JPH08204335A - Manufacture of multilayer copper-clad laminated board - Google Patents
Manufacture of multilayer copper-clad laminated boardInfo
- Publication number
- JPH08204335A JPH08204335A JP984095A JP984095A JPH08204335A JP H08204335 A JPH08204335 A JP H08204335A JP 984095 A JP984095 A JP 984095A JP 984095 A JP984095 A JP 984095A JP H08204335 A JPH08204335 A JP H08204335A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- printed wiring
- prepreg
- pins
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は多層銅張積層板の製造方
法に関し、特にコンピュータ，通信機等に用いられる多
層銅張積層板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a multilayer copper-clad laminate, and more particularly to a method for producing a multilayer copper-clad laminate used for computers, communication devices and the like.
【０００２】[0002]
【従来の技術】一般に用いられている従来例１の多層銅
張積層板の製造方法は、各層の内層印刷配線板が所定の
位置に積層される必要があるため、図３に示すように、
各内層印刷配線板２と各内層印刷配線板２間に挿入され
る複数枚ののプリプレグ１の相対応する位置にガイドホ
ール４を穿設し、図４（ａ）に示すように、各内層印刷
配線板２とプリプレグ１と外層銅箔３を積層ピン５を用
いて、位置合わせを行いながら組み合わせ積層して積層
体９を形成し、図４（ｂ）に示すごとく、この積層体９
を一組として積層体９を一対の鏡板７で挟んで積重す
る。その後、鏡板７及び積層体９のそれぞれ対応する所
定の位置に穿設してある複数個のガイドホール４を有す
る治具８に積層体９及び鏡板７に挿入されている積層ピ
ン５とともにセットする。しかる後、ガイドホール４に
積層ピン５を挿入した状態でこれを積層プレスの熱板間
に挿入して、加熱・加圧成形をして、所望の多層銅張積
層板を製造していた。2. Description of the Related Art A method of manufacturing a multilayer copper-clad laminate of Conventional Example 1 which is generally used requires an inner printed wiring board of each layer to be laminated at a predetermined position, as shown in FIG.
Guide holes 4 are formed at positions corresponding to the respective inner-layer printed wiring boards 2 and the plurality of prepregs 1 inserted between the respective inner-layer printed wiring boards 2, and as shown in FIG. The printed wiring board 2, the prepreg 1, and the outer layer copper foil 3 are combined and laminated while performing positioning using the laminated pins 5 to form a laminated body 9, as shown in FIG. 4B.
Are stacked, and the stack 9 is sandwiched between a pair of end plates 7 and stacked. Then, the jig 8 having a plurality of guide holes 4 drilled at predetermined positions corresponding to the end plate 7 and the laminated body 9 is set together with the laminated pins 9 inserted in the laminated body 9 and the end plate 7. . Thereafter, the laminated pin 5 was inserted into the guide hole 4 and then inserted between the hot plates of the laminating press, and heat and pressure molding was performed to manufacture a desired multilayer copper clad laminate.
【０００３】この多層銅張積層板の製造方法では、１治
具当たりにセットする積層体９に合わせ、積層ピン５を
多種類準備しなければならないことと、積層ピン５が加
熱・加圧成形時の樹脂流出により抜き出すのが困難とな
ること及び積層ピン５を治具に配置しなければならない
ことにより、複数の積層体９を同時に加熱・加圧成形出
来ないという欠点がある。In this method of manufacturing a multilayer copper-clad laminate, it is necessary to prepare various types of laminated pins 5 in accordance with a laminated body 9 to be set per jig. There is a drawback in that it is difficult to extract the plurality of laminates 9 by heating and pressing at the same time, because it is difficult to extract the resin due to the outflow of resin at the time and the lamination pins 5 must be arranged in the jig.
【０００４】前述した従来例１の改善を行った多層プリ
ント配線板の製造方法として、従来例２の特開昭５９−
６９９９７号公報に示されているように、プリプレグ１
のガイドホール４の周囲を成形前に予め硬化させ、その
後積層ピン５を挿入し加熱・加圧成形を行う方法があ
る。As a method of manufacturing a multilayer printed wiring board in which the above-mentioned conventional example 1 is improved, Japanese Patent Laid-Open Publication No.
No. 69997, the prepreg 1
There is a method in which the periphery of the guide hole 4 is hardened in advance before molding, and then the laminated pin 5 is inserted and heat / pressure molding is performed.
