CN113165027B - Cleaning of flux residue - Google Patents
Cleaning of flux residue Download PDFInfo
- Publication number
- CN113165027B CN113165027B CN201980080692.6A CN201980080692A CN113165027B CN 113165027 B CN113165027 B CN 113165027B CN 201980080692 A CN201980080692 A CN 201980080692A CN 113165027 B CN113165027 B CN 113165027B
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- CN
- China
- Prior art keywords
- component
- mass
- cleaning
- group
- cleaning agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 116
- 230000004907 flux Effects 0.000 title claims abstract description 114
- 239000000203 mixture Substances 0.000 claims abstract description 165
- 239000012459 cleaning agent Substances 0.000 claims abstract description 115
- 238000000034 method Methods 0.000 claims abstract description 88
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 61
- 150000001875 compounds Chemical class 0.000 claims abstract description 51
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 46
- 239000003960 organic solvent Substances 0.000 claims abstract description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 16
- 125000002883 imidazolyl group Chemical group 0.000 claims abstract description 15
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 15
- 125000004193 piperazinyl group Chemical group 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims description 49
- 238000004519 manufacturing process Methods 0.000 claims description 33
- -1 tetrahydrofurfuryl Chemical group 0.000 claims description 31
- 239000003599 detergent Substances 0.000 claims description 28
- 238000005476 soldering Methods 0.000 claims description 26
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 16
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 14
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 14
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 14
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 14
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 13
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 12
- 150000001412 amines Chemical class 0.000 claims description 10
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 claims description 9
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 9
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 claims description 8
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 8
- SVNWKKJQEFIURY-UHFFFAOYSA-N 2-methyl-1-(2-methylpropyl)imidazole Chemical compound CC(C)CN1C=CN=C1C SVNWKKJQEFIURY-UHFFFAOYSA-N 0.000 claims description 7
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 claims description 7
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 7
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 7
- 125000002541 furyl group Chemical group 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 7
- XFLSMWXCZBIXLV-UHFFFAOYSA-N n,n-dimethyl-2-(4-methylpiperazin-1-yl)ethanamine Chemical compound CN(C)CCN1CCN(C)CC1 XFLSMWXCZBIXLV-UHFFFAOYSA-N 0.000 claims description 6
- 125000000466 oxiranyl group Chemical group 0.000 claims description 5
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 5
- 125000003718 tetrahydrofuranyl group Chemical group 0.000 claims description 5
- 125000003566 oxetanyl group Chemical group 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 27
- 239000000243 solution Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 10
- 239000000543 intermediate Substances 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- 235000019445 benzyl alcohol Nutrition 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 4
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 3
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 239000002529 flux (metallurgy) Substances 0.000 description 3
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 3
- JMVIVASFFKKFQK-UHFFFAOYSA-N 1-phenylpyrrolidin-2-one Chemical compound O=C1CCCN1C1=CC=CC=C1 JMVIVASFFKKFQK-UHFFFAOYSA-N 0.000 description 2
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 2
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 2
- IOGISYQVOGVIEU-UHFFFAOYSA-N 4-hydroxypyrrolidin-2-one Chemical compound OC1CNC(=O)C1 IOGISYQVOGVIEU-UHFFFAOYSA-N 0.000 description 2
- LEGVTAFKUDAZRE-UHFFFAOYSA-N 5-ethylnonane-1,2,3-triol Chemical compound CCCCC(CC)CC(O)C(O)CO LEGVTAFKUDAZRE-UHFFFAOYSA-N 0.000 description 2
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- WPPOGHDFAVQKLN-UHFFFAOYSA-N N-Octyl-2-pyrrolidone Chemical compound CCCCCCCCN1CCCC1=O WPPOGHDFAVQKLN-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 150000001414 amino alcohols Chemical class 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 239000013556 antirust agent Substances 0.000 description 2
- 239000003899 bactericide agent Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- YVIVRJLWYJGJTJ-UHFFFAOYSA-N gamma-Valerolactam Chemical compound CC1CCC(=O)N1 YVIVRJLWYJGJTJ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229960005323 phenoxyethanol Drugs 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003755 preservative agent Substances 0.000 description 2
- 230000002335 preservative effect Effects 0.000 description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000011550 stock solution Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- DSESGJJGBBAHNW-UHFFFAOYSA-N (e)-[amino(anilino)methylidene]-phenylazanium;bromide Chemical compound Br.C=1C=CC=CC=1N=C(N)NC1=CC=CC=C1 DSESGJJGBBAHNW-UHFFFAOYSA-N 0.000 description 1
- FILVIKOEJGORQS-UHFFFAOYSA-N 1,5-dimethylpyrrolidin-2-one Chemical compound CC1CCC(=O)N1C FILVIKOEJGORQS-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- CVDGNRZPDAXOQO-UHFFFAOYSA-N 1-(3-hydroxypropyl)pyrrolidin-2-one Chemical compound OCCCN1CCCC1=O CVDGNRZPDAXOQO-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- FOUZISDNESEYLX-UHFFFAOYSA-N 2-(2-hydroxyethylazaniumyl)acetate Chemical compound OCCNCC(O)=O FOUZISDNESEYLX-UHFFFAOYSA-N 0.000 description 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- IDHKBOHEOJFNNS-UHFFFAOYSA-N 2-[2-(2-phenoxyethoxy)ethoxy]ethanol Chemical compound OCCOCCOCCOC1=CC=CC=C1 IDHKBOHEOJFNNS-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- NCZPCONIKBICGS-UHFFFAOYSA-N 3-(2-ethylhexoxy)propane-1,2-diol Chemical compound CCCCC(CC)COCC(O)CO NCZPCONIKBICGS-UHFFFAOYSA-N 0.000 description 1
- HOJZEMQCQRPLQQ-UHFFFAOYSA-N 4-phenylpyrrolidin-2-one Chemical compound C1NC(=O)CC1C1=CC=CC=C1 HOJZEMQCQRPLQQ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- VSSAZBXXNIABDN-UHFFFAOYSA-N cyclohexylmethanol Chemical compound OCC1CCCCC1 VSSAZBXXNIABDN-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229930182478 glucoside Natural products 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000008624 imidazolidinones Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000003884 phenylalkyl group Chemical group 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/32—Amides; Substituted amides
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present disclosure provides, in one embodiment, a cleaning method that is excellent in flux removal. In one embodiment, the present disclosure relates to a cleaning method including a step of cleaning an object to be cleaned having flux residue with a cleaning agent composition containing an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring.
Description
Technical Field
The present disclosure relates to a cleaning agent composition for cleaning flux residue, a cleaning method using the cleaning agent composition, and a method for manufacturing an electronic component.
Background
In recent years, in mounting electronic components on printed wiring boards and ceramic substrates, the components have been miniaturized from the viewpoints of low power consumption and high-speed processing, and the gap to be cleaned at the time of cleaning of solder flux has been narrowed. In addition, lead-free solders have been used in terms of environmental safety, and rosin-based fluxes have been used in association with this.
International publication No. 2012/005068 (patent document 1) discloses a stock solution for a cleaning agent composition for use in a state of cloudiness in which a specific amount of water is added to a cleaning object, the stock solution for a cleaning agent composition comprising 1 st and 2 nd organic solvents as organic solvents, the 1 st organic solvent being a predetermined hydrophobic glycol ether compound or the like, the 2 nd organic solvent being a predetermined hydrophilic amine compound, the amount of the 2 nd organic solvent being a value in the range of 0.3 to 30 parts by weight relative to 100 parts by weight of the 1 st organic solvent, and the amount of the organic solvent having a boiling point exceeding 190 ℃ being a value in the predetermined range.
