CN113260249A - Bonding equipment - Google Patents

Bonding equipment Download PDF

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Publication number
CN113260249A
CN113260249A CN202110553734.2A CN202110553734A CN113260249A CN 113260249 A CN113260249 A CN 113260249A CN 202110553734 A CN202110553734 A CN 202110553734A CN 113260249 A CN113260249 A CN 113260249A
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CN
China
Prior art keywords
bonding
driving mechanism
fixed
platform
tearing
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Granted
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CN202110553734.2A
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Chinese (zh)
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CN113260249B (en
Inventor
董丙玺
蔡永潮
王伟
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Goertek Inc
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Goertek Inc
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Priority to CN202110553734.2A priority Critical patent/CN113260249B/en
Publication of CN113260249A publication Critical patent/CN113260249A/en
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Publication of CN113260249B publication Critical patent/CN113260249B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0469Surface mounting by applying a glue or viscous material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Labeling Devices (AREA)

Abstract

The invention belongs to the technical field of electronic product assembly, and particularly relates to bonding equipment which comprises a workbench, wherein a feeding mechanism, a stripping platform, an anti-sticking transfer table and a positioning device are sequentially arranged on the workbench, and the bonding equipment also comprises a material taking mechanism for carrying materials between the feeding mechanism and the stripping platform, a tearing mechanism for stripping the materials on the stripping platform and carrying the materials to the anti-sticking transfer table, and a bonding mechanism for carrying the materials on the anti-sticking transfer table to the positioning device for bonding. A layer of flaky materials in the feeding mechanism are taken up by the taking mechanism and are conveyed to the peeling platform, after the flaky materials are fixed by the peeling platform, the single materials on the flaky materials are torn down by the tearing mechanism and are conveyed to the anti-sticking transfer platform, and then the materials are stuck to a product at the positioning device by the sticking mechanism.

Description

Bonding equipment
Technical Field
The invention belongs to the technical field of electronic product assembly, and particularly relates to bonding equipment.
Background
When assembling electronic products (such as audio), assembling flexible parts such as silicone keys and foot pads is often encountered. At present, the silica gel key is bonded on the circuit board through double faced adhesive tape, UV glue and the like, and the foot pad is bonded at the bottom of the electronic product through double faced adhesive tape, UV glue and the like.
Generally, flexible parts such as silica gel keys, foot pads and the like are manually bonded, so that the efficiency is low, and the production cost is high; and the precision of manually bonding flexible parts such as silica gel keys, foot pads and the like is low, so that the increasing production requirements cannot be met.
Disclosure of Invention
The invention aims to provide bonding equipment, which aims to solve the problem of low efficiency of manually bonding flexible parts and can improve bonding precision.
The invention discloses bonding equipment which comprises a workbench, wherein a feeding mechanism, a stripping platform, an anti-sticking transfer table and a positioning device are sequentially arranged on the workbench, and the bonding equipment also comprises a material taking mechanism, a tearing mechanism and a bonding mechanism, wherein the material taking mechanism is arranged between the feeding mechanism and the stripping platform and used for carrying materials, the tearing mechanism is used for stripping the materials on the stripping platform and carrying the materials to the anti-sticking transfer table, and the bonding mechanism is used for carrying the materials on the anti-sticking transfer table to the positioning device for bonding.
As an improvement, the feeding mechanism comprises a bin, a supporting plate arranged in the bin and a lifting driving mechanism used for driving the supporting plate to lift.
As an improvement, a feeding bracket fixed on the workbench is arranged at the side part of the storage bin, and the lifting driving mechanism is fixed on the feeding bracket; the feeding mechanism further comprises a bin translation driving mechanism fixed on the workbench, an installation plate is fixed on an output part of the bin translation driving mechanism, and the bin is detachably installed on the installation plate; and a fork body for lifting the supporting plate is fixed on the output part of the lifting driving mechanism.
