CN113050013B - Device, method and panel for detecting contact performance of puncture test probe - Google Patents
Device, method and panel for detecting contact performance of puncture test probe Download PDFInfo
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- CN113050013B CN113050013B CN202110287883.9A CN202110287883A CN113050013B CN 113050013 B CN113050013 B CN 113050013B CN 202110287883 A CN202110287883 A CN 202110287883A CN 113050013 B CN113050013 B CN 113050013B
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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Abstract
Disclosed herein are an apparatus, method and panel for detecting contact performance of a needle insertion test probe. The device for detecting the contact performance of the puncture test probe comprises: a signal line structure and a test structure; the signal line structure comprises one or more signal line regions, and the test structure comprises one or more test regions; any one of the signal line regions includes: a plurality of signal lines; any one of the test zones includes: a plurality of test pads and a plurality of test leads; the signal line areas are in one-to-one correspondence with the test areas; for any one test area, the test pad is used for contacting the probe, one end of the test pad is connected with one end of the signal wire in a one-to-one correspondence manner, the other end of the test pad is connected with the first ends of the test leads in a one-to-one correspondence manner, and the second ends of all the test leads in the same test area are connected with each other. The device for detecting the contact performance of the puncture test probe can be used for a test system to conveniently detect whether the contact failure between the probe and the test pad exists in the puncture test of the signal wire.
Description
Technical Field
The present disclosure relates to the field of display technology, and more particularly, to a device, method, and panel for detecting contact performance of a puncture test probe.
Background
The Flexible AM-OLED (Active-matrix organic light-emitting diode) technology is widely used in mobile phones and wearable electronic devices due to its Flexible advantage, and the Flexible AM-OLED with On Cell Touch (external Touch) is lighter and thinner, so it is popular in the market.
In the process of manufacturing signal wires on the touch panel, open-circuit or short-circuit type wiring defects may occur, so that the touch panel needs to be tested before leaving the factory to check manufacturing defects of the signal wires. By connecting the test pad to the end of the signal line, a needle insertion test is performed on the test pad by using a special detection device, and whether the signal line is open or short can be detected. However, in the actual needle insertion test process, the touch panel is not well inspected due to poor contact between the probe of the detection device and the test pad on the touch panel, so that the touch panel with normal wiring is mistakenly scrapped due to poor inspection and wiring opening, and the touch panel is not well inspected, thereby causing waste.
Disclosure of Invention
The embodiment of the disclosure provides a device, a method and a panel for detecting probe contact performance during signal wire puncture test.
In a first aspect, embodiments of the present disclosure provide an apparatus for detecting contact performance of a puncture test probe, comprising: a signal line structure and a test structure; the signal line structure comprises one or more signal line regions, and the test structure comprises one or more test regions;
any one of the signal line regions includes: a plurality of signal lines; any one of the test zones includes: a plurality of test pads and a plurality of test leads; the signal line areas are in one-to-one correspondence with the test areas;
for any one test area, the test pad is used for contacting the probe, one end of the test pad is connected with one end of the signal wire in a one-to-one correspondence manner, the other end of the test pad is connected with the first ends of the test leads in a one-to-one correspondence manner, and the second ends of all the test leads in the same test area are connected with each other.
In a second aspect, embodiments of the present disclosure provide a method for detecting contact performance of a puncture test probe, which is applied to a test system including the above-mentioned device for detecting contact performance of a puncture test probe, the method including the steps of:
taking any signal wire to be tested in a signal wire area to be tested as a target signal wire, taking a test lead directly connected with the target signal wire through a test pad as a target test lead, and taking a test area where the target test lead is positioned as a target test area; taking other test areas with connection relation with the test leads in the target test area as associated test areas;
taking the test pad connected with the target signal line as a first node; if the second end of the target signal line is open, optionally selecting a test pad except the first node from the target test area as a second node; if the second end of the target signal line is connected with another signal line in the same signal line area, the test pad connected with the other signal line is used as a second node;
if the target signal wire has an associated test area, shorting together first ends of all test leads except the target test lead in the target test area and the associated test area; if the target signal line does not have an associated test area, shorting first ends of all test leads except the target test lead in the target test area together;
the method comprises the steps of needling a first node by using a first probe, inputting an electric signal, needling a second node by using a second probe, outputting the electric signal, measuring the equivalent resistance between the first node and the second node, comparing the resistance measured value of the equivalent resistance with a resistance threshold value, and determining whether the needled contact failure exists according to a comparison result.