【０００５】この多層プリント配線板の製造方法では、
外層銅箔３に内層印刷配線板２およびプリプレグ１と同
様にガイドホール４を穿設しなければならず、そのガイ
ドホール４より加熱・加圧成形時に樹脂が流出し、積層
ピン５を抜き取るのが困難となる欠点がある。In this method of manufacturing a multilayer printed wiring board,
Guide holes 4 must be formed in the outer copper foil 3 in the same manner as the inner printed wiring board 2 and the prepreg 1, and the resin flows out from the guide holes 4 during heating and pressure molding, and the laminated pins 5 are removed. Has the drawback that it becomes difficult.
【０００６】一方、従来例３の多層板の製造方法では、
特開昭６１−２２４４９７号公報に示されているよう
に、複数の内層印刷配線板２間の位置決め接着剤を用い
て位置決め及び固定を行い、その後加熱・加圧成形を行
う方法がある。On the other hand, in the method of manufacturing the multilayer board of Conventional Example 3,
As disclosed in JP-A-61-224497, there is a method of performing positioning and fixing using a positioning adhesive between a plurality of inner-layer printed wiring boards 2, and then performing heat and pressure molding.
【０００７】さらに、従来例４の多層印刷配線基板の製
造方法では、特開昭５６−１３０９９７号公報、特開昭
５７−１２９７号公報に示されているように、複数の内
層印刷配線板２及び複数のプリプレグ１を積層ピン５に
て位置合わせを行った後、接着剤または接着テープを用
いて接着し、積層ピン５から外して加熱・加圧成形を行
う方法がある。Further, in the method of manufacturing the multilayer printed wiring board of Conventional Example 4, as shown in JP-A-56-130997 and JP-A-57-1297, a plurality of inner-layer printed wiring boards 2 are provided. And a method in which a plurality of prepregs 1 are aligned with the laminated pins 5 and then bonded using an adhesive or an adhesive tape, removed from the laminated pins 5 and subjected to heat and pressure molding.
【０００８】この従来例３及び従来例４の製造方法で
は、接着テープや接着剤が製造した多層銅張積層板の内
部に残留する可能性があり安定した品質を維持すること
が困難であるという欠点がある。In the manufacturing methods of the conventional examples 3 and 4, it is difficult to maintain a stable quality because there is a possibility that the adhesive tape or the adhesive may remain inside the manufactured multilayer copper-clad laminate. There are drawbacks.
【０００９】また、従来例５の多層積層板の積層方法で
は、特開平２−２４１０９１号公報に示されているよう
に、積層される複数の内層印刷配線板２及び複数のプリ
プレグ１を局部的に溶着して内層印刷配線板２間の相互
の位置ずれを無くした後加熱・加圧成形を行う方法があ
る。Further, in the method of laminating a multilayer laminated board of the conventional example 5, as shown in Japanese Patent Application Laid-Open No. 2-241091, a plurality of laminated inner printed wiring boards 2 and a plurality of prepregs 1 are locally localized. Then, heat and pressure molding is performed after eliminating the mutual displacement between the inner printed wiring boards 2 by welding.
【００１０】この従来例５の積層方法では、溶接を内層
印刷配線板２及びプリプレグ１を組み合わせた上下より
溶接するため、組み合わせた内部の溶接が不十分となり
位置ずれを生じ易いという欠点がある。In the laminating method of the prior art 5, since the welding is performed from above and below the combination of the inner printed wiring board 2 and the prepreg 1, there is a disadvantage that the welding inside the combined is insufficient and the displacement is apt to occur.
【００１１】[0011]
【発明が解決しようとする課題】上述した従来の多層銅
張積層板の製造方法では、下記に列挙する問題点があ
る。The above-mentioned conventional method for manufacturing a multilayer copper-clad laminate has the following problems.
【００１２】（１）積層ピンが挿入してあるガイドホー
ル部に加熱・加圧成形時に樹脂が流出し、積層ピンを抜
き取ることが困難となる。(1) The resin flows out into the guide hole into which the laminated pin is inserted at the time of heat and pressure molding, and it becomes difficult to remove the laminated pin.
【００１３】（２）１治具当たりにセットする積層体に
合わせ、積層ピンを多種類準備しなければならない。(2) It is necessary to prepare various types of lamination pins according to the lamination to be set per jig.
【００１４】（３）治具に積層ピンを配置しなければな
らないことにより、複数の積層体を同時に製造できな
い。(3) A plurality of laminated bodies cannot be manufactured at the same time because the laminated pins must be arranged on the jig.
