CN113186043A - Fluorine-containing cleaning liquid composition and application thereof - Google Patents
Fluorine-containing cleaning liquid composition and application thereof Download PDFInfo
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- CN113186043A CN113186043A CN202110459918.2A CN202110459918A CN113186043A CN 113186043 A CN113186043 A CN 113186043A CN 202110459918 A CN202110459918 A CN 202110459918A CN 113186043 A CN113186043 A CN 113186043A
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/08—Acids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3272—Urea, guanidine or derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
Abstract
The invention discloses a fluorine-containing cleaning liquid composition and application thereof. The fluorine-containing cleaning liquid composition comprises the following components in percentage by mass: 10-30% of oxidant, 0.001-0.01% of reduced glutathione, 0.001-0.25% of cysteine, 1-5% of fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.01-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water. The fluorine-containing cleaning solution composition can selectively remove the hard mask on the microelectronic device and has good application prospect.
Description
Technical Field
The present invention relates to a fluorine-containing cleaning solution composition and its application, and more particularly to a composition for selectively removing a hard mask containing TiN, TaN, TiNxOy or Ti and a hard mask of an alloy of Ti, and other residues from such a chip or wafer containing a low dielectric constant dielectric material, TEOS, copper and cobalt using the fluorine-containing cleaning solution composition.
Background
In the chip manufacturing technology, the cleaning solution for residues after copper interconnection plasma etching is mainly fluorine-containing cleaning solution. With the continuous advance of technology nodes, more and more materials are introduced, such as metal materials of cobalt, titanium, tungsten, titanium nitride, and the like, and low-k dielectric materials, and the compatibility of the conventional fluorine-containing cleaning solution with various materials is challenged.
Plasma dry etching is commonly used to fabricate vertical sidewall trenches and anisotropic interconnect vias in a copper (Cu)/low dielectric constant dual damascene fabrication process. As technology nodes evolve to 45nm and smaller (e.g., 28-14nm), the shrinking of semiconductor device dimensions makes it more challenging to achieve precise profile control of vias and trenches. Integrated circuit manufacturing companies are investigating the use of various hard masks to improve etch selectivity to low dielectric constant materials for better profile control. The hardmask material (e.g., Ti, TiN, silicon oxynitride, or the like) is removed after etch protection, and other metals and dielectric materials are protected during the cleaning process to remove the hardmask material, thereby challenging compatibility of conventional fluorine-containing cleaning fluids with a variety of materials.
Developing a highly compatible cleaning solution for selectively removing the hard mask is a problem to be solved in the art.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defect of poor selectivity of removing a hard mask by the conventional fluorine-containing cleaning solution, and provides a fluorine-containing cleaning solution composition and application thereof. The fluorine-containing cleaning solution microelectronic device has good compatibility between an interlayer dielectric material and a metal interconnection material, good cleaning effect on residues after plasma etching and ashing and excellent selectivity on a hard mask.
The present invention solves the above technical problems by the following technical solutions.
The invention provides a fluorine-containing cleaning liquid composition which comprises the following components in parts by mass: 10-30% of oxidant, 0.001-0.01% of reduced glutathione, 0.001-0.25% of cysteine, 1-5% of fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.01-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance being water; the sum of the mass fractions of the components is 100 percent.
The mass fraction of each component is the mass percentage of the mass of each component in the total mass of all the components in the fluorine-containing cleaning liquid composition.
The fluorine-containing cleaning solution composition preferably does not contain an amine-containing oxidizing agent stabilizer. The amine-containing oxidant stabilizer may be an amine compound (e.g., primary amine, secondary amine, tertiary amine, or an alcohol compound containing such amines), an alcohol amine compound (e.g., triethanolamine, N-methylethanolamine, N-dimethyldiglycolamine), or an amine-N-oxide compound (e.g., N-methylmorpholine oxide).
In the fluorine-containing cleaning liquid composition, the mass fraction of the oxidizing agent may be 10 to 15%, and may be 15 to 30%.
In the fluorine-containing cleaning liquid composition, the oxidizing agent can be an oxidizing agent conventional in the art, and is preferably hydrogen peroxide (H)2O2) Benzoyl peroxide, tetrabutylammonium peroxymonosulfate, ozone, ferric chloride, permanganate, perborate, perchlorate, persulfate, ammonium peroxydisulfate, peracetic acid, urea peroxide, nitric acid (HNO)3) Ammonium chlorite (NH)4ClO2) Ammonium chlorate (NH)4ClO3) Ammonium iodate (NH)4IO3) Ammonium perborate (NH)4BO3) Ammonium perchlorate (NH)4ClO4) Ammonium periodate (NH)4IO3) Ammonium persulfate ((NH)3)2S2O8) Tetramethylammonium chlorite ((N (CH)3)4ClO2) Tetramethylammonium chlorate ((N (CH)3)4ClO3) Tetramethylammonium iodate (N (CH)3)4IO3) Tetramethylammonium perborate ((N (CH)3)4BO3) Tetramethylammonium perchlorate ((N (CH)3)4)ClO4) Tetramethylammonium periodate ((N (CH)3)4IO4) Tetramethylammonium persulfate ((N (NH)4)4S2O8) And urea peroxide ((CO (NH)2)2)H2O2) And peroxyacetic acid (CH)3(CO) OOH), more preferably one or more of hydrogen peroxide, carbamide peroxide and peracetic acid, more preferably hydrogen peroxide and/or peracetic acid.