International publication No. 2005/021700 (patent document 2) discloses a cleaning agent for removing solder flux, which is characterized in that: when the content of the diol compound is less than 1 wt%, the content of the benzyl alcohol is in the range of 70 to 99.9 wt% and the content of the amino alcohol is in the range of 0.1 to 30 wt%, and when the content of the diol compound is 1 to 40 wt%, the content of the benzyl alcohol is in the range of 15 to 99 wt% and the content of the amino alcohol is in the range of 0.1 to 30 wt%.
Japanese patent application laid-open No. 7-179893 (patent document 3) discloses the following cleaning composition: comprises 0-30wt% of N-methyl-2-pyrrolidone and at least one compound selected from phosphines, phenols, imidazolidinones, imidazoles or fluorenes.
Disclosure of Invention
In one embodiment, the present disclosure relates to a cleaning method including a step of cleaning an object to be cleaned having flux residue with a cleaning agent composition containing an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring.
The present disclosure relates to a method for manufacturing an electronic component, including: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method of the present disclosure.
The present disclosure relates to a composition for use as a cleaning agent for cleaning an object to be cleaned having flux residue, the composition containing an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring.
Detailed Description
In recent years, due to miniaturization of semiconductor package substrates, solder bumps have been miniaturized, and gaps between the solder bumps and members to be connected have been narrowed. Further, since solder bumps are miniaturized and gaps between the solder bumps and members to be connected are narrowed, the cleaning agent composition disclosed in the above patent document is insufficient in the removal property of the flux residue (flux removal property), and is said to be insufficient in the cleaning property.
Accordingly, the present disclosure provides a cleaning agent composition having excellent flux removability, a cleaning method using the same, and a method of manufacturing an electronic component.
According to the present disclosure, in one embodiment, a cleaning agent composition and a cleaning method excellent in flux removal property can be provided.
The present disclosure is based on the following recognition: when a cleaning agent composition containing a specific solvent and a specific amine is used for removing flux residue, the removal performance of the flux residue is improved as compared with the conventional one.
That is, the present disclosure relates to a cleaning method (hereinafter, also referred to as "the cleaning method of the present disclosure") including a step of cleaning an object to be cleaned having flux residue with a cleaning agent composition containing an organic solvent (component a) and a compound having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring (component B). According to the present disclosure, in one or more embodiments, the flux residue of the object to be cleaned can be efficiently removed.
In another aspect, the present disclosure relates to a composition (hereinafter, also referred to as "the cleaning agent composition of the present disclosure") for use as a cleaning agent in cleaning an object to be cleaned having flux residue, the composition containing an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms at the nitrogen atom of an imidazole ring or piperazine ring. According to the present disclosure, in one or more embodiments, a cleaning agent composition excellent in flux removability can be obtained. Further, according to the present disclosure, in one or more embodiments, a cleaning agent composition capable of suppressing the influence of corrosion or the like of a weld metal can be obtained.
The details of the mechanism of action of the effects of the cleaning method of the present disclosure and the cleaning agent composition of the present disclosure remain unclear, but are presumed as follows.
That is, in the cleaning method of the present disclosure and the cleaning agent composition of the present disclosure, the component a penetrates the flux and the flux residue deteriorated by reflow or the like to reduce the viscosity so as to be easily flowable, and the component B acts to form a salt with the flux to decompose or hydrophilize the flux and the flux residue so as to be easily dissolved in the cleaning agent composition.
In addition, it is presumed that the component B increases the solubility in water in the rinsing step after the cleaning of the flux and the flux residue, improves the removability by the rinsing, and reduces the remaining after the cleaning and rinsing.
Further, it is presumed that the component B acts on the solder metal in the solvent containing the component a, and the cleaning property is improved as described above without corroding the solder metal, so that the cleaning agent composition for removing the flux residue, which can suppress the influence of corrosion or the like of the solder metal, is obtained.
However, the present disclosure may also be construed without being limited to this mechanism.
In the present disclosure, "soldering" refers to rosin-based soldering fluxes containing rosin or rosin derivatives for soldering, water-soluble soldering fluxes containing no rosin, and the like for removing oxides that interfere with the connection of metals such as electrodes and wirings to solder metals to promote the connection, and in the present disclosure, "soldering" includes soldering by reflow soldering and flow soldering. In the present disclosure, "solder flux" refers to a mixture of solder and flux. In the present disclosure, "flux residue" refers to a residue derived from flux that remains on a substrate after a solder bump is formed using flux and/or a substrate after soldering using flux. For example, when other components (for example, a semiconductor chip, a chip capacitor, and other circuit boards) are stacked and mounted on a circuit board, a space (gap) is formed between the circuit board and the other components. The flux used for the mounting may remain in the gap as a flux residue after soldering by reflow soldering or the like.
[ cleaning method ]
The cleaning method of the present disclosure is, in one or more embodiments, a cleaning method for removing flux residue, which includes a step of cleaning an object to be cleaned having flux residue with the cleaning agent composition of the present disclosure. The cleaning methods of the present disclosure include, in one or more embodiments, contacting a cleaned object having flux residue with a cleaning agent composition of the present disclosure. Examples of the method of cleaning the object to be cleaned using the cleaning agent composition of the present disclosure or the method of bringing the cleaning agent composition of the present disclosure into contact with the object to be cleaned include a method of bringing the cleaning agent composition into contact with the object to be cleaned in a bath of an ultrasonic cleaning apparatus, a method of spraying the cleaning agent composition in a spray form and bringing the cleaning agent composition into contact with the object to be cleaned (a spray method), and the like. The cleaning agent composition of the present disclosure can be used directly for cleaning without dilution. The cleaning method of the present disclosure preferably includes a step of washing with water and drying after contacting the object to be cleaned with the cleaning agent composition. In the case of the cleaning method of the present disclosure, the flux residue remaining in the gap of the welded member can be efficiently cleaned. The solder is preferably a lead-free (Pb) solder in terms of the remarkable effect of the cleaning property and the penetration into a narrow gap of the cleaning method of the present disclosure. Further, from the same viewpoint, the cleaning method of the present disclosure is preferably used for electronic parts which are solder-connected using a flux described in International publication No. 2006/025224, japanese patent application laid-open No. 6-75796, japanese patent application laid-open No. 2014-144473, japanese patent application laid-open No. 2004-230426, japanese patent application laid-open No. 2013-188761, japanese patent application laid-open No. 2013-173184, and the like. In the cleaning method of the present disclosure, in order to easily exert the cleaning power of the cleaning agent composition of the present disclosure, it is preferable to irradiate ultrasonic waves when the cleaning agent composition of the present disclosure is in contact with an object to be cleaned, and it is more preferable that the ultrasonic waves are strong. The frequency of the ultrasonic wave is preferably 26 to 72Hz, 80 to 1500W, more preferably 36 to 72Hz, and 80 to 1500W, from the same point of view.
[ detergent composition ]
The cleaning agent composition of the present disclosure is a composition for use as a cleaning agent in cleaning an object to be cleaned having flux residue, and in one or more embodiments is a cleaning agent composition for removing flux residue. In the present disclosure, "cleaning agent composition for removing flux residue" means, in one or more embodiments, a cleaning agent composition for removing flux residue after forming solder bumps and/or soldering using a flux or solder flux. In terms of the remarkable effect of the detergency of the detergent composition of the present disclosure, the solder is preferably a lead-free (Pb) solder containing tin.
Accordingly, the present disclosure relates to a composition for use as a cleaning agent in cleaning an object to be cleaned having flux residue, the composition containing an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring.
