CN113107885A - Heat dissipation structure and heat dissipation method for bottom surface of notebook computer - Google Patents
Heat dissipation structure and heat dissipation method for bottom surface of notebook computer Download PDFInfo
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- CN113107885A CN113107885A CN202110375765.3A CN202110375765A CN113107885A CN 113107885 A CN113107885 A CN 113107885A CN 202110375765 A CN202110375765 A CN 202110375765A CN 113107885 A CN113107885 A CN 113107885A
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- air outlet
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/002—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying geometry within the pumps, e.g. by adjusting vanes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
- F04D29/4226—Fan casings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
- F04D29/44—Fluid-guiding means, e.g. diffusers
- F04D29/46—Fluid-guiding means, e.g. diffusers adjustable
- F04D29/462—Fluid-guiding means, e.g. diffusers adjustable especially adapted for elastic fluid pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/70—Suction grids; Strainers; Dust separation; Cleaning
- F04D29/701—Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps
- F04D29/703—Suction grids; Strainers; Dust separation; Cleaning especially adapted for elastic fluid pumps specially for fans, e.g. fan guards
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat radiation structure and heat radiation method for notebook computer bottom surface, through the first air intake of seting up on the radiator unit with the cold wind that radiator unit formed, derive from first air outlet after the cotton guide of shape bubble of returning, the wind that derives from first air outlet blows from the surface of notebook computer bottom surface behind the wind-guiding groove, makes cold wind directly blow through the higher region of temperature in the D face to reach the purpose that reduces notebook computer bottom surface temperature.
Description
Technical Field
The present disclosure relates to the field of notebook computers, and more particularly, to a heat dissipation structure and a heat dissipation method for a bottom surface of a notebook computer.
Background
The layout of the components of the D-surface (i.e. the bottom surface in contact with the desktop during normal use) of the notebook computer is relatively fixed, as shown in fig. 1, a long row of air inlets and a long foot pad are arranged near the rear side of the notebook computer, and the main heating components, heat pipes, and the convex columns for fixing the D-surface of the system layout are all arranged near the air inlets and the foot pads, so that the area corresponding to the D-surface is easily overheated, for example, the dotted frame in fig. 1. When a user holds the notebook computer by hand or places the notebook computer on a leg for use, the performance of the computer is affected by overheating of the D surface, and the use experience of the user is reduced.
Disclosure of Invention
An object of the embodiments of the present disclosure is to provide a heat dissipation structure and a heat dissipation method for a bottom surface of a notebook computer, so as to solve the problem of overheating of the bottom surface of the notebook computer in the prior art.
The embodiment of the disclosure adopts the following technical scheme: a heat dissipation structure for bottom surface of notebook computer at least includes: the heat dissipation assembly is provided with a first air inlet; the shell covers one side of the heat dissipation assembly, and a first air outlet is formed in the shell; the first air inlet and the first air outlet are arranged in an area enclosed by the square-wave foam; the foot pad is arranged on one side, far away from the heat dissipation assembly, of the shell, and an accommodating groove is formed in one side, close to the shell, of the foot pad and used for accommodating an air guide groove; the air guide groove is a hollow groove body, a first surface of the air guide groove is a surface in contact with the shell, the first surface is provided with a second air inlet corresponding to the first air outlet, a second surface adjacent to the first surface is provided with at least one second air outlet, and the second air outlet is used for guiding out air quantity guided by the second air inlet.
Further, the heat dissipation assembly at least comprises a centrifugal fan and a fan cover, and the fan cover is provided with the first air inlet.
Further, the size of the second air inlet is larger than or equal to that of the first air outlet.
The embodiment of the present disclosure further provides a heat dissipation structure for a bottom surface of a notebook computer, which at least includes: the heat dissipation structure; the air blocking door is arranged in the air guide groove, corresponds to the first air outlet and is used for blocking the first air outlet; the unfolding structure is arranged between the air blocking door and the air guide groove and used for providing unfolding force for the air blocking door; the contraction structure is arranged between the air blocking door and the air guide groove and is used for providing contraction force for the air blocking door; wherein the direction of the stretching force is opposite to the direction of the contracting force.
Further, the extension structure comprises at least a hydraulic rod or a spring; the constriction comprises at least a thermal memory metal and/or an electromagnetic constriction device, wherein the electromagnetic constriction device comprises at least an electromagnet or a motor.