In the fluorine-containing cleaning solution composition, the mass fraction of the reduced glutathione can be 0.005-0.01%.
In the fluorine-containing cleaning liquid composition, the mass fraction of the cysteine may be 0.15 to 0.25%.
In the fluorine-containing cleaning liquid composition, the mass fraction of the fluoride may be 1.0 to 2.5%, and may be 2.5 to 5.0%.
In the fluorine-containing cleaning liquid composition, the fluoride may be a fluoride which is conventional in the art, and is preferably one or more of hydrogen fluoride, ammonium fluoride, potassium fluoride, alkali metal fluoride, tetraalkylammonium fluoride, fluoroboric acid, ammonium tetrafluoroborate, alkali metal tetrafluoroborate, tetraalkylammonium tetrafluoroborate and trimethyloxonium tetrafluoroborate, and is preferably hydrogen fluoride.
In the fluorine-containing cleaning liquid composition, the mass fraction of the organic base may be 1.0 to 2.5%, and may be 2.5 to 5.0%.
In the fluorine-containing cleaning solution composition, the organic base may be an organic base conventionally used in the art, preferably one or more of tetramethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetraethylammonium hydroxide (TEAH), benzyltrimethylammonium hydroxide (BTAH), choline, (2-hydroxyethyl) trimethylammonium hydroxide, tris (2-hydroxyethyl) methylammonium hydroxide, Monoethanolamine (MEA), Diglycolamine (DGA), Triethanolamine (TEA), isobutanol amine, isopropanolamine, tetrabutylphosphonium hydroxide (TBPH) and tetramethylguanidine, more preferably one or more of tetramethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetraethylammonium hydroxide and choline, and most preferably tetramethylammonium hydroxide.
In the fluorine-containing cleaning liquid composition, the chelating agent may be present in an amount of 0.01 to 1.0% by mass, or 1.0 to 2.0% by mass.
In the fluorine-containing cleaning liquid composition, the chelating agent may be a chelating agent conventional in the art, preferably one or more of 1, 2-cyclohexanediamine-N, N, N ', N ' -tetraacetic acid (CDTA), ethylenediaminetetraacetic acid (EDTA), nitrilotriacetic acid, diethylenetriaminepentaacetic acid, 1,4,7, 10-tetraazacyclododecane-1, 4,7, 10-tetraacetic acid, ethyleneglycol tetraacetic acid (EGTA), 1, 2-bis (o-aminophenoxy) ethane-N, N, N ', N ' -tetraacetic acid, N- {2- [ bis (carboxymethyl) amino ] ethyl } -N- (2-hydroxyethyl) glycine (HEDTA), ethylenediamine-N, N ' -bis (2-hydroxyphenylacetic acid) (EDDHA), dioxaoctamethylenediazadicyclotetraacetic acid (DOCTA), and triethylenetetraminehexaacetic acid (TTHA), more preferably 1, 2-cyclohexanediamine-N, N' -tetraacetic acid and/or ethylenediaminetetraacetic acid, most preferably ethylenediaminetetraacetic acid.
In the fluorine-containing cleaning liquid composition, the mass fraction of the corrosion inhibitor can be 0.01-0.5%, and can also be 0.5-2.0%.
In the fluorine-containing cleaning liquid composition, the corrosion inhibitor may be a corrosion inhibitor conventional in the art, preferably Benzotriazole (BTA), tolyltriazole, 5-phenyl-benzotriazole, 5-nitro-benzotriazole, 3-amino-5-mercapto-1, 2, 4-triazole, 1-amino-1, 2, 4-triazole, hydroxybenzotriazole, 2- (5-amino-pentyl) -benzotriazole, 1-amino-1, 2, 3-triazole, 1-amino-5-methyl-1, 2, 3-triazole, 3-amino-1, 2, 4-triazole, 3-mercapto-1, 2, 4-triazole, 3-isopropyl-1, 2, 4-triazole, 5-benzenethiol-benzotriazole, halo-benzotriazole (halogen ═ F, Cl, Br or I), naphthotriazole, 2-Mercaptobenzimidazole (MBI), 2-mercaptobenzothiazole, 4-methyl-2-phenylimidazole, 2-mercaptothiazoline, 5-aminotetrazole monohydrate, 5-amino-1, 3, 4-thiadiazole-2-thiol, 2, 4-diamino-6-methyl-1, 3, 5-triazine, thiazole, triazine, methyltetrazole, 1, 3-dimethyl-2-imidazolidinone, 1, 5-pentamethylenetetrazole, 1-phenyl-5-mercaptotetrazole, diaminomethyltriazine, thiotriazinyl-5-yl-2-imidazolidinone, thiotriazinyl-5-yl-2-thiazolyl-2-mercaptotetrazole, thiotriazinyl-5-methyl-tetrazolyl-2-methyl-thiazolyl-1, 5-dimethylenetetrazole, and mixtures thereof, One or more of imidazolinethiones, mercaptobenzimidazoles, 4-methyl-4H-1, 2, 4-triazole-3-thiol, 5-amino-1, 3, 4-thiadiazole-2-thiol, and benzothiazoles, preferably benzotriazole and/or tolyltriazole, more preferably tolyltriazole.
