CN113075981A

CN113075981A - Electronic equipment

Info

Publication number: CN113075981A
Application number: CN202110333639.1A
Authority: CN
Inventors: 张治成; 李华桥
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-07-06

Abstract

An embodiment of the present application provides an electronic device, including: a first heat source; a heat dissipation system comprising at least a heat dissipation device for transferring heat from a location of the first heat source to another location; the sound generating device comprises a sound generating device, a first sound cavity and a second sound cavity which are communicated with each other, wherein the first sound cavity is communicated with the sound generating device, the first end of the second sound cavity is communicated with the first sound cavity, and the second end of the second sound cavity is communicated with the heat radiating device. The electronic equipment can effectively improve the sound quality and the heat dissipation intensity, and the use performance of the electronic equipment is guaranteed.

Description

Electronic equipment

Technical Field

The embodiment of the application relates to the field of electronic product preparation, in particular to electronic equipment.

Background

At present, many electronic devices in the market, especially light and thin electronic devices such as notebook computers and the like have poor tone quality, insufficient bass diving and high surface temperature of the computer. One of the most important causes of this phenomenon is: as the notebook computer is thinner and thinner, the internal volume is insufficient, so that the volume of the rear sound acoustic cavity of the left and right sound channel loudspeakers is seriously insufficient, generally less than 6CC, and even less than 3 CC; moreover, the heat dissipation device of the CPU/GPU is small in size, and cannot load heat generated by the CPU/GPU, so that heat inside the body cannot be well dissipated, the performance of the electronic device is finally affected, and the use experience of a user is reduced.

Disclosure of Invention

The application provides an electronic equipment that has effectively promoted audio quality and heat dissipation intensity.

In order to solve the above technical problem, an embodiment of the present application provides an electronic device, including:

a first heat source;

a heat dissipation system comprising at least a heat dissipation device for transferring heat from a location of the first heat source to another location;

the sound generating device comprises a sound generating device, a first sound cavity and a second sound cavity which are communicated with each other, wherein the first sound cavity is communicated with the sound generating device, the first end of the second sound cavity is communicated with the first sound cavity, and the second end of the second sound cavity is communicated with the heat radiating device.

Optionally, the second sound chamber is tubular.

Optionally, the second end of the second sound cavity is a closed end, the heat dissipation device further includes a heat conduction member, one end of the heat conduction member is inserted into the second end of the second sound cavity, and the other end of the heat conduction member is connected to the heat dissipation device, so that the second sound cavity absorbs heat of the heat dissipation device through the heat conduction member, and the heat is conducted to the first sound cavity through the second sound cavity, and finally the heat is discharged from the electronic device through the first sound cavity.

Optionally, the heat conducting member is a plate-shaped body or a sheet-shaped body made of a metal material, and the second sound cavity is formed by a plastic pipe.

Optionally, the heat sink is a heat plate with uniform heat transfer, and the heat conducting member is connected with the heat plate.

Optionally, the heat dissipation device comprises a heat pipe.

Optionally, the second sound cavity is formed by a metal pipe, a first end of the second sound cavity is communicated with the first sound cavity, a second end of the second sound cavity extends into the heat pipe and forms a closed end, the second sound cavity absorbs heat of the heat pipe and then conducts the heat to the first sound cavity, and the heat is discharged from the electronic device through the first sound cavity.

Optionally, the heat dissipation device further includes an airflow generating component for dissipating heat from the first heat source, and an airflow channel for discharging hot airflow formed by absorbing heat from the first heat source out of the electronic device.

Optionally, the heat dissipation system further comprises one or more of heat dissipation fins, and a heat dissipation copper plate connected to the first heat source through a heat conductive silicone grease.

Optionally, the sound generating device is a plurality of sound generating devices, and the first sound cavity volume and the second sound cavity volume of the plurality of sound generating devices are the same.

Based on the disclosure of above-mentioned embodiment can know, the beneficial effect that this application embodiment possessed includes through setting up first sound chamber and second sound chamber in sound generating device, has increased the sound chamber volume for the bass dive of sound generating device output is darker, improves tone quality and the volume of the sound of output simultaneously. In addition, through linking to each other the second sound chamber with first sound chamber and heat abstractor respectively, can make the absorptive heat of heat abstractor can pass through the second sound chamber, first sound chamber flows into in the sound produces the device, and finally by the output of sound production device, so heat abstractor's heat dissipation capacity has been increaseed, the radiating efficiency, make electronic equipment can not set up heat abstractor and the sound production device of great volume because of the small and exquisite fibre of size again, and the performance decline problem that leads to takes place, show the performance that has promoted small-size electronic equipment, and user's use experience.

