CN113132019B

CN113132019B - External modulation type multi-channel cooperative simulation multi-dimensional microwave photon acquisition chip

Info

Publication number: CN113132019B
Application number: CN202110545768.7A
Authority: CN
Inventors: 李沛轩; 邹喜华; 邹放; 白文林; 潘炜; 闫连山
Original assignee: Southwest Jiaotong University
Current assignee: Southwest Jiaotong University
Priority date: 2021-05-19
Filing date: 2021-05-19
Publication date: 2022-04-29
Anticipated expiration: 2041-05-19
Also published as: CN113132019A

Abstract

The invention discloses an external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip which utilizes an on-chip 8-path parallel phase modulator combination to realize the dense acquisition function of multi-channel signals and combines an optical phase shifter PS, a 2 x 1 multi-mode interferometer MMI type multiplexer, an asymmetrical Mach Zehnder interferometer AMZI type wave splitter cascade and parallel reconfigurable optical path selection unit, a polarization beam combiner and the like to realize the multi-channel cooperative analog multi-dimensional signal acquisition function. The invention realizes the dense acquisition function of multi-channel signals; and meanwhile, the multi-channel cooperative acquisition function of the simulated multi-dimensional microwave photon signals can be completed.

Description

External modulation type multi-channel cooperative simulation multi-dimensional microwave photon acquisition chip

Technical Field

The invention belongs to the technical field of integrated microwave photons, and particularly relates to an external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip.

Background

The acquisition and the reception of multi-channel microwave signals are key links of a modern radio frequency system, and relate to a plurality of core key application fields such as communication, radar, electronic warfare and the like. At present, 5G/B5G and a spatial information network rapidly evolve and gradually enter a plurality of fields such as satellite communication, rail transit, military and civil integration and the like to play a basic supporting role. However, the "heterogeneous" nature of these systems and industrial applications is very clear: multiple frequency bands, multiple standards, multiple functions, multiple services, multiple platforms, multiple scenes and the like coexist and blend for a long time. The continuous promotion of the multi-band, multi-standard and multi-functional integrated system needs to realize the compatibility and the quick reconstruction of ultra-wideband and multi-band signals, and brings great challenges to the traditional microwave signal acquisition means based on electronic technology. The advantages of large bandwidth, low loss, electromagnetic interference resistance, flexible reconstruction and the like of the microwave photon technology provide a new effective way for solving the problems.

Generally, a microwave photon signal multichannel acquisition system is built by a discrete electro-Optical modulator, a photodetector and various Optical processing units together, such as a microwave photon channelized receiver (r.li, h.chen, y.yu, m.chen, s.yang, s.xie, "Multiple-Frequency Measurement Based on Serial photon Channelization Optical Wavelength Scanning," Optics Letters, pp:4781,2013), and by Using a circulating Optical Frequency shift and a time-domain Optical switch, channelized acquisition and reception of a 20GHz wide-spectrum signal is realized. However, the microwave photon collection system based on discrete devices is difficult to meet practical requirements in terms of cost, volume, power consumption and the like. The further development and maturity of the integrated microwave photon technology indicate the development direction for the integrated multichannel simulation microwave photon signal acquisition. For example, NTT corporation of Japan reports an 8-channel electro-absorption modulated laser array transceiver module with 3-dB bandwidth exceeding 50GHz by using flip-chip packaging technology (S. Kanazawa, T. Fujisawa, H. Ishii, et al. "High-speed (400Gb/s) light-channel EADFB laser array using flip-chip interconnection technology," IEEE Journal of Selected diodes in Quantum Electronics, vol.21, No.6, pp.183-188,2015.). Researchers at the Egyin thermo industries, Netherlands have reported 8-channel multi-channel transmit chips with single channel 3-dB bandwidths exceeding 40GHz (W.Yao, M.Smit and M.Wale, "Monolithic 300Gb/s parallel transmitter in-based genetic integration technology," IEEE Journal of Selected topocs in Quantum Electronics, vol.24, No.1, pp.1-11,2017) using a laser and MZM modulator array structure with the aid of an indium phosphide (InP) -based photonic integration platform.