In the fluorine-containing cleaning liquid composition, the mass fraction of the ammonium carboxylate may be 0.5 to 1.0%, and may be 1.0 to 3.0%.
In the fluorine-containing cleaning liquid composition, the ammonium carboxylate may be an ammonium carboxylate which is conventional in the art, and is preferably one or more of ammonium oxalate, ammonium lactate, ammonium tartrate, triammonium citrate, ammonium acetate, ammonium carbamate, ammonium carbonate, ammonium benzoate, ammonium ethylenediaminetetraacetate, diammonium ethylenediaminetetraacetate, triammonium ethylenediaminetetraacetate, tetraammonium ethylenediaminetetraacetate, ammonium succinate, ammonium formate and 1-H-pyrazole-3-ammonium formate, more preferably ammonium oxalate and/or triammonium citrate, and most preferably triammonium citrate.
In the fluorine-containing cleaning liquid composition, the mass fraction of the EO-PO polymer L81 can be 0.01-0.05%, and can also be 0.05-1.0%.
In the fluorine-containing cleaning liquid composition, the mass fraction of the 9-anthracene formaldehyde-1, 1-diphenylhydrazone can be 0.01-0.9%, and can also be 0.9-2.0%.
In the fluorine-containing cleaning liquid composition, the water is preferably deionized water.
In a preferred embodiment, the fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-30% of oxidant, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.05-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water;
the oxidant is one or more of hydrogen peroxide, peroxyacetic acid and carbamide peroxide;
the organic alkali is tetramethyl ammonium hydroxide and/or choline;
the chelating agent is 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid and/or ethylene diamine tetraacetic acid;
the corrosion inhibitor is benzotriazole and/or tolyltriazole;
the ammonium carboxylate is ammonium oxalate and/or triammonium citrate.
In a preferred embodiment, the fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-15% of oxidant, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.05-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water;
the oxidant is hydrogen peroxide and/or peroxyacetic acid;
the organic alkali is tetramethyl ammonium hydroxide;
the chelating agent is 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid and/or ethylene diamine tetraacetic acid;
the corrosion inhibitor is benzotriazole and/or tolyltriazole;
the ammonium carboxylate is ammonium oxalate and/or triammonium citrate.
In a preferred embodiment, the fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-15% of peroxyacetic acid, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of tetramethylammonium hydroxide, 0.01-2% of ethylene diamine tetraacetic acid, 0.01-2% of benzotriazole, 0.5-3% of ammonium oxalate, 0.01-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water.
In a preferred embodiment, the fluorine-containing cleaning liquid composition is any combination of the following components in parts by mass:
combination 1: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water;
and (3) combination 2: 10% of hydrogen peroxide, 0.01% of reduced glutathione, 0.15% of cysteine, 1.0% of hydrogen fluoride, 1.0% of tetramethylammonium hydroxide, 0.01% of ethylenediamine tetraacetic acid, 0.01% of benzotriazole, 0.5% of ammonium oxalate, 0.01% of EO-PO polymer L81, 0.1% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone, deionized water and the balance of deionized water;
and (3) combination: 30% of hydrogen peroxide, 0.01% of reduced glutathione, 0.25% of cysteine, 5.0% of hydrogen fluoride, 5.0% of tetramethylammonium hydroxide, 2.0% of ethylenediamine tetraacetic acid, 2.0% of benzotriazole, 3.0% of ammonium oxalate, 1.0% of EO-PO polymer L81, 2.0% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone, water and deionized water to make up the balance;
and (4) combination: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water;
and (3) combination 5: 30% of hydrogen peroxide, 0.01% of reduced glutathione, 0.15% of cysteine, 2.5% of hydrogen fluoride, 5.0% of tetramethylammonium hydroxide, 2.0% of ethylenediamine tetraacetic acid, 2.0% of benzotriazole, 3.0% of ammonium oxalate, 1.0% of EO-PO polymer L81, 2.0% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
and (4) combination 6: 15% carbamide peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylene diamine tetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, deionized water, and the balance being deionized water;
and (3) combination 7: 15% of peroxyacetic acid, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of tetramethylammonium hydroxide, 1.0% of ethylenediamine tetraacetic acid, 0.5% of benzotriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
and (4) combination 8: 15% of hydrogen peroxide, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of choline, 1.0% of ethylenediamine tetraacetic acid, 0.5% of benzotriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and deionized water, and the balance is made up by deionized water;
combination 9: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenealdehyde-1, 1-diphenylhydrazone, and deionized water to make up the balance;
combination 10: 15% of hydrogen peroxide, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of tetramethylammonium hydroxide, 1.0% of ethylenediamine tetraacetic acid, 0.5% of tolutriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
combination 11: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% triammonium citrate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water.