Drawings

Fig. 1 is a schematic partial structural diagram of an electronic device in an embodiment of the present invention.

Fig. 2 is a schematic partial structural diagram of an electronic device in another embodiment of the present invention.

Reference numerals:

1-a first heat source; 2-a heat sink; 3-a sound generating device; 4-a sound generating device; 5-a second sound cavity; 6-a gas flow generating component; 7-an air flow channel; 8-hot plate; 9-a heat pipe; 10-Heat conducting Member

Detailed Description

Specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, but the present application is not limited thereto.

It will be understood that various modifications may be made to the embodiments disclosed herein. The following description is, therefore, not to be taken in a limiting sense, but is made merely as an exemplification of embodiments. Other modifications will occur to those skilled in the art within the scope and spirit of the disclosure.

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above, and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.

These and other characteristics of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.

It should also be understood that, although the present application has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The above and other aspects, features and advantages of the present disclosure will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely examples of the disclosure that may be embodied in various forms. Well-known and/or repeated functions and structures have not been described in detail so as not to obscure the present disclosure with unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.

The specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the disclosure.

Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, an embodiment of the present application provides an electronic device, including:

a first heat source 1;

the heat dissipation system at least comprises a heat dissipation device 2, and the heat dissipation device 2 is used for transferring heat from the position of the first heat source 1 to other positions;

the sound generating device 3 comprises a sound generating device 4, a first sound cavity and a second sound cavity 5 which are communicated with each other, wherein the first sound cavity is communicated with the sound generating device 4, the first end of the second sound cavity 5 is communicated with the first sound cavity, and the second end of the second sound cavity 5 is communicated with the heat radiating device 2.

For example, the electronic device in this embodiment is a notebook computer, but may also be other types of electronic devices, such as a desktop computer, a personal computer, a sound box, and so on. The electronic device has a first heat source 1, which may be, for example, a CPU, a GPU, a memory, a battery, etc., and the specific number of the first heat sources 1 is not limited, and may be one or more. In order to dissipate heat from the first heat source 1, a heat dissipation system is installed in the electronic device, and the heat dissipation system may include a plurality of different heat dissipation devices, and is not limited in particular, the heat dissipation system in this embodiment at least includes a heat dissipation device 2, and the heat dissipation device 2 is configured to transfer heat generated by the first heat source 1 to other locations, such as directly outside the electronic device, or to other structures communicated with the outside, and then the structures discharge heat out of the electronic device, or the heat dissipation device 2 can directly discharge heat out of the electronic device, that is, the heat dissipation device 2 itself is communicated with the outside, and is also communicated with other structures, so as to discharge heat out of the electronic device through the structures, and increase the heat dissipation efficiency. Further, the electronic device in this embodiment is further provided with a sound generating device 3, which includes a sound generating device 4, specifically, a speaker/loudspeaker, and a first sound cavity and a second sound cavity 5 that are communicated with each other, where the first sound cavity is communicated with the sound generating device 4, for example, when the sound generating device 4 is a speaker, the first sound cavity may be a rear sound cavity of the speaker. The second sound cavity 5 includes a first end and a second end, the first end is communicated with the first sound cavity, the second end is communicated with the heat sink 2 to obtain the heat emitted from the heat sink 2, and then the heat is transmitted to the sound generating device 4 through the communicated first sound cavity and second sound cavity 5, that is, the second sound cavity 5 in this embodiment may be regarded as the above-mentioned structural body. Because the sound generating devices 4 are communicated with the outside to realize the output of sound waves, when heat is sent to the sound generating devices 4, the sound generating devices 4 can emit the heat out of the electronic equipment along with the output of the sound waves, and therefore the effect of heat dissipation of the auxiliary heat dissipation device 2 is achieved.