The present disclosure relates to a cleaning agent composition for removing flux residue, which contains: at least one solvent (component a) selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III); and at least one amine (component B) selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole, 1-isobutyl-2-methylimidazole and 1- (2-dimethylaminoethyl) -4-methylpiperazine.
The present disclosure relates to a use of a composition for cleaning an object to be cleaned having a flux residue, the composition comprising an organic solvent (component a) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on a nitrogen atom of an imidazole ring or piperazine ring.
(component A: organic solvent)
Component a in the cleaning agent composition of the present disclosure is an organic solvent. In one or more embodiments, the component a is preferably at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III) from the viewpoint of improving the flux removability. The component A may be 1 kind, 2 kinds, or 2 kinds or more.
R 1 -O-(AO) n -R 2 (I)
In the above formula (I), R is preferable from the viewpoint of improving the flux removability 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is an integer of 1 to 3 inclusive in terms of the number of addition moles of AO.
In the above formula (I), R is from the viewpoint of improving the flux removability 1 The alkyl group is preferably a phenyl group or an alkyl group having 1 to 8 carbon atoms, more preferably a phenyl group or an alkyl group having 4 to 6 carbon atoms, and still more preferably an alkyl group having 4 to 6 carbon atoms. From the viewpoint of improving the flux removability, R 2 The alkyl group is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and still more preferably a hydrogen atom or an n-butyl group. In addition, from the viewpoint of improving the flux removability, R is preferable 1 Is alkyl of 1 to 3 carbon atoms, R 2 Is an alkyl group having 1 to 3 carbon atoms. From the viewpoint of improving the flux removability, AO is preferably an ethylene oxide group or a propylene oxide group, more preferably an ethylene oxide group. From the viewpoint of improving the flux removability, n is preferably an integer of 1 to 3, more preferably 1 or 2, and even more preferably 2.
Examples of the compound represented by the formula (I) include: monophenyl ether such as ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, triethylene glycol monophenyl ether, and the like; monoalkyl ethers such as ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether and triethylene glycol monoalkyl ether having an alkyl group having 1 to 8 carbon atoms; dialkyl ethers such as ethylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, and triethylene glycol dialkyl ethers having an alkyl group having 1 to 8 carbon atoms and an alkyl group having 1 to 4 carbon atoms; phenyl alkyl ethers such as ethylene glycol phenyl alkyl ether, diethylene glycol phenyl alkyl ether and triethylene glycol phenyl alkyl ether having a phenyl group and an alkyl group having 1 to 4 carbon atoms. The compound represented by the above formula (I) is preferably at least one selected from ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, ethylene glycol dibutyl ether, diethylene glycol dibutyl ether and triethylene glycol dimethyl ether, more preferably at least one selected from diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monophenyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether, still more preferably at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether and diethylene glycol dimethyl ether, and still more preferably diethylene glycol dimethyl ether.
R 3 -CH 2 OH(II)
In the above formula (II), R is from the viewpoint of improving the flux removability 3 Preferably phenyl, benzyl, cyclohexyl, furyl, tetrahydrofurfuryl, furfuryl or tetrahydrofurfuryl, more preferably phenyl, cyclohexyl or tetrahydrofurfuryl, even more preferably phenyl or tetrahydrofurfuryl, and even more preferably phenyl.
Examples of the compound represented by the formula (II) include: benzyl alcohol, phenethyl alcohol, cyclohexane methanol, furfuryl alcohol and tetrahydrofurfuryl alcohol. The compound represented by the above formula (II) is preferably at least one selected from the group consisting of benzyl alcohol, furfuryl alcohol and tetrahydrofurfuryl alcohol, more preferably at least one selected from the group consisting of benzyl alcohol and tetrahydrofurfuryl alcohol, and still more preferably benzyl alcohol, from the viewpoint of improving the flux removability.
[ chemical formula 1]
In the above formula (III), R is from the viewpoint of improving the flux removability 4 、R 5 、R 6 、R 7 Preferably each independently is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms or a hydroxyl group, more preferably R 4 、R 5 、R 6 、R 7 Any one of the hydrocarbon groups is a hydrocarbon group having 1 to 8 carbon atoms, more preferablyThe hydrocarbon group having 1 to 6 carbon atoms is more preferably any one of methyl group, ethyl group and vinyl group.
Examples of the compound represented by the formula (III) include: 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone, 3-hydroxypropyl-2-pyrrolidone, 4-hydroxy-2-pyrrolidone, 4-phenyl-2-pyrrolidone, 5-methyl-2-pyrrolidone, and the like. The compound represented by the above formula (III) is preferably at least one selected from the group consisting of 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone and 5-methyl-2-pyrrolidone, more preferably at least one selected from the group consisting of 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone and 1-vinyl-2-pyrrolidone, and even more preferably 1-methyl-2-pyrrolidone, from the viewpoint of improving the flux removal property.
The component A may be 1 kind, 2 kinds or more than 2 kinds. When the component a is a combination of 2 kinds, examples of the component a include a combination of a compound represented by the formula (I) and a compound represented by the formula (II).
The component a is preferably at least one selected from the group consisting of diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, benzyl alcohol and 1-methyl-2-pyrrolidone, and more preferably at least one selected from the group consisting of diethylene glycol monobutyl ether, benzyl alcohol and 1-methyl-2-pyrrolidone, from the viewpoint of improving the flux removability. From the viewpoint of improving the removability of the rosin-based flux, component a is preferably diethylene glycol dimethyl ether, benzyl alcohol, or 1-methyl-2-pyrrolidone.
The content of the component a in the cleaning agent composition of the present disclosure is preferably 35% by mass or more, more preferably 50% by mass or more, further preferably 75% by mass or more, and is preferably 99.5% by mass or less, more preferably 99.3% by mass or less, further preferably 99% by mass or less, from the viewpoint of improving the flux removability. More specifically, the content of the component a in the cleaning agent composition of the present disclosure is preferably 35% by mass or more and 99.5% by mass or less, more preferably 50% by mass or more and 99.3% by mass or less, and still more preferably 75% by mass or more and 99% by mass or less. When the component a is a combination of 2 or more, the content of the component a means the total content thereof.
(component B: amine)
Component B in the cleaning agent composition of the present disclosure is a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of the imidazole ring or piperazine ring. From the viewpoint of improving the flux removability, component B is preferably at least one amine selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole, 1-isobutyl-2-methylimidazole and 1- (2-dimethylaminoethyl) -4-methylpiperazine. The component B may be 1 kind, 2 kinds, or 2 kinds or more. In view of improving the removability of the rosin-based flux, component B is preferably a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of the imidazole ring, preferably at least one amine selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole, and more preferably at least one amine selected from the group consisting of 1-methylimidazole and 1, 2-dimethylimidazole.
The content of component B in the cleaning agent composition of the present disclosure is preferably 0.2 mass% or more, more preferably 0.3 mass% or more, still more preferably 0.4 mass% or more, still more preferably 0.5 mass% or more, from the viewpoint of improving the flux removability, and is preferably 15 mass% or less, more preferably 12 mass% or less, more preferably 10 mass% or less, still more preferably 8 mass% or less, and still more preferably 5 mass% or less, from the viewpoint of suppressing corrosion of the solder metal. More specifically, the content of component B in the cleaning agent composition of the present disclosure is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.3% by mass or more and 10% by mass or less, still more preferably 0.4% by mass or more and 8% by mass or less, and still more preferably 0.5% by mass or more and 5% by mass or less. When the component B is a combination of 2 or more, the content of the component B means the total content thereof.