In a preferred embodiment, the fluorine-containing cleaning liquid composition comprises the following components: the above-mentioned oxidizing agent, the above-mentioned reduced glutathione, the above-mentioned cysteine, the above-mentioned fluoride, the above-mentioned organic base, the above-mentioned chelating agent, the above-mentioned corrosion inhibitor, the above-mentioned ammonium carboxylate, the above-mentioned EO-PO polymer L81, the above-mentioned 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and the above-mentioned water.
Wherein the above-mentioned oxidizing agent, the above-mentioned fluoride, the above-mentioned organic base, the above-mentioned chelating agent, the above-mentioned corrosion inhibitor, the above-mentioned ammonium carboxylate and the above-mentioned water all refer to the kind and content of these components.
The components of the invention can adopt a split charging mode, and can be mixed temporarily when in use; it is preferable that the above-mentioned oxidizing agent is separately packaged as component A, the components other than the above-mentioned oxidizing agent are mixed and packaged as component B, and AB is mixed at the time of use.
The invention also provides a kit, which comprises one or more containers, wherein the container contains a component for mixing all the components for forming the fluorine-containing cleaning liquid composition, multiple components for independently separating all the components or multiple components for separating all the components into a plurality of groups;
the components are the above-mentioned oxidizing agent, the above-mentioned reduced glutathione, the above-mentioned cysteine, the above-mentioned fluoride, the above-mentioned organic base, the above-mentioned chelating agent, the above-mentioned corrosion inhibitor, the above-mentioned ammonium carboxylate, the above-mentioned EO-PO polymer L81, the above-mentioned 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and the above-mentioned water.
Wherein the above-mentioned oxidizing agent, the above-mentioned fluoride, the above-mentioned organic base, the above-mentioned chelating agent, the above-mentioned corrosion inhibitor, the above-mentioned ammonium carboxylate and the above-mentioned water all refer to the kind and content of these components.
Preferably, the oxidizing agent is separately placed in the vessel.
The invention also provides a preparation method of the fluorine-containing cleaning liquid composition, which comprises the following steps of mixing the components to obtain the fluorine-containing cleaning liquid composition.
Wherein, the mixing is preferably carried out by adding the solid component in the components into the liquid component and uniformly stirring.
Wherein the temperature of the mixing may be room temperature.
The invention also provides the application of the substance A in cleaning one or more of the residues after plasma etching, the residues after plasma ashing and the hard mask on the microelectronic device, wherein the substance A is the fluorine-containing cleaning solution composition or the kit.
The microelectronic device is preferably a silicon wafer.
The microelectronic device preferably includes a low dielectric material, and the hard mask is disposed on the low dielectric material.
The hard mask material is preferably a Ti-containing material, a TiN-containing material, a TaN-containing material, a TiNxOy-containing material or a Ti alloy.
In such applications, it is preferred to immerse the microelectronic device in the fluorine-containing cleaning solution composition. The dipping time can be 20-30 min. The temperature of the impregnation may be 40-60 c, for example 50 c.
In the application, the Ti alloy is a Ti alloy which is conventional in the field.
In the present invention, the "low dielectric material" refers to a material having a dielectric constant of 3.5 or less.
The above preferred conditions can be arbitrarily combined to obtain preferred embodiments of the present invention without departing from the common general knowledge in the art.
The 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone is self-made and is prepared according to example 2 in patent CN 106366017A; other reagents and starting materials are commercially available, with EO-PO polymer L81, EO-PO polymer L42, EO-PO polymer L62 and EO-PO polymer L31 all purchased from Nantong Koilai chemical Co.
The positive progress effects of the invention are as follows: the fluorine-containing cleaning solution composition has the advantages of highly selectively removing TiN, TaN, TiNxOy, Ti hard mask and Ti alloy hard mask, and has good cleaning effect on post-plasma etching residues and post-ashing residues.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention. The experimental methods without specifying specific conditions in the following examples were selected according to the conventional methods and conditions, or according to the commercial instructions.
In the following examples, the specific operation temperature is not limited, and all the operations are carried out at room temperature. The room temperature is 10-30 ℃.