【００１５】（４）積層ピンを用いずに、積層体の上下
より溶接し位置決めを行う場合、内部の固定が不十分と
なり位置ずれを生じ易い。(4) In the case where the laminated body is welded from above and below for positioning without using the laminated pin, the internal fixation becomes insufficient and the positional deviation easily occurs.
【００１６】本発明の目的は、積層ピンの抜き取りが容
易で多種類の積層ピンの準備の必要がなく、効率的に積
層ができ位置ずれのない積層体を形成できる多層銅張積
層板の製造方法を提供することにある。An object of the present invention is to manufacture a multi-layer copper-clad laminate that can be easily laminated, does not require preparation of various types of laminated pins, can be laminated efficiently, and can be formed without displacement. It is to provide a method.
【００１７】[0017]
【課題を解決するための手段】本発明の多層銅張積層板
の製造方法は、導体回路を有する複数枚の内層印刷配線
板の所定の位置に層間位置合わせ用のガイドホールを複
数箇所穿設する工程と、前記内層印刷配線板の間に挿入
されこの内層印刷配線板を接着するプリプレグの前記ガ
イドホールと相対応する位置にガイドホールを穿設する
工程と、前記内層印刷配線板を前記プリプレグを介して
積層しそれぞれの前記ガイドホールに積層ピンを挿入し
位置合わせを行う工程と、この積層ピンを加熱し前記プ
リグレグのガイドホールの周囲を硬化させ前記内層印刷
配線板と前記プリプレグを固定した後前記積層ピンを抜
き取る工程と、両面に銅箔を組み合わせ加熱・加圧成形
する工程とを含む。According to the method of manufacturing a multilayer copper-clad laminate of the present invention, a plurality of guide holes for interlayer positioning are formed at predetermined positions of a plurality of inner printed wiring boards having conductive circuits. And a step of forming a guide hole at a position corresponding to the guide hole of the prepreg that is inserted between the inner printed wiring boards and adheres the inner printed wiring board, and that the inner printed wiring board is inserted through the prepreg. A step of inserting a laminated pin into each of the guide holes and performing alignment, heating the laminated pin, curing the periphery of the guide hole of the prepreg, fixing the inner layer printed wiring board and the prepreg, and then The method includes a step of extracting a laminated pin and a step of combining and heating and pressing copper foil on both surfaces.
【００１８】[0018]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１９】図１（ａ）〜（ｃ）は本発明の第１の実施
例を説明する工程順に示した断面図である。本発明の第
１の実施例は、まず、図１（ａ）に示すように、、各層
の内層印刷配線板２が所定の位置に積層される必要があ
るための、各内層印刷配線板２とこれらの内層印刷配線
板２間に挿入される複数枚のプリプレグ１のそれぞれ相
対応する同じ位置にガイドホール４を穿設して積層ピン
５を挿入し各内層印刷配線板２の位置合わせを行う。次
に、図１（ｂ）に示すように、積層ピン５を加熱し積層
ピン５の周囲のプリプレグ１を硬化させ各内層印刷配線
板２を接着し固定する。このときの積層ピン５の加熱温
度は１１０〜１８０℃，加熱時間は１分〜２時間が適当
である。また、プリプレグ熱硬化部６を形成した後、積
層ピン５を抜き取る。プリプレグ熱硬化部６はガイドホ
ール４の周囲１０ｍｍのリング状に形成するのが望まし
い。次に、図１（ｃ）に示すように、一対の外層銅箔３
と組み合わせ積層体９を形成する。この時用いる外層銅
箔３にはガイドホール４は穿設する必要はない。その
後、積層体９を一組として積層体９間に鏡板７を挟んで
積重して治具８にセットし、これを積層プレスの熱板間
に挿入して加熱・加圧成形して第１の実施例の多層銅張
積層板を得る。FIGS. 1A to 1C are sectional views showing a first embodiment of the present invention in the order of steps for explaining the first embodiment. In the first embodiment of the present invention, first, as shown in FIG. 1A, each inner-layer printed wiring board 2 needs to be laminated at a predetermined position. And a plurality of prepregs 1 inserted between the inner printed wiring boards 2, each having a guide hole 4 at the same position corresponding to each other, and inserting the laminated pins 5 to align the respective inner printed wiring boards 2. Do. Next, as shown in FIG. 1 (b), the laminated pins 5 are heated to cure the prepreg 1 around the laminated pins 5, and the inner printed wiring boards 2 are bonded and fixed. At this time, the heating temperature of the laminated pin 5 is 110 to 180 ° C., and the heating time is 1 minute to 2 hours. After forming the prepreg thermosetting portion 6, the laminated pin 5 is removed. The prepreg thermosetting portion 6 is desirably formed in a ring shape of 10 mm around the guide hole 4. Next, as shown in FIG.
