CN113056087A - Printed circuit board embedded with micro-channel and preparation method thereof - Google Patents
Printed circuit board embedded with micro-channel and preparation method thereof Download PDFInfo
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- CN113056087A CN113056087A CN202110118888.9A CN202110118888A CN113056087A CN 113056087 A CN113056087 A CN 113056087A CN 202110118888 A CN202110118888 A CN 202110118888A CN 113056087 A CN113056087 A CN 113056087A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a printed circuit board with embedded micro-channels, which comprises an embedded micro-channel metal core plate, wherein n layers of first wiring layers are arranged at the top of the embedded micro-channel metal core plate, m layers of second wiring layers are arranged at the bottom of the embedded micro-channel metal core plate, and the printed circuit board is provided with a liquid inlet and a liquid outlet which are communicated with the micro-channels. The structure has high-efficiency heat dissipation capability, can realize the transmission of high-density electric signals, and meets the application requirements of high-density integrated high-power electronic devices.
Description
Technical Field
The invention belongs to the technical field of microelectronic heat dissipation, and particularly relates to a printed circuit board with embedded micro-channels and a preparation method thereof.
Background
With the further increase of integration density and the gradual increase of power density of electronic systems, the thermal management problem has become one of the technical bottlenecks in the development of electronic systems. The traditional passive heat dissipation technology cannot meet the heat dissipation requirement of the high-power device. This is because: the traditional passive heat dissipation adopts metal heat sink, and heat dissipation is realized through metal heat conduction and heat radiation, so that the heat dissipation is not suitable for large heat flow density heat transfer. Thermal management techniques that utilize microfluidics to achieve enhanced heat dissipation have become an important solution. Compared with the passive heat dissipation technology, the micro-channel heat dissipation technology has unique advantages: on one hand, the micro-channel heat dissipation technology using liquid as a cooling medium can realize heat transfer with large heat flow density; on the other hand, the heat convection coefficient of the liquid flowing heat exchange in the micro-channel is inversely proportional to the equivalent size of the channel, so that the heat exchange effect can be obviously improved while the equivalent size of the channel is reduced, and the volume can be greatly reduced, so that the structural size and the weight of the whole heat dissipation system are greatly simplified and reduced. Therefore, the micro-channel heat dissipation technology has wide application prospect in the field of high-power electronic device system integration.
The printed circuit board is a general electronic system substrate, is a provider of electrical connection of electronic components, and is an important carrier for realizing high-density integration of electronic systems. The traditional printed circuit board mainly comprises organic materials and a copper wiring layer, and the requirement of high-density integration of high-power devices is difficult to meet due to the low thermal conductivity of the organic materials (generally less than 1W/m.K). Chinese utility model patent CN211019412U proposes a copper-embedded printed circuit board, which is manufactured by embedding copper blocks into the cavity grooves of the printed circuit board during the production process of the printed circuit board, and the high heat conductivity (400W/m.k) of the copper blocks is utilized to realize the high-efficiency heat dissipation requirement of the high-power devices. However, the printed circuit board based on passive heat dissipation has limited heat dissipation capability, and can only solve the heat dissipation problem of low heat flux density.
How to combine the micro-channel heat dissipation technology with the high-density integrated technology of the printed circuit board to realize high-heat-flux heat dissipation is recently reported.
Disclosure of Invention
The technical problem solved by the invention is as follows: the printed circuit board with the embedded micro-channel has high-efficiency heat dissipation capability, and can realize transmission of high-density electric signals.
The technical scheme adopted by the invention is as follows:
the utility model provides an embedded miniflow channel's printed circuit board, printed circuit board includes embedded miniflow channel metal core, embedded miniflow channel metal core top is provided with n layer wiring layer one, embedded miniflow channel metal core bottom is provided with m layer wiring layer two, printed circuit board is provided with the inlet and the liquid outlet of intercommunication miniflow channel.
Preferably, the embedded microchannel metal core plate includes, but is not limited to, copper, aluminum, and molybdenum-copper alloy.
Preferably, the embedded micro-channel metal core plate is made of copper.
Preferably, the size of the flow channel of the micro-flow channel in the metal core plate with the embedded micro-flow channel is between 100 mu m and 10 mm;
preferably, the size of the micro-channel in the micro-channel embedded metal core plate is 300 μm.
Preferably, the sizes of the liquid inlet and the liquid outlet are consistent and are between 0.5mm and 20 mm.
Preferably, the size of the liquid inlet and the liquid outlet is 1 mm.
Preferably, the first wiring layer is made of an organic material and a copper wiring material, and the number n of the wiring layers is as follows: n is more than or equal to 10 and more than or equal to 1.