The fluorine-containing cleaning liquid composition comprises the following components: the kinds and contents of the oxidant, reduced glutathione, cysteine, fluoride, organic base, chelating agent, corrosion inhibitor, ammonium carboxylate, EO-PO polymer L81, 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water are shown in tables 1 and 2, respectively.
The fluorine-containing cleaning solution composition is prepared by adding a solid component into a liquid component according to the components and contents in tables 1 and 2 and uniformly stirring.
TABLE 1
TABLE 2
The fluorine-containing cleaning liquid compositions of comparative examples 1 to 19 below were obtained by adding the solid component to the liquid component in accordance with the following components and contents and stirring them uniformly.
The following comparative examples 1 to 15 are screens of the kinds or contents of components based on example 1.
Comparative example 1
The component reduced glutathione in example 1 was replaced with oxidized glutathione, and the others were unchanged.
Comparative example 2
The reduced glutathione component in example 1 was removed and the rest was unchanged.
Comparative example 3
The cysteine component of example 1 was removed and the others were unchanged.
Comparative example 4
The cysteine component in example 1 was replaced with arginine, and the others were not changed.
Comparative example 5
The cysteine component in example 1 was replaced by histidine, and the others were unchanged.
Comparative example 6
The EO-PO polymer L81 of example 1 was removed and the rest was unchanged.
Comparative example 7
The 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone component in example 1 was removed, and the rest was unchanged.
Comparative example 8
The ammonium carboxylate component of example 1 was removed and the rest was unchanged.
Comparative example 9
The EO-PO polymer L81 was replaced by EO-PO polymer L42, except in example 1, which was otherwise unchanged.
Comparative example 10
The EO-PO polymer L81 was replaced by EO-PO polymer L62, except in example 1, which was otherwise unchanged.
Comparative example 11
The EO-PO polymer L81 was replaced by EO-PO polymer L31, except in example 1, which was otherwise unchanged.
Comparative example 8
The corrosion inhibitor of the composition in example 1 was removed, and the rest was unchanged.
Comparative example 13
The content of the oxidizing agent in example 1 was replaced with 9%, and the rest was unchanged.
Comparative example 14
The content of reduced glutathione in example 1 was replaced with 0.02%, and the rest was unchanged.
Comparative example 15
The cysteine content in example 1 was replaced with 0.40%, and the others were unchanged.
Comparative example 16
The EO-PO polymer L81 content in example 1 was replaced by 1.10%, the other being unchanged.
Comparative example 17
The content of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone in example 1 was replaced with 2.10%, and the others were not changed.
Comparative example 18
The EO-PO polymer L81 content in example 1 was replaced by 0.0005%, the other being unchanged.
Comparative example 19
The content of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone in example 1 was replaced with 0.0005%, and the others were not changed.
Effects of the embodiment
1. Etch rate
TABLE 3
TABLE 4
Remarking: the "TiN" in the table is PVD (physical Vapor deposition) TiN.
In Table 3, the fluorine-containing cleaning liquid composition of the present invention was applied to siliconThe etching rates of AlNxOy, aluminum nitride, W, copper, TEOS, BD2, SiCN and cobalt on the wafer are extremely low and are all less than
Fluorine-containing cleaning solutions not within the scope of the present application etch such materials at rates up to about the maximum rate
In Table 4, the fluorine-containing cleaning liquid composition of the present invention has extremely high etching rates of Ti, TiN, TaN and TiNxOy on silicon wafers, which are all higher than those of Ti, TiN, TaN and TiNxOy
Therefore, the hard mask can be quickly removed; the fluorine-containing cleaning liquid which is not in the scope of the application has extremely low etching rate to the materials, and the lowest etching rate is only that
In combination with tables 3 and 4, the fluorine-containing cleaning solution composition of the present invention has a high etching selectivity to Ti, TiN, TaN and TiNxOy on a silicon wafer, and a selection ratio of at least 279:1, preferably 18075, relative to TiN/Cu as an example of the interconnection material on the device in Table 3. Particularly, examples 1,2,4, 7, 9, 10 and 11 all have TiN/Cu of above 983 and have a lower etching rate than copper
2. Cleaning effect
The cleaning effect is divided into four grades: a-no residue was observed; b-very little residue was observed; C-Small residue observed; d-significantly more residue was observed.
The corrosion effect is classified into four grades: good A-compatibility without undercutting; b-there is very slight undercut; c-there is little undercut; d-undercut is more pronounced and severe.
TABLE 5
Therefore, the fluorine-containing cleaning solution composition has good cleaning effect on patterned wafers of plasma etching residues and ashing residues and good compatibility with metal wires.
Claims (10)
1. The fluorine-containing cleaning liquid composition is characterized by comprising the following components in percentage by mass: 10-30% of oxidant, 0.001-0.01% of reduced glutathione, 0.001-0.25% of cysteine, 1-5% of fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.01-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance being water; the sum of the mass fractions of the components is 100 percent.
