CN113200228A - Method for preventing welding spot cavity defect treatment - Google Patents
Method for preventing welding spot cavity defect treatment Download PDFInfo
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- CN113200228A CN113200228A CN202110687962.9A CN202110687962A CN113200228A CN 113200228 A CN113200228 A CN 113200228A CN 202110687962 A CN202110687962 A CN 202110687962A CN 113200228 A CN113200228 A CN 113200228A
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- pcb
- packaging bag
- bag
- bag body
- welding spot
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D33/00—Details of, or accessories for, sacks or bags
- B65D33/16—End- or aperture-closing arrangements or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D31/00—Bags or like containers made of paper and having structural provision for thickness of contents
- B65D31/14—Valve bags, i.e. with valves for filling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N5/00—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid
- G01N5/02—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
- G01N5/025—Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content for determining moisture content
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Food Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a method for treating a void defect of a solder joint, which relates to the technical field of PCB welding and comprises the following steps: s1, manufacturing a sealable packaging bag corresponding to the PCB plate type number, S2, manufacturing a humidity display card, S3, putting the PCB plate and the humidity display card into the packaging bag for sealing treatment, S4, vacuumizing the sealed packaging bag, S5, regularly observing the humidity display card in the packaging bag with the PCB plate one by one and detecting the air tightness of the packaging bag, S6, regularly weighing the packaging bag with the PCB plate and judging the absorbed moisture. The packaging bag is formed by the bag body and the one-way air valve, the PCB is independently packaged, the PCB to be used is periodically detected by the humidity display card and the weighing method, and the PCB used in the welding process is not subjected to moisture absorption and moisture absorption by baking treatment and periodic use, so that the problem of cavity defects caused by moisture absorption and moisture absorption when the PCB is stored is solved.
Description
Technical Field
The invention relates to the technical field of PCB welding, in particular to a method for treating void defects of solder joints.
Background
With the development of electronic technology, the requirements of users on electronic products are further improved, and the technological requirements of the welding spots of the PCB are as follows: the mechanical strength of the welding spot is enough; the welding is reliable, and the conductivity is ensured; the surface of the welding spot needs to be smooth and clean, but when the PCB is welded, a cavity is inevitably generated; the air conditioner is characterized in that small holes are formed in welding spots, the small holes are hollow, the condition that the small holes and the blowing holes are formed in the small holes is adopted, the mechanical strength of the welding spots can be reduced due to the influence of the holes on the welding spots of the PCB, the reliability and the service life of the welding spots are influenced, the smaller the hole area is, the better the hole area is, the less holes can not influence the welding spots greatly, the reliability of the welding spots can be influenced due to the large number of holes, and therefore the generation of the hole phenomenon must be controlled.
The method is characterized in that a plurality of reasons for generating the holes are provided, the general reason for generating the holes is that gas is generated, water vapor is one of the sources of the gas, the PCB is wet after moisture absorption and wetting in the storage process, the water cannot be well discharged, and is an important factor for causing the holes, the water is vaporized when being heated, and bubbles are formed in welding points, so that the removal of the water in the PCB is very important, and the method for treating the defects of the holes in the welding points is provided aiming at solving the problem that the PCB is wet and wetted by moisture absorption.
Disclosure of Invention
Technical problem to be solved
Aiming at the defect that the welding spot cavity defect is generated after the material absorbs moisture and is damped during the PCB welding in the prior art, the invention provides a method for treating the welding spot cavity defect, and solves the problem of the cavity defect caused by moisture absorption and damping during the PCB storage.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a method for treating void defects of solder joints comprises the following steps:
s1, manufacturing a sealable packaging bag corresponding to the PCB plate type number;
s2, manufacturing a humidity display card;
s3, placing the PCB and the humidity display card into a packaging bag for sealing treatment;
s4, vacuumizing the sealed packaging bag;
s5, regularly observing the humidity display cards in the packaging bags filled with the PCB one by one and detecting the air tightness of the packaging bags;
and S6, weighing the packaging bag with the PCB regularly, and judging the absorbed water.
Preferably, in step S1, the packaging bag includes a bag body and a one-way air valve disposed on the bag body, a double-edge seam-type self-sealing strip is disposed in an opening of the bag body, the opening of the bag body is sealed by the double-edge seam-type self-sealing strip, the bottom and two side pressure-equalizing edges of the bag body are sealed, and a transparent viewing port is disposed on one side of the bag body.