As an improvement, the peeling platform comprises a flat plate, a peeling translation driving mechanism for driving the flat plate to move towards one side of the tearing mechanism, pressing claws respectively arranged at two opposite sides of the flat plate, and a pressing driving mechanism arranged corresponding to the pressing claws.
As an improvement, a mounting bracket is arranged on the output part of the peeling translation driving mechanism, the flat plate is fixed on the upper side surface of the mounting bracket, and the pressing driving mechanism is fixed on the peripheral side surface of the mounting bracket.
As an improvement, the peeling platform further comprises a peeling rotary driving mechanism fixed on the output part of the peeling translational driving mechanism, and the mounting bracket is fixed on the output part of the peeling rotary driving mechanism.
As an improvement, the material taking mechanism comprises a material taking translation driving mechanism and a material taking lifting driving mechanism fixed on an output part of the material taking translation driving mechanism, and a suction assembly is fixed on the output part of the material taking lifting driving mechanism; the tearing mechanism comprises a tearing translation driving mechanism and a tearing lifting driving mechanism fixed on an output part of the tearing translation driving mechanism, and a clamping jaw structure is fixed on the output part of the tearing lifting driving mechanism.
As an improvement, a transfer support is fixed on the workbench, a transfer driving mechanism is fixed on the transfer support, the feeding mechanism, the peeling platform and the anti-sticking transfer platform are sequentially arranged along the arrangement direction of the transfer driving mechanism, the material taking translation driving mechanism and the tearing translation driving mechanism are the transfer driving mechanism, and the material taking lifting driving mechanism and the tearing lifting driving mechanism are respectively fixed on an output part of the transfer driving mechanism.
As an improvement, the bonding mechanism comprises a bonding support, a bonding translation driving mechanism fixed on the bonding support, and a bonding lifting driving mechanism fixed on an output part of the bonding translation driving mechanism, wherein a bonding suction nozzle is arranged on the output part of the bonding lifting driving mechanism.
As an improvement, a bonding rotary driving mechanism is fixed on an output part of the bonding lifting driving mechanism, the axial direction of the bonding rotary driving mechanism is the same as the lifting direction of the bonding lifting driving mechanism, and the bonding suction nozzle is fixed on the output part of the bonding rotary driving mechanism; and a first CCD detection mechanism fixed on the workbench is arranged between the anti-sticking transfer table and the bonding mechanism.
As an improvement, a second CCD detection mechanism is provided at the positioning device, and the second CCD detection mechanism is fixed to the output portion of the bonding translation driving mechanism.
As an improvement, the positioning device comprises a positioning mechanism, a conveying mechanism and a plurality of tools, wherein the positioning mechanism is arranged at one end, away from the anti-sticking transfer table, of the bonding mechanism, and the conveying mechanism passes through the upper portion of the positioning mechanism.
As an improvement, a collecting box fixed on the workbench is arranged between the feeding mechanism and the stripping platform.
Due to the adoption of the technical scheme, the bonding equipment comprises a workbench, wherein a feeding mechanism, a stripping platform, an anti-sticking transfer platform and a positioning device are sequentially arranged on the workbench, and the bonding equipment further comprises a material taking mechanism arranged between the feeding mechanism and the stripping platform and used for carrying materials, a tearing mechanism used for stripping the materials on the stripping platform and carrying the materials to the anti-sticking transfer platform and a bonding mechanism used for carrying the materials on the anti-sticking transfer platform to the positioning device for bonding. During assembly, an operator places a plurality of layers of flaky materials into the feeding mechanism, the material taking mechanism takes up and carries a layer of flaky materials in the feeding mechanism to the stripping platform, the stripping platform fixes the flaky materials, the tearing mechanism tears down and carries a single material on the flaky materials to the anti-sticking transfer platform, and the bonding mechanism takes up and bonds the materials on the anti-sticking transfer platform to a product at the positioning device; the whole bonding process is completed by the equipment only by an operator, the bonding equipment solves the problem of low efficiency of manually bonding flexible parts, and can improve bonding precision.