However, most of the reported multi-channel integrated acquisition chips are directed to digital modulation formats, and the chip design for wideband analog signal acquisition is rarely reported. And the analog modulation has more strict requirements on indexes such as linearity, dynamic range and the like. Meanwhile, most of the chips only have an independent single-dimensional signal modulation function (mainly intensity modulation), and cannot meet the requirement of microwave signal optical domain collaborative multi-dimensional acquisition and reconstruction.

Disclosure of Invention

In view of the above problems faced by the acquisition and reception of multi-channel microwave signal photonics, the present invention provides an external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip.

The invention relates to an external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip which comprises a light injection port, a multi-channel cooperative acquisition module, a reconfigurable multi-dimensional acquisition module, a polarization beam combiner and a light output port.

The multi-path cooperative acquisition module comprises an optical phase shifter, a 4-path parallel phase modulator and a two-stage parallel and cascaded MMI type wave combiner; a light source is directly input into a 4-path phase modulator through a light injection port and a light phase shifter, and a 4-path parallel phase modulator is used for collecting multiple paths of analog signals and modulating the analog signals onto optical carriers of different channels, namely signal photonics collection; and then, coupling optical signals of different channels by using an MMI type wave combiner connected in parallel and cascade through two stages.

The reconfigurable multi-dimensional acquisition module comprises a reconfigurable optical path selection unit, a 4-path parallel phase modulator, an optical phase shifter and a two-stage MMI type wave combiner which is connected in parallel and in cascade connection; a light source input by the light injection port is divided into 4 paths of signals through a reconfigurable light path selection unit, the signals are correspondingly input into 4 paths of phase modulators, and in the phase modulators, analog broadband signals are modulated onto multiple paths of optical carriers, namely photon signal acquisition is implemented; the output signals of the 4 paths of phase modulators are combined by two stages of MMI type wave combiners which are connected in parallel and cascade after passing through the optical phase shifter.

The multi-path cooperative acquisition module and the reconfigurable multi-dimensional acquisition module are subjected to polarization combination by the polarization beam combiner and output through the optical output port.

The reconfigurable optical path selection unit is formed by combining three cascade and parallel adjustable asymmetric Mach Zehnder interferometer type wave splitters; the adjustable asymmetric Mach-Zehnder interferometer type wave splitter is composed of a phase shifter and two MMI couplers.

The beneficial technical effects of the invention are as follows:

1. the multichannel acquisition chip provided by the invention realizes the function of intensive acquisition of multichannel signals on a chip based on multichannel parallel phase modulation.

2. The multi-channel acquisition chip provided by the invention can realize multi-channel coherent acquisition channels and support the cooperative acquisition function of multi-channel microwave signals.

3. The multi-channel acquisition chip provided by the invention can realize a reconfigurable analog multi-dimensional modulation acquisition function based on-chip dynamic bias control and light path selection.

Drawings

Fig. 1 is a schematic structural diagram of an external modulation type multi-channel cooperative analog multi-dimensional microwave photon collection chip.

Fig. 2 is a block diagram of an asymmetric mach-zehnder interferometer type demultiplexer.

In the figure: PS: an optical phase shifter; MMI: a multimode interference coupler; AMZI: asymmetric Mach-Zehnder interferometer

Detailed Description

The invention is described in further detail below with reference to the figures and the detailed description.

The invention discloses an external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip, which is shown in figure 1 and comprises a light injection port 10, a multi-channel cooperative acquisition module 20, a reconfigurable multi-dimensional acquisition module 30, a polarization beam combiner 40 and a light output port 50.

The multi-path cooperative acquisition module 20 comprises an optical phase shifter 201, a 4-path parallel phase modulator 202 and a two-stage parallel and cascaded MMI type wave combiner 203; a light source is directly input into a 4-path phase modulator 202 through a light injection port 10 and a light phase shifter 201, and a 4-path parallel phase modulator 202 is used for collecting multiple paths of analog signals and modulating the analog signals onto optical carriers of different channels, namely signal photonics collection; and then, two paths of phase modulation signal combination are respectively carried out by utilizing two parallel 2 × 1MMI type wave combiners, two channels are supported to be cooperatively collected, the outputs of the two parallel 2 × 1MMI type wave combiners are further coupled by the other 2 × 1MMI type wave combiner, and four channels are supported to be cooperatively collected. In the module, the optical phase shifter 201 dynamically controls the phases of optical carriers of different paths, so as to realize phase matching of optical waves of different paths, thereby finally supporting multi-channel cooperative acquisition.

