CN113068377A

CN113068377A - Heating device heat radiation structure, heat radiation assembly and electrical equipment

Info

Publication number: CN113068377A
Application number: CN202110286387.1A
Authority: CN
Inventors: 张华丽; 黄楠
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2021-07-02

Abstract

The invention discloses a heat dissipation structure of a heating device, which comprises a heat dissipation box for mounting the heating device and a heat radiator integrally connected with the heat dissipation box. In the heat dissipation structure of the heating device disclosed by the invention, the heat dissipation box for mounting the heating device and the radiator are in an integrated connection structure, namely, the heat dissipated by the heat dissipation box is directly transferred to the radiator without any intermediate medium. The invention also discloses a heat dissipation assembly and electrical equipment.

Description

Heating device heat radiation structure, heat radiation assembly and electrical equipment

Technical Field

The invention relates to the technical field of design and production of electrical equipment, in particular to a heat dissipation structure of a heating device and electrical equipment.

Background

In the prior art, a heating device is usually installed in a heat dissipation box, the bottom of the heat dissipation box is bonded with a radiator through heat conduction silicone adhesive, in order to ensure heat conduction in the heat dissipation box, the heat conduction adhesive is filled in the heat dissipation box, the heat conduction path generated by the heating device is heat conduction adhesive-heat dissipation box-heat conduction silicone grease-radiator-heat dissipation fin, because the heat dissipation box and the radiator are two independent devices, the heat in the heat dissipation box can be dissipated only by indirectly conducting the heat conduction silicone grease at the bottom to the radiator, the heat conduction path is complex, the heat conduction resistance is large, and the heat dissipation performance is not ideal.

Disclosure of Invention

In view of the above, an objective of the present invention is to provide a heat dissipation structure of a heat generating device, so as to simplify a heat transfer path, reduce heat transfer resistance, and improve heat dissipation performance.

Another objective of the present invention is to provide a heat dissipation assembly having the heat dissipation structure of the heater.

Still another object of the present invention is to provide an electrical apparatus having the above heat dissipating assembly.

In order to achieve the purpose, the invention provides the following technical scheme:

a heat dissipation structure of a heating device comprises a heat dissipation box for mounting the heating device and a radiator integrally connected with the heat dissipation box.

Preferably, the top of the heat dissipation box is of an open structure, and the bottom of the heat dissipation box is integrally connected with the heat sink.

Preferably, the radiator includes the base plate and an organic whole connect in radiating fin on the base plate, radiating fin is air-cooled radiating fin or water-cooled radiating fin, and, the base plate constitutes the bottom of heat dissipation box.

Preferably, the radiator includes the base plate and sets up water cooling system on the base plate, water cooling system include the water course, and with water inlet and the delivery port of water course intercommunication.

Preferably, still include the baffle, still be provided with waterproof sealing strip on the base plate, the sealing strip encircles the outer fringe of base plate sets up at least a week, the baffle install in on the base plate and with the sealing strip is sealed to be cooperated, the heat dissipation box with the radiator is separated the both sides of baffle.

Preferably, a plurality of the heat dissipation cases are disposed on the substrate.

The heat dissipation assembly disclosed by the invention comprises the heating device heat dissipation structure, the heating device and the circuit board disclosed in any one of the above items, wherein the heating device is arranged at the bottom of the heat dissipation box and/or on the side wall of the heat dissipation box, the heat conduction component is further filled in the heat dissipation box, and the circuit board at least comprises a bottom circuit board electrically connected with the heating device.

Preferably, the circuit board further comprises an upper end circuit board, and the upper end circuit board and the bottom end circuit board are arranged in a layered mode in the height direction of the heat dissipation box.

Preferably, the heat conducting component is a heat conducting glue filled in the heat dissipation box, or a heat conducting pad arranged in the heat dissipation box.

Preferably, the heating device is arranged at the bottom of the heat dissipation box and on the side wall of the heat dissipation box, the heating device comprises a power tube, part or all of the power tube is attached to the side wall of the heat dissipation box, and the rest of the heating device is arranged at the bottom of the heat dissipation box.

Preferably, the heat-conducting piece is heat-conducting glue filled in the heat dissipation box, an identification piece used for indicating the highest position of glue filling is arranged in the heat dissipation box, and the top of the heat dissipation box is provided with a glue overflow groove recessed in the side wall of the heat dissipation box so as to contain the overflowing heat-conducting glue.

The electrical equipment disclosed by the invention comprises a shell, wherein a heat dissipation cavity is formed in the shell, and the heat dissipation assembly is arranged in the heat dissipation cavity.

Preferably, the electrical equipment is a charging pile.