Drawings
FIG. 1 is a schematic top view of a bonding apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a feeding mechanism of a bonding apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic perspective view of a tear platform of a bonding apparatus according to an embodiment of the invention;
fig. 4 is a schematic perspective view of a material taking mechanism of the bonding apparatus according to the embodiment of the invention;
FIG. 5 is an enlarged schematic view of the structure at A in FIG. 4;
fig. 6 is a schematic perspective view of a bonding mechanism of the bonding apparatus according to the embodiment of the present invention;
FIG. 7 is a schematic top view of materials to be bonded by the bonding apparatus according to the embodiment of the present invention;
10, a workbench; 20. a feeding mechanism; 21. a storage bin; 211. a base plate; 212. a side plate; 213. a handle; 214. a guide bar; 215. installing a sleeve; 22. a support plate; 23. a lift drive mechanism; 24. a fork body; 25. a feeding support; 26. a bin translation driving mechanism; 27. mounting a plate; 28. a pin; 30. stripping the platform; 31. a flat plate; 32. pressing claws; 33. a pressing drive mechanism; 34. a peeling rotation drive mechanism; 35. a peeling translation drive mechanism; 40a, a material taking mechanism; 40b, a tearing mechanism; 41. transferring the stent; 42. a transfer drive mechanism; 43. a material taking lifting driving mechanism; 44. a suction assembly; 45. a tearing lifting driving mechanism; 46. a jaw structure; 461. a compression member; 462. a claw body; 463. an extension portion; 50. an anti-sticking transfer platform; 60. a bonding mechanism; 61. bonding a bracket; 62. bonding a translation driving mechanism; 63. a lifting driving mechanism is bonded; 64. adhering a suction nozzle; 65. a rotary drive mechanism is bonded; 70a, a first CCD detection mechanism; 70b, a second CCD detection mechanism; 80. a positioning device; 81. a positioning mechanism; 82. a conveying mechanism; 83. assembling; 84. a static electricity removing device; 90. a collection box; 100. release paper; 110. a silica gel key; 120. a first guide hole; 130. a second guide hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 to 7 are schematic structural diagrams of a bonding apparatus according to an embodiment of the present invention, where fig. 1 shows a schematic top structural diagram of the bonding apparatus according to the embodiment of the present invention, fig. 2 shows a schematic perspective structural diagram of a feeding mechanism of the bonding apparatus according to the embodiment of the present invention, fig. 3 shows a schematic perspective structural diagram of a tear platform of the bonding apparatus according to the embodiment of the present invention, fig. 4 shows a schematic perspective structural diagram of a material taking mechanism of the bonding apparatus according to the embodiment of the present invention, fig. 5 shows an enlarged structural diagram at a in fig. 4, fig. 6 shows a schematic perspective structural diagram of a bonding mechanism of the bonding apparatus according to the embodiment of the present invention, and fig. 7 shows a schematic top structural diagram of a material bonded by the bonding apparatus according to the embodiment of the present invention. For the sake of convenience, only the parts relevant to the present invention are shown in the drawings.
As can be seen from fig. 1 to 7, the bonding apparatus includes a workbench 10, a feeding mechanism 20, a peeling platform 30, an anti-sticking transfer platform 50, and a positioning device 80 are sequentially disposed on the workbench 10, and further includes a material taking mechanism 40a disposed between the feeding mechanism 20 and the peeling platform 30 for conveying materials, a tearing mechanism 40b for peeling the materials on the peeling platform 30 and conveying the materials to the anti-sticking transfer platform 50, and a bonding mechanism 60, wherein the bonding mechanism 60 is used for conveying the materials on the anti-sticking transfer platform 50 to the positioning device 80 for bonding.
