CN113206025A - Mounting device for electronic component - Google Patents

Mounting device for electronic component Download PDF

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Publication number
CN113206025A
CN113206025A CN202110117011.8A CN202110117011A CN113206025A CN 113206025 A CN113206025 A CN 113206025A CN 202110117011 A CN202110117011 A CN 202110117011A CN 113206025 A CN113206025 A CN 113206025A
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CN
China
Prior art keywords
electronic component
substrate
mounting
mark
imaging unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110117011.8A
Other languages
Chinese (zh)
Inventor
桥本正规
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2020214305A external-priority patent/JP2021121014A/en
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN113206025A publication Critical patent/CN113206025A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws

Abstract

The invention provides a mounting device for electronic components, which can restrain generated dust and can mount the electronic components with good precision, comprising: a mounting mechanism for mounting the electronic component on the substrate; a substrate support mechanism supporting a substrate on which electronic components are mounted; a mounting head provided in the mounting mechanism and having a transmissive portion through which a mark of the substrate can be recognized in a state where the electronic component is held; a first imaging unit which is disposed below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate, and which images a mark of the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position; a second imaging unit which is arranged above the mounting head at the mounting position and images the mark of the substrate through the transmission unit; and a positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the marks and the images of the marks photographed by the first photographing unit and the second photographing unit.

Description

Mounting device for electronic component
Technical Field
The present invention relates to an apparatus for mounting electronic components.
Background
A method of mounting a semiconductor chip (chip) as an electronic component on a substrate includes face-up (face-up) and face-down (face-down). The surface of the semiconductor chip on which the semiconductor layer is formed is referred to as a front surface (face). The front surface side is set to the side opposite to the substrate, and the mounting is performed in such a manner that the front surface faces upward. For example, when a semiconductor chip is mounted on a lead frame (lead frame) or the like, and wiring is performed between an electrode and the lead frame by a wire (wire), the mounting is performed with the front surface facing upward.
The mounting method is performed with the front side facing the substrate, i.e., with the front side facing downward. For example, when a flip chip (flip chip) connection for fixing and electrically connecting is performed by providing a bump electrode on the surface of a semiconductor layer and pressing the bump electrode against a wiring of a substrate, mounting is performed with the front surface facing downward.
When mounting electronic components such as semiconductor chips on a substrate, it is necessary to precisely position the electronic components with respect to the substrate. To cope with this problem, for example, a camera capable of simultaneously picking up images in both the vertical and horizontal directions is inserted between a mounting tool for holding an electronic component by suction and a substrate. Based on the image taken by the camera, the relative position of the substrate and the electronic part in the horizontal direction is recognized. Then, the position of the mounting tool is corrected based on the recognized relative position, and the electronic component is mounted on the substrate.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent application laid-open No. 2010-129913
Disclosure of Invention
[ problems to be solved by the invention ]
In recent years, in a three-dimensional (3D) package (package) and a hybrid bonding (hybrid bonding) in which semiconductor chips are arranged in multiple layers to improve integration, it is necessary to bond electrodes having a very narrow pitch to each other. Therefore, when mounting electronic components on a substrate, higher accuracy, for example, sub-micron order (submicron) accuracy is required. Further, when mounting, an error due to the operation of the mechanism portion for mounting or a bonding failure may be caused by dust generated by the operation, and therefore, it is preferable that the distance over which the mechanism portion operates is as short as possible.
However, in the case of using a photographing camera that can photograph both the upper and lower directions at the same time, when recognizing the relative position of the substrate and the electronic component in the horizontal direction, it is necessary to enter the camera between the substrate and the electronic component, and therefore, it is necessary to increase the separation distance between the two. Therefore, the distance of the moving electronic component becomes long after the relative position between the two is recognized. As the moving distance is longer, the risk of positional deviation in the horizontal direction is higher, and thus it is difficult to obtain high mounting accuracy. Further, since the moving distance of the mechanism portion becomes long, the amount of generated dust may become large.
The present invention has been made to solve the above-described problems, and an object thereof is to provide a mounting device for electronic components, which can suppress the amount of dust generated and can mount electronic components with high accuracy.
[ means for solving problems ]
The electronic component mounting apparatus of the present invention includes: a mounting mechanism for mounting the electronic component on the substrate; a substrate support mechanism supporting the substrate on which the electronic component is mounted; a mounting head provided to the mounting mechanism and having a transmissive portion through which a mark of the substrate can be recognized in a state where the electronic component is held; a first imaging unit that is disposed below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate, and that images a mark of the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position; a second imaging unit which is disposed above the mounting head at the mounting position and which images a mark of the substrate through the transparent unit; and a positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks captured by the first and second imaging units.
[ Effect of the invention ]
The invention provides a mounting device for electronic components, which can restrain the amount of generated dust and can mount the electronic components with good precision.
Drawings
Fig. 1 is a front view showing a schematic configuration of a mounting device according to an embodiment.
Fig. 2 is a plan view showing an electronic component and a substrate.
Fig. 3 is a plan view (a) of the mounting device and an enlarged plan view (B) of the mounting portion of fig. 3.
Fig. 4 (a) to 4 (C) are explanatory views showing a mounting process of the mounting device.
Fig. 5 is a flowchart showing an installation process of the installation device.
Fig. 6 (a) to 6 (C) are explanatory views showing a mounting method of a mounting device of another embodiment.
Fig. 7 is a flowchart showing an installation process in the form of fig. 6.
Fig. 8 (a) to 8 (C) are explanatory views showing a mounting method of a mounting device according to still another embodiment.
Fig. 9 is a flowchart showing an installation process in the form of fig. 8.
[ description of symbols ]
1: mounting device
2: substrate supporting mechanism
3: mounting mechanism
4: first photographing part
5: second photographing part
6: control device
11: supporting table
11 a: containing hole
21: carrying platform
22: driving mechanism
22a, 22b, 33a, 34a, 35 a: guide rail
23: movable board
23 a: through hole
31: mounting head
31 a: hollow part
31 b: holding part
32: driving mechanism
33. 34, 35: moving body
B: mounting area
C: electronic component
D: adsorption zone
M, M, ma: marking
OA: mounting location
S: substrate
S101 to S108, S201 to S209, S301 to S308: step (ii) of
T: transmission area
X, Y, Z: coordinate axes
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. As shown in fig. 1 and 2, the present embodiment is a mounting apparatus 1 for mounting an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of a mounting device 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. The drawings are schematic, and the specification (size) (hereinafter also referred to as size), shape, ratio of the specification of each portion, and the like may differ from the actual ones.
[ electronic Components ]
First, the electronic component C to be mounted in the present embodiment includes, for example, a semiconductor element such as an Integrated Circuit (IC) or a large-scale integrated circuit (LSI).
As shown in fig. 2, the present embodiment uses a semiconductor chip in a rectangular parallelepiped shape as the electronic component C. Each semiconductor chip is a bare chip (bare chip) that is singulated by dicing (dicing) a semiconductor wafer (wafer) into small pieces. The bare chip is provided with bump (bump) or bumpless (bump) electrodes on the exposed semiconductor, and is mounted by flip-chip connection to pads (pads) on the substrate S.
The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, two marks m are provided at each of a pair of corners that are diagonal corners of the rectangular electronic component C. The mark m is provided on the front surface of the electronic component C on which the electrode is formed. The present embodiment is an example of a device for performing front-down mounting in which the front surface is mounted to the substrate S.
