CN113133227A - Method for manufacturing multilayer printed circuit board - Google Patents
Method for manufacturing multilayer printed circuit board Download PDFInfo
- Publication number
- CN113133227A CN113133227A CN201911409471.7A CN201911409471A CN113133227A CN 113133227 A CN113133227 A CN 113133227A CN 201911409471 A CN201911409471 A CN 201911409471A CN 113133227 A CN113133227 A CN 113133227A
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- China
- Prior art keywords
- positioning
- circuit board
- circuit boards
- fixing
- stacked substrate
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- 238000000034 method Methods 0.000 title claims abstract description 83
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 239000002313 adhesive film Substances 0.000 claims description 16
- 230000003287 optical effect Effects 0.000 claims description 14
- 238000010030 laminating Methods 0.000 claims description 5
- 238000007499 fusion processing Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 23
- 238000005553 drilling Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 239000002356 single layer Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for manufacturing a multilayer printed circuit board, which comprises the steps of firstly aligning each circuit board to a superposition positioning position to be superposed to form a stacked substrate, wherein the stacked substrate is provided with a plurality of positioning areas, carrying out a pre-fixing procedure in each positioning area, then forming a positioning through hole in each positioning area, and putting the stacked substrate which is subjected to the pre-fixing procedure on a positioning pin of a pressing machine table to carry out the pressing procedure; the circuit boards which are accurately aligned are preliminarily fixed through the pre-fixing procedures of the positioning areas, and then the positioning through holes are formed in the positioning areas to be fixed on the positioning pins for pressing, so that the alignment with high precision cannot deviate in the moving or pressing process, and the scrap dust generated when the positioning through holes are formed cannot fall on the surfaces of the circuit boards, and the circuit damage is avoided.
Description
Technical Field
A circuit board process, especially a method for manufacturing multi-layer printed circuit board.
Background
The multilayer circuit board is applied to electronic devices in various fields, and has the advantages of improving circuit density and reducing device volume. In the existing multilayer circuit board process, a plurality of circuit boards with single-layer or double-layer circuits are produced, and then the circuit boards are mutually overlapped and fixed to form the circuit layers of the single-layer or double-layer circuit boards which are mutually electrically connected, so that the multilayer circuit board with complete functions is completed. In the process of laminating and fixing a plurality of single-layer or double-layer circuit boards, a common method is to form positioning through holes at a plurality of corresponding positions on each circuit board and prepare adhesive films on which the corresponding positioning through holes are also formed; the circuit boards are sleeved on a group of positioning pins by the positioning through holes in sequence to fix the relative positions when stacked, and the bonding films for bonding the adjacent circuit boards are arranged in a staggered mode. Finally, the laminated circuit board is pressed to adhere the circuit boards.
The positioning through holes of the circuit boards and the bonding film are formed in a drilling or punching mode respectively, and dust or debris generated in the drilling or punching process is easy to adhere to the surfaces of the positioning through holes and is adhered to the surfaces of the circuit boards when the positioning through holes are stacked with the circuit boards, and further scratches are caused on the surface circuit layers of the circuit boards due to extrusion friction in the subsequent stacking or pressing step; the drilling or punching machine has the precision tolerance of the repeated process, and the position of the positioning through hole of each circuit board is necessarily slightly deviated; in addition, when the positioning through holes of the circuit boards are sleeved on the positioning pins, the positioning pins may collide with the periphery of the positioning through holes in the taking and placing processes, so that the positioning accuracy is further affected due to the deformation of the positioning through holes, and the positioning through holes may also collide with the surface of the circuit board to damage the surface circuit layer. The scratch on the surface of the circuit layer makes the finished multilayer circuit board easy to generate high-frequency noise, and the inaccurate positioning among the circuit boards can cause that the conductive material is in poor contact with certain circuit layers in the subsequent step of forming conductive through holes among the circuit layers, thereby further influencing the quality of the multilayer circuit board.
In addition, in another technique for laminating and fixing a plurality of circuit boards, the circuit boards and the bonding films therebetween are positioned and stacked by an optical scanning positioning procedure, a central point is positioned, pressurization and heating fusion are performed on the central point, so that the central points of the circuit boards form initial relative fixation, and then the laminated and fixed circuit boards are subjected to an integral laminating procedure to complete integral laminating and fixing.
