the falling process, meanwhile, the water contacted with the complete sphere in the falling process can gradually reduce the temperature and slow down the glue cooling speed of the complete sphere, and finally the complete sphere falls on the material receiving net for blanking, and the cooling water from the water channel enters the water receiving tank, is heated by the heating assembly and then is transported to the water inlet at the upper end of the water channel again by the water pump assembly to form water circulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110534321.XA CN113270527B (en) | 2021-05-17 | 2021-05-17 | Mini-LED packaging and cooling device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110534321.XA CN113270527B (en) | 2021-05-17 | 2021-05-17 | Mini-LED packaging and cooling device and method |
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| CN113270527A CN113270527A (en) | 2021-08-17 |
| CN113270527B true CN113270527B (en) | 2022-06-03 |
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Citations (6)
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| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| JP2012089755A (en) * | 2010-10-21 | 2012-05-10 | Harison Toshiba Lighting Corp | Light source device |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
| CN105161603A (en) * | 2015-10-22 | 2015-12-16 | 山东浪潮华光光电子股份有限公司 | All-dimension luminous spherical LED spot light source packaging structure and preparation method thereof |
| CN112248331A (en) * | 2020-12-21 | 2021-01-22 | 深圳市众凌泰科技有限公司 | Chip glue spreading constant-temperature turnover device and method |
| CN213208297U (en) * | 2020-08-03 | 2021-05-14 | 九江龙泰电气有限公司 | Mold for semiconductor device |
-
2021
- 2021-05-17 CN CN202110534321.XA patent/CN113270527B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012089755A (en) * | 2010-10-21 | 2012-05-10 | Harison Toshiba Lighting Corp | Light source device |
| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN104210064A (en) * | 2014-08-27 | 2014-12-17 | 广东威创视讯科技股份有限公司 | LED mold pressing molding device and molding method thereof |
| CN105161603A (en) * | 2015-10-22 | 2015-12-16 | 山东浪潮华光光电子股份有限公司 | All-dimension luminous spherical LED spot light source packaging structure and preparation method thereof |
| CN213208297U (en) * | 2020-08-03 | 2021-05-14 | 九江龙泰电气有限公司 | Mold for semiconductor device |
| CN112248331A (en) * | 2020-12-21 | 2021-01-22 | 深圳市众凌泰科技有限公司 | Chip glue spreading constant-temperature turnover device and method |
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| CN113270527A (en) | 2021-08-17 |
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