According to the technical scheme, the heat dissipation box for mounting the heating device and the radiator are in an integrated connection structure in the heat dissipation structure of the heating device, namely, heat dissipated by the heat dissipation box is directly transferred to the radiator without any intermediate medium.

The heat dissipation assembly disclosed by the invention has the corresponding technical advantages of the heat dissipation structure of the heating device due to the adoption of the heat dissipation structure of the heating device, and the details are not repeated herein.

The electric equipment disclosed by the invention also has the corresponding technical advantages of the heat dissipation structure of the heating device due to the adoption of the heat dissipation assembly, and the details are not repeated herein.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a heat dissipation structure of a heat generating device disclosed in an embodiment of the present invention;

fig. 2 is a schematic layout view of a heat generating device and a power tube in a heat dissipation box of the heat dissipation structure of the heat generating device disclosed in fig. 1;

FIG. 3 is a schematic structural diagram of the circuit board added to the circuit board shown in FIG. 2;

FIG. 4 is a schematic view of the bottom structure of the container of FIG. 3 with the addition of a partition;

FIG. 5 is a schematic top view of the structure of FIG. 4;

FIG. 6 is a schematic top view of a heat sink assembly having a plurality of heat-dissipating cassettes;

FIG. 7 is a schematic view of the separator of FIG. 6;

FIG. 8 is a schematic view of the structure of the water-cooled heat sink and the heat dissipating box.

The drawings are numbered as follows:

the heat dissipation device comprises a heat dissipation box 1, a heat radiator 2, a heating device 3, a heat dissipation partition plate 4, a power tube 5, a bottom circuit board 6, an upper circuit board 7, a partition plate 8, an opening 9, a water channel 10, an identification piece 11, an adhesive overflow groove 12, a base plate 21, a heat dissipation fin 22, a sealing groove 23, a water inlet 101 and a water outlet 102.

Detailed Description

One of the core points of the present invention is to provide a heat dissipation structure of a heat generating device, so as to simplify a heat transfer path, reduce heat transfer resistance, and improve heat dissipation performance.

The other core of the invention is to provide a heat dissipation assembly with the heat radiator heat dissipation structure.

The invention further provides an electrical device with the heat dissipation assembly.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As will be understood with reference to fig. 1 and 2, the heat dissipation structure of a heating device disclosed in the present invention includes a heat dissipation box 1 and a heat sink 2, wherein the heat dissipation box 1 and the heat sink 2 are integrated, the heat dissipation box 1 is used for mounting the heating device, and the heat dissipation box 1 can be divided into a plurality of mounting areas by a heat dissipation partition plate 4 as required. It should be understood by those skilled in the art that the heat dissipation box 1 and the heat sink 2 should both be good conductors of heat, both are usually made of metal materials, and the heat dissipation box 1 and the heat sink 2 may be the same kind of metal or different kinds of metal.

Compared with the prior art, the heat dissipation box 1 and the heat sink 2 in the heat dissipation structure of the heating device disclosed in the above embodiment are of an integrated structure, that is, the heat dissipated by the heat dissipation box 1 can be directly transferred to the heat sink 2 without passing through any intermediate medium, so that the heat dissipation path is simplified, the heat transfer resistance is reduced, and the heat dissipation efficiency of the heat dissipation structure of the heating device is effectively improved.

The heat dissipation box 1 is a box structure, the inner cavity of the box structure forms an installation space for accommodating the heating device 3, the shape of the box structure is not limited, the box structure can be rectangular, cylindrical or other shapes, certainly, in order to realize the installation of the heating device 3, the heat dissipation box 1 should have an open structure, the open position should be considered to facilitate the installation of the heating device 3, and the heat dissipation box may be arranged at the top or the side of the box structure. In the solution shown in fig. 1 and 2, the heat dissipation box 1 is rectangular as a whole, the top of the heat dissipation box is in an open structure, and the bottom of the heat dissipation box 1 and the heat sink 2 are in an integrated structure.

In this case, the heating device 3 is loaded into the heat dissipation case 1 from the top of the heat dissipation case 1, and this mounting manner is convenient for the heating device 3.

The structure of the radiator 2 can be various, in one case, the radiator 2 is an air-cooled radiator, the radiator 2 includes a substrate 21 and radiating fins 22 (namely air-cooled radiating fins) integrally connected to the substrate 21, and air is blown or exhausted by a fan to flow between the surfaces and gaps of the radiating fins 22, so as to achieve the purpose of radiating the radiating box 1, further, in view of improving heat exchange efficiency, the substrate 21 can also form the bottom of the radiating box 1, that is, the substrate 21 can also be used as a bottom plate of the radiating box 1 while being used as a connection base of the radiating fins 22, so that heat generated by the heating device 3 can be directly transferred to the radiator 2, and of course, water channels (namely water-cooled radiating fins) can also be arranged in the radiating fins, so as to realize water-cooled radiating; in another case, the radiator 2 may also be a water-cooled radiator in contact with the box body, as shown in fig. 8, a water channel 10 is arranged inside the water-cooled radiator, the water channel 10 is connected with a water inlet 101 and a water outlet 102, and cooling water flows into the water channel 10 from the water inlet 101, exchanges heat with the heat dissipation box 1, and then flows out from the water outlet 102, so as to achieve the purpose of dissipating heat from the heat dissipation box 1.