[ base plate ]
In the present embodiment, as shown in fig. 2, the substrate S on which the electronic component C described above is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. The substrate S is provided with a mounting area B, which is an area where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In the present embodiment, the two marks M are provided at positions outside the mounting region B and corresponding to the marks M of the electronic component C. That is, one mounting region B is provided outside a pair of diagonal corners of the mounting region B having the same shape and the same specification as the rectangular electronic component C.
[ mounting device ]
The mounting apparatus 1 of the present embodiment is a mounting apparatus 1 capable of mounting with high accuracy, for example, mounting accuracy of ± 0.2 μm or less, and includes, as shown in fig. 1, 3 (a), and 3 (B): a substrate supporting mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, and a control device 6. Fig. 3 (a) is a plan view of the mounting device 1, and fig. 3 (B) is a plan view showing a mark M penetrating a mounting head 31 described later.
In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is defined as a Z axis, and two axes orthogonal to each other in a plane orthogonal to the Z axis are defined as an X axis and a Y axis. In the present embodiment, the Z axis is vertical, the direction following the gravity is referred to as downward, the direction resisting the gravity is referred to as upward, and the position on the Z axis is referred to as height. The X axis and the Y axis are on a horizontal plane, and the X axis is a left-right direction and the Y axis is a depth direction as viewed from the front side of fig. 1. However, the present invention is not limited to the arrangement direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as an upper side and the opposite side is referred to as a lower side with respect to the substrate S or the substrate support mechanism 2.
The substrate support mechanism 2 is a mechanism for supporting a substrate S on which electronic components C are mounted, and is a so-called substrate stage (stage). The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmission portion through which the mark M of the substrate S facing the electronic component C can be recognized in a state where the electronic component C is held.
The first imaging unit 4 is disposed below the substrate support mechanism 2 at a mounting position OA at which the mounting head 31 mounts the electronic component C on the substrate S, and images the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, that is, from below, in a state where the substrate S is retracted from the mounting position OA by the substrate support mechanism 2. The mounting position OA is a position where the electronic component C is mounted on the substrate S, and is indicated by a one-dot chain line in the direction along the Z axis passing through a point (e.g., a center point) on the XY coordinate within the region where the electronic component C is to be mounted. As described later, the mounting position OA coincides with the optical axes of the cameras of the first and second imaging units 4 and 5. The second imaging unit 5 is arranged above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transparent part of the mounting head 31 (hereinafter, this is referred to as "imaging over the mounting head 31"). The control device 6 controls the operation of the mounting device 1.
The substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark M and the mark M captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 described above is mounted on a support base 11 provided on a mounting surface. The top surface of the support table 11 is a horizontal surface. Each part will be described in detail below.
(substrate supporting mechanism)
As shown in fig. 1 and 3 (a), the substrate support mechanism 2 is disposed on the support base 11, and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-like member on which the substrate S is placed. The drive mechanism 22 is, for example, a biaxial movement mechanism having a pair of guide rails 22a in the X-axis direction and a pair of guide rails 22b in the Y-axis direction, and moving the stage 21 in a horizontal plane by a belt or a ball screw (ball screw) using a motor (not shown) as a drive source. The pair of guide rails 22a and the pair of guide rails 22b are arranged symmetrically with respect to the mounting position OA. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism that rotates and moves the stage 21 in a horizontal plane.
The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22 b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.
Further, although not shown, at one end (specifically, the moving end on the right side in the figure) of the moving ends of the stage 21 in the X-axis direction of the substrate support mechanism 2, a loader/unloader is provided which supplies/stores the substrate S to the stage 21. Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the moving end.
(mounting mechanism)
The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32. The mounting head 31 has a substantially rectangular parallelepiped shape and has a hollow portion 31a and a holding portion 31b as transmission portions. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to close the opening of the hollow portion 31a toward the substrate S side. For example, a transparent glass plate is used as the holding portion 31 b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.
As shown in fig. 3 (B), a suction region D for suction-holding the electronic component C is provided in the center of the holding portion 31B. Although not shown, suction holes are formed in the suction region D. The holding portion 31b is provided with a flow path for communicating the suction hole with a negative pressure source, and is provided so as to be capable of suction-holding the electronic component C by generating a negative pressure in the suction hole. The periphery of the suction area D of the holding portion 31b is a transmission area T through which the mark M of the substrate S can be transmitted and imaged even when the electronic component C is sucked. That is, the mounting head 31 has a transparent portion so that the mark M of the substrate S can be imaged by the second imaging part 5. The holding surface (suction surface) on which the electronic component C is held by the holding portion 31b is referred to as a lower end surface.
The drive mechanism 32 includes a moving body 33, a moving body 34, and a moving body 35, and is a mechanism that drives the mounting head 31. The movable body 33 is provided movably along a guide rail 33a in the Y-axis direction provided on the support base 11. The moving body 34 is provided movably along a guide rail 34a in the X-axis direction provided on the top surface of the moving body 33. The moving body 35 is provided movably along a guide rail 35a in the Z-axis direction provided on the front surface of the moving body 34. The moving body 35 is formed in a substantially concave shape in plan view. The movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, an air cylinder, or the like using a motor as a drive source.
The mounting head 31 is provided at a lower portion of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31b holding the mounting head 31 on the substrate S. The moving body 35 provided with the mounting head 31 is moved in the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34. Therefore, the driving mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31. Although not shown, the driving mechanism 32 includes a θ driving mechanism for rotating and moving the mounting head 31 in a horizontal plane.
In the present embodiment, it is preferable to set the movement amounts of the driving mechanism 32 in the X-axis direction, the Y-axis direction, and the Z-axis direction to be extremely short in order to prevent movement errors. For example, the moving amounts of the moving bodies 33 and 34 in the X-axis direction and the Y-axis direction are set to be several mm to ten and several mm, respectively. The amount of movement of the movable body 35 in the Z-axis direction is also set to about several mm to ten and several mm. That is, the mounting head 31 receives the electronic component C and images the mark m of the received electronic component C at a height position where the lower end surface of the holding portion 31b is at an opposing distance (vertical separation distance) of several mm, for example, 1mm to 2mm, with respect to the upper surface of the substrate S placed on the stage 21. Therefore, the amount of movement of the movable body 35 in the Z-axis direction is only required to be a movement that can ensure that at least the electronic component C held by the holding portion 31b can be mounted on the substrate S with a predetermined pressing force from the height position.
Although not shown, the mounting apparatus 1 is provided with a supply unit for the electronic component C such as a wafer stage or a tray stage, and a transfer mechanism for receiving the electronic component C from the supply unit and transferring the electronic component C to the mounting head 31 of the mounting mechanism 3.
(first imaging part)
The first imaging unit 4 includes a camera, a lens barrel, a light source, and the like, and is disposed in a housing hole 11a provided in the support base 11. The first imaging unit 4 is arranged with the optical axis of the camera in a direction in which the mark m of the electronic component C held by the mounting head 31 can be imaged. Specifically, the optical axis is arranged in a vertical direction. The first imaging unit 4 is provided so that the mark m of the electronic component C held by the mounting head 31 does not deviate from the imaging field of view within a range in which the mark m can move to the maximum. The holding position of the electronic component C delivered to the mounting head 31 is deviated. That is, the position of the electronic component C is deviated from the mounting position OA. Therefore, the position of the mark m of the electronic component C also varies. The maximum range of the deviation is a range in which the mark m of the electronic component C can move to the maximum. The first imaging unit 4 can perform imaging with a sufficient magnification and with illumination intensity of illumination by the light source or luminance necessary for position recognition in order to ensure necessary mounting accuracy. Further, the imaging range (field of view range) determined by these conditions is also considered as a range in which the marker m can move to the maximum. The first imaging unit 4 sets the center of the imaging field to a position corresponding to the mounting position OA as an initial position. The position does not change when the first imaging unit 4 is fixed or when it is movable. The first imaging unit 4 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with the movement of these.