Further, under the condition that the contraction structure is made of thermal memory metal, when the ambient temperature exceeds a first threshold value, the thermal memory metal contracts, so that the contraction force received by the air blocking door is larger than the extension force, and the first air outlet is opened.
Further, under the condition that the contraction structure is an electromagnetic contraction device, when the power of the notebook computer exceeds a second threshold value, the electromagnetic contraction device is started, so that the contraction force received by the air blocking door is greater than the extension force, and the first air outlet is opened.
Furthermore, the size of the side, close to the shell, of the air blocking door is larger than or equal to that of the first air outlet.
An embodiment of the present disclosure further provides a heat dissipation method for a bottom surface of a notebook computer, where the notebook computer has the heat dissipation structure described above, and the heat dissipation method includes: judging the form mode of the notebook computer; controlling the contraction structure to contract to open the first air outlet under the condition that the shape mode of the notebook computer is a tent mode or a panel mode; judging whether the notebook computer is placed on a desktop or not under the condition that the form mode of the notebook computer is a common mode; and under the condition that the notebook computer is not placed on a desktop, controlling the contraction structure to contract so as to open the first air outlet.
Further, when the contraction structure is an electromagnetic contraction device, the method further comprises the following steps: judging a current power consumption mode of the notebook computer under the condition that the notebook computer is not placed on a desktop; and when the current power consumption mode of the notebook computer is a high power consumption mode, controlling the contraction structure to contract so as to open the first air outlet.
The beneficial effects of this disclosed embodiment lie in: the cold air formed by the heat dissipation assembly passes through the first air inlet formed in the heat dissipation assembly, is guided out from the first air outlet after being guided by the zigzag foam, and the air guided out from the first air outlet passes through the air guide groove and then is blown over from the outer surface of the bottom surface of the notebook computer, so that the cold air directly blows over the area with higher temperature in the D surface, and the purpose of reducing the temperature of the bottom surface of the notebook computer is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a bottom view of a prior art notebook computer;
fig. 2 is a stacked view showing a positional relationship between components in the heat dissipation structure according to the first embodiment of the present disclosure;
fig. 3 is a schematic diagram of air volume transmission of the heat dissipation structure according to the first embodiment of the disclosure;
FIG. 4 is a schematic view of a portion of an air guiding slot according to a first embodiment of the present disclosure;
FIG. 5 is a schematic view illustrating the flow of air passing through the air guide slot in the first embodiment of the present disclosure;
FIG. 6 is a schematic view illustrating a first outlet being closed according to a second embodiment of the disclosure;
fig. 7 is a schematic view illustrating the opening of a first outlet according to a second embodiment of the disclosure;
fig. 8 is a flowchart illustrating a heat dissipation method for a bottom surface of a notebook computer according to a third embodiment of the disclosure.
Reference numerals
10-radiating component 11-centrifugal fan 12-fan cover 20-shell 30-square-shaped foam
40-foot pad 50-air guide groove 60-air blocking door 61-stretching structure 62-contraction structure
100-first inlet 200-first outlet 400-second outlet
Detailed Description
Various aspects and features of the disclosure are described herein with reference to the drawings.
It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.
These and other characteristics of the present disclosure will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.
It should also be understood that, although the present disclosure has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of the disclosure, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.
The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.
The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.
A first embodiment of the present disclosure provides a heat dissipation structure for a bottom surface of a notebook computer, which mainly includes the following components: the heat dissipating assembly 10, the housing 20, the hollow square-wave foam 30, the foot pad 40, and the air guiding groove 50 are described in detail below with reference to fig. 2 to 5.
Fig. 2 shows a positional relationship among components in the heat dissipation structure, and fig. 3 shows a schematic diagram of transmission of air volume in the heat dissipation structure. Specifically, the heat dissipation assembly 10 mainly includes a centrifugal fan 11 and a fan housing 12, in this embodiment, a first air inlet 100 (shown as a dashed line frame portion in fig. 3) is formed in the fan housing 11, a specific position of the first air inlet may be a portion of the fan housing 12 close to an edge of the notebook computer, a specific shape of the first air inlet 100 may be a rectangle, and specific dimensions of a length and a width of the first air inlet may be set in combination with a size of the fan housing 12 and a size of the rectangular foam 30, which is not particularly limited in this embodiment, as long as it is ensured that air volume generated when the centrifugal fan 11 operates can be guided out through the first air inlet 100.