The optical positioning procedure has good positioning accuracy, however, in the initial fixing step, since only the central point is fused, the fixing strength is insufficient, so that the circuit board may be loosened due to collision in the moving process, or the circuit board may be relatively displaced due to uneven force application in the subsequent pressing procedure, thereby affecting the alignment accuracy between the circuit boards.
In summary, the process of the prior art multilayer circuit board is required to be further improved.
Disclosure of Invention
In view of the technical problems that the existing multilayer printed circuit board process may have direct or indirect inaccurate alignment, the surface circuit of the inner layer circuit board is scratched by material scraps, or the circuit board is damaged by the positioning pin in the positioning pin sleeving step, the invention provides a manufacturing method of the multilayer printed circuit board, which comprises the following steps:
preparing a plurality of circuit substrates and at least one adhesive film;
sequentially aligning each circuit substrate to a superposition positioning position for superposition, and alternately arranging adhesive films between the circuit substrates to form a superposition substrate; the stacked substrate has a plurality of positioning regions;
performing a pre-fixing procedure in each positioning area;
forming a positioning through hole in each positioning area of the stacked substrate;
sleeving the stacked substrate on a plurality of positioning pins of a pressing machine table through the positioning through holes;
and executing a pressing procedure on the stacked substrate.
The method for manufacturing a multi-layered printed circuit board as described above, wherein the pre-fixing process performs the fusing by applying pressure and heat in the positioning region of the stacked substrate.
The method for manufacturing a multi-layer printed circuit board as described above, wherein the pre-fixing process rivets in each of the positioning regions of the stacked substrate.
In the method for manufacturing a multi-layer printed circuit board, the pre-fixing process is performed by performing a pressure-heating fusion process and a riveting process on the positioning regions of the stacked substrate.
The method for manufacturing a multi-layer printed circuit board as described above, wherein the step of forming the positioning through holes is performed after performing a pre-fixing procedure on each positioning region and then performing an optical positioning on the stacked substrate.
The method for manufacturing a multilayer printed circuit board as described above, wherein the riveting uses a hollow rivet.
The manufacture of the multilayer printed circuit board of the invention firstly aligns and superposes the circuit boards in an optical scanning positioning mode, and ensures the alignment accuracy between the circuit boards through the high accuracy of optical positioning. Furthermore, a plurality of positioning areas are determined in the stacked circuit board stack in an optical scanning mode, and a pre-fixing procedure is performed in each positioning area to preliminarily fix the circuit boards in the stacked substrate to be fixedly connected with each other. Then, forming a positioning through hole in each positioning area for sleeving the stacked substrate on the group of positioning pins before the final pressing procedure; the positioning area is determined in an optical scanning mode, so that the positioning area also has high precision, and each positioning through hole can be accurately matched with the corresponding positioning pin in the group.
Because the stacked substrate is fixed by the pre-fixing procedure, the bonding films are also arranged among the circuit boards, when the positioning through holes are formed, the whole stacked substrate is drilled, punched or punched, but not the circuit boards or the bonding films are respectively drilled, punched or punched, so that dust or debris generated by the bonding films cannot be scattered on the surface of the circuit board in the middle, the phenomenon that the debris or dust of the bonding films falls on the circuit board to cause line scratch is avoided, and the relative accuracy of the positioning through holes of the circuit boards is also ensured by the disposable stacked substrate forming positioning through holes. In addition, the stacked substrate is relatively fixed through a pre-fixing procedure, the step of placing the stacked substrate on the positioning pin through the positioning through hole sleeve only needs to be carried out once, and compared with a method of respectively sequentially placing the circuit boards on the positioning pin through the positioning through hole sleeve, the probability of damage to the positioning through hole or peripheral surface circuits caused by the positioning pin is reduced.
In summary, the layer circuit board process method of the present invention not only improves the alignment accuracy between the circuit boards by the optical positioning method, but also performs the pre-fixing procedure in the plurality of positioning areas, so that the alignment between the circuit boards is maintained stable without shifting. Furthermore, the steps of forming positioning through holes and sleeving the positioning holes on the positioning pins are uniformly carried out on the circuit boards which have finished the pre-fixing procedure, so that the damage to the surface circuit of the circuit board on the inner layer or the circuit board on the outer side is greatly reduced, and the good characteristics of the finished multilayer circuit board are improved.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing a multi-layer printed circuit board according to the present invention
Fig. 2A to 2C are schematic perspective views illustrating a method for manufacturing a multi-layer printed circuit board according to the present invention.