Preferably, the one-way air valve exhausts air from the inside of the bag body to the outside of the bag body.
Preferably, the bag sets up the adhesive linkage outward, and the adhesive linkage setting is in the bilateral bite type strip top of proclaiming oneself, the bag body is in the inward rolling of open position fifty percent discount and bond with the adhesive linkage, the adhesive linkage is the glue film.
Preferably, the bag body of wrapping bag is the waterproof bag of PVC material.
Preferably, the bag body of the packaging bag is a waterproof bag made of TPU.
Preferably, in step S3, a desiccant is further placed in the packaging bag.
Preferably, the packaging bag independently packages a single PCB and requires a gloving operation when being in contact with the PCB.
Preferably, the PCB needs to be baked after the packaging bag is unsealed, the baking temperature is 100 ℃, the baking time is 2 hours, the PCB is used after being naturally cooled after baking is finished, the PCB is used up within 2 hours after being cooled, and the unused PCB is stored in the moisture-proof cabinet.
(III) advantageous effects
The invention provides a method for treating a void defect of a welding spot, which has the following beneficial effects:
according to the invention, the bag body and the one-way air valve are arranged to form the packaging bag, the double-side seam type self-sealing strip is used for sealing and vacuum processing the packaging bag, so that the PCB can be subjected to damp-proof sealing processing, the PCB is further dried through the moisture proofing of a drying agent, the PCB to be used is regularly detected through a humidity display card and a weighing method, the use standard is ensured to be met, the bag body is made of a waterproof material, the PCB is independently packaged, the PCB is protected through gloves in the operation process, and the PCB used in the welding process is ensured not to absorb moisture and be wetted through baking processing and regular use, so that the problem of cavity defect caused by moisture absorption and wetting when the PCB is stored is solved.
Drawings
FIG. 1 is a schematic view of the overall structure of the packaging bag of the present invention;
FIG. 2 is a left side view of the closure of the package of the present invention;
FIG. 3 is a top view of the open interior of the package of the present invention;
FIG. 4 is a schematic view of a solder joint void in a prior art;
FIG. 5 is a schematic view of solder joint voiding in accordance with the present invention.
In the figure: 101. a bag body; 102. a one-way air valve; 103. double-edge seaming type self-sealing strips; 104. a transparent viewing port; 105. and (7) bonding the layers.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-3, the present invention provides a technical solution: a method for treating void defects of solder joints comprises the following steps:
s1, manufacturing a packaging bag which corresponds to the PCB plate type number and can be sealed and sealed, wherein the PCB plate can be conveniently placed into the packaging bag through an opening at the top of the packaging bag, and the periphery of the packaging bag is sealed;
s2, manufacturing a humidity display card;
s3, placing the PCB and the humidity display card into a packaging bag for sealing treatment;
s4, vacuumizing the sealed packaging bag;
s5, regularly observing the humidity display cards in the packaging bags filled with the PCB one by one and detecting the air tightness of the packaging bags;
and S6, weighing the packaging bags containing the PCB regularly, judging the absorbed moisture, and re-baking the PCB exceeding the threshold value.
As a technical optimization scheme of the present invention, in step S1, the packaging bag includes a bag body 101 and a one-way air valve 102 disposed on the bag body 101, a double-sided seam-type self-sealing strip 103 is disposed in an opening of the bag body 101, the opening of the bag body 101 is sealed by the double-sided seam-type self-sealing strip 103, the bottom and both sides of the bag body 101 are sealed by pressure-equalizing edges, a transparent viewing port 104 is disposed on one side of the bag body 101, and the display information of the internal humidity display card is observed through the transparent viewing port 104.
In a preferred embodiment of the present invention, the one-way air valve 102 exhausts air from the inside of the bag 101 to the outside of the bag 101, and the sealed bag 101 is vacuumized by an air pump installed on the one-way air valve 102.
As a technical optimization scheme of the invention, the bonding layer 105 is arranged outside the bag body 101, the bonding layer 105 is arranged above the double-edge seaming type self-sealing strips 103, the bag body 101 is folded inwards at the opening position and is bonded with the bonding layer 105, the bonding layer 105 is a glue layer, and the opening position is folded inwards and is bonded with the bonding layer 105 after the bag body 101 is sealed and vacuumized, so that the opening position is prevented from being opened by mistake.