The heat dissipation assembly 10 can be directly installed inside a notebook computer, the heat dissipation assembly 10 is covered with a housing 20 of the notebook computer, one side of the housing 20 far away from the heat dissipation assembly 10 is equivalent to a D-side of the notebook computer, in this embodiment, the housing 20 is provided with an air inlet, and at the same time, the edge of the housing is provided with a first air outlet 200. Further, a square-shaped foam 30 is further disposed between the heat dissipation assembly 10 and the housing 20, and may be a square-shaped foam structure or a foam structure with other shapes as long as the enclosed area is a closed area, it should be noted that the first air inlet 100 and the first air outlet 200 are both disposed in the area enclosed by the square-shaped foam 30, and since the square-shaped foam 30 has a certain thickness, a sealed channel is formed at the square-shaped foam 30 after the housing 20 is mounted, so that the air volume introduced by the first air inlet 100 is guided out from the first air outlet 200 under the limitation of the square-shaped foam 30. In practical implementation, the clip-shaped foam 30 may be first adhered to a surface of the fan housing 12 close to the casing 20 to ensure that the first air inlet 100 is located in an area surrounded by the clip-shaped foam 30, and then the casing 20 is fixed to make the casing 20 and the clip-shaped foam 30 fully contact with each other to compress the clip-shaped foam 30, so as to form a sealed passage.
A foot pad 40 (not shown in fig. 3) is disposed at an edge of the side of the housing 20 away from the heat dissipation assembly 10, and is used for supporting the notebook computer and preventing the notebook computer from slipping, and is generally a rubber pad with a certain length and thickness, and a receiving groove (not shown in the figure) is formed at a surface of the foot pad 40 contacting the housing 20, that is, the middle of the foot pad 40 is hollowed to form a receiving groove for receiving the air guiding groove 50. Specifically, the air guiding groove 50 may be a hollow groove body, the shape of the cross section of the air guiding groove may be rectangular, and the shape of the accommodating groove is matched with the shape of the air guiding groove 50, so that the air guiding groove 50 can be completely placed in the foot pad 40, and the bottom surface of the notebook computer is not influenced in appearance while the air guiding effect is achieved.
Fig. 4 shows a partial schematic view of the air guide groove 50. In this embodiment, a surface of the air guiding groove 50 contacting the housing 20 is a first surface of the air guiding groove 50, and taking the air guiding groove 50 shown in fig. 4 as an example, a bottom surface thereof is the first surface (not shown in fig. 4), and the first surface is provided with a second air inlet (not shown in fig. 4) corresponding to a position of the first air outlet 200 arranged on the housing 20, so as to ensure that air guided out from the first air outlet 200 can directly enter the air guiding groove 50 through the second air inlet. It should be noted that the size of the second air inlet may be greater than or equal to the size of the first air outlet 200, so as to ensure that the air volume can be directly introduced into the air guiding groove 50, and when the air guiding groove 50 is actually designed, the first surface of the air guiding groove 50 may be completely opened to be directly used as the second air inlet.
Correspondingly, the second surface of the air guiding groove 50 is provided with at least one second air outlet 400 for guiding out the air quantity guided by the second air inlet. In this embodiment, the second surface of the air guiding groove 50 is a surface adjacent to the first surface, and it needs to be ensured that the second surface is a surface far away from the inner wall of the accommodating groove, so as to ensure that the air guided out through the second air outlet 400 can flow along the surface of the housing 20, as shown in fig. 5, wherein the arrow direction in fig. 5 is the air flow direction.
It should be noted that, in the present embodiment, all the components and the openings are required to be arranged according to the limit of safety regulations, and for the air guiding duct 50, the height of the at least one second air outlet 400 formed on the second surface thereof is limited to be between 0.5 mm and 1 mm, and is preferably set to be 0.95 mm.
In the embodiment, cold air formed by the heat dissipation assembly passes through the first air inlet 100 formed in the heat dissipation assembly 10, is guided by the zigzag foam 30 and then is discharged from the first air outlet 200, and the air guided out of the first air outlet 200 passes through the air guide groove 50 and then is blown over the outer surface of the bottom surface of the notebook computer, so that the cold air directly blows over a region with higher temperature in the D surface, and the purpose of reducing the temperature of the bottom surface of the notebook computer is achieved.