During assembly, an operator places a plurality of layers of sheet materials shown in fig. 7 into the feeding mechanism 20, the taking mechanism 40a takes up and carries a layer of sheet materials in the feeding mechanism 20 to the peeling platform 30, the peeling platform 30 fixes the sheet materials, the tearing mechanism 40b tears off and carries a single material on the sheet materials to the anti-sticking transfer table 50, and the bonding mechanism 60 takes up and bonds the material on the anti-sticking transfer table 50 to a product at the positioning device 80; the whole bonding process is completed by the equipment only by an operator, the bonding equipment solves the problem of low efficiency of manually bonding flexible parts, and can improve bonding precision.
The adhesive equipment provided by the embodiment of the invention is used for adhering flexible parts such as the silica gel keys and the foot pads, so that the labor can be saved, and the production cost can be reduced.
In the embodiment of the present invention, the feeding mechanism 20 includes a magazine 21, a pallet 22 disposed in the magazine 21, and a lift driving mechanism 23 for driving the pallet 22 to ascend and descend. When the lifting type multi-layer sheet material taking mechanism is used, a plurality of layers of sheet materials are placed on the supporting plate 22, after one layer of sheet materials are taken away by the material taking mechanism 40a, the lifting driving mechanism 23 drives the supporting plate 22 to ascend, the ascending height is the thickness of one layer of sheet materials at each time, the sheet materials on the uppermost layer can be located at the same height, and therefore the material taking mechanism 40a can take materials from the same position, and the material taking time can be saved.
Specifically, a loading bracket 25 fixed to the work table 10 is provided at a side portion of the hopper 21, and the elevation driving mechanism 23 is fixed to the loading bracket 25, and generally, the elevation driving mechanism 23 is an electric cylinder.
In order to further improve the working efficiency, the feeding mechanism 20 further comprises a bin translation driving mechanism 26 fixed on the workbench 10, a mounting plate 27 is fixed on an output part of the bin translation driving mechanism 26, the bin 21 is detachably mounted on the mounting plate 27, and the bin translation driving mechanism 26 is an electric cylinder; a fork 24 for lifting the pallet 22 is fixed to an output portion of the lift drive mechanism 23. After the multilayer slice material in the feed bin 21 has been got, move to one side of keeping away from promotion actuating mechanism 23 by feed bin translation actuating mechanism 26 drive feed bin 21, take off empty feed bin 21 from mounting panel 27 by operating personnel, will fill with the feed bin 21 of slice material again and install on mounting panel 27, operating personnel can load to empty feed bin 21 in, can not lead to equipment to shut down because of lacking the material, can save time, can further improve work efficiency. Usually, the mounting plate 27 is provided with pins 28 at intervals, the cartridge 21 is provided with insertion holes corresponding to the pins 28, and the cartridge 21 is mounted on the mounting plate 27 by inserting the pins 28 into the insertion holes.
The stock bin 21 comprises a bottom plate 211, a side plate 212 which is arranged on one side of the bottom plate 211 far away from the lifting driving mechanism 23 and is fixedly connected with the bottom plate 211, and a handle 213 which is arranged on the side plate 212, wherein the insertion hole is arranged on the bottom plate 211; the supporting plate 22 is slidably arranged in the storage bin 21, and a space is arranged between the supporting plate 22 and the bottom plate 211; this feed bin 21's simple structure, only be equipped with curb plate 212 in one side department moreover, can reduce the whole weight of feed bin 21, be convenient for change. Specifically, the guide rods 214 are arranged in the storage bin 21 at intervals, the mounting sleeve 215 is arranged between the guide rods 214 and the bottom plate 211, the outer diameter of the mounting sleeve 215 is larger than that of the guide rods 214, guide holes are formed in the supporting plate 22 corresponding to the guide rods 214, generally, two guide rods 214 are arranged at intervals, one guide hole is a round hole, the other guide hole is an elongated hole, the width of the elongated hole is matched with the outer diameter of the guide rods 214, and the supporting plate 22 is convenient to mount.