2. A fluorine-containing cleaning liquid composition according to claim 1, wherein the mass fraction of said oxidizing agent in said fluorine-containing cleaning liquid composition is 10 to 15%, and may be 15 to 30%;
and/or in the fluorine-containing cleaning solution composition, the mass fraction of the reduced glutathione is 0.005-0.01%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the cysteine is 0.15-0.25%;
and/or in the fluorine-containing cleaning liquid composition, the mass fraction of the fluoride is 1.0-2.5%, and can also be 2.5-5.0%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the organic alkali is 1.0-2.5%, and can be 2.5-5.0%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the chelating agent is 0.01-1.0%, and can be 1.0-2.0%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the corrosion inhibitor is 0.01-0.5%, and can be 0.5-2.0%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the ammonium carboxylate is 0.5-1.0%, and can also be 1.0-3.0%;
and/or, in the fluorine-containing cleaning liquid composition, the mass fraction of the EO-PO polymer L81 is 0.01-0.05%, and can be 0.05-1.0%;
and/or in the fluorine-containing cleaning solution composition, the mass fraction of the 9-anthracene formaldehyde-1, 1-diphenylhydrazone is 0.01-0.9%, and can be 0.9-2.0%.
3. A fluorine-containing cleaning liquid composition according to claim 1, wherein said fluorine-containing cleaning liquid composition is free from an amine compound, an alcohol amine compound or an amine-N-oxide compound; the alcohol amine compounds are triethanolamine, N-methylethanolamine and N, N-dimethyldiglycolamine; the amine-N-oxide compound is N-methylmorpholine oxide;
and/or, in the fluorine-containing cleaning liquid composition, the oxidizing agent is one or more of hydrogen peroxide, benzoyl peroxide, tetrabutylammonium peroxymonosulfate, ozone, ferric chloride, permanganate, perborate, perchlorate, persulfate, ammonium peroxodisulfate, peracetic acid, urea peroxide, nitric acid, ammonium chlorite, ammonium chlorate, ammonium iodate, ammonium perborate, ammonium perchlorate, ammonium periodate, ammonium persulfate, tetramethylammonium chlorite, tetramethylammonium chlorate, tetramethylammonium iodate, tetramethylammonium perborate, tetramethylammonium perchlorate, tetramethylammonium periodate, tetramethylammonium persulfate, urea peroxide and peracetic acid, preferably one or more of hydrogen peroxide, urea peroxide and peracetic acid, more preferably hydrogen peroxide and/or peracetic acid;
and/or, in the fluorine-containing cleaning liquid composition, the fluoride is one or more of hydrogen fluoride, ammonium fluoride, potassium fluoride, alkali metal fluoride, tetraalkylammonium fluoride, fluoroboric acid, ammonium tetrafluoroborate, alkali metal tetrafluoroborate, tetraalkylammonium tetrafluoroborate and trimethyloxonium tetrafluoroborate, preferably hydrogen fluoride;
and/or, in the fluorine-containing cleaning solution composition, the organic base is one or more of tetramethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetraethylammonium hydroxide, benzyltrimethylammonium hydroxide, choline, (2-hydroxyethyl) trimethylammonium hydroxide, tris (2-hydroxyethyl) methylammonium hydroxide, monoethanolamine, diglycolamine, triethanolamine, isobutanolamine, isopropanolamine, tetrabutylphosphonium hydroxide and tetramethylguanidine, preferably one or more of tetramethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, tetraethylammonium hydroxide and choline, more preferably tetramethylammonium hydroxide;
and/or, in the fluorine-containing cleaning liquid composition, the chelating agent is one or more of 1, 2-cyclohexanediamine-N, N, N ', N ' -tetraacetic acid, ethylenediamine tetraacetic acid, nitrilotriacetic acid, diethylenetriaminepentaacetic acid, 1,4,7, 10-tetraazacyclododecane-1, 4,7, 10-tetraacetic acid, ethylene glycol tetraacetic acid, 1, 2-bis (o-aminophenoxy) ethane-N, N, N ', N ' -tetraacetic acid, N- {2- [ bis (carboxymethyl) amino ] ethyl } -N- (2-hydroxyethyl) glycine, ethylenediamine-N, N ' -bis (2-hydroxyphenyl acetic acid), dioxaoctamethylenediazene tetraacetic acid and triethylenetetramine hexaacetic acid, preferably 1, 2-cyclohexanediamine-N, N' -tetraacetic acid and/or ethylenediaminetetraacetic acid, more preferably ethylenediaminetetraacetic acid;