In order to make the heat radiation structure of the heating device possess waterproof performance, still be provided with the sealing strip on the base plate 21 disclosed in this scheme, the sealing strip is provided with a week or more week around the outer fringe of base plate, baffle 8 is installed on base plate 21 and is compressed tightly the sealing strip, in order to realize with the sealed cooperation of sealing strip, so far, heat dissipation box 1 and radiator 2 are separated in the both sides of baffle 8, realize waterproof sealing between heat dissipation box 1 and the radiator 2, after installing in the heat dissipation chamber, radiator 2 exposes in the heat dissipation chamber, and heat dissipation box 1 is then sealed, thereby effectively avoid electrical components to intake, the purpose of the independent waterproof of heat radiation structure of the heating device has been reached. It should be noted that the installation of the partition 8 on the base plate 21 can be selected in many ways, for example, screw fastening or snap locking are two common connection ways.

It can be understood by those skilled in the art that one heat sink 2 may be correspondingly connected to one heat dissipation box 1, and certainly, in order to increase the power, one heat sink 2 may also be correspondingly connected to a plurality of heat dissipation boxes 1, as in the scheme shown in fig. 6, one heat sink 2 corresponds to three heat dissipation boxes 1, correspondingly, an opening corresponding to the heat dissipation box 1 should also be provided on the partition plate 8 adapted to the heat dissipation structure of the heat generating device, and the function of the openings is to provide a relief opening for the heat dissipation box 1, so that the partition plate 8 can smoothly cover the substrate 21.

The embodiment of the invention also discloses a heat dissipation component, which comprises the heat dissipation structure of the heating device disclosed in any one of the embodiments, besides, it also comprises a heating device 3 and a circuit board, in the heat dissipation structure of the heating device, the heating device 3 is arranged at the bottom of the heat dissipation box 1, or the heating device 3 is arranged on the side wall of the heat dissipation box 1, or the heating device 3 is arranged on the bottom of the heat dissipation box 1 and the side wall of the heat dissipation box 1, the heat dissipation box 1 is filled with a heat conduction component, the heat conduction component has the functions of filling the gap between the heating devices 3 and assisting in positioning the heating devices 3 on one hand, and the function of conducting the heat generated by the heating devices 3 to the heat dissipation box 1 on the other hand, then the heat is transferred to the radiator 2 through the heat dissipation box 1 for heat dissipation, and the circuit board at least comprises a bottom circuit board 6 electrically connected with the heating device 3.

In the heat dissipation assembly, the heat generating devices 3 are intensively arranged on the bottom or the side wall of the heat dissipation box 1, compared with the prior art, the area occupied by the intensively arranged heat generating devices 3 is remarkably reduced, and under the condition that the number of the heat generating devices 3 is the same, the heat generating devices 3 can be completely covered by the heat sink 2 with a smaller size, which is beneficial to reducing the size of a product and improving the compactness of the product.

The circuit boards may include other circuit boards in addition to the bottom-end circuit board 6, which are disposed above the bottom-end circuit board 6 in the height direction of the heat dissipation case 1, and thus these circuit boards are referred to as upper-end circuit boards 7, and the upper-end circuit boards 7 are layered with the bottom-end circuit board 6, and of course, if the upper-end circuit boards 7 themselves include a plurality of them, a plurality of upper-end circuit boards 7 are also layered therebetween.

The heat conducting component in the heat dissipation box 1 may be a heat conducting glue filled in the heat dissipation box 1, or may be a heat conducting pad disposed in the heat dissipation box 1.

In this embodiment, the heating device 3 is specifically arranged on the bottom of the heat dissipation box 1 and the side wall of the heat dissipation box 1, and the heating device 3 includes the power tube 5, as shown in fig. 2, a part of the power tube 5 or the whole power tube 5 is attached to the side wall of the heat dissipation box 1, and the rest of the heating devices 3 are all arranged at the bottom of the heat dissipation box 1, and the layout mode can vacate the inner space of the heat dissipation box 1 as much as possible, so as to reduce the whole volume of the heat dissipation box 1, and further reduce the volume of the heat dissipation box 2, and the rest of the heating devices 3 include, but are not limited to, a magnetic device, a power tube, a capacitor, a relay.