In the cleaning agent composition of the present disclosure, the mass ratio of the component a to the component B (component a/component B) is preferably 8 or more, more preferably 10 or more, further preferably 15 or more, and is preferably 200 or less, more preferably 100 or less, further preferably 25 or less, from the viewpoint of improving the flux removability. More specifically, the mass ratio (component a/component B) is preferably 8 to 200, more preferably 10 to 100, and even more preferably 15 to 25.
(component C: water)
In one or more embodiments, the cleaning agent compositions of the present disclosure may further comprise water (component C). As the component C, ion-exchanged water, RO water, distilled water, pure water, ultrapure water, or the like can be used. The content of component C in the cleaning agent composition of the present disclosure is preferably 1% by mass or more, more preferably 5% by mass or more, further preferably 8% by mass or more, from the viewpoint of reducing the ignition point, and is preferably 55% by mass or less, more preferably 15% by mass or less, further preferably 12% by mass or less, further preferably 10% by mass or less, from the viewpoint of improving the flux removability. More specifically, the content of component C in the cleaning agent composition of the present disclosure is preferably 1% by mass or more and 55% by mass or less, more preferably 1% by mass or more and 15% by mass or less, still more preferably 5% by mass or more and 12% by mass or less, still more preferably 8% by mass or more and 10% by mass or less.
In the case where the cleaning agent composition of the present disclosure contains the component C, it is preferable to use diethylene glycol monobutyl ether in combination with other component a than the diethylene glycol monobutyl ether in the component a contained in the cleaning agent composition of the present disclosure from the viewpoint of improving stability.
(other Components)
The cleaning agent composition of the present disclosure may contain other components as needed in addition to the above components a to C. The content of the other components in the cleaning agent composition of the present disclosure is preferably 0% by mass or more and 10% by mass or less, more preferably 0% by mass or more and 8% by mass or less, still more preferably 0% by mass or more and 5% by mass or less, and still more preferably 0% by mass or more and 2% by mass or less.
As other components in the detergent composition of the present disclosure, surfactants are exemplified in view of improving stability. The surfactant is preferably a nonionic surfactant such as polyoxyalkylene alkyl ether, polyoxyalkylene alkyl amine, glycerin fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, alkyl glucoside, or alkyl glycerin ether, more preferably polyoxyalkylene alkyl ether, or alkyl glycerin ether, and still more preferably alkyl glycerin ether. Specific examples of the surfactant include 2-ethylhexyl glyceryl ether and the like. The content of the surfactant in the detergent composition of the present disclosure is preferably 0.5 mass% or more, more preferably 0.8 mass% or more, and preferably 7 mass% or less, more preferably 5 mass% or less, from the viewpoint of improving stability. More specifically, the content of the surfactant is preferably 0.5% by mass or more and 7% by mass or less, and more preferably 0.8% by mass or more and 5% by mass or less.
As further other components, the cleaning agent composition of the present disclosure may appropriately contain, as necessary, a compound having chelating force such as hydroxyethylaminoacetic acid, hydroxyethyiiminodiacetic acid, ethylenediamine tetraacetic acid or other aminocarboxylate used in a general cleaning agent, an antirust agent such as benzotriazole, a thickener, a dispersant, an alkaline substance other than component B, a polymer compound, a solubilizing agent, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, an antioxidant, and the like, within a range that does not impair the effects of the present disclosure.
[ method for producing cleaning agent composition ]
The cleaning agent composition of the present disclosure can be produced, for example, by blending the components a and B, and the above component C and other components as needed, by a known method. The cleaning agent composition of the present disclosure may be formulated in one or more embodiments by blending at least component a and component B. Accordingly, the present disclosure relates to a method for producing a cleaning agent composition, which includes a step of blending at least a component a and a component B. In the present disclosure, "blending" includes mixing the component a, the component B, and the component C and other components as needed simultaneously or in any order. In the method for producing the cleaning agent composition of the present disclosure, the amount of each component may be the same as the content of each component in the cleaning agent composition of the present disclosure. In the present disclosure, the "content of each component in the cleaning agent composition" refers to the content of each component at the time of cleaning, that is, at the time of cleaning when the cleaning agent composition is used for cleaning.
The cleaning agent composition of the present disclosure can be produced and stored in the form of a concentrate from the viewpoint of the addition operation, storage and transportation. The dilution ratio of the concentrate of the cleaning agent composition of the present disclosure may be, for example, 3 to 30 times. The concentrate of the cleaning agent composition of the present disclosure can be diluted with water (component C) at the time of use so that the component a, component B, and optionally blended component C and other components are present in the above-described amounts (i.e., the content at the time of cleaning).
[ pH value of detergent composition ]
The cleaning agent composition of the present disclosure is preferably alkaline in terms of improving the flux removability, and for example, is preferably at a pH of 8 or more and at a pH of 14 or less. The pH value can be adjusted by appropriately compounding the following substances in the required amounts as required: inorganic acids such as nitric acid and sulfuric acid; organic acids such as hydroxycarboxylic acids, polycarboxylic acids, aminopolycarboxylic acids, and amino acids; and alkaline substances other than component B, such as metal salts or ammonium salts thereof, ammonia, sodium hydroxide, potassium hydroxide, and amines. The pH of the cleaning composition in the present disclosure is the pH of the cleaning composition at 25 ℃ when in use (after dilution).
[ object to be cleaned ]
The cleaning agent composition of the present disclosure is used in one or more embodiments for cleaning of an object to be cleaned having flux residue. Examples of the object to be cleaned having flux residue include objects to be cleaned having reflowed solder. Specific examples of the object to be cleaned include, for example, electronic components and manufacturing intermediates thereof, specifically, soldering electronic components and manufacturing intermediates thereof, and more specifically, soldering electronic components and manufacturing intermediates thereof, and the like, and the specific examples thereof include: an electronic component in which components are soldered with solder and a manufacturing intermediate thereof, an electronic component in which components are connected via solder and a manufacturing intermediate thereof, an electronic component in which flux residues are contained in gaps between soldered components and a manufacturing intermediate thereof, an electronic component in which flux residues are contained in gaps between components connected via solder and a manufacturing intermediate thereof, and the like. The manufacturing intermediate is an intermediate product in a manufacturing process of an electronic component including a semiconductor package or a semiconductor device, and includes, for example, a circuit board on which at least one member selected from a semiconductor chip, a chip-type capacitor, and a circuit board is mounted by soldering using a flux, and/or a circuit board on which solder bumps for solder-connecting the members are formed. The clearance in the object to be cleaned is a space having a height (distance between components) of, for example, 5 to 500 μm, 10 to 250 μm, or 20 to 100 μm, in a space formed between the circuit board and a component (semiconductor chip, chip capacitor, circuit board, or the like) mounted on the circuit board by soldering. The width and depth of the gap depend on the size and spacing of the mounted component and the electrode (pad) on the circuit board.
[ method for manufacturing electronic component ]
The present disclosure relates to a method for manufacturing an electronic component (hereinafter, also referred to as "method for manufacturing an electronic component of the present disclosure"), including the steps of: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method of the present disclosure. Soldering using a flux is performed by, for example, lead-free solder, and may be reflow soldering or flow soldering. The electronic component includes a semiconductor package on which the semiconductor chip is not mounted, a semiconductor package on which the semiconductor chip is mounted, and a semiconductor device. By performing the cleaning method of the present disclosure, the method of manufacturing an electronic component of the present disclosure reduces flux residue remaining in the gaps of the soldered components, the periphery of the solder bumps, and the like, and suppresses short-circuiting between electrodes and adhesion failure caused by the flux residue, thereby manufacturing an electronic component of high reliability. Further, by performing the cleaning method of the present disclosure, the cleaning of the flux residue remaining in the gap or the like of the soldered component is facilitated, and therefore the cleaning time can be shortened, and the manufacturing efficiency of the electronic component can be improved.