As can be seen from the above, the present embodiment has the advantages that by arranging the first sound cavity and the second sound cavity 5 in the sound generating apparatus 3, the volume of the sound cavity is significantly increased by the arrangement of the second sound cavity 5, so that the low sound output by the sound generating apparatus 3 dives deeper, and the sound quality and volume of the output sound are improved. In addition, through linking to each other second sound chamber 5 with first sound chamber and heat abstractor 2 respectively, can make the heat that heat abstractor 2 absorbed can flow into sound production device 3 through second sound chamber 5, first sound chamber, and finally by sound production device 3 output, so the heat dissipation capacity of heat abstractor 2 has been increaseed, the radiating efficiency, make the structural design of electronic equipment more diversified, can not be subject to the size of a body, for example, can make electronic equipment can not set up heat abstractor 2 and the sound production device 3 of great volume no longer because of the small and exquisite thin of size through the above-mentioned structural design of this embodiment, and the performance degradation problem that leads to takes place, the performance of small-size electronic equipment has been showing and has been promoted, and user's use experience.

Specifically, the sound generating device 4 in this embodiment may be a speaker, the first sound cavity may be a rear sound cavity of the speaker, and the second sound cavity 5 is tubular, at least partially extending out of the speaker, and connected to the heat dissipating device 2. This second sound chamber 5's tubulose inner chamber is equivalent to the partly of back sound cavity, extends, has increased the volume of back sound cavity to when making loudspeaker sound production, the air current that vibrations produced is more, and the sound that makes loudspeaker send dives more deeply, promotes tone quality, and especially more obvious to the improvement effect of bass can make the bass more flood, and tone quality is better. Certainly, the shape of the second sound cavity 5 is not necessarily a tube, and may be other shapes, or the cross section of the tubular body is not necessarily a circle, and may also be a rectangle, and the like, and it may be determined by the actual situation of the internal structure of the electronic device, for example, the first sound cavity is closer to the heat dissipation device 2, so as to increase the volume of the sound cavity of the sound generation device 3, the second sound cavity 5 may be configured as a tubular body with a larger cross section and a rectangle, so as to achieve the connection with the first sound cavity and the heat dissipation device 3, and improve the heat dissipation capability and the volume of the sound cavity of the sound generation device 3, that is, improve the sound quality and the volume. If the second sound cavity 5 is a circular tube, in order to increase the heat dissipation capability and the volume of the sound cavity, the diameter/width of the second sound cavity 5 may be increased, and the specific increase may be determined according to the space inside the device and the actual heat dissipation requirement. Further, in practical application, the second sound cavity 5 may be directly formed by an independent pipe or may be a channel, the channel is integrally formed with a housing of the electronic device, a first end and a second end of the channel are respectively connected to the first sound cavity and the heat dissipation device 2, and the specific structure is not unique. In addition, the second sound cavity 5 is not made of unique material, and can be made of non-metal material, or metal material, such as plastic, or aluminum alloy, copper, and the like. The second end of the second sound cavity 5, i.e. the end connected to the heat sink 2, needs to be a closed end to avoid the heat from the heat sink 2 to be dissipated, and to avoid the sound cavity from "leaking" and affecting the sound generating effect of the sound generating device 4.

Further, the arrangement of the second sound cavity 5 is different corresponding to the heat sink 2 with different structures, for example:

the first embodiment is as follows:

as shown in fig. 1, the heat dissipation device 2 in this embodiment includes a heat plate 8 with uniform heat transfer, and may be other heat dissipation devices with metal heat dissipation areas. The inner structure of the hot plate 8 in this embodiment is the same as that of the heat pipe 9, and both have a capillary structure, a fluid heat dissipation medium and the like, and the outer portion may be made of a copper material. Alternatively, the heat plate 8 may be a metal plate made of a metal material with high heat conductivity, such as a copper plate, an aluminum alloy plate, or the like.