In the embodiment of the present invention, the peeling platform 30 includes a flat plate 31, a peeling translational driving mechanism 35 for driving the flat plate 31 to move toward the tearing mechanism 40b side, pressing claws 32 respectively provided at opposite sides of the flat plate 31, and a pressing driving mechanism 33 provided corresponding to the pressing claws 32, and typically, the peeling translational driving mechanism 35 is an electric cylinder and the pressing driving mechanism 33 is an air cylinder.
Specifically, a mounting bracket is provided on the output portion of the peeling translational drive mechanism 35, the flat plate 31 is fixed to the upper side surface of the mounting bracket, and the pressing drive mechanism 33 is fixed to the peripheral side surface of the mounting bracket.
For convenience of understanding, the structure of the sheet material and the working principle of the peeling platform 30 are described by taking a silicone key as an example:
as shown in fig. 7, the sheet material includes a release paper 100, and a plurality of silicone keys 110 adhered to the release paper 100 by a double-sided adhesive tape, wherein a first guiding hole 120 and a second guiding hole 130 are correspondingly disposed on the release paper 100, the first guiding hole 120 is a circular hole, and the second guiding hole 130 is an elongated hole. When the automatic tearing device works, a layer of sheet materials are taken out from the bin 21 by the material taking mechanism 40a and placed on the flat plate 31, the pressing claw 32 is driven by the pressing driving mechanism 33 to be pressed at the edge of the release paper 100 for fixing, the silica gel keys 110 on the release paper 100 are torn down by the tearing mechanism 40b, after a row of silica gel keys 110 are taken out, the flat plate 31 is driven by the peeling translation driving mechanism 35 to move towards one side close to the tearing mechanism 40b, so that the next row of silica gel keys 110 correspond to the tearing mechanism 40b, and all the silica gel keys 110 on the layer of sheet materials are torn down completely.
In view of the shape of the silicone key 110 shown in fig. 7, the silicone key 110 includes a main body portion and a tail portion connected to one side of the main body portion, and in order to facilitate placing more silicone keys 110 on one piece of release paper 100, the silicone key 110 is disposed at an angle of 45 degrees, so that the amount of the release paper 100 can be reduced, and the production cost can be reduced.
Specifically, the peeling platform 30 further includes a peeling rotary driving mechanism 34 fixed on the output portion of the peeling translational driving mechanism 35, and the mounting bracket is fixed on the output portion of the peeling rotary driving mechanism 34, and typically, the peeling rotary driving mechanism 34 is a pneumatic swing table or an electric swing table; during operation, the peeling rotation driving mechanism 34 drives the flat plate 31 to rotate for 45 degrees, so that the direction of the tail of the silicone key 110 is matched with the clamping direction of the tearing mechanism 40b, and the silicone key 110 can be conveniently torn off from the release paper 100 by clamping the tail.
In the embodiment of the present invention, the material taking mechanism 40a includes a material taking translation driving mechanism and a material taking lifting driving mechanism 43 fixed on the output part of the material taking translation driving mechanism, a suction assembly 44 is fixed on the output part of the material taking lifting driving mechanism 43, the material taking translation driving mechanism drives the material taking lifting driving mechanism 43, the suction assembly 44 moves to the material taking mechanism 20, the material taking lifting driving mechanism 43 drives the suction assembly 44 to descend, the suction assembly 44 sucks up a layer of sheet material, the material taking lifting driving mechanism 43 drives the suction assembly 44 to ascend, and the material taking translation driving mechanism drives the material taking lifting driving mechanism 43, the suction assembly 44 and the layer of sheet material to move to the peeling platform 30. Specifically speaking, this suction assembly 44 includes the backup pad, along the circumference interval set up a plurality of material suction nozzles of getting in the backup pad, generally, get the material suction nozzle and be provided with four, be the rectangle and install in the backup pad.