FIGS. 3A-3B are schematic cross-sectional views illustrating a method for manufacturing a multi-layer printed circuit board according to a first preferred embodiment of the present invention.
FIGS. 4A-4B are schematic cross-sectional views illustrating a method for manufacturing a multi-layer printed circuit board according to a second preferred embodiment of the present invention.
Description of reference numerals:
11 circuit board
12 adhesive film
13 rivet
10 location area
100 positioning through hole
21 positioning pin
Detailed Description
Referring to fig. 1 and fig. 2A to 2C, the method for manufacturing a multi-layer printed circuit board of the present invention includes the following steps:
preparing a plurality of circuit boards 11 and at least one adhesive film 12 (S101);
sequentially aligning each circuit board 11 to a stacking position for stacking, and alternately placing the adhesive films 12 therebetween to form a stacked substrate having a plurality of positioning regions 10 (S102);
performing a pre-fixing process on the stacked substrate in each of the positioning regions 10 (S103);
forming a positioning via hole 100 in each of the positioning regions 10 of the stacked substrate (S104);
placing the stacked substrate on a plurality of positioning pins 21 of a press machine with the positioning through holes 100 (S105);
a bonding process is performed on the stacked substrate (S106).
As shown in fig. 2A, after preparing the circuit boards 11 and the adhesive films 12 in steps S101 to S102, the circuit boards 11 are sequentially aligned to a stacking position, and the adhesive films 12 are alternately placed during the stacking process. The adhesive film 12 can bond the two adjacent circuit boards 11 between the two circuit boards 11 by a pressure heating process. Preferably, each circuit board is stacked by aligning the stacked positioning positions with an optical scanning positioning machine. Furthermore, each positioning region 10 is preferably determined by optical scanning, so as to achieve a better accuracy.
As shown in fig. 2B, in step S103, a pre-fixing process, such as a pressure-heat bonding, a riveting or a combination thereof, is performed in each of the positioning regions 10, which will be described in further detail below.
As shown in fig. 2C, in step S104, a positioning through hole 100 is formed in each positioning region 10 of the stacked substrate, and the positioning through hole 100 is formed by, for example, mechanical drilling, laser drilling, punching or punching. Regardless of the method for forming the positioning through-holes 100, since each circuit board 11 passes through the pre-fixing process after the stacked substrate passes through the pre-fixing process, each circuit board 11 and the adhesive film 12 are in close contact and fixed, dust or debris of the adhesive film 12 is not scattered to the surface of the adjacent circuit board 11 during the process of forming the positioning through-holes 100.
In step S106, the pressing process is to perform a pressure-heating fusion on the whole stacked substrate, so that the bonding films 12 completely bond the circuit boards 11 to form a multi-layer circuit board with precise alignment and tight connection.
Referring to fig. 3A, in a first preferred embodiment of the present invention, the pre-fixing process is performed by performing pressure and heat fusion on the stacked substrate in the positioning region 10. That is, the bonding films 12 bond the adjacent circuit boards 11 in the positioning region 10 by locally performing the pressure-heat fusion in the positioning region 10. Therefore, when the positioning through holes 100 are formed, dust and debris generated by the circuit boards 11 and the adhesive films 12 are scattered to the outside of the stacked substrate and cannot fall between the circuit boards 11 and the adhesive films 12, so that the circuit layers on the surfaces of the circuit boards 11 are prevented from being affected.
Referring to fig. 3B, the stacked substrate fused and fixed in the positioning area 10 is then placed on the positioning pins 21, and a pressing process is performed to completely fix each circuit board 11 in the stacked substrate through the adhesive film 12. That is, the two-stage alignment step of partially pressing, heating and fusing the pre-fixing in the positioning region 10 and then placing the whole stacked substrate on the positioning pins 21 ensures that the stacked positioning positions of the circuit boards 11 aligned precisely by optical positioning are maintained stable and will not shift in the subsequent pressing process.