It should be noted that, if the heat conduction piece is the heat conduction glue filled in the heat dissipation box, then need to fill the heat conduction glue in the heat dissipation box 1 before the installation of the device 3 that generates heat, in order to master the glue filling amount conveniently, be provided with the identification piece 11 that is used for instructing glue filling amount highest position in the heat dissipation box 1 in this scheme, furthermore, the top of heat dissipation box 1 is provided with the excessive gluey groove 12 of recessing in the heat dissipation box 1 lateral wall, in order to hold the heat conduction glue that overflows in the heat dissipation box 1 in the device 3 installation that generates heat, so set up can make the heat conduction glue that overflows in the heat dissipation box 1 get into excessive gluey groove 12, avoid the heat conduction glue to cover on power tube 5.

The invention also discloses electrical equipment which comprises a shell, wherein a heat dissipation cavity is formed in the shell, and the heat dissipation assembly disclosed in any one embodiment is arranged in the heat dissipation cavity.

Due to the adoption of the heat dissipation assembly, the electric equipment has the corresponding technical advantages of the heat dissipation assembly, and the description is omitted herein.

It should be noted that the form of the electrical equipment is various, and for example, an inverter, a converter, a transformer, a charging pile, and the like are all the electrical equipment referred to in the present invention.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The heat dissipation structure of the heating device is characterized by comprising a heat dissipation box (1) for mounting the heating device and a heat radiator (2) integrally connected with the heat dissipation box (1).

2. The heat sink structure for heat-generating devices according to claim 1, wherein the top of the heat sink case (1) is an open structure, and the bottom is integrally connected to the heat sink (2).

3. The heat generating device heat dissipating structure according to claim 2, wherein the heat sink (2) includes a base plate (21) and heat dissipating fins (22) integrally connected to the base plate (21), the heat dissipating fins (22) are air-cooled heat dissipating fins or water-cooled heat dissipating fins, and the base plate (21) constitutes a bottom of the heat dissipating box (1).

4. The heat generating device heat dissipating structure according to claim 2, wherein the heat sink (2) includes a base plate (21) and a water cooling system provided on the base plate (21), the water cooling system including a water channel (10), and a water inlet (101) and a water outlet (102) communicating with the water channel (10).

5. The heat sink structure of claim 3 or 4, further comprising a partition (8), wherein the substrate (21) is further provided with a sealing strip, the sealing strip surrounds the outer edge of the substrate (21) for at least one circle, the partition (8) is mounted on the substrate (21) and is in sealing fit with the sealing strip, and the heat sink box (1) and the heat sink (2) are separated at two sides of the partition (8).

6. The heat generating device heat dissipation structure according to claim 3 or 4, wherein a plurality of the heat dissipation boxes (1) are provided on the substrate (21).

7. A heat dissipation assembly comprising the heat generating device heat dissipation structure of any one of claims 1 to 6, the heat generating device (3) and a circuit board, wherein the heat generating device (3) is disposed on the bottom of the heat dissipation box (1) and/or the side wall of the heat dissipation box (1), the heat dissipation box (1) is further filled with a heat conduction component, and the circuit board at least comprises a bottom circuit board (6) electrically connected with the heat generating device (3).

8. The heat dissipation assembly of claim 7, wherein the circuit board further comprises an upper end circuit board (7), and the upper end circuit board (7) and the bottom end circuit board (6) are layered in a height direction of the heat dissipation box (1).

9. The heat sink assembly according to claim 7, wherein the heat conducting member is a heat conducting glue filled in the heat sink box (1) or a heat conducting pad disposed in the heat sink box (1).

10. The heat dissipation assembly of claim 7, wherein the heat generating device (3) is disposed at the bottom of the heat dissipation box (1) and on the side wall of the heat dissipation box (1), and the heat generating device (3) comprises a power tube (5), a part or all of the power tube (5) is attached to the side wall of the heat dissipation box (1), and the rest of the heat generating devices (3) are disposed at the bottom of the heat dissipation box (1).

11. The heat dissipation assembly of claim 10, wherein the heat conducting member is a heat conducting adhesive filled in the heat dissipation box, an identification member (11) for indicating the highest position of the filled adhesive is arranged in the heat dissipation box (1), and the top of the heat dissipation box (1) is provided with an adhesive overflow groove (12) recessed in the side wall of the heat dissipation box (1) for accommodating the overflowing heat conducting adhesive.

12. An electrical apparatus comprising a housing in which a heat dissipation chamber is formed, wherein a heat dissipation assembly as claimed in any one of claims 7 to 11 is disposed in the heat dissipation chamber.

13. The electrical device of claim 12, wherein the electrical device is a charging post.