The second embodiment of the present disclosure also provides a heat dissipation structure for a bottom surface of a notebook computer, on the basis of the heat dissipation structure in the first embodiment, in this embodiment, a wind blocking door 60 is disposed in the wind guiding groove 50, and the disposed position of the wind blocking door corresponds to the first wind outlet 200, so that the wind blocking door can be used for blocking the first wind outlet 200, preventing the wind led in by the first wind inlet 100 from being led out, and closing the heat dissipation structure under the condition of low power consumption or no direct contact of a user on a D surface of the notebook computer.
The heat dissipation structure in this embodiment further includes an extending structure 61 and a contracting structure 62 which are disposed between the air blocking door 60 and the air guiding groove 50, as shown in fig. 6 and 7, and are used for providing extending force and contracting force for the air blocking door 60, the extending force and the contracting force act on the air blocking door 60 in opposite directions, when the contracting force is greater than the extending force, the air blocking door 60 is far away from the first air outlet 200 under the action of the contracting force, so that the first air outlet 200 is opened, thereby achieving the heat dissipation function, when the extending force is greater than the contracting force, the air blocking door 60 is close to the first air outlet 200 or is kept in a state of blocking the first air outlet 200, and achieving the effect of blocking the first air outlet. It should be noted that, the damper door 60 is preferably a cube with a certain thickness, when the damper door 60 is disposed in the air guiding groove 50, one side of the damper door 60 close to the housing 20 is preferably in direct contact with the housing 20, and the size of the side close to the housing 20 is limited to be greater than or equal to the size of the first air outlet 200, so as to ensure that the damper door 60 can completely block the first air outlet 200 when the heat dissipation function is not required to be turned on, as shown in fig. 6.
Specifically, the unfolding structure 61 in this embodiment may use a hydraulic rod or a spring structure, or other mechanisms that have a certain length and can resist the external force to a certain extent without applying the external force, and one end of the unfolding structure is fixed inside the air guiding groove 50, and the other end of the unfolding structure is fixed on the air blocking door 60; the contraction structure 62 may be a thermal memory metal or an electromagnetic contraction device, one end of which is also fixed inside the air guiding groove 50, and the other end of which is also fixed on the damper 60, wherein the electromagnetic contraction device at least comprises a structure with a contraction characteristic or a contraction function, such as an electromagnet or a motor.
When the contraction structure 62 is made of the thermal memory metal, if the ambient temperature exceeds the first threshold, that is, the ambient temperature exceeds the phase transition temperature of the thermal memory metal, the thermal memory metal contracts, and since one end of the thermal memory metal is fixed inside the air guiding groove 50 and cannot move, the thermal memory metal drives the air blocking door 60 to be away from the first air outlet 200 when the thermal memory metal contracts. It should be noted that the selection of the thermal memory metal may be performed in combination with the corresponding phase transition temperature, so as to ensure that when the notebook computer is in a general working state, the heat generated by the working of the notebook computer is not enough to cause the thermal memory metal to contract, and only after the temperature is too high or the notebook computer is in a high power consumption state for a certain time, the heat generated by the working of the notebook computer can cause the thermal memory metal to contract, thereby achieving an effect that the heat dissipation structure is automatically opened according to the environmental temperature, when the environmental temperature is reduced below a first threshold value, the thermal memory metal can be slowly restored to a pre-contraction form, the corresponding stretching force can be slowly greater than the contraction force, and the air blocking door 60 approaches the first air outlet 200 under the stretching force until the first air outlet 200 is blocked.
If the current contraction structure 62 is an electromagnetic contraction device, the current contraction structure can be actively controlled by a notebook computer, when the heat dissipation function needs to be realized, the contraction structure 62 can be controlled to continuously increase the contraction force, and after the contraction force is greater than the extension force, the contraction structure 62 drives the air blocking door 60 to be away from the position of the first air outlet 200, so that the first air outlet 200 is opened; specifically, the notebook computer may have different powers when processing different tasks, or the notebook computer may also correspondingly open different working modes according to the user's usage requirements, and correspond to different powers in different working modes, and the higher the power is, the more obvious the heating effect of the notebook computer is, at this time, it may be set that when the power of the notebook computer exceeds the second threshold, the electromagnetic contraction device is started and starts to contract, when the contraction force is greater than the extension force, the electromagnetic contraction device drives the air blocking door 60 away from the position of the first air outlet 200, and the first air outlet 200 is opened, and when the power of the notebook computer is reduced below the second threshold, the electromagnetic contraction device may be automatically closed or the electromagnetic contraction device may be controlled to return to the pre-contraction state, that is, the first air outlet 200 is closed.