The tearing mechanism 40b includes a tearing translation driving mechanism, a tearing lift driving mechanism 45 fixed on an output portion of the tearing translation driving mechanism, and a jaw structure 46 fixed on the output portion of the tearing lift driving mechanism 45. The clamping jaw structure 46 comprises a clamping driving mechanism fixed on the output part of the tearing lifting driving mechanism 45, a pressing piece 461 is fixed on the output part of the clamping driving mechanism, the clamping jaw structure 462 fixed on the output part of the tearing lifting driving mechanism 45 is further provided, an extending part 463 extending to the lower part of the end part of the pressing piece 461 is arranged on the clamping jaw body 462, when one silica gel key 110 is torn, the tearing lifting driving mechanism 45 is driven by the tearing translation driving mechanism, the clamping jaw structure 46 moves to the corresponding silica gel key 110, the clamping jaw structure 46 is driven by the tearing lifting driving mechanism 45 to descend, the tearing lifting driving mechanism 45 is driven by the tearing translation driving mechanism, the clamping jaw structure 46 carries out micro-motion to enable the extending part 463 to be inserted between the tail part of the silica gel key 110 and the release paper 100, then the pressing piece is driven by the clamping driving mechanism to be pressed on the tail part 461 of the silica gel key 110, and the tail part of the silica gel key 110 is clamped between the pressing piece 461 and the extending part 463, the silicone key 110 can be easily torn off from the release paper 100. Specifically, a connection plate is provided at an output portion of the tearing lifting drive mechanism 45, and the gripping drive mechanism and the claw 462 are respectively fixed to the connection plate, and generally, the gripping drive mechanism is an air cylinder, and the tearing lifting drive mechanism 45 is an electric cylinder or an air cylinder; of course, the jaw structure 46 may also be a cylinder jaw.
Specifically, a transfer holder 41 is fixed to the table 10, a transfer drive mechanism 42 is fixed to the transfer holder 41, the feed mechanism 20, the peeling platform 30, and the anti-sticking relay table 50 are arranged in this order along the installation direction of the transfer drive mechanism 42, the take-out translational drive mechanism and the tear-off translational drive mechanism are the transfer drive mechanism 42, the take-out elevation drive mechanism 43 and the tear-off elevation drive mechanism 45 are fixed to the output section of the transfer drive mechanism 42, respectively, and the transfer drive mechanism 42 is usually an electric cylinder.
In the embodiment of the present invention, the anti-sticking relay table 50 includes a table body, and an anti-sticking plate made of an anti-sticking material fixed to the table body, and typically, the anti-sticking plate is fixed to the table body by bolts.
In the embodiment of the present invention, the bonding mechanism 60 includes a bonding holder 61, a bonding translation driving mechanism 62 fixed to the bonding holder 61, and a bonding elevation driving mechanism 63 fixed to an output portion of the bonding translation driving mechanism 62, and a bonding suction nozzle 64 is provided at the output portion of the bonding elevation driving mechanism 63, and usually, the bonding translation driving mechanism 62 is an electric cylinder, and the bonding elevation driving mechanism 63 is an electric cylinder or an air cylinder. During bonding, the bonding translation driving mechanism 62 drives the bonding lifting driving mechanism 63 and the bonding suction nozzle 64 to move to the anti-sticking transfer platform 50, the bonding lifting driving mechanism 63 drives the bonding suction nozzle 64 to suck up the material (the silica gel key 110) on the anti-sticking transfer platform 50, the bonding translation driving mechanism 62 drives the bonding lifting driving mechanism 63, the bonding suction nozzle 64 and the material (the silica gel key 110) to move to the positioning device 80, and the bonding lifting driving mechanism 63 drives the bonding suction nozzle 64 to descend to bond the material (the silica gel key 110) to the product at the positioning device 80.