In the present embodiment, the first imaging unit 4 is fixed to the mounting position OA of the electronic component C. That is, in the present embodiment, the first imaging unit 4 is disposed upward in the housing hole 11a of the support base 11, which is a position below the substrate support mechanism 2, in a state where the optical axis of the camera coincides with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 in such a size and positional relationship that the two marks m do not deviate from the imaging field of view even if the electronic component C is moved to the maximum for positioning. The imaging field of view of the first imaging unit 4 is set in consideration of a range in which the two marks m of the electronic component C can move to the maximum for positioning in a state where the optical axis (the center of the imaging field of view) is aligned with and fixed to the mounting position OA.
(second imaging part)
The second imaging unit 5 includes a camera, a lens barrel, a light source, and the like, and is supported by a frame or the like, not shown, above the support base 11, more specifically, above the mounting head 31, and is provided on the support base 11. The second imaging unit 5 is arranged with the optical axis of the camera in a direction that can image the mark M around the mounting region B of the substrate S through the holding unit 31B of the mounting head 31. Specifically, the optical axis is arranged in a vertical direction. The second imaging unit 5 is provided so that the mark M does not deviate from the imaging field of view within a range in which the mark M on the substrate S can move to the maximum extent through the holding unit 31 b. The supporting position of the substrate S mounted on the stage 21 is deviated. That is, the position of the substrate S is deviated from the mounting position OA. Therefore, the position of the mark M on the substrate S is also deviated. The maximum range of the deviation is a range in which the mark M of the substrate S can move to the maximum. The second imaging unit 5 can perform imaging with a sufficient magnification, and with illumination intensity of illumination by the light source or luminance required for position recognition, in order to ensure necessary mounting accuracy. Further, the imaging range (field of view range) determined by these conditions is also considered to be a range in which the marker M can move to the maximum. The second imaging unit 5 sets the center of the imaging field to a position corresponding to the mounting position OA as an initial position. The position does not change when the second photographing part 5 is fixedly provided or when it is movably provided. The second imaging unit 5 is provided separately from the mounting head 31 and the stage 21 so as not to interfere with the movement of these.
In the present embodiment, the second imaging unit 5 is disposed downward at a position directly above the mounting head 31 in a state where the optical axis (center of the imaging field of view) of the camera coincides with the mounting position OA as described above. The second imaging unit 5 is fixed to the mounting position OA of the electronic component C, similarly to the first imaging unit 4. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the range in which the two marks M marked on the mounting region B of the substrate S can move to the maximum for positioning. Therefore, the size of the transmission portion of the mounting head 31 is set in accordance with the imaging field of view of the second imaging portion 5.
Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 in the present embodiment will be described. As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of the mounting head 31 and the stage 21 so as not to interfere with the movement operations thereof. That is, the first imaging unit 4 and the second imaging unit 5 are provided on the support 11 independently of each other. Therefore, when the marks M and M are imaged or positioned, the first imaging unit 4 and the second imaging unit 5 do not move integrally with the mounting head 31 and the stage 21.
For example, the first imaging unit 4 and the second imaging unit 5 are fixed and arranged on the support 11 independently of each other. Alternatively, the first imaging unit 4 and the second imaging unit 5 include driving devices in the X-axis and Y-axis directions (horizontal direction) and driving devices in the Z-axis direction (vertical direction), and are disposed so as to be movable (movable) in the horizontal direction and the vertical direction. The movement is performed to adjust the horizontal direction position and the vertical direction position of the imaging unit 4 and the imaging unit 5 (the first imaging unit 4 and the second imaging unit 5) as operation preparation work of the apparatus, or to move between marks when imaging a plurality of marks M and M as described later.
As described above, the first imaging unit 4 and the second imaging unit 5 are provided independently and movably from the mounting head 31 and the stage 21, respectively. Therefore, the above-described immobilization with respect to the mounting position OA means that the first imaging unit 4 and the second imaging unit 5 do not move integrally with the mounting head 31 and the stage 21 when imaging the mark M or when positioning. For example, the imaging unit 4 and the imaging unit 5 are provided movably independently of the mounting head 31 and the stage 21, and the horizontal position and the vertical position of the imaging unit 4 and the imaging unit 5 are adjusted as the operation preparation work of the apparatus, which is included in the fixation to the mounting position OA. Alternatively, the first and second imaging units 4 and 5 may move between the marks to image the plurality of marks M and M while being stationary with respect to the mounting position OA.
In addition, the mounting apparatus 1 of the present embodiment is preferably configured to obtain a mounting accuracy of 0.2 μm or less. For this reason, the first imaging unit 4 and the second imaging unit 5 need to have a performance capable of performing high-magnification and high-precision imaging commensurate with the accuracy thereof.
In general, it is known that in order to capture a high-definition image, an imaging unit needs to be disposed at a position close to an electronic component C or a substrate S to be captured. Therefore, it is also preferable that the first imaging unit 4 and the second imaging unit 5 be disposed as close to the electronic component C or the substrate S as possible, that is, the imaging distance be shortened.
However, in the mounting apparatus 1 of the present embodiment, in order to reduce the amount of movement of the electronic component C to be lowered during mounting as much as possible, the mark M of the electronic component C or the mark M of the substrate S is imaged while the electronic component C is positioned at a position high enough to be close to the upper surface of the substrate S. Therefore, the stage 21 and the moving plate 23 of the drive mechanism 22 are present between the first imaging unit 4 and the electronic component C, and the mounting head 31 is present between the second imaging unit 5 and the substrate S. Accordingly, since it is necessary to avoid interference with the moving plate 23 and the mounting head 31, the distance between the first imaging unit 4 and the electronic component C and the distance between the second imaging unit 5 and the substrate S are limited.
Therefore, the present inventors studied the maximum value of the shooting distance (so-called working distance) capable of shooting an image that can achieve the mounting accuracy. As a result, it was deduced that the thickness was approximately 100mm or so. According to the above results, in the present embodiment, the first imaging unit 4 is disposed at a height position within 100mm from the imaging distance of the electronic component C without moving, and the second imaging unit 5 is disposed at a height position within 100mm from the imaging distance of the substrate S without moving.
In addition, the mounting head 31 positioned between the second imaging unit 5 and the substrate S is a member having a relatively large height dimension (dimension in the Z-axis direction) in order to ensure rigidity and the like. Therefore, it is considered that interference occurs in a general structure. Therefore, as a result of diligent research by the present inventors, it has been successful to minimize the height dimension while maintaining the functions and rigidity required for the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31 a) is about 70 mm. This allows the second imaging unit 5 to be disposed at a height of 100mm or less with respect to the substrate S.