It should be noted that the above-mentioned shrinking structure 62 can use the thermal memory metal and the electromagnetic shrinking device at the same time when it is set up, so that it can automatically radiate heat when the temperature is too high, and at the same time, the opening of the heat radiating structure can be realized under the control of the notebook computer.
This embodiment has realized the on-off control to heat radiation structure through setting up the air blocking door to through the setting of extension structure and constriction structure, correspond the automation of having realized the air blocking door and open and close, can be according to notebook computer's in-service use condition when in-service use, correspond the switching selection that carries out heat radiation structure, in order to reach better result of use.
A third embodiment of the present disclosure provides a heat dissipation method for a bottom surface of a notebook computer, and is mainly applied to the notebook computer having the heat dissipation structure of the second embodiment of the present disclosure, wherein a flowchart thereof is shown in fig. 8, and mainly includes the following steps:
s1, the form mode of the notebook computer is determined, and if the form mode of the notebook computer is the normal mode, the step S2 is executed, and if the form mode of the notebook computer is the tent mode or the tablet mode, the step S3 is executed.
The conventional notebook computer usually has at least one form mode, such as a normal mode (i.e. a form mode when the notebook computer is generally used), a tablet mode (i.e. a form mode in which a keyboard side is completely rotated to a screen side back side and functions similar to the tablet computer are realized by directly touching a screen), a tent mode (i.e. a form mode in which a keyboard side is rotated to a screen side back side to form a certain included angle with the screen side and is placed on a desktop), and the like. Therefore, the notebook computer can judge the current form mode through the built-in sensors (such as a gyroscope and an angular velocity sensor), and further select whether to start the heat dissipation structure according to different form modes.
S2, judging whether the notebook computer is placed on the desktop, if not, executing S3.
And S3, controlling the contraction structure to contract so as to open the first air outlet.
In the case that the form mode of the notebook computer is the tent mode or the tablet mode, the user may perform the handheld operation on the computer for a large number of times during the use of the notebook computer, and therefore, in the two form modes, the opening of the first air outlet is preferably controlled to cool the bottom surface of the notebook computer.
When the notebook computer is in a common mode, whether the notebook computer is placed on a flat desktop or other flat object surfaces can be further judged through the internal sensor of the notebook computer, when the notebook computer is placed on the desktop for use, the bottom surface of the notebook computer is directly contacted with the desktop, a user can not usually sense the bottom surface temperature in the use process, and the first air outlet is not required to be opened to cool the bottom surface; if the notebook computer is not placed on the desktop, the possibility that the user holds the notebook computer by hands or places the notebook computer on legs for use is high, the user can intuitively feel the temperature of the bottom of the notebook computer at the moment, and the contraction structure can be controlled to contract to open the first air outlet, so that the bottom surface of the notebook computer is cooled.
In actual use, if a user actively sets the power consumption mode of the notebook computer, the power consumption mode of the notebook computer can be controlled by combining with the current power consumption mode when controlling the opening of the first air outlet, under a normal condition, the power consumption mode of the notebook computer is divided into a high power consumption mode, a low power consumption mode and a quiet mode, each hardware of the notebook computer continuously runs in an optimal state under the high power consumption mode, at the moment, the power consumption is increased, the corresponding heating problem is serious, under the low power consumption mode or the quiet mode, each hardware can be in a standby state or a dormant state when the notebook computer is in an inactive state until a new task is wakened up, at the moment, the power consumption is relatively low, and the heating problem is slight.
Specifically, when the notebook computer is in a normal mode and is not placed on a desktop, the current power consumption mode of the notebook computer can be further judged, and if the current power consumption mode of the notebook computer is in a high power consumption mode, the contraction structure is controlled to contract so as to open the first air outlet, so that the bottom surface of the notebook computer is cooled; if the current power consumption mode of the notebook computer is a low power consumption mode or a quiet mode, the power consumption of the notebook computer is low at the moment, even if the heating phenomenon exists, the user experience cannot be influenced, the first air outlet does not need to be opened, and if the power consumption mode is actively switched by a user in the subsequent use process or the current power of the notebook computer exceeds a second threshold value, the first air outlet is correspondingly opened.