To form a laminate 9. The guide hole 4 need not be formed in the outer copper foil 3 used at this time. After that, the laminated body 9 is set as one set, the end plates 7 are sandwiched between the laminated bodies 9 and stacked, and the stacked bodies are set on the jig 8. The multilayer copper clad laminate of Example 1 is obtained.
【００２０】図２は本発明の第２の実施例の積層体のセ
ット方法を説明する斜視図である。本発明の第２の実施
例は積層体の面積が小さい場合の例で、図２に示すよう
に、治具８の面積を有効に利用するように数種類の面積
の大きさの異る積層体９を組み合わせて治具８にセット
し、加熱・加圧成形して同時に複数の多層銅張積層板を
得る。この第２の実施例を用いることにより、例えば、
２種類の大きさの異なる積層体９を同時に加熱・加圧成
形を行った場合、従来の１／２の時間でそれぞれの多層
銅張積層板を、また、３種類の大きさの異る積層体９を
加熱・加圧成形を行った場合は、１／３の時間でそれぞ
れの多層銅張積層板を得ることが可能となる。FIG. 2 is a perspective view for explaining a method of setting a laminate according to a second embodiment of the present invention. The second embodiment of the present invention is an example in which the area of the laminated body is small, and as shown in FIG. 2, several kinds of laminated bodies having different sizes so that the area of the jig 8 can be used effectively. 9 are combined and set on a jig 8, and are subjected to heat and pressure molding to simultaneously obtain a plurality of multilayer copper-clad laminates. By using this second embodiment, for example,
When two kinds of laminates 9 having different sizes are simultaneously subjected to heat and pressure molding, each multilayer copper-clad laminate is laminated in half the time of the conventional method, and three different sizes of laminates are laminated. When the body 9 is subjected to heat and pressure molding, each multilayer copper-clad laminate can be obtained in 1/3 of the time.
【００２１】[0021]
【発明の効果】以上説明したように本発明は、内層印刷
配線板とプリプレグの相対応する同じ位置に層間位置合
わせ用のガイドホールを複数個設けてこのガイドホール
に積層ピンを挿入した状態で位置合わせを行い積層ピン
を加熱し、予めガイドホール周囲を硬化させこの内層印
刷配線板とプリプレグを固定してから積層ピンを抜取
り、外層銅箔を組み合わせ加熱・加圧成形を行うことに
より、次に列挙する効果が得られる。As described above, according to the present invention, a plurality of guide holes for interlayer positioning are provided at the same position corresponding to the inner printed wiring board and the prepreg, and the laminated pins are inserted into the guide holes. After positioning, heating the laminated pins, curing the surroundings of the guide holes in advance, fixing the inner layer printed wiring board and prepreg, removing the laminated pins, combining the outer copper foil, and performing heating and pressure molding, The following effects can be obtained.
【００２２】（１）積層ピンを加熱・加圧成形前に抜き
取ることにより、成形後のピン抜き作業を廃止できる。(1) By extracting the laminated pin before the heat and pressure forming, the pin removing operation after the forming can be eliminated.
【００２３】（２）治具にセットする積層体の枚数によ
る積層ピン長さの選定が不要となり、積層ピンの長さ種
類が１種類に限定できる。(2) It is not necessary to select the length of the laminated pin depending on the number of laminated bodies set on the jig, and the length of the laminated pin can be limited to one type.
【００２４】（３）積層体の面積が小さい場合に、複数
の種類の積層体を同時に加熱・加圧成形が可能で作業効
率を向上できる。(3) When the area of the laminate is small, a plurality of types of laminates can be simultaneously heated and pressed to improve the working efficiency.
【００２５】（４）積層ピンを加熱して内層印刷配線板
とプリプレグの固定を行うため、積層体の内部も均一に
固定でき位置ずれを防止できる。(4) Since the inner layer printed wiring board and the prepreg are fixed by heating the laminated pin, the inside of the laminated body can be evenly fixed and the positional deviation can be prevented.
【図１】（ａ）〜（ｃ）は本発明の第１の実施例を説明
する工程順に示した断面図である。FIGS. 1A to 1C are cross-sectional views showing a first embodiment of the present invention in the order of steps for explaining the first embodiment.