[ set ]
The present disclosure relates in one embodiment to a kit (hereinafter, also referred to as "kit of the present disclosure") for use in the cleaning method of the present disclosure and/or the manufacturing method of the electronic component of the present disclosure. The kits of the present disclosure are, in one or more embodiments, kits for making the cleaning agent compositions of the present disclosure.
As an embodiment of the kit of the present disclosure, a kit (two-part type cleaning agent composition) comprising a solution containing the above-described component a (solution 1) and a solution containing the component B (solution 2) in an immiscible state, wherein the solution 1 and the solution 2 are mixed at the time of use, is exemplified. Accordingly, the cleaning methods of the present disclosure may include, in one or more embodiments, the following: the cleaning agent composition is prepared by mixing the 1 st liquid and the 2 nd liquid at the time of use in a state where the solution containing the component a (1 st liquid) and the solution containing the component B (2 nd liquid) are not mixed with each other. In addition, the cleaning methods of the present disclosure may include the following steps in one or more embodiments: and a step of preparing a cleaning agent composition by mixing the 1 st liquid and the 2 nd liquid at the time of use, using a kit comprising the solution containing the component A (1 st liquid) and the solution containing the component B (2 nd liquid) in an immiscible state.
The above-mentioned component C and other components may be contained in the above-mentioned liquid 1 and liquid 2, respectively, if necessary. At least one of the above-mentioned solutions 1 and 2 may contain a part or all of the component C (water) in one or more embodiments. In one or more embodiments, the above-described liquid 1 and liquid 2 may be mixed and then diluted with component C (water) as needed.
The present disclosure is also directed to one or more of the following embodiments.
< 1 > a cleaning agent composition for removing flux residue, comprising: at least one solvent (component a) selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III); and
At least one amine (component B) selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole, 1-isobutyl-2-methylimidazole and 1- (2-dimethylaminoethyl) -4-methylpiperazine.
R 1 -O-(AO) n -R 2 (I)
In the above formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is an integer of 1 to 3 inclusive in terms of the number of addition moles of AO.
R 3 -CH 2 OH (II)
In the above formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl.
[ chemical formula 2]
In the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
< 2 > the cleaning agent composition according to < 1 >, wherein R in the above formula (I) 1 The alkyl group is preferably a phenyl group or an alkyl group having 1 to 8 carbon atoms, more preferably a phenyl group or an alkyl group having 4 to 6 carbon atoms, and still more preferably an alkyl group having 4 to 6 carbon atoms.
< 3 > the cleaning agent composition according to < 1 > or < 2 >, wherein in the above formula (I), R 2 The alkyl group is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and still more preferably a hydrogen atom or an n-butyl group.
< 4 > the detergent composition according to any one of < 1 > to < 3 >, wherein in the above formula (I), AO is an oxirane group or an oxetanyl group, preferably an oxirane group.
The cleaning agent composition according to any one of < 1 > to < 4 > wherein n in the above formula (I) is an integer of 1 to 3, preferably 1 or 2, more preferably 2.
< 6 > the cleaning agent composition according to any one of < 1 > to < 5 >, wherein, in the above formula (II), R 3 Represents phenyl, benzyl, cyclohexyl, furyl, tetrahydrofurfuryl, furfuryl or tetrahydrofurfuryl, preferably phenyl, cyclohexyl or tetrahydrofurfuryl, more preferably phenyl or tetrahydrofurfuryl, even more preferably phenyl.
< 7 > the cleaning agent composition according to any one of < 1 > to < 6 >, wherein, in the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms or a hydroxyl group, preferably R 4 、R 5 、R 6 、R 7 Any one of the hydrocarbon groups is a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 6 carbon atoms, still more preferably any one of a methyl group, an ethyl group and a vinyl group.
The cleaning agent composition according to any one of < 8 > to < 1 > to < 7 >, wherein component A is preferably at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, benzyl alcohol and 1-methyl-2-pyrrolidone, more preferably at least one selected from diethylene glycol monobutyl ether, benzyl alcohol and 1-methyl-2-pyrrolidone.
The detergent composition according to any one of < 1 > to < 8 >, wherein the content of component A is preferably 35% by mass or more, more preferably 50% by mass or more, still more preferably 75% by mass or more.
The detergent composition according to any one of < 1 > to < 9 >, wherein the content of component A is preferably 99.5% by mass or less, more preferably 99.3% by mass or less, and further preferably 99% by mass or less.
The detergent composition according to any one of < 1 > to < 10 > wherein the content of component A is preferably 35% by mass or more and 99.5% by mass or less, more preferably 50% by mass or more and 99.3% by mass or less, still more preferably 75% by mass or more and 99% by mass or less.
The detergent composition according to any one of < 1 > to < 11 >, wherein the content of component B is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.4% by mass or more, still more preferably 0.5% by mass or more.
The detergent composition according to any one of < 1 > to < 12 >, wherein the content of component B is preferably 15% by mass or less, more preferably 12% by mass or less, still more preferably 10% by mass or less, still more preferably 8% by mass or less, still more preferably 5% by mass or less.
The detergent composition according to any one of < 14 > to < 1 > to < 13 >, wherein the content of component B is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.3% by mass or more and 10% by mass or less, still more preferably 0.4% by mass or more and 8% by mass or less, still more preferably 0.5% by mass or more and 5% by mass or less.
The detergent composition according to any one of < 1 > to < 14 > wherein the mass ratio of component A to component B (component A/component B) is preferably 8 or more, more preferably 10 or more, still more preferably 15 or more.
The detergent composition according to any one of < 1 > to < 15 >, wherein the mass ratio of component A to component B (component A/component B) is preferably 200 or less, more preferably 100 or less, still more preferably 25 or less.
The detergent composition according to any one of < 1 > to < 16 >, wherein the mass ratio of component A to component B (component A/component B) is preferably 8 to 200, more preferably 10 to 100, still more preferably 15 to 25.
< 18 > the cleaning agent composition according to any one of < 1 > to < 17 >, further comprising water (component C).
The detergent composition according to the above-mentioned formula < 19 > and < 18 > wherein the content of component C is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 8% by mass or more.
The detergent composition according to < 20 > to < 18 > or < 19 > is preferably 55 mass% or less, more preferably 15 mass% or less, still more preferably 12 mass% or less, still more preferably 10 mass% or less of component C.
The detergent composition according to any one of < 21 > to < 18 > to < 20 >, wherein the content of component C is preferably 1% by mass or more and 55% by mass or less, more preferably 1% by mass or more and 15% by mass or less, still more preferably 5% by mass or more and 12% by mass or less, still more preferably 8% by mass or more and 10% by mass or less.
< 22 > the cleaning agent composition according to any one of < 1 > to < 21 >, further comprising a surfactant.
The detergent composition according to any one of < 23 > to < 1 > to < 22 >, which further comprises at least one member selected from the group consisting of a compound having a chelating ability, an anti-rust agent such as benzotriazole, a thickener, a dispersant, an alkaline substance other than component B, a polymer compound, a solubilizing agent, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, and an antioxidant.
A cleaning method comprising the step of cleaning an object to be cleaned having flux residue with the cleaning agent composition according to any one of < 1 > to < 23 >.
The cleaning method according to < 25 > to < 24 >, wherein the object to be cleaned is an intermediate for manufacturing a soldered electronic part.
< 26 > a method for manufacturing an electronic component, comprising the steps of: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method described in < 24 > or < 25 >.