and/or in the fluorine-containing cleaning solution composition, the corrosion inhibitor is benzotriazole, tolyltriazole, 5-phenyl-benzotriazole, 5-nitro-benzotriazole, 3-amino-5-mercapto-1, 2, 4-triazole, 1-amino-1, 2, 4-triazole, hydroxybenzotriazole, 2- (5-amino-pentyl) -benzotriazole, 1-amino-1, 2, 3-triazole, 1-amino-5-methyl-1, 2, 3-triazole, 3-amino-1, 2, 4-triazole, 3-mercapto-1, 2, 4-triazole, 3-isopropyl-1, 2, 4-triazole, 5-benzenethiol-benzotriazole, benzotriazole derivatives thereof, and the like, Halo-benzotriazoles, naphthotriazoles, 2-Mercaptobenzimidazoles (MBI), 2-mercaptobenzothiazoles, 4-methyl-2-phenylimidazoles, 2-mercaptothiazolines, 5-aminotetrazoles, 5-aminotetrazole monohydrate, 5-amino-1, 3, 4-thiadiazole-2-thiol, 2, 4-diamino-6-methyl-1, 3, 5-triazines, thiazoles, triazines, methyltetrazoles, 1, 3-dimethyl-2-imidazolidinone, 1, 5-pentamethylenetetrazole, 1-phenyl-5-mercaptotetrazole, diaminomethyltriazine, imidazolinethiones, mercaptobenzimidazoles, 4-methyl-4H-1, 2, 4-triazole-3-thiol, thiotriazines, aminotetrazoles, aminothiazoles, thiazoles, triazines, methyltetrazoles, 1, 3-dimethyl-2-imidazolidinones, 1, 5-pentamethylenetetrazoles, 1-phenyl-5-mercaptotetrazoles, diaminomethyltriazines, imidazolinones, mercaptobenzimidazoles, 4-4H-1, 2, 4-triazole-3-thiols, thiotriazines, thioles, and mixtures thereof, One or more of 5-amino-1, 3, 4-thiadiazole-2-thiol and benzothiazole, preferably benzotriazole and/or tolyltriazole, more preferably tolyltriazole;
and/or in the fluorine-containing cleaning liquid composition, the ammonium carboxylate is one or more of ammonium oxalate, ammonium lactate, ammonium tartrate, triammonium citrate, ammonium acetate, ammonium carbamate, ammonium carbonate, ammonium benzoate, ammonium ethylenediamine tetraacetate, diammonium ethylenediamine tetraacetate, triammonium ethylenediamine tetraacetate, tetraammonium ethylenediamine tetraacetate, ammonium succinate, ammonium formate and 1-H-pyrazole-3-ammonium formate, preferably ammonium oxalate and/or triammonium citrate, and more preferably triammonium citrate;
and/or the water is deionized water.
4. A fluorine-containing cleaning liquid composition according to claim 1, wherein said fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-30% of oxidant, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.05-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water;
the oxidant is one or more of hydrogen peroxide, peroxyacetic acid and carbamide peroxide;
the organic alkali is tetramethyl ammonium hydroxide and/or choline;
the chelating agent is 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid and/or ethylene diamine tetraacetic acid;
the corrosion inhibitor is benzotriazole and/or tolyltriazole;
the ammonium carboxylate is ammonium oxalate and/or triammonium citrate.
5. A fluorine-containing cleaning liquid composition according to claim 1, wherein said fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-15% of oxidant, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of organic base, 0.01-2% of chelating agent, 0.01-2% of corrosion inhibitor, 0.5-3% of ammonium carboxylate, 0.05-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water;
the oxidant is hydrogen peroxide and/or peroxyacetic acid;
the organic alkali is tetramethyl ammonium hydroxide;
the chelating agent is 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid and/or ethylene diamine tetraacetic acid;
the corrosion inhibitor is benzotriazole and/or tolyltriazole;
the ammonium carboxylate is ammonium oxalate and/or triammonium citrate.
6. A fluorine-containing cleaning liquid composition according to claim 1, wherein said fluorine-containing cleaning liquid composition comprises the following components in parts by mass: 10-15% of peroxyacetic acid, 0.005-0.01% of reduced glutathione, 0.15-0.25% of cysteine, 1-5% of hydrogen fluoride, 1-5% of tetramethylammonium hydroxide, 0.01-2% of ethylene diamine tetraacetic acid, 0.01-2% of benzotriazole, 0.5-3% of ammonium oxalate, 0.01-1% of EO-PO polymer L81, 0.01-2% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and water, and the balance of water.