(control device)
The control device 6 controls the positioning mechanism based on the marks M and M imaged by the first imaging unit 4 and the second imaging unit 5 so as to position the substrate S and the electronic component C. The coordinates of each of the imaging units 4 and 5 are adjusted to match the coordinates of the mounting device 1. Specifically, the control device 6 has coordinates of XY coordinates in the design of the mounting device 1, and its origin may be the mounting position OA. The coordinates of each of the imaging units 4 and 5 are set to, for example, the origin of XY coordinates as the imaging center, and are matched with the mounting position OA as information that can be mechanically or computationally obtained. Therefore, in this case, the reference position on the XY coordinates in the mounting apparatus 1 is the mounting position OA, and the imaging centers of the imaging units 4 and 5 are also the same reference position.
The coordinates of the imaging units 4 and 5 and the coordinates of the mounting device 1, which are adjusted to match each other, actually include errors in assembly of the respective parts of the device. The control device 6 stores information on the mark M, the shape of the mark M, information on design indicating the positional relationship between the electronic component C and the mark M, and information on design indicating the positional relationship between the mounting region B of the substrate S and the mark M in advance. Each of the imaging units 4 and 5 has an image recognition unit. The image recognition unit recognizes the mark M and the mark M stored in the control device 6 in advance from the captured image by a known image recognition process, and calculates the position on the coordinates as a reference of the mounting device 1. That is, the image recognition unit of the first imaging unit 4 calculates the positional information (X, Y, θ) of the electronic component C held by the mounting head 31 on the basis of the recognized mark M at the adjusted coordinates. The image recognition unit of the second imaging unit 5 similarly calculates the positional information (X, Y, θ) of the mounting area B of the substrate S placed on the stage 21 for the mark M. Such position information is calculated based on the information indicating the positional relationship between the electronic component C and the mark M and the information indicating the positional relationship between the mounting region B and the mark M, which are stored in advance in the control device 6 as described above.
The control device 6 obtains the positional information of the electronic component C and the positional information of the mounting region B calculated as described above, and the amount of deviation from the reference position (the origin of coordinates of each of the imaging units 4 and 5) and the XY axis direction, and controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32) so that the electronic component C or the substrate S is moved in the direction and by the amount of movement in which the deviation is corrected and the electronic component C coincides with the mounting region B.
[ actions ]
The operation of the present embodiment as described above will be described with reference to the explanatory views (a) to (C) of fig. 4 and the flowchart of fig. 5. In the initial state, the substrate S is delivered from the loader to the stage 21 of the substrate support mechanism 2, and is retracted from the mounting position OA which is a position facing the mounting head 31.
First, the center of the holding portion 31b of the mounting head 31 in the mounting mechanism 3 is located directly below the second imaging unit 5. That is, the center of the holding portion 31b is positioned at the mounting position OA. In this state, the transfer mechanism receives the electronic component C from a supply unit (both not shown) and transfers the electronic component C to the mounting head 31 (step S101). As shown in fig. 4a, the holding portion 31b of the mounting head 31 receives the electronic component C from the transfer mechanism, and performs suction holding by negative pressure (step S102). Since the transfer of the electronic component C to the holding portion 31b by the transfer mechanism is performed at the mounting position OA, the stage 21 is kept in a retracted state to avoid interference with the transfer mechanism at the time of transfer.
The first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 (step S103). At this time, the stage 21 is retracted from the mounting position OA, and the through hole 23a provided in the moving plate 23 is positioned directly above the first imaging unit 4. The first imaging unit 4 images the mark m through the through hole 23 a. The image recognition unit of the first imaging unit 4 recognizes the mark m from the image captured by the first imaging unit 4, and calculates the positional information of the electronic component C. The control device 6 obtains the amount of deviation between the position information of the electronic component C and the reference position and the XY-axis direction, and positions the electronic component C by operating the driving mechanism 32 so as to cancel the deviation (step S104).
Next, as shown in fig. 4B, the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (the mounting area B where the electronic component C is mounted at this time) reaches a position facing the electronic component C held by the mounting head 31, that is, the center of the mounting area B reaches the mounting position OA (step S105). As shown in fig. 3B, the second imaging unit 5 passes over the mounting head 31 and images the mark M of the substrate S visible in the transmission region T around the electronic component C (step S106). The image recognition unit of the second imaging unit 5 recognizes the mark M from the image captured by the second imaging unit 5, and calculates the positional information of the mounting area B.
In step S106, the second imaging unit 5 may image the mark M of the substrate S while the mounting head 31 holding the electronic component C is still at the height position for receiving the electronic component C, or may image the mark M after moving to a predetermined height position closer to the substrate S. In the case of performing shooting at a closer height position, the amount of downward movement for mounting after shooting can be made smaller, and therefore movement errors can be further suppressed.
The controller 6 determines the amount of displacement between the position information of the mounting region B and the reference position and the XY axis direction, and operates the driving mechanism 22 to position the substrate S so as to cancel the displacement (step S107). Further, as shown in fig. 4C, the mounting head 31 is driven toward the substrate S by the driving mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S108).
In this manner, the electronic components C are mounted in the respective mounting areas B of the substrate S in sequence by repeating the operations of delivering the electronic components C, positioning the electronic components C and the substrate S, and mounting. The substrate S on which the predetermined number of electronic components C are mounted is transported by the substrate support mechanism 2 and stored in the unloader.
[ Effect ]
The mounting device 1 of the present embodiment includes: a mounting mechanism 3 for mounting the electronic component C on the substrate S; a substrate support mechanism 2 for supporting a substrate S on which an electronic component C is mounted; and a mounting head 31 provided in the mounting mechanism 3 and having a transmissive portion through which the mark M of the substrate S can be recognized in a state where the electronic component C is held.
In addition, the mounting device 1 includes: a first imaging unit 4 which is disposed below the substrate support mechanism 2 at a mounting position OA at which the mounting head 31 mounts the electronic component C on the substrate S, and which images a mark m of the electronic component C held by the mounting head 31 in a state in which the substrate S is retracted from the mounting position OA; a second imaging unit 5 which is disposed above the mounting head 31 at the mounting position OA and which images the mark M of the substrate S through the transparent portion; and a positioning mechanism for positioning the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the mark M and the mark M captured by the first imaging unit 4 and the second imaging unit 5.
According to this embodiment, in a state where the substrate S is retracted from the mounting position OA, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 arranged below the substrate support mechanism 2 at the mounting position OA, and the substrate S supported by the substrate support mechanism 2 is imaged by the transparent unit of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that the mark M of the electronic component C and the mark M of the substrate S can be imaged in a state as close to the electronic component C and the substrate S as possible.
Therefore, the amount of movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) when the mark M and the mark M are imaged and the amount of relative movement of the electronic component C (mounting head 31) and the substrate S (substrate support mechanism 2) after the mark M and the mark M are imaged can be reduced as much as possible. Therefore, it is possible to suppress the expansion of the error caused by moving the mounting head 31 or the substrate support mechanism 2 for a long distance. Further, the longer the movement distance of the mechanism, the more dust is blown out, but in the present embodiment, since the movement distance can be suppressed, the deterioration of the cleanliness due to dust and the occurrence of poor bonding can be prevented. In particular, in the state where the substrate S is positioned at the mounting position OA, the amount of movement of the mounting head 31 or the second imaging unit 5 positioned on the substrate S can be reduced as much as possible, and therefore, dust can be prevented from falling on and adhering to the substrate S. Further, when the mounting head 31 moves and the electronic component C is transferred to and from the supply unit, dust may fall thereunder. However, in the present embodiment, the mounting head 31 does not move for reception. When the mounting head 31 delivers the electronic component C to and from the transfer mechanism, the substrate S is retracted. Therefore, the dust does not fall onto and adhere to the substrate S.