Preferably, the second wiring layer is made of an organic material and a copper wiring material, and the value of the number m of the wiring layers is as follows: m is more than or equal to 10 and more than or equal to 1.
A method for preparing a printed circuit board with embedded micro-channels comprises the following steps:
step 1: preparing an embedded micro-channel metal core plate:
processing a micro-channel on one surface of one metal core plate, and then connecting the surface processed with the micro-channel with the other metal core plate;
step 2: preparing n layers of wiring layers I.
And preparing the first n layers of wiring layers by a printed circuit board laminating process.
And step 3: and preparing a second m-layer wiring layer.
And preparing a second m-layer wiring layer through a printed circuit board laminating process.
And 4, step 4: and (3) carrying out surface treatment on the micro-channel embedded metal core plate in the step (1).
And 5: and (3) laminating the n layers of wiring layers I in the step (2), the embedded micro-channel metal core plate subjected to surface treatment in the step (4) and the m layers of wiring layers II in the step (3) into the printed circuit board embedded with the micro-channels.
Step 6: and (3) processing a liquid inlet and a liquid outlet on the printed circuit board prepared in the step (5) by a depth control milling method, wherein the liquid inlet and the liquid outlet are communicated with a micro channel.
Preferably, in the step 1, any one of precision machining, chemical corrosion, electric spark machining or metal micro-electroforming is adopted for machining the micro-flow channel on the metal core plate.
Preferably, in the step 1, the connection method of connecting the surface on which the micro flow channel is processed to another metal core plate is any one of vacuum diffusion welding, vacuum brazing or solder welding.
Preferably, the surface treatment is performed on the micro-channel embedded metal core plate in the step 4, and the treatment process is blackening or browning.
Preferably, the pressing method in the step 5 is a printed circuit board laminating process method.
The beneficial technical effects of the invention are as follows:
compared with the prior art, the beneficial effects of adopting the technical scheme are as follows:
(1) the metal core micro-channel is embedded in the printed circuit board, and the high heat flux density heat dissipation is realized by utilizing the enhanced heat dissipation effect of the micron-scale fluid. Compared with the common printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 5 times; compared with a copper-embedded printed circuit board, the high-efficiency heat dissipation capacity of the printed circuit board is improved by more than 1 time.
(2) The metal core plate with the embedded micro-channel is integrated in the printed circuit board, so that high-density transmission of electric signals can be realized while high-efficiency heat dissipation is realized. Compared with the common printed circuit board and the external metal micro-channel integration method, the integration density can be improved by more than 1 time.
(3) The technical method of firstly laminating and then controlling the milling and processing liquid inlet/outlet depth can avoid the problems of flow passage pollution, blockage and the like in the processing process of the printed circuit board.
(4) The printed circuit board is formed by laminating the micro-channel embedded metal core board and the wiring layer material by adopting a laminating process. The micro-channel embedded metal core plate is prepared by a vacuum diffusion welding method, a vacuum brazing method or a solder welding method, is of a pure metal structure, and is only arranged in the metal core plate and is not contacted with the organic material of the wiring layer. After the cooling medium is injected into the micro-channel area, the cooling medium is not in contact with the organic material in the wiring layer of the printed circuit board, moisture absorption and denaturation phenomena are avoided, and reliability risks such as layer rising, bulging, liquid leakage and the like are avoided.
Drawings
FIG. 1 is a schematic cross-sectional view of an embedded microchannel metal core plate according to the present invention.
FIG. 2 is a schematic cross-sectional view of n wiring layers on the top of the micro-flow channel embedded metal core board of the present invention.
FIG. 3 is a cross-sectional view of the bottom m layers of the micro-flow channel embedded metal core board of the present invention.
FIG. 4 is a schematic cross-sectional view of a micro flow channel embedded printed circuit board according to the present invention.
FIG. 5 is a schematic cross-sectional view of a micro-channel embedded PCB and an inlet/outlet port of the present invention.
FIG. 6 is a process flow diagram of a manufacturing method of the present invention.
Wherein, the names corresponding to the reference numbers are:
1-embedded micro-channel metal core plate, 2-micro-channel, 3-n layers of first wiring layers, 4-organic materials, 5-copper wiring materials, 6-m layers of second wiring layers, 7-printed circuit board and 8-liquid inlet/outlet.
Detailed Description
The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.
The invention combines the micro-channel heat dissipation technology with the high-density integrated technology of the printed circuit board to realize the high-heat-flux heat dissipation, and the specific structure of the prepared printed circuit board is as follows:
a printed circuit board with embedded micro-channels is shown in figures 1-5, wherein the printed circuit board 7 comprises an embedded micro-channel metal core board 1, n layers of wiring layers I3 are arranged on the top of the embedded micro-channel metal core board 1, m layers of wiring layers II 6 are arranged at the bottom of the embedded micro-channel metal core board 1, and the printed circuit board 7 is provided with a liquid inlet 8 and a liquid outlet 8 which are communicated with the micro-channels.