The reconfigurable multi-dimensional acquisition module 30 comprises a 1 × 4 reconfigurable optical path selection unit 301, a 4-path parallel phase modulator 302, an optical phase shifter 303 and a two-stage parallel and cascade connected MMI-type wave combiner 304; the reconfigurable optical path selection unit 301 is formed by combining three cascade and parallel adjustable asymmetric Mach Zehnder interferometer type wave splitters; as shown in fig. 2, the tunable asymmetric mach-zehnder interferometer type demultiplexer is composed of a phase shifter 3011, a 1 × 2MMI type demultiplexer 3012, and a 2 × 1MMI type multiplexer 3013.

A light source input by the light injection port 10 is divided into 4 paths of signals through a reconfigurable light path selection unit 301, the signals are correspondingly input into a 4-path phase modulator 302, and in the phase modulator 302, an analog broadband signal is modulated onto multiple paths of optical carriers, namely photon signal acquisition is implemented; the output signals of the 4-path phase modulator 302 are combined by a two-stage parallel and cascade connected MMI-type combiner 304 after passing through an optical phase shifter 303. In this module, the on-chip optical path dynamic selection can be realized by the combined control of the adjustable phase shifter 3011 of the 3 AMZI, and a plurality of different optical paths are constructed, including: parallel multi-path phase modulation, double-drive MZM optical paths, double-parallel MZM optical paths and the like. Further combining with on-chip dynamic bias control implemented by the optical phase shifter 303, the reconfigurable multi-dimensional analog modulation acquisition functions of phase, intensity, single sideband, carrier double sideband suppression, carrier single sideband suppression and the like are realized.

The multi-path cooperative acquisition module 20 and the reconfigurable multi-dimensional acquisition module 30 are polarization-combined by the polarization beam combiner 40 and output through the optical output port 50. Further expand the polarization dimension, promote the flexibility of gathering the chip.

In summary of the above statements, the present invention has the following features: 1. based on-chip multi-path parallel phase modulation, the dense acquisition function of multi-path signals is realized; 2. based on-chip dynamic bias control and flexible light path selection, the multi-channel cooperative analog multi-dimensional microwave photon signal acquisition function is completed.

Claims

1. An external modulation type multi-channel cooperative analog multi-dimensional microwave photon acquisition chip is characterized by comprising a light injection port (10), a multi-channel cooperative acquisition module (20), a reconfigurable multi-dimensional acquisition module (30), a polarization beam combiner (40) and a light output port (50);

the multi-path cooperative acquisition module (20) comprises a first optical phase shifter (201), a 4-path parallel first phase modulator (202) and a two-stage parallel and cascaded first MMI type wave combiner (203); the light source is directly input to the 4-path first phase modulator (202) through the light injection port (10) and the first light phase shifter (201), and the 4-path first phase modulator (202) is used for collecting multi-path analog signals and modulating the multi-path analog signals onto optical carriers of different channels, namely signal photonics collection; then, the optical signals of different channels are coupled by a first MMI type wave combiner (203) which is connected in parallel and cascade through two stages;

the reconfigurable multi-dimensional acquisition module (30) comprises a reconfigurable optical path selection unit (301), a 4-path parallel second phase modulator (302), a second optical phase shifter (303) and a second MMI type wave combiner (304) which is connected in parallel at two stages and in cascade connection; a light source input by the light injection port (10) is divided into 4 paths of signals through a reconfigurable light path selection unit (301), the signals are correspondingly input into 4 paths of second phase modulators (302), and in the second phase modulators (302), analog broadband signals are modulated onto multiple paths of optical carriers, namely photon signal acquisition is implemented; after the output signals of the 4 paths of second phase modulators (302) pass through the second optical phase shifters (303), the output signals are combined by two stages of second MMI type wave combiners (304) which are connected in parallel and in cascade connection;

the reconfigurable optical path selection unit (301) is formed by combining three adjustable asymmetric Mach-Zehnder interferometer type wave splitters in cascade connection and parallel connection; the adjustable asymmetric Mach-Zehnder interferometer type wave splitter is composed of a phase shifter (3011) and two MMI couplers (3012 and 3013);

the multi-path cooperative acquisition module (20) and the reconfigurable multi-dimensional acquisition module (30) are polarized and combined by a polarization beam combiner (40) and output through an optical output port (50).