It should be noted that, in the heat dissipation structure used in this embodiment, the contraction structure at least includes the electromagnetic contraction device, so as to ensure that the contraction structure can realize the contraction operation based on the control of the notebook computer, and of course, the contraction device may also include the thermal memory metal, so that on the basis that the contraction device can be controlled by the computer, when the ambient temperature exceeds the first threshold value, the contraction device automatically contracts to open the first air outlet, thereby achieving the cooling effect.
While the present disclosure has been described in detail with reference to the embodiments, the present disclosure is not limited to the specific embodiments, and those skilled in the art can make various modifications and alterations based on the concept of the present disclosure, and the modifications and alterations should fall within the scope of the present disclosure as claimed.
Claims (10)
1. A heat radiation structure for a bottom surface of a notebook computer at least comprises:
the heat dissipation assembly is provided with a first air inlet;
the shell covers one side of the heat dissipation assembly, and a first air outlet is formed in the shell;
the first air inlet and the first air outlet are arranged in an area enclosed by the square-wave foam;
the foot pad is arranged on one side, far away from the heat dissipation assembly, of the shell, and an accommodating groove is formed in one side, close to the shell, of the foot pad and used for accommodating an air guide groove;
the air guide groove is a hollow groove body, a first surface of the air guide groove is a surface in contact with the shell, the first surface is provided with a second air inlet corresponding to the first air outlet, a second surface adjacent to the first surface is provided with at least one second air outlet, and the second air outlet is used for guiding out air quantity guided by the second air inlet.
2. The heat dissipation structure of claim 1, wherein the heat dissipation assembly at least comprises a centrifugal fan and a fan cover, and the fan cover is provided with the first air inlet.
3. The heat dissipation structure of claim 1, wherein the size of the second air inlet is greater than or equal to the size of the first air outlet.
4. A heat radiation structure for a bottom surface of a notebook computer at least comprises:
the heat dissipation structure of any one of claims 1 to 3;
the air blocking door is arranged in the air guide groove, corresponds to the first air outlet and is used for blocking the first air outlet;
the unfolding structure is arranged between the air blocking door and the air guide groove and used for providing unfolding force for the air blocking door;
the contraction structure is arranged between the air blocking door and the air guide groove and is used for providing contraction force for the air blocking door;
wherein the direction of the stretching force is opposite to the direction of the contracting force.
5. The heat dissipation structure of claim 4, wherein the spreader structure comprises at least a hydraulic rod or spring;
the constriction comprises at least a thermal memory metal and/or an electromagnetic constriction device, wherein the electromagnetic constriction device comprises at least an electromagnet or a motor.
6. The heat dissipating structure of claim 5, wherein in case the contracting structure is a thermal memory metal, when the ambient temperature exceeds a first threshold, the thermal memory metal contracts, so that the contracting force received by the damper is greater than the expanding force, and the first outlet is opened.
7. The heat dissipating structure of claim 5, wherein in case the contracting structure is an electromagnetic contracting device, when the power of the notebook computer exceeds a second threshold, the electromagnetic contracting device is activated, so that the contracting force received by the damper door is greater than the expanding force, and the first air outlet is opened.
8. The heat dissipating structure of any one of claims 4 to 7, wherein a face of the damper adjacent to the housing has a size greater than or equal to the first air outlet.
9. A method for dissipating heat from a bottom surface of a notebook computer having the heat dissipating structure of any one of claims 4 to 8, comprising:
judging the form mode of the notebook computer;
controlling the contraction structure to contract to open the first air outlet under the condition that the shape mode of the notebook computer is a tent mode or a panel mode;
judging whether the notebook computer is placed on a desktop or not under the condition that the form mode of the notebook computer is a common mode;
and under the condition that the notebook computer is not placed on a desktop, controlling the contraction structure to contract so as to open the first air outlet.
10. The method for dissipating heat according to claim 9, further comprising, when the constriction is an electromagnetic constriction,:
judging a current power consumption mode of the notebook computer under the condition that the notebook computer is not placed on a desktop;
and when the current power consumption mode of the notebook computer is a high power consumption mode, controlling the contraction structure to contract so as to open the first air outlet.
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