For example, when the positions of the electronic component C and the mounting region B of the substrate S at the mounting position OA are simultaneously recognized by an imaging camera capable of simultaneously imaging in the vertical direction, the camera needs to be moved between the electronic component C and the substrate S during imaging. Therefore, the electronic component C and the substrate S have to be separated so as not to interfere with the camera. Therefore, the distance for moving the electronic component C to the substrate S at the time of mounting becomes long. In addition, when mounting, it is necessary to retract the camera to a position where it does not interfere with the mounting head 31. According to the mounting device 1 of the present embodiment, the camera does not enter between the electronic component C and the substrate S, and therefore, the image can be taken as close as possible to the electronic component C and the substrate S. Therefore, the distance that the electronic component C moves to the substrate S can be shortened in mounting after imaging. In addition, the camera is not moved on the substrate S significantly before and after the photographing. This can suppress errors and dust emissions associated with these movements.
As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of the mounting head 31 and the stage 21 so as not to interfere with the movement operations thereof. Therefore, when positioning the electronic component C and the mounting region B of the substrate S, only the mounting head 31, only the stage 21, or both are moved, but are independent of the imaging unit 4 and the imaging unit 5, so that the moved portion can be reduced in weight and the movement error can be reduced as compared with a case where the moving portion is not independent of the imaging unit 4 and the imaging unit 5.
As compared with this embodiment, for example, when the mark of the substrate S is imaged by the imaging unit provided integrally with the mounting head 31, the imaging unit is first positioned at the mounting position OA to perform imaging, the position of the substrate S is recognized based on the imaging result, and the electronic component C held by the mounting head 31 is positioned and mounted at a position positioned so as to be aligned with the position of the electronic component C recognized separately. In this case, when the substrate S is imaged and mounted, the imaging unit and the mounting head 31 provided integrally with each other move relative to the mounting position OA, and thus an error or a large amount of dust may occur. In the mounting device 1 of the present embodiment, the mounting head 31, the mounting region B of the substrate S, the first imaging unit 4, and the second imaging unit 5 are independently arranged at the mounting position OA, and therefore, only a minute movement for positioning is required, and the electronic component C and the substrate S are not moved together with the camera every time imaging is performed by the imaging unit 4 and the imaging unit 5. This makes it possible to mount the electronic device with high accuracy and suppress dust.
Furthermore, in order to achieve high required accuracy, a high magnification camera needs to be used. It is not practically impossible to arrange the second imaging unit 5 above the mounting head 31 and image the mark M over the mounting head 31 as in the present embodiment, that is, to image the mark M not through the transparent holding unit 31b but by using a camera provided in the mounting head 31 so as to be adjacent to the mounting head 31 to perform imaging, thereby achieving high required accuracy. First, the external shape of the mounting head 31 has to be larger than the electronic part C to be mounted. The area of the substrate S to which the mark M is applied is only a range of about several millimeters larger than the area to which the electronic component C is mounted. Therefore, the region to which the mark M is given is located closer to the center of the mounting head 31 than the outer shape of the mounting head 31. Therefore, even if the lens barrel of the camera is disposed adjacent to the mounting head 31, the mark M does not enter the field of view of the camera in the state where the mounting head 31 is positioned at the mounting position OA, and the mark M cannot be imaged by the camera. Therefore, it is necessary to take an image of the mark M at a position within the field of view of the camera by moving the mounting head 31 away from the mounting position OA.
Generally, the higher the magnification objective lens, the darker the image. The brightness of an image is proportional to the square of the Numerical Aperture (NA) and inversely proportional to the square of the integrated magnification (M). That is, the larger the numerical aperture, the brighter the image, and the higher the magnification, the darker the image. Therefore, in the case where a high magnification is required, the numerical aperture needs to be increased, resulting in a need to use an objective lens having a large diameter. For example, a lens barrel including an objective lens of a high-magnification camera requiring high-precision positioning is generally required to have a bore of 10mm or more. If the position where the best image is obtained is the center of the lens, a camera provided at a position adjacent to the mounting head 31 can see a position 5mm or more away from the end of the mounting head 31. Thus, photographing can be performed only at a place far from the mounting head 31. Therefore, even if a single camera or a plurality of cameras are used, the mark M of the substrate S cannot be imaged in a state where the center of the mounting head 31 is positioned at the mounting position OA. Therefore, in order to photograph, it is necessary to position the camera on the mark M of the substrate S.
That is, in order to take an image by bringing the mark M of the substrate S into the visual field, the mounting head 31 needs to be moved to position the camera directly above the mark M, and an error occurs during the movement. For example, when the mark M of the electronic component C is recognized to obtain the positional information for positioning and then the mark M of the substrate S is recognized, the camera must be moved together with the mounting head 31 in order to recognize the mark M, and then even if the position is returned to the original position, the position of the electronic component C may be shifted due to an error caused by the movement. In addition, there is a possibility that dust emission increases.
In addition, when only one of the plurality of (two) marks M that enter the substrate S in the imaging field of view is taken, it is necessary to move the camera between the marks M to take an image of the plurality of (two) marks M of the substrate S. That is, when the camera is provided in the mounting head 31 so as to be adjacent to the mounting head 31, a portion of the mounting head 31 that moves the distance between the center of the mounting head 31 and the center of the camera and a portion of the two marks M that are spaced apart from each other are necessary, and there is a possibility that a larger error occurs or dust is increased.
It does not change whether the camera is single or multiple. Even if two cameras are disposed adjacent to the mounting head 31 so as to correspond to the two-point marks M, only a portion that is farther from the two-point marks M disposed diagonally can be used as the field of view, and therefore the cameras must be moved together with the mounting head 31, and the offset similarly occurs.
For example, when the mark M of the electronic component C is recognized after the mark M of the substrate S is recognized, the electronic component C is shielded and the position thereof cannot be recognized in a state where the substrate S is located at the position to be mounted (mounting position OA) in a camera for imaging the mark M of the electronic component C held by the mounting head 31 provided at the mounting position OA. Therefore, the substrate S having obtained the positional information for positioning must be moved to pick up the mark m and returned to the original position, and the substrate S is displaced by the movement. In addition, dust emission also increases.
It is also conceivable to prepare a template (template) to which marks corresponding to the marks M of the substrate S are marked at a position different from the position to be mounted, and perform positioning based on the relative positions of the marks of the template and the marks M of the substrate S. In this case, however, the mounting head 31 and the camera must be moved to recognize the mark of the stencil each time the electronic component C is mounted. Accordingly, time required for identifying the mark of the template and time required for positioning are additionally spent, and thus productivity is lowered. Further, since the moving distance of the mechanism increases, the amount of dust also increases, and an error accompanying the movement also increases.
In the present embodiment, since the moving distance of the electronic component C and the substrate S can be suppressed after the imaging of the mark M and the mark M, any of the positional shift, the reduction in productivity, and the dust generation amount can be suppressed.
The transmission section has a transparent plate-like member. Therefore, in a narrow area corresponding to the size of the minute electronic component C, it is possible to hold the electronic component C and secure the transparency imaging of the mark M of the substrate S.
The first imaging unit 4 and the second imaging unit 5 are provided without being moved to the mounting position OA. Therefore, the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5 do not deviate from each other, and dust caused by movement can be prevented.