7. The fluorine-containing cleaning solution composition according to claim 1, wherein the fluorine-containing cleaning solution composition comprises any combination of the following components in parts by mass:
combination 1: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water;
and (3) combination 2: 10% of hydrogen peroxide, 0.01% of reduced glutathione, 0.15% of cysteine, 1.0% of hydrogen fluoride, 1.0% of tetramethylammonium hydroxide, 0.01% of ethylenediamine tetraacetic acid, 0.01% of benzotriazole, 0.5% of ammonium oxalate, 0.01% of EO-PO polymer L81, 0.1% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone, deionized water and the balance of deionized water;
and (3) combination: 30% of hydrogen peroxide, 0.01% of reduced glutathione, 0.25% of cysteine, 5.0% of hydrogen fluoride, 5.0% of tetramethylammonium hydroxide, 2.0% of ethylenediamine tetraacetic acid, 2.0% of benzotriazole, 3.0% of ammonium oxalate, 1.0% of EO-PO polymer L81, 2.0% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone, water and deionized water to make up the balance;
and (4) combination: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water;
and (3) combination 5: 30% of hydrogen peroxide, 0.01% of reduced glutathione, 0.15% of cysteine, 2.5% of hydrogen fluoride, 5.0% of tetramethylammonium hydroxide, 2.0% of ethylenediamine tetraacetic acid, 2.0% of benzotriazole, 3.0% of ammonium oxalate, 1.0% of EO-PO polymer L81, 2.0% of 9-anthracene formaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
and (4) combination 6: 15% carbamide peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylene diamine tetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, deionized water, and the balance being deionized water;
and (3) combination 7: 15% of peroxyacetic acid, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of tetramethylammonium hydroxide, 1.0% of ethylenediamine tetraacetic acid, 0.5% of benzotriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
and (4) combination 8: 15% of hydrogen peroxide, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of choline, 1.0% of ethylenediamine tetraacetic acid, 0.5% of benzotriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and deionized water, and the balance is made up by deionized water;
combination 9: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% 1, 2-cyclohexanediamine-N, N, N ', N' -tetraacetic acid, 0.5% benzotriazole, 1.0% ammonium oxalate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenealdehyde-1, 1-diphenylhydrazone, and deionized water to make up the balance;
combination 10: 15% of hydrogen peroxide, 0.005% of reduced glutathione, 0.25% of cysteine, 2.5% of hydrogen fluoride, 2.5% of tetramethylammonium hydroxide, 1.0% of ethylenediamine tetraacetic acid, 0.5% of tolutriazole, 1.0% of ammonium oxalate, 0.05% of EO-PO polymer L81, 0.9% of 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone and deionized water, and the balance is made up by deionized water;
combination 11: 15% hydrogen peroxide, 0.005% reduced glutathione, 0.25% cysteine, 2.5% hydrogen fluoride, 2.5% tetramethylammonium hydroxide, 1.0% ethylenediaminetetraacetic acid, 0.5% benzotriazole, 1.0% triammonium citrate, 0.05% EO-PO polymer L81, 0.9% 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and deionized water, the balance being made up by deionized water.
8. A fluorine-containing cleaning liquid composition according to any one of claims 1 to 7, wherein said fluorine-containing cleaning liquid composition is composed of: said oxidizing agent, said reduced glutathione, said cysteine, said fluoride, said organic base, said chelating agent, said corrosion inhibitor, said ammonium carboxylate, said EO-PO polymer L81, said 9-anthracenecarboxaldehyde-1, 1-diphenylhydrazone, and said water.
9. A kit comprising one or more containers containing a component forming a mixture of the components of the fluorine cleaning solution composition according to any one of claims 1 to 8, separate components or a plurality of components dividing the components into several groups;
the components are the oxidant, the reduced glutathione, the cysteine, the fluoride, the organic base, the chelating agent, the corrosion inhibitor, the ammonium carboxylate, the EO-PO polymer L81, the 9-anthracene formaldehyde-1, 1-diphenyl hydrazone and the water.
10. Use of a material a for cleaning one or more of post plasma etch residues, post plasma ash residues, and hard masks on a microelectronic device, said material a being a fluorine-containing cleaning solution composition according to any one of claims 1 to 8 or a kit according to claim 9.
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| CN115895792A (en) * | 2022-11-11 | 2023-04-04 | 上海新阳半导体材料股份有限公司 | Cleaning solution and kit |
| CN116042331A (en) * | 2022-11-11 | 2023-05-02 | 上海新阳半导体材料股份有限公司 | Application of cleaning liquid |
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| CN115558557A (en) * | 2022-11-03 | 2023-01-03 | 上海新阳半导体材料股份有限公司 | Preparation method of cleaning fluid composition |
| CN115895792A (en) * | 2022-11-11 | 2023-04-04 | 上海新阳半导体材料股份有限公司 | Cleaning solution and kit |
| CN116042331A (en) * | 2022-11-11 | 2023-05-02 | 上海新阳半导体材料股份有限公司 | Application of cleaning liquid |
| CN115895792B (en) * | 2022-11-11 | 2024-02-23 | 上海新阳半导体材料股份有限公司 | Cleaning solution and kit |
| CN116042331B (en) * | 2022-11-11 | 2024-03-08 | 上海新阳半导体材料股份有限公司 | Application of cleaning liquid |
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