< 27 > a kit for use in the cleaning method described as < 24 > or < 25 > and/or the method for manufacturing an electronic component described as < 26 > comprising a solution containing component A (solution 1) and a solution containing component B (solution 2) in an immiscible state, the solutions 1 and 2 being mixed at the time of use.
< 28 > a cleaning method comprising the step of cleaning an object to be cleaned having flux residue with a cleaning agent composition,
the cleaning agent composition contains an organic solvent (component A) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of the imidazole ring or piperazine ring.
The method of cleaning according to < 29 > to < 28 > wherein component B is at least one amine selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole, 1-isobutyl-2-methylimidazole and 1- (2-dimethylaminoethyl) -4-methylpiperazine.
The method for cleaning according to < 30 > to < 28 > or < 29 > wherein component A is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II) and a compound represented by the following formula (III).
R 1 -O-(AO) n -R 2 (I)
In the above formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is an integer of 1 to 3 inclusive in terms of the number of addition moles of AO.
R 3 -CH 2 OH(II)
In the above formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl and furfurylOr tetrahydrofurfuryl.
[ chemical formula 3]
In the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
The cleaning method according to any one of < 31 > to < 28 > to < 30 >, wherein the content of component A in the cleaning agent composition is 35% by mass or more and 99.5% by mass or less.
The cleaning method according to any one of < 28 > to < 31 >, wherein a mass ratio of the component A to the component B (component A/component B) in the cleaning agent composition is 8 to 200.
The cleaning method according to any one of < 28 > to < 32 >, wherein the above-mentioned cleaning agent composition further contains water (component C).
The method of cleaning according to claim 33, wherein the content of component C in the cleaning composition is 15% by mass or less.
The cleaning method according to any one of < 28 > to < 34 >, wherein the content of component B in the cleaning agent composition is 0.2 mass% or more and 15 mass% or less.
The method according to any one of < 36 > to < 28 > to < 35 >, wherein component A is at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, benzyl alcohol and 1-methyl-2-pyrrolidone.
The method according to any one of < 28 > to < 36 >, wherein the content of the other components than the components A to C in the cleaning agent composition is 0% by mass or more and 10% by mass or less.
The cleaning method according to any one of < 28 > to < 37 >, wherein the object to be cleaned is an intermediate in the manufacture of the welded electronic parts.
The cleaning method according to any one of < 28 > to < 38 > comprising the steps of: the cleaning agent composition is prepared by mixing the solution 1 st and 2 nd solutions at the time of use in a state where the solution 1 st and 2 nd solutions containing the component a and the component B are not mixed with each other.
The method of cleaning an object to be cleaned according to any one of < 40 > to < 28 > to < 39 > using a method of contacting in a bath of an ultrasonic cleaning apparatus or a method of spraying and spraying a cleaning composition to contact the cleaning composition.
< 41 > a method for manufacturing an electronic component, comprising the steps of: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by a cleaning method according to any one of < 28 > to < 40 >.
< 42 > a composition for use as a cleaning agent for cleaning an object to be cleaned having flux residue, which contains an organic solvent (component A) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of an imidazole ring or piperazine ring.
Use of a composition containing an organic solvent (component A) and a compound (component B) having an alkyl group having 1 to 4 carbon atoms at the nitrogen atom of an imidazole ring or piperazine ring for cleaning an object to be cleaned having a flux residue.
Examples
Hereinafter, the present disclosure will be specifically described with reference to examples, but the present disclosure is not limited to these examples.
1. Preparation of detergent compositions (examples 1 to 16 and comparative examples 1 to 9)
The cleaning agent compositions of examples 1 to 16 and comparative examples 1 to 9 were prepared by mixing the components in a 100mL glass beaker so as to have the compositions shown in table 1 below and mixing the components under the following conditions. The numerical values of the respective components in table 1 represent the contents (% by mass) in the prepared detergent composition unless otherwise specified.
< mixing Condition >
Liquid temperature: 25 DEG C
A stirrer: magnetic stirrer (50 mm rotor)
Rotational speed: 300rpm
Stirring time: for 10 minutes
The following substances were used as components of the cleaning agent composition.
(component A)
A1: benzyl alcohol (Lanxess Co., ltd.)
A2: diethylene glycol monobutyl ether (manufactured by Japanese emulsifier Co., ltd., diethylene glycol butyl ether (BDG))
A3: dipropylene glycol monobutyl ether (dipropylene glycol butyl ether (BFDG) manufactured by Japanese emulsifier Co., ltd.)
A4: diethylene glycol dimethyl ether (DMDG) manufactured by Japanese emulsifier Co., ltd.)
A5: 1-methyl-2-pyrrolidone (Fuji film and light purity chemical Co., ltd.)
(component B)
B1: 1-methylimidazole (Kaolizer No.110, manufactured by Kaolizer Co., ltd.)
B2:1, 2-dimethylimidazole (Tokyo chemical industry Co., ltd.)
B3: 1-isobutyl-2-methylimidazole (Kaolizer No.120, manufactured by Kaolizer Co., ltd.)
B4:1- (2-dimethylaminoethyl) -4-methylpiperazine (Kaolizer No.8, manufactured by Kaolizer Co., ltd.)
(non-component B)
B5: triethanolamine (manufactured by Japanese catalyst Co., ltd.)
B6: methyl diethanolamine (manufactured by Japanese emulsifier Co., ltd., amino alcohol MDA)
B7: 2-ethyl-4-methylimidazole (Fuji film and light purity chemical Co., ltd.)
B8:1, 5-dimethyl-2-pyrrolidone
(component C)
Water [ purified water of 1. Mu.S/cm or less manufactured by pure water apparatus G-10DSTSET manufactured by Organo Co., ltd ]
(other ingredients: surfactant)
2-ethylhexyl Glycerol ether (produced by the following production method)
130g of 2-ethylhexanol and 2.84g of boron trifluoride etherate were cooled to 0℃with stirring. 138.8g of epichlorohydrin was added dropwise over 1 hour while keeping the temperature at 0 ℃. After the completion of the dropwise addition, the remaining alcohol was distilled off under reduced pressure (13 to 26 Pa) and at 100 ℃. The reaction mixture was cooled to 50℃and 125g of 48% aqueous sodium hydroxide solution was added dropwise over 1 hour while maintaining the temperature at 50℃and stirred for 3 hours, followed by addition of 200mL of water and delamination. After removing the aqueous layer, the mixture was washed with 100mL of water 2 times to obtain 208g of crude 2-ethylhexyl glycidyl ether. The crude 2-ethylhexyl glycidyl ether (208 g), water (104.8 g), lauric acid (5.82 g) and potassium hydroxide (18.5 g) were charged into an autoclave, and stirred at 140℃for 5 hours. After dehydration under reduced pressure (6.67 kPa) and at 100 ℃, 9.7g of lauric acid and 2.72g of potassium hydroxide were added, the mixture was reacted at 160℃for 15 hours, and then purified by distillation under reduced pressure (53 to 67Pa,120 to 123 ℃) to obtain 110.2g of 2-ethylhexyl glycerol ether.
(other component: rust inhibitor)
Benzotriazole [ 1,2, 3-benzotriazole manufactured by Tokyo chemical industry Co., ltd.)
2. Evaluation of detergent composition
The cleaning properties and the anticorrosive properties were tested and evaluated by using the cleaning agent compositions of examples 1 to 16 and comparative examples 1 to 9.
Test substrate
On a copper wiring printed board (10 mm. Times.15 mm), the following solder paste was applied using a screen. The test substrate was fabricated by reflow soldering at 250 ℃ under nitrogen atmosphere.
Composition of flux
58.0% by mass of fully hydrogenated rosin (Foral AX-E manufactured by Eastman Chemical Co., ltd.)