In order to improve the bonding accuracy, a bonding rotary driving mechanism 65 is fixed to an output part of the bonding elevation driving mechanism 63, the axial direction of the bonding rotary driving mechanism 65 is the same as the elevation direction of the bonding elevation driving mechanism 63, the bonding suction nozzle 64 is fixed to the output part of the bonding rotary driving mechanism 65, and the bonding rotary driving mechanism 65 is usually a motor; a first CCD detection mechanism 70a fixed on the worktable 10 is provided between the anti-sticking transit table 50 and the bonding mechanism 60 for photographing and positioning the material sucked up by the bonding mechanism 60. The bonding rotation driving mechanism 65 drives the bonding suction nozzle 64 to rotate correspondingly according to the signal of the first CCD detecting mechanism 70a, so as to adjust the direction of the material (the silicone rubber button 110) sucked by the bonding suction nozzle 64, thereby improving the bonding precision. Generally, the second CCD detection mechanism 70b is provided at the positioning device 80 for positioning the product at the positioning device 80 by photographing, so as to further improve the bonding accuracy, and for the convenience of installation, the second CCD detection mechanism 70b is fixed at the output part of the bonding translation driving mechanism 62 and is provided at the side of the bonding elevation driving mechanism 63 close to the positioning device 80.
In the embodiment of the present invention, the positioning device 80 includes a positioning mechanism 81 provided corresponding to an end of the bonding mechanism 60 away from the anti-sticking transit table 50, a conveying mechanism 82 passing over the positioning mechanism 81, and a plurality of tools 83. The product is placed in the tooling 83, the tooling 83 filled with the product is conveyed to the positioning mechanism 81 by the conveying mechanism 82, the tooling 83 is supported by the positioning mechanism 81, the tooling 83 is limited at the positioning mechanism 81, and the material on the anti-sticking transfer table 50 is taken up and transferred to the positioning mechanism 81 by the bonding mechanism 60 and is bonded to the product in the tooling 83. Specifically, the positioning mechanism 81 includes a positioning plate and a positioning lifting driving mechanism for driving the positioning plate to lift, and a pin column for cooperating with the tool 83 is disposed on the positioning plate.
In order to facilitate subsequent assembly, a static removing device 84 is disposed below the conveying mechanism 82 and spaced from the positioning mechanism 81 for removing static electricity from the bonded product, and the static removing device 84 is typically an ion blower.
Of course, the positioning device 80 can also be implemented in a manner that the positioning device 80 is a tool seat fixed on the workbench 10, and a product is manually placed in the tool seat to take and place the product.
In the embodiment of the present invention, a collecting box 90 fixed on the workbench 10 is disposed between the feeding mechanism 20 and the peeling platform 30, the material taking translation driving mechanism drives the material taking lifting driving mechanism 43, and the suction assembly 44 takes up the release paper 100 after the material is torn off and transfers the release paper into the collecting box 90.
In the embodiment of the present invention, the bonding apparatus further includes an electric control device, and the feeding mechanism 20, the peeling platform 30, the material taking mechanism 40a, the tearing mechanism 40b, the bonding mechanism 60, and the positioning device 80 are electrically connected to the electric control device, respectively.
Generally, the electric control device includes a PLC controller, a power line, a control switch, and the like.
The above description is only exemplary of the present invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (13)

1. The utility model provides a bonding equipment, its characterized in that, includes the workstation be equipped with feed mechanism, peel off platform, antiseized transfer platform and positioner on the workstation in proper order, still including setting up feed mechanism with peel off the extracting mechanism that is used for carrying the material between the platform, be used for with peel off the material on the platform and peel off and carry to tear mechanism on the antiseized transfer platform and be used for with material on the antiseized transfer platform carries to positioner department carries out the bonding mechanism who bonds.
2. The bonding apparatus according to claim 1, wherein the feeding mechanism comprises a magazine, a pallet disposed in the magazine, and a lift driving mechanism for driving the pallet to be lifted.
3. The bonding apparatus according to claim 2, wherein a loading bracket fixed to the work table is provided at a side of the magazine, and the lift driving mechanism is fixed to the loading bracket; the feeding mechanism further comprises a bin translation driving mechanism fixed on the workbench, an installation plate is fixed on an output part of the bin translation driving mechanism, and the bin is detachably installed on the installation plate; and a fork body for lifting the supporting plate is fixed on the output part of the lifting driving mechanism.