Further, the first end of the second sound cavity 5 in this embodiment is communicated with the first sound cavity, and the rest of the second sound cavity is located outside the sound generating device 4, i.e. exposed in the housing of the electronic device. The second sound cavity 5 in this embodiment is formed by a plastic tube, or may be formed by other tube made of non-metal material, such as plastic, including PET (polyethylene terephthalate), PVC (polyvinyl chloride), PP (polypropylene), and other materials. The second sound cavity 5 is formed by using a non-metal material to prevent the second sound cavity 5 from having better heat conduction performance, so that the heat absorbed from the heat dissipation device 2 is released to the electronic equipment again through the surface of the pipe body and then absorbed by the heat dissipation device 2, circulation is caused, the capacity of auxiliary heat dissipation of the heat dissipation device 2 is reduced, and the heat dissipation efficiency of the electronic equipment is influenced. Further, in the present embodiment, the second end of the second sound cavity 5 is a closed end, and in order to successfully suck the heat of the heat dissipation device 2 into the second sound cavity 5, the heat dissipation device 2 in the present embodiment further includes a heat conduction member 10, where the heat conduction member 10 may be a plate or a sheet made of a metal material, for example, the heat conduction member 10 is a narrow strip-shaped metal plate or a metal sheet made of a copper or aluminum alloy material, or a structure with a gradually increasing width in a direction close to the heat dissipation device 2, or may be in a shape with a connection portion, for example, the heat conduction member 10 is in a narrow strip-shaped or rod-shaped body, and one end of the heat conduction member connected to the heat dissipation device 2 forms a rectangular, circular or other shaped plate body, which is the connection portion, through which the connection portion can be conveniently attached to the heat dissipation device 2, so as to increase a contact area and improve. One end of the heat conducting member 10, i.e. the end with smaller width, is inserted into the second end of the second sound cavity 5 and is hermetically connected with the second end of the second sound cavity 5, so as to prevent the gas in the second sound cavity 5 from flowing into the electronic device from the gap between the second end and the heat conducting member 10, thereby increasing the internal temperature of the electronic device and affecting the heat dissipation of the electronic device. The other end of heat-conducting piece 10, the one end that the width is great promptly, or the one end that is equipped with connecting portion, links to each other with heat abstractor 2's metal heat dissipation region, specifically can adopt the welding, or bond the two through the colloid that has the heat conduction function etc. and realize connecting, also can adopt the form that sets up fastener or mounting to link to each other heat-conducting piece 10's the other end with heat abstractor 2. When the electronic equipment operates, and simultaneously, when a user uses the loudspeaker to externally discharge audio, the cone of the loudspeaker vibrates front and back to extrude the first cavity and the second cavity, so that the air pressure in the two cavities changes, air flows are formed in the first sound cavity and the second sound cavity 5, meanwhile, the heat dissipation device 2 absorbs the heat of the first heat source 1 and transfers the heat to the second sound cavity 5 through the heat conduction piece 10, at the moment, the air flow in the second sound cavity 5 can absorb the heat to form hot air flow, the hot air flow is guided to the first sound cavity along with the air pressure difference generated by the continuous vibration of the loudspeaker, and finally, the hot air flow is released to the outside of the electronic equipment from the opening of the loudspeaker, and therefore the successful heat dissipation is realized.

Example two:

as shown in fig. 2, the heat dissipating device 2 in the present embodiment includes a heat pipe 9. The second sound cavity 5 is formed by a metal tube, which may be a copper tube or other metal tube. The diameter/width of the pipe body for forming the second sound chamber 5 is not particularly limited, and the shape of the cross section of the pipe body is not limited, and can be determined comprehensively according to the structural size of the heat pipe 9 and the required heat dissipation effect. The first end and the first sound chamber intercommunication of second sound chamber 5, the second end stretches into heat pipe 9's well hollow portion department (this well hollow portion department) to form the blind end, hold effluvium again from the second of second sound chamber 5 with the second in order to avoid second sound chamber 5 absorptive heat, and can't get into first sound chamber, influence electronic equipment's heat dissipation, avoid simultaneously in the heat pipe liquid flows into second sound chamber 5, and the air current that produces in the second sound chamber 5 leaks, influence loudspeaker's vocal effect. In practical applications, the second sound cavity 5 is preferably inserted into the heat pipe 9 more, so as to ensure a larger area for heat transfer therebetween, thereby improving the efficiency of heat transfer.

When the electronic equipment runs, when a user uses the loudspeaker to externally discharge audio, the cone of the loudspeaker vibrates back and forth to extrude the first cavity and the second cavity, so that the air pressure in the two cavities changes to form air flow, meanwhile, the heat dissipation device 2 absorbs the heat of the first heat source 1, the second sound cavity 5 is positioned in the heat dissipation device 2, the heat is transferred to the inside of the second sound cavity 5 by absorbing the heat of the hot end and/or the cold end of the heat dissipation device 2, at the moment, the air flow in the second sound cavity 5 can absorb the heat to form hot air flow, the hot air flow flows to the first sound cavity by the air pressure difference along with the continuous vibration of the loudspeaker, and is finally released to the outside of the electronic equipment from the opening of the loudspeaker, and therefore the successful heat dissipation is realized.