N, N' -diphenylguanidine hydrobromide (manufactured by Kagaku Co., ltd., photochemistry Co., ltd.) 0.5% by mass
Adipic acid (manufactured by Wako pure chemical industries, ltd.) 0.5% by mass
Hydrogenated castor oil (manufactured by Fengguo oil Co., ltd.) 6.0% by mass
Hexyl glycol (Japanese text, section コ, manufactured by Nippon emulsifier Co., ltd.) 35.0 mass%
Method for producing flux
The flux having the above composition is obtained by adding and dissolving the remaining other components in the hexylene glycol of the solvent.
Method for producing solder paste
11.0g of the flux was kneaded with 89.0g of a solder powder [ Qianzhi Metal industry Co., ltd., M705 (Sn/Ag/Cu=96.5/3/0.5) ] for 1 hour.
< cleaning test >)
The cleaning test was performed as follows.
First, an ultrasonic cleaning tank, a 1 st flushing tank, and a 2 nd flushing tank were prepared under the following conditions. The ultrasonic cleaning tank set the frequency to 40kHz and the output to 200W. Obtained by adding 50g of each cleaning agent composition to a 50mL glass beaker, putting into an ultrasonic cleaning layer and heating to 60 ℃. The 1 st flushing tank and the 2 nd flushing tank are obtained by the following modes: two 100mL glass beakers with one 50mm rotor added thereto were prepared, and 100g of pure water was added to each glass beaker, and the glass beakers were put into a warm bath and heated to 40℃while stirring at 100 rpm.
Then, the test substrate was held by tweezers and inserted into the ultrasonic cleaning tank, and immersed for 5 minutes. Next, the test substrate was held by tweezers and inserted into the 1 st rinse tank, and immersed for 3 minutes while stirring at a rotation speed of 100 rpm.
Further, the test substrate was held by tweezers and inserted into the 2 nd rinse tank, and immersed for 3 minutes while stirring at a rotation speed of 100 rpm.
Finally, the test substrate was dried by nitrogen purging.
[ evaluation of detergency (flux removability) ]
After cleaning, the test substrate was observed with a microscope Miniscope (TM) 3030 (Hitachi Ltd.) to visually confirm the presence or absence of flux residue remaining on any 10 solder bumps, and the number of flux residues was counted. The results are shown in Table 1.
Further, the test substrate was observed by an optical microscope VHX-2000 (manufactured by KEYENCE corporation), and the presence or absence of flux residue remaining in the vicinity of the solder bump was visually confirmed, to count the number of solder bumps in which flux residue remained in the vicinity of the solder bump. The results are shown in Table 1.
[ evaluation of Corrosion resistance ]
The solder metal on the test substrate after evaluation of the cleaning property (flux removing property) was visually observed using an optical microscope VHX-2000 (manufactured by KEYENCE corporation) and a desktop microscope minicope TM3030 (manufactured by hitachi high new technology corporation), and the effect on the solder metal was evaluated based on the following evaluation criteria. The evaluation results are shown in table 1.
< evaluation criterion >
A: no influence on solder metal
B: there is an influence on the weld metal due to corrosion or the like
Evaluation of detergency (abietic acid solubility)
To confirm the affinity of the flux, the solubility of rosin acid used as a component of the flux was evaluated by the following method. The evaluation results are shown in table 1.
100g of the detergent composition and 1g of abietic acid were added to a 50mL glass beaker, and ultrasonic treatment was performed at 25℃for 1 hour using an ultrasonic cleaning tank under conditions of a frequency of 40kHz and an output of 200W. 1g of rosin acid was further added in the case of dissolution of rosin acid, and the same procedure was carried out. This operation was repeated until the rosin acid was not dissolved, whereby the solubility was estimated. The higher the solubility, the more excellent the removability of the rosin-based flux can be evaluated. From the viewpoint of improving the removability of the rosin-based flux, the solubility can be evaluated as preferably 40 mass% or more, more preferably 50 mass% or more, and still more preferably 60 mass% or more.
< evaluation criterion >
A: solubility of 60 mass% or more
B: solubility of 50 mass% or more and less than 60 mass%
C: the solubility is 40 mass% or more and less than 50 mass%
D: solubility less than 40 mass%
TABLE 1
As shown in table 1, the cleaning agent compositions of examples 1 to 16 containing the component a and the component B were superior in the flux removability as compared with comparative examples 1 to 9 containing no component a or no component B. Furthermore, the cleaning agent compositions of examples 1 to 16 were inhibited from affecting the weld metal. The rosin acid solubility of the cleaning agent compositions of examples 2 to 3, 6, 9 to 11, 13 to 14, and 16 was as high as 50 mass% or more, and it was found that the rosin-based flux remover was superior to examples 1, 4 to 5, 7 to 8, 12, and 15.
Industrial applicability
By using the present disclosure, the cleaning of the flux residue can be performed satisfactorily, and thus, for example, shortening of the cleaning process of the flux residue in the manufacturing process of the electronic component and improvement of the performance and reliability of the manufactured electronic component become possible, and productivity of the electronic component can be improved.
Claims (29)
1. A cleaning method comprising a step of cleaning an object to be cleaned having flux residue by using a cleaning agent composition,
The cleaning agent composition comprises a component A which is an organic solvent, a component B which is a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of an imidazole ring or piperazine ring, and a component C which is water,
the component A is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II) and a compound represented by the following formula (III),
R 1 -O-(AO) n -R 2 (I)
in the formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an oxirane group or an oxetane group, n is an addition mole number of AO and is an integer of 1 to 3,
R 3 -CH 2 OH(II)
in the formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl,
in the formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
2. The method according to claim 1, wherein component B is at least one amine selected from the group consisting of 1-methylimidazole, 1, 2-dimethylimidazole, 1-isobutyl-2-methylimidazole and 1- (2-dimethylaminoethyl) -4-methylpiperazine.
3. The cleaning method according to claim 1 or 2, wherein component a is a combination of the compound represented by the formula (I) and the compound represented by the formula (II).
4. The cleaning method according to claim 1 or 2, wherein the content of the component a in the cleaning agent composition is 35 mass% or more and 99.5 mass% or less.
5. The cleaning method according to claim 1 or 2, wherein the content of the component a in the cleaning agent composition is 75% by mass or more and 99% by mass or less.
6. The cleaning method according to claim 1 or 2, wherein a mass ratio of component a to component B, i.e., component a/component B, in the cleaning agent composition is 8 or more and 200 or less.
7. The cleaning method according to claim 1 or 2, wherein a mass ratio of component a to component B, i.e., component a/component B, in the cleaning agent composition is 10 or more and 100 or less.
8. The cleaning method according to claim 1 or 2, wherein the content of component C in the cleaning agent composition is 15 mass% or less.
9. The cleaning method according to claim 1 or 2, wherein the content of component C in the cleaning agent composition is 1 mass% or more.
10. The cleaning method according to claim 1 or 2, wherein the content of component C in the cleaning agent composition is 5 mass% or more and 12 mass% or less.
11. The cleaning method according to claim 1 or 2, wherein the content of component B in the cleaning agent composition is 0.2 mass% or more and 15 mass% or less.
12. The cleaning method according to claim 1 or 2, wherein the content of component B in the cleaning agent composition is 0.3 mass% or more and 10 mass% or less.
13. The cleaning method according to claim 1 or 2, wherein component a is at least one selected from the group consisting of diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, benzyl alcohol, and 1-methyl-2-pyrrolidone.
14. The cleaning method according to claim 1 or 2, wherein the component a is a combination of diethylene glycol monobutyl ether and a component a other than the diethylene glycol monobutyl ether.