【図２】本発明の第２の実施例の積層体のセット方法を
説明する斜視図である。FIG. 2 is a perspective view illustrating a method for setting a laminate according to a second embodiment of the present invention.
【図３】従来の内層印刷配線板とプリプレグの積層状態
を示す斜視図である。FIG. 3 is a perspective view showing a laminated state of a conventional inner layer printed wiring board and a prepreg.
【図４】（ａ），（ｂ）は従来例の多層銅張積層板の製
造方法を説明する工程順に示した断面図である。4 (a) and 4 (b) are cross-sectional views showing, in the order of steps, a method for manufacturing a conventional multilayer copper clad laminate.
１ プリプレグ ２ 内層印刷配線板 ３ 外層銅箔 ４ ガイドホール ５ 積層ピン ６ プリプレグ熱硬化部 ７ 鏡板 ８ 治具 ９ 積層体 1 prepreg 2 inner layer printed wiring board 3 outer layer copper foil 4 guide hole 5 laminated pin 6 prepreg thermosetting part 7 end plate 8 jig 9 laminated body
Claims (1)
板の所定の位置に層間位置合わせ用のガイドホールを複
数箇所穿設する工程と、前記内層印刷配線板の間に挿入
されこの内層印刷配線板を接着するプリプレグの前記ガ
イドホールと相対応する位置にガイドホールを穿設する
工程と、前記内層印刷配線板を前記プリプレグを介して
積層しそれぞれの前記ガイドホールに積層ピンを挿入し
位置合わせを行う工程と、この積層ピンを加熱し前記プ
リグレグのガイドホールの周囲を硬化させ前記内層印刷
配線板と前記プリプレグを固定した後前記積層ピンを抜
き取る工程と、両面に銅箔を組み合わせ加熱・加圧成形
する工程とを含むことを特徴とする多層銅張積層板の製
造方法。A step of forming a plurality of guide holes for interlayer alignment at predetermined positions of a plurality of inner printed wiring boards having conductive circuits; and inserting said plurality of inner printed wiring boards between said inner printed wiring boards. Forming a guide hole at a position corresponding to the guide hole of the prepreg, and laminating the inner layer printed wiring board via the prepreg, inserting a laminated pin into each of the guide holes, and performing alignment. Performing a step of heating the laminated pin, curing the periphery of the guide hole of the prepreg, fixing the inner printed wiring board and the prepreg, and then extracting the laminated pin, and combining both sides with copper foil, heating and pressing. Forming a multilayer copper-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP984095A JP2602423B2 (en) | 1995-01-25 | 1995-01-25 | Method for producing multilayer copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP984095A JP2602423B2 (en) | 1995-01-25 | 1995-01-25 | Method for producing multilayer copper-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08204335A true JPH08204335A (en) | 1996-08-09 |
| JP2602423B2 JP2602423B2 (en) | 1997-04-23 |
Family
ID=11731329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP984095A Expired - Fee Related JP2602423B2 (en) | 1995-01-25 | 1995-01-25 | Method for producing multilayer copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2602423B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128275A (en) * | 2004-10-27 | 2006-05-18 | Hitachi Chem Co Ltd | Method for manufacturing multilayer board |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN113840481A (en) * | 2021-10-25 | 2021-12-24 | 东莞市吉宏五金科技有限公司 | Pin feeding encapsulation machine and PIN feeding encapsulation process |
| US11919251B2 (en) | 2019-11-15 | 2024-03-05 | Mitsubishi Electric Corporation | Adhesive member, adhesion method, and method for manufacturing electronic device casing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI733135B (en) * | 2019-07-02 | 2021-07-11 | 美商塔德克公司 | Manufacturing method of multilayer printed circuit board |
-
1995
- 1995-01-25 JP JP984095A patent/JP2602423B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128275A (en) * | 2004-10-27 | 2006-05-18 | Hitachi Chem Co Ltd | Method for manufacturing multilayer board |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| US11919251B2 (en) | 2019-11-15 | 2024-03-05 | Mitsubishi Electric Corporation | Adhesive member, adhesion method, and method for manufacturing electronic device casing |
| CN113840481A (en) * | 2021-10-25 | 2021-12-24 | 东莞市吉宏五金科技有限公司 | Pin feeding encapsulation machine and PIN feeding encapsulation process |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2602423B2 (en) | 1997-04-23 |
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