As a technical optimization scheme of the present invention, the bag body 101 of the packaging bag is a waterproof bag made of PVC.
As a technical optimization scheme of the invention, the bag body 101 of the packaging bag is a waterproof bag made of TPU.
As a technical optimization scheme of the present invention, in step S3, a desiccant is further placed in the packaging bag.
As a technical optimization scheme of the invention, the packaging bag independently packages a single PCB, and the single PCB needs to be operated by wearing gloves when being in contact with the PCB, so that hand sweat is prevented from contacting the PCB.
As a technical optimization scheme of the invention, the PCB needs to be baked after the packaging bag is unsealed, the baking temperature is 100 ℃, the baking time is 2 hours, the PCB is used after being naturally cooled after the baking is finished, the PCB is used within 2 hours after being cooled, and the unused PCB is stored in a moisture-proof cabinet.
In conclusion, the packaging bags are arranged to independently package the PCB and then store the PCB, the packaging bags are in a sealed state in the storage process, and the sealing performance and the moisture-proof data of the packaging bags are regularly checked during the storage process, so that the PCB in the packaging bags can be ensured to meet the use standard, the use reliability of the PCB is greatly improved, the weldability of the PCB is also improved, the production efficiency is improved, the rejection rate of welding spots caused by cavity defects is reduced, the packaging bags can be recycled and reused, and the packaging bags have the effects of moisture prevention, scratch prevention and collision prevention on the storage of the PCB;
as shown in fig. 4-5, fig. 4 shows that in the case of voids after soldering of a PCB that has not been subjected to process improvement under the same conditions, the solder joints have significant void defects, and the voids have large areas and large quantities; FIG. 5 shows the void condition of the PCB after soldering, which is treated by the improved process of the present invention under the same conditions, the void phenomenon on the solder joint is not obvious, the void area is reduced, and the number is also reduced;
the hollow occurrence is reduced through the optimization of the PCB material storage condition, the formation of the hollow can be effectively reduced through the process, and the problem of the hollow defect caused by moisture absorption and wetting when the PCB is stored is solved.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A method for treating void defects of solder joints is characterized by comprising the following steps: the method comprises the following steps:
s1, manufacturing a sealable packaging bag corresponding to the PCB plate type number;
s2, manufacturing a humidity display card;
s3, placing the PCB and the humidity display card into a packaging bag for sealing treatment;
s4, vacuumizing the sealed packaging bag;
s5, regularly observing the humidity display cards in the packaging bags filled with the PCB one by one and detecting the air tightness of the packaging bags;
and S6, weighing the packaging bag with the PCB regularly, and judging the absorbed water.
2. The method for preventing the defect treatment of the welding spot hole as claimed in claim 1, wherein: in step S1, the packaging bag includes a bag body (101) and a one-way air valve (102) disposed on the bag body (101), a double-sided seam-type self-sealing strip (103) is disposed in an opening of the bag body (101), the opening of the bag body (101) is sealed by the double-sided seam-type self-sealing strip (103), the bottom and two sides of the bag body (101) are subjected to pressure-equalizing edge sealing treatment, and a transparent viewing port (104) is disposed on one side of the bag body (101).
3. The method for preventing the defect treatment of the welding spot hole as claimed in claim 2, wherein: the one-way air valve (102) exhausts air from the inside of the bag body (101) to the outside of the bag body (101).
4. The method for preventing the defect treatment of the welding spot hole as claimed in claim 2, wherein: the bag body (101) is provided with adhesive linkage (105) outward, and adhesive linkage (105) set up in bilateral seaming formula from strip (103) top, bag body (101) is in the inward rolling of open position fifty percent discount and bond with adhesive linkage (105), adhesive linkage (105) are the glue film.
5. The method for preventing the defect treatment of the welding spot hole as claimed in claim 2, wherein: the bag body (101) of the packaging bag is a waterproof bag made of PVC materials.
6. The method for preventing the defect treatment of the welding spot hole as claimed in claim 2, wherein: the bag body (101) of the packaging bag is a waterproof bag made of TPU.
7. The method for preventing the defect treatment of the welding spot hole as claimed in claim 1, wherein: in step S3, a desiccant is also placed in the packaging bag.