4. The bonding apparatus according to claim 1, wherein the peeling platform comprises a flat plate, a peeling translational driving mechanism for driving the flat plate to move to one side of the tearing mechanism, pressing claws respectively arranged at two opposite sides of the flat plate, and a pressing driving mechanism arranged corresponding to the pressing claws.
5. The bonding apparatus according to claim 4, wherein a mounting bracket is provided on an output portion of the peeling translational drive mechanism, the flat plate is fixed on an upper side surface of the mounting bracket, and the pressing drive mechanism is fixed on a peripheral side surface of the mounting bracket.
6. The bonding apparatus of claim 5, wherein the peel station further comprises a peel rotational drive mechanism secured to an output of the peel translational drive mechanism, the mounting bracket being secured to the output of the peel rotational drive mechanism.
7. The bonding equipment as claimed in claim 1, wherein the material taking mechanism comprises a material taking translation driving mechanism and a material taking lifting driving mechanism fixed on an output part of the material taking translation driving mechanism, and a suction assembly is fixed on the output part of the material taking lifting driving mechanism; the tearing mechanism comprises a tearing translation driving mechanism and a tearing lifting driving mechanism fixed on an output part of the tearing translation driving mechanism, and a clamping jaw structure is fixed on the output part of the tearing lifting driving mechanism.
8. The bonding apparatus according to claim 7, wherein a transfer support is fixed to the work table, a transfer driving mechanism is fixed to the transfer support, the feeding mechanism, the peeling platform, and the anti-sticking transfer platform are sequentially arranged along an arrangement direction of the transfer driving mechanism, the material taking translation driving mechanism and the tearing translation driving mechanism are the transfer driving mechanism, and the material taking lifting driving mechanism and the tearing lifting driving mechanism are respectively fixed to an output portion of the transfer driving mechanism.
9. The bonding apparatus according to claim 1, wherein the bonding mechanism comprises a bonding support, a bonding translation driving mechanism fixed on the bonding support, and a bonding elevation driving mechanism fixed on an output part of the bonding translation driving mechanism, and a bonding suction nozzle is arranged on the output part of the bonding elevation driving mechanism.
10. The bonding apparatus according to claim 9, wherein a bonding rotation driving mechanism is fixed to an output portion of the bonding elevation driving mechanism, an axial direction of the bonding rotation driving mechanism is the same as an elevation direction of the bonding elevation driving mechanism, and the bonding suction nozzle is fixed to the output portion of the bonding rotation driving mechanism; and a first CCD detection mechanism fixed on the workbench is arranged between the anti-sticking transfer table and the bonding mechanism.
11. The bonding apparatus according to claim 10, wherein a second CCD detection mechanism is provided at the positioning device, the second CCD detection mechanism being fixed to an output of the bonding translation drive mechanism.
12. The bonding apparatus according to claim 1, wherein the positioning device comprises a positioning mechanism disposed at an end of the bonding mechanism away from the anti-sticking transfer table, a conveying mechanism passing over the positioning mechanism, and a plurality of tools.
13. The bonding apparatus according to claim 1, wherein a collection box fixed to the work table is provided between the feed mechanism and the peeling platform.
CN202110553734.2A 2021-05-20 2021-05-20 Bonding equipment Active CN113260249B (en)

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Application Number Priority Date Filing Date Title
CN202110553734.2A CN113260249B (en) 2021-05-20 2021-05-20 Bonding equipment

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Application Number Priority Date Filing Date Title
CN202110553734.2A CN113260249B (en) 2021-05-20 2021-05-20 Bonding equipment

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Publication Number Publication Date
CN113260249A true CN113260249A (en) 2021-08-13
CN113260249B CN113260249B (en) 2022-11-25

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