The drive mechanism 22 includes a drive mechanism 22 functioning as a positioning mechanism, and the drive mechanism 22 has a biaxial movement mechanism for moving the stage 21 in a horizontal plane, the biaxial movement mechanism having a pair of guide rails 22a and a pair of guide rails 22b in a direction orthogonal thereto, and the pair of guide rails 22a and the pair of guide rails 22b are arranged symmetrically with respect to each other with the mounting position OA therebetween. Therefore, when mounting the electronic component C on the substrate S positioned at the mounting position OA, the deformation of the stage 21 can be suppressed, and the mounting with high accuracy can be realized. Of course, since the pair of guide rails 22a and the pair of guide rails 22b are disposed with the mounting position OA therebetween, the deformation can be suppressed, and therefore, the arrangement is not necessarily limited to the symmetrical arrangement with respect to the mounting position OA.
The driving mechanism 22 includes a moving plate 23 that moves along the guide rail 22b, and a through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C. Therefore, the first imaging section 4 can image the electronic component C without being hindered by a mechanism for positioning the substrate S. In addition, as long as the substrate S can be imaged, the light-transmitting member may be fitted into the through hole 23a, or a part or the whole of the moving plate 23 may be constituted by the light-transmitting member.
[ modified examples ]
(1) The mounting head 31 may be configured such that the second imaging unit 5 can image the mark M of the substrate S. Therefore, even if the transparent part of the mounting head 31 is not formed of a transparent material, a through hole can be formed at a position corresponding to the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M, or the hollow portion 31a may be absent, and the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a portion corresponding to the mark M of the mounting head 31 and the holding portion 31 b. That is, such a through hole is also a through part of the mounting head 31.
(2) The following aspects are considered for the imaging field of view of the first imaging unit 4 and the second imaging unit 5.
(A) View field of the camera
The collective imaging field of view is a field of view in which a plurality of marks M or a plurality of marks M can be collectively imaged. For example, the position of the electronic component C when it is delivered to the mounting head 31 varies within a certain range. Therefore, if there is a field of view in which the two marks m of the electronic component C can be captured even when the positions thereof are deviated, it is not necessary to move the first imaging unit 4 in order to capture the two marks m. In addition, if the second imaging unit 5 also has a field of view for capturing images together, it is not necessary to move the second imaging unit for capturing the two marks M.
(B) Individual shooting field of view
The individual imaging field of view is an imaging field of view in which only the plurality of marks M or the plurality of marks M are individually imaged, that is, a field of view in which one mark M or one mark M can be imaged.
In the above embodiment, the case where the mark M can be imaged across the mounting head 31 and the mounting region B of the electronic component C and the substrate S can be imaged in one imaging field of view by the first imaging unit 4 and the second imaging unit 5 has been described, but there is a case where a higher magnification is obtained depending on the required mounting accuracy. In this case, there is a fear that the mounting region B of the electronic component C and the substrate S cannot be imaged in one imaging field of view. That is, the first imaging unit 4 and the second imaging unit 5 may have only individual imaging fields. In this case, as described above, it is necessary to move the imaging field between a plurality of markers to image the markers.
The movement between the marks in the imaging field is, for example, to move the mounting head 31 between two marks m provided at the diagonal corners of the electronic component C with respect to the first imaging unit 4 for imaging the electronic component C. The mounting head 31 is XY-movable and thus directly applicable. Even when such movement between the marks of the imaging field of view is required, the mounting head 31 is moved only, and the moving distance thereof is limited to the size of the electronic component C, and only a short moving distance is required, so that errors and dust emission can be suppressed.
Further, the first imaging unit 4 may be moved to move the marks m in the imaging field of view. That is, the first imaging unit 4 may be provided movably at a position where the electronic component C is mounted (mounting position OA). When the first imaging unit 4 is moved, a moving device for moving the first imaging unit is provided, and the first imaging unit 4 is fixed to the moving device. In this case, only the first imaging unit 4 moves, and the mounting head 31 does not move. Further, the moving distance is limited to the size of the electronic component C, and only a short moving distance is required. Therefore, errors and dust emission can be suppressed. Further, since the first imaging unit 4 is disposed below the substrate S, even if dust occurs, the dust can be prevented from adhering to the surface of the substrate S.
Likewise, for example, in order to photograph two marks M provided at opposite corners of a rectangular region in the vicinity of the mounting region B of the substrate S, the photographing field of view is moved between the marks M. In this case, the stage 21 is moved between the marks M with respect to the second imaging unit 5 that images the substrate S. The stage 21 can be XY-moved and thus can be directly applied. Even in this case, only the stage 21 is moved, and the movement distance thereof is limited to a range of a size near the mounting area B of the substrate S, and only a short movement distance is required, so that errors and dust emission can be suppressed. Since the drive mechanism 22 of the stage 21 is disposed below the substrate S, dust does not adhere to the surface of the substrate S even if dust is generated.
In addition, the movement between the markers M may be performed by moving the second imaging unit 5. That is, the second imaging unit 5 may be provided movably at a position where the electronic component C is mounted (mounting position OA). When the second imaging unit 5 is moved, a moving device for moving the second imaging unit is provided, and the second imaging unit 5 is fixed to the moving device. In this case, only the second imaging unit 5 moves, and the mounting head 31 and the stage 21 do not move. Further, the moving distance is limited to a range of a size near the mounting region B of the substrate S, and only a short moving distance is required. Therefore, errors and dust emission can be suppressed.
(3) In the above embodiment, the calculated position of the electronic component C and the position of the mounting area B of the substrate S are positioned so as to be aligned with the reference positions, but the present invention is not limited thereto, and the position of the mounting area B may be positioned so as to be aligned with the position of the electronic component C, or the position of the electronic component C may be positioned so as to be aligned with the position of the mounting area B. In short, the position of the mounting region B of the substrate S and the position of the electronic component C may be aligned.
(4) In the above embodiment, the control device 6 controls to move the substrate S in order to position the electronic component C and the substrate S, but the substrate S may not be moved in order to position, that is, correct the alignment. In this case, the electronic component C is moved by the mounting head 31. As shown in fig. 2, a plurality of electronic components C are often mounted on the substrate S. In such a substrate S, the movement range of the stage 21 for positioning each mounting region B at the mounting position OA is increased. In this case, in the movable range of the stage 21, the positioning error often differs depending on the location, and there is a fear that the recognition result of the substrate position by the camera (second imaging unit 5) that images the substrate S cannot be correctly reflected. Therefore, by positioning the substrate position (the mounting position OA is the position of the mark M) with respect to the deviation from the reference position by the movement of the mounting head 31, the electronic component C and the substrate S can be positioned more accurately. Further, by moving the mounting head 31 which is smaller and lighter, instead of moving the stage 21 which is large and heavy, the movement error can be further suppressed. Further, in this case, the substrate positioning of step S107 in fig. 5 is performed by operating the driving mechanism 32.
(5) The transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA before the mark m of the electronic component C is imaged by the first imaging unit 4.
(6) In the embodiment, front-down mounting is performed. That is, in the case of front-side-down mounting, the face (front face) of the individual electronic component C on which the semiconductor layer is formed before separation from the wafer is directed upward, that is, the front face is directed upward. The picked-up electronic part C is turned upside down, i.e., front-side down. The transfer mechanism that has received it gives it to the mounting head 31 in a downward state, so the mounting head 31 holds the electronic component C downward. From below the mounting head 31, the front surface (including the mark m) of the electronic component C is photographed by the first photographing part 4. The substrate S moves below the mounting head 31. From above the mounting head 31, the front surface (including the mark M) of the substrate S is imaged by the second imaging unit 5 through the transparent unit. The electronic component C held by the mounting head 31 is mounted by positioning the substrate S.