Further, the material of the micro flow channel embedded metal core plate 1 is selected from materials with strong thermal conductivity, including but not limited to copper, aluminum and molybdenum-copper alloy. Preferably, the embedded micro-channel metal core plate 1 is made of copper.
Further, the flow channel size of the micro-flow channel 2 in the micro-flow channel embedded metal core plate 1 is between 100 mu m and 10 mm; preferably, the size of the micro flow channel 2 is 300 μm.
Furthermore, the sizes of the liquid inlet 8 and the liquid outlet 8 are consistent and are between 0.5mm and 20 mm. Preferably, the size of the liquid inlet 8 and the liquid outlet 8 is 1 mm.
Further, the n wiring layers one 3 are made of an organic material and a copper wiring material, and the value of the number n of the wiring layers is as follows: n is more than or equal to 10 and more than or equal to 1. In the present embodiment, the wiring structure of the n-layer wiring layer one 3 is a wiring structure common to those skilled in the art and will not be described in detail herein.
Preferably, the m wiring layers two 6 are made of organic materials and copper wiring materials, and the values of the m wiring layers are as follows: m is more than or equal to 10 and more than or equal to 1. In the present embodiment, the wiring structure of the m-layer wiring layer two 6 is a wiring structure common to those skilled in the art and will not be described in detail here.
According to the invention, the micro-channel 2 is embedded into the metal core plate, and then the embedded micro-channel metal core plate 1 is integrated in the printed circuit board 7, so that high heat flux density heat dissipation of a local area is realized, high-density transmission of electric signals is realized, and the application requirements of high-density integrated high-power electronic devices are met. The micro-channel 2 is embedded in the pure metal structure, and the medium circulating in the micro-channel is not contacted with the organic material in the wiring layer of the printed circuit board 7, so that the reliability risks of layer rising, bulging, liquid leakage and the like of the printed circuit board can be avoided.
The preparation method of the printed circuit board, as shown in fig. 6, specifically includes the following steps:
a method for preparing a printed circuit board with embedded micro-channels comprises the following steps:
step 1: preparing a micro-channel embedded metal core plate 1:
processing a micro-channel 2 on one surface of one metal core plate, and then connecting the surface processed with the micro-channel 2 with the other metal core plate;
further, the micro flow channel 2 can be processed on the metal core plate by any one of precision machining, chemical etching, electric discharge machining or metal micro-electroforming, for example, precision machining as shown in fig. 6. The above-described processing is well known to those skilled in the art and will not be described in detail here.
Further, the connection of the side on which the micro flow channel 2 is formed to another metal core plate may be performed by any one of vacuum diffusion welding, vacuum brazing, and solder welding, for example, vacuum diffusion welding is used in fig. 6. The above-described connection means are well known to those skilled in the art and will not be described in detail here.
Step 2: preparing n layers of wiring layers I3.
And preparing n layers of wiring layers I3 through a printed circuit board laminating process. The lamination process is a common process for printed circuit boards known to those skilled in the art and will not be described in detail herein.
And step 3: and preparing a second m-layer wiring layer 6.
And preparing a second m-layer wiring layer 6 through a printed circuit board laminating process. The lamination process is a common process for printed circuit boards known to those skilled in the art and will not be described in detail herein.
And 4, step 4: and (3) carrying out surface treatment on the micro-channel embedded metal core plate 1 in the step (1). The surface treatment is generally a blackening or browning treatment, and the treatment process is well known to those skilled in the art and will not be described in detail herein.
And 5: and (3) pressing the n layers of wiring layers I3, the surface-treated embedded micro-channel metal core plate 1 in the step 4 and the m layers of wiring layers II 6 in the step 3 into the micro-channel embedded printed circuit board 7. The lamination process of the printed circuit board is well known to those skilled in the art, and will not be described in detail herein.
Step 6: and (3) processing a liquid inlet 8 and a liquid outlet 8 on the printed circuit board 7 prepared in the step (5) by a depth control milling method, wherein the liquid inlet 8 and the liquid outlet 8 are communicated with the micro-channel 2.