8. The method for preventing the defect treatment of the welding spot hole as claimed in claim 1, wherein: the wrapping bag is independently packed single PCB board, and need wear the operation of gloves when contacting with the PCB board.
9. The method for preventing the defect treatment of the welding spot hole as claimed in claim 1, wherein: the PCB needs to be baked after the packaging bag is unsealed, the baking temperature is 100 ℃, the baking time is 2 hours, the PCB is used after being naturally cooled after baking is finished, the PCB is used up within 2 hours after being cooled, and the PCB which is not used up is stored in a moisture-proof cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687962.9A CN113200228A (en) | 2021-06-22 | 2021-06-22 | Method for preventing welding spot cavity defect treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110687962.9A CN113200228A (en) | 2021-06-22 | 2021-06-22 | Method for preventing welding spot cavity defect treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113200228A true CN113200228A (en) | 2021-08-03 |
Family
ID=77022429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110687962.9A Withdrawn CN113200228A (en) | 2021-06-22 | 2021-06-22 | Method for preventing welding spot cavity defect treatment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113200228A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201749070U (en) * | 2010-06-30 | 2011-02-16 | 中国人民解放军第三军医大学第一附属医院 | Moisture-absorption-material weight change monitoring device |
| CN201914615U (en) * | 2010-12-30 | 2011-08-03 | 北大方正集团有限公司 | Circuit board packaging structure |
| CN106251784A (en) * | 2016-08-25 | 2016-12-21 | 广东信达光电科技有限公司 | Production method of LED display screen module |
| CN205916519U (en) * | 2016-08-29 | 2017-02-01 | 四川回头客食品有限公司 | Satisfy food safety monitoring's wrapping bag |
| CN107719785A (en) * | 2017-10-18 | 2018-02-23 | 迅得机械（东莞）有限公司 | A kind of pcb board packing method and its packing machine |
| CN207497240U (en) * | 2017-07-10 | 2018-06-15 | 青岛乐源包装有限公司 | A kind of barrier material packaging bag |
| CN207890259U (en) * | 2017-12-29 | 2018-09-21 | 旭宇光电（深圳）股份有限公司 | LED packs storage bag |
| CN209275280U (en) * | 2018-12-28 | 2019-08-20 | 昆山意诺福半导体包装材料有限公司 | The three-in-one integrated dampproof packaging bag of semiconductor device |
| CN212654794U (en) * | 2020-06-15 | 2021-03-05 | 昆山市中润塑业有限公司 | Moisture-proof aluminum foil packaging bag |
| CN213169286U (en) * | 2020-09-16 | 2021-05-11 | 四川兴财潮盛科技有限公司 | Reusable packaging bag |
-
2021
- 2021-06-22 CN CN202110687962.9A patent/CN113200228A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201749070U (en) * | 2010-06-30 | 2011-02-16 | 中国人民解放军第三军医大学第一附属医院 | Moisture-absorption-material weight change monitoring device |
| CN201914615U (en) * | 2010-12-30 | 2011-08-03 | 北大方正集团有限公司 | Circuit board packaging structure |
| CN106251784A (en) * | 2016-08-25 | 2016-12-21 | 广东信达光电科技有限公司 | Production method of LED display screen module |
| CN205916519U (en) * | 2016-08-29 | 2017-02-01 | 四川回头客食品有限公司 | Satisfy food safety monitoring's wrapping bag |
| CN207497240U (en) * | 2017-07-10 | 2018-06-15 | 青岛乐源包装有限公司 | A kind of barrier material packaging bag |
| CN107719785A (en) * | 2017-10-18 | 2018-02-23 | 迅得机械（东莞）有限公司 | A kind of pcb board packing method and its packing machine |
| CN207890259U (en) * | 2017-12-29 | 2018-09-21 | 旭宇光电（深圳）股份有限公司 | LED packs storage bag |
| CN209275280U (en) * | 2018-12-28 | 2019-08-20 | 昆山意诺福半导体包装材料有限公司 | The three-in-one integrated dampproof packaging bag of semiconductor device |
| CN212654794U (en) * | 2020-06-15 | 2021-03-05 | 昆山市中润塑业有限公司 | Moisture-proof aluminum foil packaging bag |
| CN213169286U (en) * | 2020-09-16 | 2021-05-11 | 四川兴财潮盛科技有限公司 | Reusable packaging bag |
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Application publication date: 20210803 |
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