On the other hand, the mounting device 1 of the embodiment can also be mounted with the front face upward. When the electronic component C is mounted with the front surface facing upward, the first imaging unit 4 cannot image the front surface of the electronic component C, and therefore, the second imaging unit 5 does not image the front surface of the electronic component C. That is, the electronic part C picked up from the wafer is not inverted but is directed upward. The transfer mechanism that has received it delivers it to the mounting head 31 in an upward state, so the mounting head 31 holds the electronic component C upward. From above the mounting head 31, the front surface (including the mark m) of the electronic component C facing upward is imaged by the second imaging unit 5 through the transparent unit. The substrate S moves below the mounting head 31. From above the mounting head 31, the front surface (including the mark M) of the substrate S is imaged by the second imaging unit 5 through the transparent unit. The electronic component C held by the mounting head 31 is mounted by positioning the substrate S.
In the case of the front-side-up mounting in this manner, the reference position of the mounting head 31 and the electronic component C may be positioned before the positioning of the electronic component C and the substrate S based on the imaging result of the mark m of the electronic component C. When the electronic component C held by the mounting head 31 is greatly displaced from the reference position, the mark M of the substrate S may be hidden by the electronic component C. This is the same as the primary calibration when the cameras of the first and second imaging units 4 and 5 are infrared cameras, which will be described later. As described above, the mounting device 1 can be applied to the front-up mounting while exhibiting the same effects as those of the above-described embodiment.
(7) The second imaging unit 5 may be a camera that can image the mark m of the electronic component C in a transmissive manner. For example, the camera of the second imaging unit 5 that images the mark M on the substrate S is an infrared camera. Thus, the mark m of the electronic component C held by the holding portion 31b is imaged by the second imaging portion 5 through the holding portion 31b and the electronic component C. The positioning mechanism positions the substrate S and the electronic component C based on the mark M of the substrate S and the mark M of the electronic component C imaged by the second imaging unit 5. Before that, the electronic component C is positioned based on the position of the electronic component C obtained from the image of the mark m of the electronic component C captured by the first imaging unit 4.
That is, as described above, after the mark m of the electronic component C is imaged by the first imaging unit 4, the electronic component C is positioned at the reference position (primary correction). Then, the mounting head 31 is moved to bring the electronic component C close to the substrate S, the mark M of the substrate S is imaged by the second imaging unit 5, and the electronic component C is transparently imaged, and the substrate S is positioned (secondarily corrected) to mount the electronic component C on the substrate S. After the imaging by the second imaging unit 5, the mounting head 31 for mounting only needs to be moved down in a very short distance, and thus the positional deviation is further suppressed.
The positioning operation will be specifically described with reference to the explanatory views (a) to (C) of fig. 6 and the flowchart of fig. 7. The upper stage of fig. 6 (a) to 6 (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, and the lower stage is a plan view showing the positions of the electronic component C to be imaged, the mark M, and the mark M of the substrate S.
The movement from the transfer of the electronic component C to the substrate S is the same as the movement from S101 to S105 (S201 to S205). That is, as shown in fig. 6 (a), the electronic component C is held in the holding portion 31b of the electronic component C in a direction in which the front surface with the mark m faces the first imaging portion 4. In this state, the first imaging unit 4 images the mark m to perform position recognition, and performs primary correction to align the electronic component C with the reference position.
Then, as shown in fig. 6B, the retracted stage 21 is moved to the mounting position OA, that is, below the second imaging unit 5 (step S205), and the mounting head 31 is lowered with respect to the mounted substrate S to position the electronic component C and the substrate S at a distance of, for example, about 10 μm (step S206).
In this state, the mark M of the substrate S is imaged by the second imaging unit 5 through the transmissive portion of the holding unit 31b (step S207). At the same time, the second imaging unit 5 images the mark m of the electronic component C held by the holding unit 31b through the transmission unit of the holding unit 31b and the electronic component C. As shown in fig. 6C, the second imaging unit 5 recognizes the position of the mark M and the mark M by imaging, positions the electronic component C and the substrate S (secondary correction) (step S208), lowers the mounting head 31, and mounts the electronic component C on the substrate S (step S209).
As described above, since the electronic component C and the substrate S are simultaneously recognized by the same imaging unit in a state where the substrate S and the electronic component C are brought close to each other, there is no error in the position between the imaging units included in the position recognition results obtained by the plurality of imaging units. Therefore, the accuracy of positioning the electronic component C and the substrate S can be improved as compared with the above embodiment. Since the lowering distance after the positioning of the electronic component C and the substrate S is very small, the positional deviation due to the lowering movement is also suppressed, and the positioning accuracy is improved.
When the second imaging unit 5 simultaneously recognizes the positions of the electronic component C and the substrate S, the second imaging unit 5 may capture the marks M of the electronic component C and the marks M of the substrate S with a necessary recognition accuracy, and the operation of bringing the electronic component C and the substrate S into close contact with each other in step S206 is not necessarily required. In this case, since the movement for lowering the electronic component C is not divided, the processing time can be shortened.
When the electronic component C held by the mounting head 31 is greatly displaced from the reference position, there is a possibility that the mark M of the substrate S is blocked by the electronic component C, but the second imaging unit 5 recognizes the position thereof by imaging the mark M and the mark M, and performs position recognition by imaging the mark M by the first imaging unit 4 before performing secondary correction for positioning the electronic component C and the substrate S, and performs primary correction for aligning the electronic component C with the reference position, thereby avoiding such a situation. In addition, when the positional deviation of the electronic component C to the mounting head 31 is within the allowable range, the correction may not be performed once.
In addition, such a primary correction can be applied to a front-up mounting if a camera capable of photographing through permeability is used as the first photographing unit 4. That is, the first imaging unit 4 may have a camera capable of imaging the mark M of the electronic component C in a transmissive manner, and the positioning mechanism may position the electronic component C based on the position of the electronic component C obtained from the image of the mark M of the electronic component C imaged by the first imaging unit 4 and then position the substrate S and the electronic component C based on the mark M of the substrate S and the mark M of the electronic component C imaged by the second imaging unit 5. In this case, the second imaging unit 5 may not necessarily be a camera that can image the mark m of the electronic component C in a penetrating manner.
(8) In addition, a mark as a reference may be provided at the mounting head 31 as a tool for mounting. The mark provided to the mounting head 31 is provided so as to be able to be imaged by either the first imaging unit 4 or the second imaging unit 5. The positioning mechanism positions the substrate S and the electronic component C based on the mark M of the electronic component C imaged by the first imaging unit 4 and the second imaging unit 5, the mark M of the substrate S, and the positions of the substrate S and the electronic component C obtained from the image of the mark of the mounting head 31. In this case, the marks of the mounting head 31 are imaged by the first imaging unit 4 and the second imaging unit 5, respectively, and the alignment (reference alignment) of the cameras of the first imaging unit 4 and the second imaging unit 5 is performed based on the marks of the mounting head 31. This can suppress variation in the result of position detection between cameras, and thus further suppress positional displacement in mounting. In addition, it is possible to suppress a shift due to a change over time in the position of each camera.
For example, it is also possible to use a jig prepared separately from the mounting head 31 for the alignment of the two cameras, but this jig is mounted on the apparatus when the alignment between the cameras needs to be adjusted, and needs to be detached after the imaging is completed. Thus, since a jig needs to be installed for each adjustment, the maintainability and productivity are poor. In addition, due to the arrangement and the disassembly of the clamp, the dust emission is increased. It is also difficult to track changes over time in real time. In the present embodiment, there is no trouble of attaching and detaching the jig. The device can perform adjustment over time during real-time operation, can realize high installation precision, and can suppress dust emission.