Referring to fig. 4A, in a second preferred embodiment of the present invention, the pre-fixing process rivets each of the positioning regions 10 of the stacked substrate, i.e. drives a rivet 13 into each of the positioning regions 10. The circuit boards 11 are pre-fixed by riveting a plurality of rivets 13, so that the fixing strength is better, and even if the stacked substrate is subjected to a shearing force in a parallel direction, the circuit boards 11 can be prevented from being deviated. Preferably, a hollow rivet is used to facilitate the subsequent step of forming the positioning through-hole 100. Referring to fig. 4B, the positioning through hole 100 is formed in the rivet 13 for passing the positioning pin 21. Similarly, by performing riveting and fixing in the positioning area 10, forming the positioning through hole 100 and placing the stacked substrate on the positioning pin 21, it is ensured that the stacked positioning position of the circuit boards 11 aligned in the initial optical positioning will not be shifted by external force during the moving process or the subsequent pressing process.
In a third preferred embodiment of the present invention, the pre-fixing process is performed by performing a pressure and heat fusion in each of the positioning regions 10, and then performing a riveting process. Therefore, it is ensured that no offset occurs between the circuit boards 11 during the riveting process, and the alignment accuracy between the circuit boards 11 is further improved.
In a fourth preferred embodiment of the present invention, after the pre-fixing procedure is performed, the stacked substrate pair is located at a predetermined position of the processing platform by an optical scanning method, and then a step of forming a positioning through hole is further performed, so as to improve the precision of the through hole processing position.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. A method for manufacturing a multilayer printed circuit board, comprising the steps of:
preparing a plurality of circuit boards and at least one adhesive film;
aligning each circuit board to a superposition positioning position in sequence and superposing the circuit boards, and placing adhesive films in a staggered mode to form a superposed substrate; the laminated substrate is provided with a plurality of positioning areas;
performing a pre-fixing procedure on each positioning area;
forming a positioning through hole in each positioning area of the laminated substrate;
sleeving the laminated substrate on a plurality of positioning pins of a laminating machine table through the positioning through holes; and
and executing a pressing procedure on the laminated substrate.
2. The method of claim 1, wherein the pre-fixing process performs the fusing by applying pressure and heat in the positioning region of the stacked substrates.
3. The method of claim 1, wherein the pre-fixing process rivets in each of the positioning regions of the stacked substrates.
4. The method of claim 1, wherein the pre-fixing process comprises performing a pressure-heat fusion process and a riveting process on the stacked substrates in each of the positioning regions.
5. The method of claim 1, wherein the step of forming the positioning vias is performed after performing a pre-fixing procedure on each positioning region and then performing an optical positioning on the stacked substrate.
6. The method of manufacturing a multilayer printed circuit board according to claim 3 or 4, wherein the riveting is performed using a hollow rivet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911409471.7A CN113133227A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911409471.7A CN113133227A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113133227A true CN113133227A (en) | 2021-07-16 |
Family
ID=76770032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911409471.7A Pending CN113133227A (en) | 2019-12-31 | 2019-12-31 | Method for manufacturing multilayer printed circuit board |
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| Country | Link |
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| CN (1) | CN113133227A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0116660B2 (en) * | 1984-08-06 | 1989-03-27 | Totsupan Insatsu Kk | |
| JPH0298195A (en) * | 1988-10-04 | 1990-04-10 | Mitsubishi Electric Corp | Manufacture of multilayer printed board |
| CN2515921Y (en) * | 2001-11-07 | 2002-10-09 | 阳程科技股份有限公司 | Circuit board/printed circuit board with conducting heating return circuit |
| CN102811560A (en) * | 2012-07-31 | 2012-12-05 | 电子科技大学 | Preparation method of high-low frequency hybrid-voltage printed circuit board |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| TWI645761B (en) * | 2017-05-16 | 2018-12-21 | 陽程科技股份有限公司 | Lay-up method and pre fixation device of multilayer circuit board |
-
2019
- 2019-12-31 CN CN201911409471.7A patent/CN113133227A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0116660B2 (en) * | 1984-08-06 | 1989-03-27 | Totsupan Insatsu Kk | |
| JPH0298195A (en) * | 1988-10-04 | 1990-04-10 | Mitsubishi Electric Corp | Manufacture of multilayer printed board |
| CN2515921Y (en) * | 2001-11-07 | 2002-10-09 | 阳程科技股份有限公司 | Circuit board/printed circuit board with conducting heating return circuit |
| CN102811560A (en) * | 2012-07-31 | 2012-12-05 | 电子科技大学 | Preparation method of high-low frequency hybrid-voltage printed circuit board |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| TWI645761B (en) * | 2017-05-16 | 2018-12-21 | 陽程科技股份有限公司 | Lay-up method and pre fixation device of multilayer circuit board |
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