The structures in the first and second embodiments are not only arranged alternatively, but may be combined and arranged together in an electronic device, for example, the electronic device is provided with not only the heat plate 8 but also the heat pipe 9. In practical applications, the number of the heat pipes 9, the heat plates 8, the sound generating devices 3, and the second sound cavities 5 is not unique, for example, there are a plurality of sound generating devices 3, and a plurality of heat pipes 9 or heat plates 8, and each sound generating device 3 may be connected to a corresponding heat pipe 9 or heat plate 8 through its second sound cavity 5, that is, each sound generating device 3 corresponds to a heat pipe 9 or heat plate 8 for dissipating heat from the corresponding heat pipe 9 or heat plate 8. Alternatively, a plurality of sound generation devices 3 may be connected to one hot plate, and a plurality of sound generation devices 3 may be connected to a plurality of heat pipes 9; or, a few sound generating devices 3 are correspondingly connected with a hot plate, and a plurality of sound generating devices 3 are correspondingly connected with a plurality of heat pipes 9; or, the second sound cavities 5 of the plurality of sound generating devices 3 are all correspondingly connected with the same heat pipe 9, that is, a plurality of second sound cavities 5 may be arranged in the same heat pipe 9; alternatively, each sound generating device 3 comprises a plurality of second sound cavities 5, each second sound cavity 5 is connected with a heat pipe 9 or a heat plate 8, specifically, one second sound cavity 5 is connected with one heat plate 8 or heat pipe 9, or a plurality of second sound cavities 5 are connected with the same heat plate 8 or heat pipe 9. Or, the plurality of second sound cavities 5 are connected with the same heat pipe 9 or the same hot plate 8; alternatively, the tube for forming the second acoustic chamber 5 has a plurality of branch tubes, such as Y-shaped tubes, each of which is connected to one or more of the heat plates 8 or heat plates 8, respectively. In specific application, the number of the second sound cavities 5 respectively connected with the heat pipe 9 and the heat plate 8 can be comprehensively determined according to the heat dissipation capacity, the heat absorption degree and the distance between the heat pipe 9 and the heat plate 8 and the first heat source 1, wherein the heat dissipation capacity is weak, the distance between the heat dissipation capacity and the first heat source 1 is close, or the heat dissipation device 2 with more heat absorption capacity can be connected with a plurality of second sound cavities 5, otherwise, the number of the connected second sound cavities 5 can be reduced. In addition, when conditions permit, the number of the first sound cavities may be increased, that is, a plurality of first sound cavities may be provided, or only one first sound cavity may be provided, but the volume of the first sound cavity may be increased.

Further, when the sound generating device 3 is multiple, or the first sound cavity and the second sound cavity 5 are multiple, in order to ensure that the sound effects output by the sound generating device 4 are consistent, and the phenomenon that the sound effects output by different areas are inconsistent or the phenomenon that the sound effects output by different sound generating devices 3 are inconsistent does not occur, in this embodiment, the volumes of all the first sound cavities are the same, the volumes of all the second sound cavities 5 are the same, and the number of the first sound cavities of each sound generating device 3 is the same, and the number of the second sound cavities 5 is the same. Alternatively, the volumes of the plurality of first and second sound chambers 5 may be set to be different patterns, respectively, but the sum of the volumes of the first and second sound chambers 5 in each sound generating apparatus 3 is the same. For example, if the first sound-producing devices have a first sound chamber volume of 20ml and a number of 1, and the second sound chamber 5 has a second sound chamber volume of 5ml and a number of 3, the sum of the volumes in the first sound-producing devices 3 is 35 ml. Then, the sum of the overall volumes of the first sound chamber and the second sound chamber 5 in the second sound generating apparatus 3 is also 35ml, and in particular, the same structure as the first sound generating apparatus may be adopted, or the number of the first sound chambers may be kept unchanged, but the volume of the first sound chamber is increased, while the volume of the second sound chamber 5 is maintained, but the number of the second sound chambers 5 is decreased, so that the sum of the volumes of the sound chambers is 35ml, or the volume and the number of the first sound chambers may be kept unchanged, so that the volume of the second sound chamber 5 is increased, but the number of the second sound chambers 5 is decreased, and the like.