Further, since the mark provided in the mounting head 31 is used as a reference, for example, compared with a case where a mark of a template (jig) prepared separately from the mounting head 31 is used in the apparatus, extra movement and time for identifying the mark are not required, and a reduction in productivity, an increase in dust emission amount, and an error accompanying the movement can be suppressed.
The positioning operation will be specifically described with reference to the explanatory views (a) to (C) of fig. 8 and the flowchart of fig. 9. The upper stage of fig. 8 (a) to 8 (C) is a side view showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, and the lower stage is a plan view showing the positions of the electronic component C, the mark M of the substrate S, and the mark ma of the mounting head 31.
First, the mark ma of the mounting head 31 is provided at a position which does not overlap with the holding position of the electronic component C and can be imaged through the transparent portion on the lower end surface of the holding portion 31 b. For example, as shown in fig. 8 (a), two positions are diagonally provided so as to be located outside the mark m of the electronic component C. Before the mounting head 31 holds the electronic component C, the mark ma of the mounting head 31 is imaged by the first imaging unit 4 and the second imaging unit 5, and the offset amount (including the inclination in the horizontal plane) of the position of the mark ma with respect to each reference position, that is, the correction value is registered (step S301). The transfer mechanism transfers the electronic component C (step S302), and the mounting head 31 holds the electronic component C (step S303).
The first imaging unit 4 simultaneously images the mark m of the electronic component C and the mark ma of the mounting head 31, and calculates the positional relationship between the two (step S304). As shown in fig. 8B, the substrate S is moved to the mounting position OA (step S305), and the second imaging unit 5 simultaneously images the mark M of the substrate S and the mark ma of the mounting head 31 and calculates the positional relationship therebetween (step S306). The positioning mechanism positions the electronic component C and the substrate S based on the registered correction values of the first and second imaging units 4 and 5, the positional relationship between the mark M of the electronic component C and the mark ma of the mounting head 31, and the positional relationship between the mark M of the substrate S and the mark ma of the mounting head 31 with the mark ma of the mounting head 31 as a reference (step S307). As shown in fig. 8C, after the positioning, the mounting head 31 is lowered to mount the electronic component C on the substrate S (step S308).
As described above, the positional relationship between the first imaging unit 4 and the second imaging unit 5 is grasped with the mark ma provided on the mounting head 31 as a reference, and the positions of the electronic component C and the substrate S can be aligned. Since the position error between the plurality of imaging units can be suppressed, the accuracy of positioning the electronic component C and the substrate S can be further improved as compared with the above-described embodiment. In addition, even if the positional relationship between the plurality of imaging units changes with time, the accuracy of positioning the electronic component C and the substrate S can be ensured, and therefore the accuracy of positioning is improved. In the above-described embodiment, although it takes time to assemble the mounting device 1 in order to bring the positions of the first imaging unit 4 and the second imaging unit 5 as close as possible to the reference positions (design positions), in this embodiment, the positions of the first imaging unit 4 and the second imaging unit 5 with respect to the reference positions are not required to be highly accurate at the time of assembly, and therefore, the manufacturing and maintenance of the device are labor-saving.
The mark ma provided in the mounting head 31 may be a feature point (mark) that can be imaged by the first imaging unit 4 and the second imaging unit 5. The feature points may be printed or engraved patterns, or may be recesses or through holes. When the holding portion 31b to be provided with the mark ma is made of a transparent plate material such as glass, the mark ma does not necessarily have to be provided on the lower end surface of the holding portion 31b, and the mark ma may be provided on the surface of the holding portion 31b opposite to the surface for holding the electronic component C. In this case, the first imaging unit 4 and the second imaging unit 5 can image the mark ma in the same manner, and errors can be suppressed. In addition, in the case of the through hole, even if the holding portion 31b is not made of a transparent material, it is possible to image one hole by the first and second imaging portions 4 and 5, and thus errors can be suppressed.
Instead of providing the mark on the mounting head 31, the through hole 23a formed in the moving plate 23 of the substrate support mechanism 2 may be a transparent member such as a transparent glass plate, for example, and the mark may be provided on the transparent member. The portion of the through hole 23a is a portion for imaging the electronic component C by the first imaging unit 4, and therefore does not interfere with the substrate S.
[ other embodiments ]
While the embodiments and the modifications of the respective parts of the present invention have been described above, the embodiments and the modifications of the respective parts are presented as examples and are not intended to limit the scope of the present invention. These novel embodiments may be implemented in other various forms, and various omissions, substitutions, and changes may be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims.

Claims (8)

1. An electronic component mounting apparatus, comprising:
a mounting mechanism for mounting the electronic component on the substrate;
a substrate support mechanism supporting the substrate on which the electronic component is mounted;
a mounting head provided to the mounting mechanism and having a transmissive portion that allows a mark of the substrate to be recognized through the transmissive portion in a state where the electronic component is held;
a first imaging unit that is disposed below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate, and that images a mark of the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position;
a second imaging unit which is disposed above the mounting head at the mounting position and which images a mark of the substrate through the transparent unit; and
and a positioning mechanism for positioning the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks captured by the first and second imaging units.
2. The electronic component mounting apparatus according to claim 1, wherein the first imaging unit and the second imaging unit are provided immovably with respect to the mounting position.
3. The apparatus for mounting electronic parts as claimed in claim 1, wherein the second imaging unit has a camera capable of imaging the mark of the electronic part through the second imaging unit, and wherein the second imaging unit is capable of imaging the mark of the electronic part through the camera
The positioning mechanism positions the substrate and the electronic component based on the mark of the substrate and the mark of the electronic component photographed by the second photographing unit.
4. The electronic component mounting apparatus according to claim 3, wherein the positioning mechanism performs positioning of the electronic component based on a position of the electronic component obtained from the image of the mark of the electronic component captured by the first capturing unit before performing positioning of the substrate and the electronic component based on the mark of the substrate and the mark of the electronic component captured by the second capturing unit.
5. The apparatus for mounting an electronic component as claimed in claim 1, wherein the first imaging unit has a camera capable of imaging a mark of the electronic component through permeability, and wherein the first imaging unit is configured to capture an image of the mark of the electronic component through the camera
The positioning mechanism positions the electronic component based on the position of the electronic component obtained from the image of the mark of the electronic component captured by the first imaging unit, and then positions the substrate and the electronic component based on the mark of the substrate and the mark of the electronic component captured by the second imaging unit.
6. The mounting apparatus for electronic parts as claimed in claim 1, wherein a mark capable of photographing by said first photographing part and photographing by said second photographing part is provided at said mounting head, and
the positioning mechanism positions the substrate and the electronic component based on the positions of the substrate and the electronic component obtained from the images of the marks of the electronic component, the marks of the substrate, and the marks of the mounting head photographed by the first photographing unit and the second photographing unit.
7. The electronic component mounting apparatus according to claim 1, wherein the transmission portion has a transparent plate-like member.
8. The mounting apparatus for electronic parts according to any one of claims 1 to 7, comprising a transfer mechanism that delivers the electronic parts to the mounting head at the mounting position.
CN202110117011.8A 2020-01-30 2021-01-28 Mounting device for electronic component Pending CN113206025A (en)

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