15. The cleaning method according to claim 1 or 2, wherein the content of the other components than the components a to C in the cleaning agent composition is 0 mass% or more and 10 mass% or less.
16. The cleaning method according to claim 1 or 2, wherein the object to be cleaned is a manufacturing intermediate for soldering an electronic component.
17. The cleaning method according to claim 1 or 2, wherein the object to be cleaned has reflowed solder.
18. The cleaning method according to claim 1 or 2, wherein the flux is a rosin-based flux.
19. The cleaning method according to claim 1 or 2, comprising the steps of: the cleaning agent composition is prepared by mixing the 1 st liquid and the 2 nd liquid at the time of use in a state where the 1 st liquid which is the solution containing the component A and the 2 nd liquid which is the solution containing the component B are not mixed with each other.
20. The cleaning method according to claim 1 or 2, wherein the object to be cleaned is cleaned with the cleaning agent composition by a method of contacting in a bath of an ultrasonic cleaning apparatus or a method of spraying and injecting the cleaning agent composition to contact.
21. The cleaning method according to claim 1 or 2, comprising a step of washing with water and drying after contacting the object to be cleaned with the cleaning agent composition.
22. A method of manufacturing an electronic component, comprising:
at least one process selected from the group consisting of: a step of mounting at least one component selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the component on the circuit board; and
the cleaning method according to any one of claims 1 to 21, wherein at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed is cleaned.
23. A composition for use as a cleaning agent in the cleaning of an object to be cleaned having flux residue,
comprises a component A which is an organic solvent, a component B which is a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of an imidazole ring or piperazine ring, and a component C which is water,
The component A is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II) and a compound represented by the following formula (III),
R 1 -O-(AO) n -R 2 (I)
in the formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an oxirane group or an oxetane group, n is an addition mole number of AO and is an integer of 1 to 3,
R 3 -CH 2 OH(II)
in the formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl,
in the formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
24. The composition according to claim 23, wherein the content of component C in the detergent composition is 15 mass% or less.
25. The composition according to claim 23 or 24, wherein the content of component C in the detergent composition is 1 mass% or more.
26. The composition according to claim 23 or 24, wherein the content of component B in the detergent composition is 0.3 mass% or more and 10 mass% or less.
27. The composition according to claim 23 or 24, wherein the content of component a in the detergent composition is 75% by mass or more and 99% by mass or less.
28. The composition according to claim 23 or 24, wherein a mass ratio of component a to component B, i.e., component a/component B, in the detergent composition is 8 to 200.
29. A composition for cleaning an object to be cleaned having a flux residue, which comprises a component A which is an organic solvent, a component B which is a compound having an alkyl group having 1 to 4 carbon atoms on the nitrogen atom of an imidazole ring or piperazine ring, and a component C which is water,
the component A is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II) and a compound represented by the following formula (III),
R 1 -O-(AO) n -R 2 (I)
in the formula (I), R 1 Is phenyl orAlkyl of 1 to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an oxirane group or an oxetane group, n is an addition mole number of AO and is an integer of 1 to 3,
R 3 -CH 2 OH(II)
in the formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl,
in the formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018228145 | 2018-12-05 | ||
| JP2018-228145 | 2018-12-05 | ||
| PCT/JP2019/047492 WO2020116534A1 (en) | 2018-12-05 | 2019-12-04 | Cleaning of flux residues |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113165027A CN113165027A (en) | 2021-07-23 |
| CN113165027B true CN113165027B (en) | 2023-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980080692.6A Active CN113165027B (en) | 2018-12-05 | 2019-12-04 | Cleaning of flux residue |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7370339B2 (en) |
| KR (1) | KR20210099006A (en) |
| CN (1) | CN113165027B (en) |
| TW (1) | TW202031884A (en) |
| WO (1) | WO2020116534A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI836625B (en) | 2022-09-26 | 2024-03-21 | 南亞塑膠工業股份有限公司 | Cleaning system for circuit board |
| WO2024075678A1 (en) * | 2022-10-07 | 2024-04-11 | 株式会社Adeka | Method for producing bio-derived branched alkyl glyceryl ether, and bio-derived branched alkyl glyceryl ether produced by said method |
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| JP2017119782A (en) * | 2015-12-28 | 2017-07-06 | 花王株式会社 | Detergent composition for water-soluble flux |
| JP2018021093A (en) * | 2016-08-01 | 2018-02-08 | 花王株式会社 | Detergent composition for screen printing plates |
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| JPH0457899A (en) * | 1990-06-27 | 1992-02-25 | Arakawa Chem Ind Co Ltd | Detergent for rosing solder flux and method for washing rosin solder flux using said detergent |
| US5667594A (en) * | 1991-10-31 | 1997-09-16 | Daikin Industries Ltd. | Cleaning method with solvent |
| JPH07179893A (en) * | 1993-12-22 | 1995-07-18 | Central Glass Co Ltd | Cleaning composition |
| JP3499809B2 (en) * | 2000-06-30 | 2004-02-23 | 松下電器産業株式会社 | Cleaning remover and cleaning method |
| JP2005336342A (en) * | 2004-05-27 | 2005-12-08 | Tosoh Corp | Cleaning composition |
| US8372792B2 (en) * | 2007-08-08 | 2013-02-12 | Arakawa Chemical Industries, Ltd. | Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux |
| JP5498768B2 (en) * | 2009-12-02 | 2014-05-21 | 東京応化工業株式会社 | Lithographic cleaning liquid and wiring forming method |
| KR20140010002A (en) * | 2010-12-16 | 2014-01-23 | 카이젠 코포레이션 | Cleaning agent for removal of soldering flux |
| KR101467270B1 (en) * | 2013-11-07 | 2014-12-01 | 에이케이켐텍 주식회사 | Surfactant-free flux removal aqueous cleaning agent composition |
| JP6243792B2 (en) * | 2014-05-12 | 2017-12-06 | 花王株式会社 | Manufacturing method of circuit board on which solder is solidified, manufacturing method of circuit board on which electronic parts are mounted, and cleaning composition for flux |
| JP6487630B2 (en) * | 2014-05-20 | 2019-03-20 | 化研テック株式会社 | Stock solution for cleaning composition, cleaning composition and cleaning method |
| JP6598671B2 (en) * | 2015-12-24 | 2019-10-30 | 花王株式会社 | Cleaning composition for flux |
| CN108431197B (en) * | 2016-08-25 | 2021-06-29 | 化研科技株式会社 | Cleaning agent composition and cleaning method |
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2019
- 2019-12-04 KR KR1020217017615A patent/KR20210099006A/en active Search and Examination
- 2019-12-04 JP JP2020559986A patent/JP7370339B2/en active Active
- 2019-12-04 WO PCT/JP2019/047492 patent/WO2020116534A1/en active Application Filing
- 2019-12-04 CN CN201980080692.6A patent/CN113165027B/en active Active
- 2019-12-05 TW TW108144543A patent/TW202031884A/en unknown
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| CN102131910A (en) * | 2008-08-27 | 2011-07-20 | 荒川化学工业株式会社 | Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux |
| JP2017119782A (en) * | 2015-12-28 | 2017-07-06 | 花王株式会社 | Detergent composition for water-soluble flux |
| JP2018021093A (en) * | 2016-08-01 | 2018-02-08 | 花王株式会社 | Detergent composition for screen printing plates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020116534A1 (en) | 2021-10-21 |
| TW202031884A (en) | 2020-09-01 |
| JP7370339B2 (en) | 2023-10-27 |
| WO2020116534A1 (en) | 2020-06-11 |
| CN113165027A (en) | 2021-07-23 |
| KR20210099006A (en) | 2021-08-11 |
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