Further, when the solution of the above embodiment is applied to a notebook computer, since the sound power of the notebook computer is small, and usually does not exceed 3w to 5w, it is not necessary to provide a sound venting pipe on the first sound cavity, and if sound venting is required, sound venting can be completed only by providing a through hole of about 1mm to 2mm on the first sound cavity. If the above embodiment is applied to electronic devices such as desktop computers and sound boxes, the sound venting tube can be added according to actual needs.

Alternatively, the heat dissipating device 2 in the present embodiment includes not only the above-described heat plate 8, and/or the heat pipe 9, but also the airflow generating part 6 for dissipating heat for the first heat source 1, and the airflow passage 7 for discharging the hot airflow formed by absorbing heat of the first heat source 1 out of the electronic apparatus. For example, the airflow generating component 6 may be a heat dissipating fan, which may be provided in multiple sets, and the specific number is not limited, and may be determined according to the volume and heat dissipation requirement in the actual electronic device. The fan may be disposed at a position opposite to the position of the first heat source 1 or at a side of the first heat source 1. The air flow channel 7 may be a pipe body arranged between a fan and a heat dissipation port arranged on the device housing in the electronic device, or a channel enclosed all around and formed by a plurality of guide plates and the device housing in a matched manner, wherein the guide plates may be arranged by selecting arc-shaped plates. Alternatively, the air flow passage 7 may be formed by enclosing a structure such as a long groove integrally formed with the housing on the device housing together with the top plate and the bottom plate of the device housing. The above-mentioned hot plate 8, heat pipe 9, etc. can be connected with the air flow generating component 6, or can be adjacently arranged so as to quicken heat dissipation and reduce space occupation rate of the equipment, and of course, they can also be respectively and independently arranged. In addition, the heat pipe 9 may be at least partially overlapped with the heat plate 8 when installed, for example, the middle section of the heat pipe 9 is embedded in the heat plate 8, thereby further reducing the space occupancy of the apparatus.

Optionally, in order to further increase the heat dissipation capacity of the electronic device, the heat dissipation system in this embodiment further includes one or more of a plurality of heat dissipation fins, a heat dissipation copper plate connected to the first heat source 1 through a heat conductive silicone grease. The second cavity 5 of the sound-generating device 3 may also be connected to one or more of the above-mentioned heat sink fins, heat sink copper plates, to further increase the heat dissipation efficiency.

The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present application and such modifications and equivalents should also be considered to be within the scope of the present application.

Claims

1. An electronic device, comprising:

a first heat source;

2. The electronic device of claim 1, wherein the second acoustic chamber is tubular.

3. The electronic device of claim 2, wherein the second end of the second acoustic cavity is a closed end, the heat sink further comprises a heat conducting member, one end of the heat conducting member is inserted into the second end of the second acoustic cavity, and the other end of the heat conducting member is connected to the heat sink, so that the second acoustic cavity absorbs heat of the heat sink through the heat conducting member, and conducts the heat to the first acoustic cavity through the second acoustic cavity, and finally exits the electronic device from the first acoustic cavity.

4. The electronic device of claim 3, wherein the heat conducting member is a plate-shaped member or a sheet-shaped member made of a metal material, and the second acoustic cavity is formed by a plastic pipe.

5. The electronic device of claim 3, wherein the heat dissipation device is a thermal plate with uniform heat transfer, and the thermal conductive member is connected to the thermal plate.

6. The electronic device of claim 2, wherein the heat dissipation device comprises a heat pipe.

7. The electronic device of claim 5, wherein the second sound cavity is formed by a metal tube, a first end of the second sound cavity is communicated with the first sound cavity, a second end of the second sound cavity extends into the heat pipe and forms a closed end, and the second sound cavity absorbs heat of the heat pipe and conducts the heat to the first sound cavity to be exhausted from the electronic device.

8. The electronic apparatus according to any one of claims 1 to 7, wherein the heat dissipating device further comprises an airflow generating part for dissipating heat from the first heat source, and an airflow passage for discharging a hot airflow formed by absorbing heat of the first heat source out of the electronic apparatus.

9. The electronic device of claim 8, wherein the heat dissipation system further comprises one or more of heat fins, a heat-dissipating copper plate connected to the first heat source via thermally conductive silicone grease.

10. The electronic device according to claim 1, wherein the sound generating means is plural, and a first volume of the sound chamber and a second volume of the sound chamber in the plural sound generating means are the same.