CN113066397A - 一种结构稳定、平整度佳的led显示模组 - Google Patents
一种结构稳定、平整度佳的led显示模组 Download PDFInfo
- Publication number
- CN113066397A CN113066397A CN202110405683.9A CN202110405683A CN113066397A CN 113066397 A CN113066397 A CN 113066397A CN 202110405683 A CN202110405683 A CN 202110405683A CN 113066397 A CN113066397 A CN 113066397A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- led display
- circuit board
- display module
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims description 13
- 239000007924 injection Substances 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000012943 hotmelt Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1407—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by turn-bolt or screw member
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110405683.9A CN113066397B (zh) | 2021-04-15 | 2021-04-15 | 一种结构稳定、平整度佳的led显示模组 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110405683.9A CN113066397B (zh) | 2021-04-15 | 2021-04-15 | 一种结构稳定、平整度佳的led显示模组 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113066397A true CN113066397A (zh) | 2021-07-02 |
CN113066397B CN113066397B (zh) | 2024-03-15 |
Family
ID=76566779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110405683.9A Active CN113066397B (zh) | 2021-04-15 | 2021-04-15 | 一种结构稳定、平整度佳的led显示模组 |
Country Status (1)
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CN (1) | CN113066397B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114333573A (zh) * | 2021-12-03 | 2022-04-12 | 昆山国显光电有限公司 | 显示模组及显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752275A (zh) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Led模块的封装方法和封装结构 |
CN201859623U (zh) * | 2010-11-05 | 2011-06-08 | 深圳利亚德光电有限公司 | Led显示屏 |
CN102122463A (zh) * | 2011-03-24 | 2011-07-13 | 李海涛 | 一种贴片led显示屏及其制造方法 |
CN102163392A (zh) * | 2011-03-09 | 2011-08-24 | 深圳雷曼光电科技股份有限公司 | Led拼装屏 |
CN103280164A (zh) * | 2013-05-30 | 2013-09-04 | 创维光电科技(深圳)有限公司 | Led显示屏模组以及led显示屏 |
US20190164940A1 (en) * | 2017-11-29 | 2019-05-30 | Leyard Optoelectronic Co.,Ltd | Small pitch LED display module and manufacturing method thereof |
CN210411366U (zh) * | 2019-06-19 | 2020-04-28 | 深圳雷曼光电科技股份有限公司 | 灌胶头组件、灌胶机及需要进行灌胶的显示模组 |
-
2021
- 2021-04-15 CN CN202110405683.9A patent/CN113066397B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101752275A (zh) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Led模块的封装方法和封装结构 |
CN201859623U (zh) * | 2010-11-05 | 2011-06-08 | 深圳利亚德光电有限公司 | Led显示屏 |
CN102163392A (zh) * | 2011-03-09 | 2011-08-24 | 深圳雷曼光电科技股份有限公司 | Led拼装屏 |
CN102122463A (zh) * | 2011-03-24 | 2011-07-13 | 李海涛 | 一种贴片led显示屏及其制造方法 |
CN103280164A (zh) * | 2013-05-30 | 2013-09-04 | 创维光电科技(深圳)有限公司 | Led显示屏模组以及led显示屏 |
US20190164940A1 (en) * | 2017-11-29 | 2019-05-30 | Leyard Optoelectronic Co.,Ltd | Small pitch LED display module and manufacturing method thereof |
CN210411366U (zh) * | 2019-06-19 | 2020-04-28 | 深圳雷曼光电科技股份有限公司 | 灌胶头组件、灌胶机及需要进行灌胶的显示模组 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114333573A (zh) * | 2021-12-03 | 2022-04-12 | 昆山国显光电有限公司 | 显示模组及显示装置 |
CN114333573B (zh) * | 2021-12-03 | 2023-11-21 | 昆山国显光电有限公司 | 显示模组及显示装置 |
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Publication number | Publication date |
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CN113066397B (zh) | 2024-03-15 |
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Effective date of registration: 20240713 Address after: 501, Building 3, Xifengcheng Industrial Park, Fuyuan 2nd Road, Zhancheng Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province 518000 Patentee after: Shenzhen Zhuoxing Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 518000 4th floor, workshop beside Yousheng paper, Wenchuan Road, yingrenshi community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Jinhan Semiconductor Technology Co.,Ltd. Country or region before: China |