In the invention, a micro-channel 2 is processed through a metal core plate and then is welded with another metal core plate to form an embedded micro-channel metal core plate 1, then two surfaces of the embedded micro-channel metal core plate 1 are respectively pressed with n layers of wiring layers I3 and m layers of wiring layers II 6 to form a micro-channel embedded printed circuit board 7 through a laminating method, then a liquid inlet 8 and a liquid outlet 8 are processed, and the liquid inlet 8 and the liquid outlet 8 are communicated with the micro-channel 2; in the method, the micro-channel 2 is only arranged in the metal core plate and is not contacted with the organic material of the wiring layer, so that the contact of the cooling medium and the organic material in the wiring layer of the printed circuit board is avoided, meanwhile, the process method of firstly laminating and then deeply milling the liquid inlet 8 and the liquid outlet 8 in the process is adopted, and the problems of channel pollution, blockage and the like in the processing process are avoided.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (10)
1. The utility model provides a printed circuit board of embedded microchannel which characterized in that, printed circuit board includes embedded microchannel metal core, embedded microchannel metal core top is provided with n layer wiring layer one, embedded microchannel metal core bottom is provided with m layer wiring layer two, printed circuit board is provided with inlet and the liquid outlet of intercommunication microchannel.
2. The micro-fluidic channel embedded printed circuit board of claim 1, wherein the micro-fluidic channel embedded metal core plate comprises but is not limited to copper, aluminum and molybdenum-copper alloy.
3. The micro-channel embedded printed circuit board of claim 1, wherein the micro-channel in the micro-channel embedded metal core plate has a channel size of 100 μm to 10 mm.
4. The micro flow channel embedded printed circuit board of claim 1, wherein the size of the liquid inlet and the liquid outlet are consistent and are between 0.5mm and 20 mm.
5. The micro-channel embedded printed circuit board of claim 1, wherein the first wiring layer is made of organic material and copper wiring material, and the number of wiring layers n is as follows: n is more than or equal to 10 and more than or equal to 1.
6. The micro-channel embedded printed circuit board of claim 1, wherein the second wiring layer is an organic material and a copper wiring material, and the number m of the wiring layers is as follows: m is more than or equal to 10 and more than or equal to 1.
7. The method for preparing a micro flow channel embedded printed circuit board of any one of claims 1 to 6, comprising the steps of:
step 1: preparing an embedded micro-channel metal core plate:
processing a micro-channel on one surface of one metal core plate, and then connecting the surface processed with the micro-channel with the other metal core plate;
step 2: preparing n layers of wiring layers I.
And preparing the first n layers of wiring layers by a printed circuit board laminating process.
And step 3: and preparing a second m-layer wiring layer.
And preparing a second m-layer wiring layer through a printed circuit board laminating process.
And 4, step 4: and (3) carrying out surface treatment on the micro-channel embedded metal core plate in the step (1).
And 5: and (3) laminating the n layers of wiring layers I in the step (2), the embedded micro-channel metal core plate subjected to surface treatment in the step (4) and the m layers of wiring layers II in the step (3) into the printed circuit board embedded with the micro-channels.
Step 6: and (3) processing a liquid inlet and a liquid outlet on the printed circuit board prepared in the step (5) by a depth control milling method, wherein the liquid inlet and the liquid outlet are communicated with a micro channel.
8. The method for preparing a micro-channel embedded printed circuit board according to claim 7, wherein the micro-channel processed on the metal core board in step 1 is any one of precision mechanical processing, chemical corrosion, electric spark processing or metal micro-electroforming; in the step 1, the connection mode of connecting the surface processed with the micro flow channel with the other metal core plate adopts any one of vacuum diffusion welding, vacuum brazing or solder welding.
9. The method according to claim 7, wherein the micro flow channel embedded printed circuit board of step 4 is subjected to a surface treatment process such as blackening or browning.
10. The method of claim 7, wherein the laminating process in step 5 is a PCB laminating process.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110118888.9A CN113056087B (en) | 2021-01-28 | 2021-01-28 | Printed circuit board embedded with micro-channel and preparation method thereof |
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| CN202110118888.9A CN113056087B (en) | 2021-01-28 | 2021-01-28 | Printed circuit board embedded with micro-channel and preparation method thereof |
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| CN113056087B CN113056087B (en) | 2022-05-03 |
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Cited By (2)
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| CN113784501A (en) * | 2021-08-17 | 2021-12-10 | 中国电子科技集团公司第二十九研究所 | Micro-channel embedded printed circuit board integrated structure and manufacturing method |
| CN113891546A (en) * | 2021-11-02 | 2022-01-04 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with reinforced structure micro-channel and preparation method thereof |
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| CN113891546B (en) * | 2021-11-02 | 2023-05-16 | 中国电子科技集团公司第二十九研究所 | Printed circuit board embedded with micro-channels with reinforced structures and preparation method thereof |
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|---|---|
| CN113056087B (en) | 2022-05-03 |
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