In a third aspect, embodiments of the present disclosure provide a panel including the above-described apparatus for detecting contact performance of a puncture test probe.
According to the device, the method and the panel for detecting the contact performance of the puncture test probe, corresponding test pads and test leads are arranged for each signal wire in the signal wire area, second ends of all the test leads in the same test area are connected with each other, the signal wire is traversed for puncture test, any signal wire to be tested is subjected to puncture test, the test pad connected with the signal wire to be tested is used as a first node, and the test pad connected with the other signal wire is used as a second node. By providing the device for the test equipment, the test equipment can form a measurement loop with other test leads through the test leads connected with the signal wire to be tested when the test equipment performs the needle insertion test on the signal wire by using the probe, so that whether the contact failure between the probe and the test pad exists or not can be conveniently detected by measuring the equivalent resistance between two needle insertion points (a first node and a second node). The method has the advantages that when the contact defect of the probe and the test pad is detected, the alarm is given, the hidden danger of the contact defect of the probe needle insertion of the test equipment can be found in advance, after the hidden danger is eliminated, the signal line wiring open circuit or short circuit test is carried out on the panel, the panel with good signal line wiring can be prevented from being misjudged as the panel with the wiring open circuit, and accordingly the reject ratio and the rejection rate of the panel are reduced.
Drawings
The accompanying drawings are included to provide an understanding of the technical aspects of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present disclosure and together with the embodiments of the disclosure, not to limit the technical aspects of the present disclosure.
FIG. 1 is a schematic diagram of an apparatus for detecting contact performance of a puncture test probe according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a signal line area and a test area according to an embodiment of the disclosure;
FIG. 3 is a schematic diagram of another signal line area and test area according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural view of another device for detecting contact performance of a puncture test probe according to an embodiment of the present disclosure;
FIG. 5 is a flow chart of a method of detecting contact performance of a needle insertion test probe provided by an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of an equivalent resistance test (no direct connection between signal lines, no associated test area) provided by an embodiment of the present disclosure;
FIG. 7 is a schematic diagram of an equivalent resistance test (two signal lines connected, no associated test area) provided by an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of an equivalent resistance test (no direct connection between signal lines, associated test area) provided in an embodiment of the present disclosure;
fig. 9 is a schematic diagram of an equivalent resistance test (two signal lines are connected and have associated test areas) according to an embodiment of the present disclosure.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail hereinafter with reference to the accompanying drawings. Note that embodiments may be implemented in a number of different forms. One of ordinary skill in the art can readily appreciate the fact that the manner and content may be varied into a wide variety of forms without departing from the spirit and scope of the present disclosure. Accordingly, the present disclosure should not be construed as being limited to the following description of the embodiments. Embodiments of the present disclosure and features of embodiments may be combined with each other arbitrarily without conflict.
In the drawings, the size of each constituent element, the thickness of a layer, or a region may be exaggerated for clarity. Accordingly, one aspect of the present disclosure is not necessarily limited to this dimension, and the shapes and sizes of the various components in the drawings do not reflect actual proportions. Further, the drawings schematically show ideal examples, and one mode of the present disclosure is not limited to the shapes or numerical values shown in the drawings, and the like.
The ordinal numbers of "first", "second", "third", etc. in the present specification are provided to avoid mixing of constituent elements, and are not intended to be limited in number.
In this specification, the terms "mounted," "connected," and "connected" are to be construed broadly, unless explicitly stated or limited otherwise. For example, it may be a fixed connection, a removable connection, or an integral connection; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intermediate members, or may be in communication with the interior of two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art in the specific context.
In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some electric action. The "element having a certain electric action" is not particularly limited as long as it can transmit and receive an electric signal between the constituent elements connected. Examples of the "element having some electric action" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.
The term "about" in this disclosure refers to values that are not strictly limited to the limits, but are allowed to fall within the limits of the process and measurement errors.
Fig. 1 provides an apparatus for detecting the contact performance of a needle insertion test probe. As shown in fig. 1, an apparatus for detecting contact performance of a puncture test probe includes: a signal line structure and a test structure; the signal line structure comprises one or more signal line regions 10, and the test structure comprises one or more test regions 20;
any one of the signal line regions includes: a plurality of signal lines 12; any one of the test zones includes: a plurality of test pads 22 and a plurality of test leads 24; the signal line areas are in one-to-one correspondence with the test areas;
for any one test area, the test pad is used for contacting the probe, one end of the test pad is connected with one end of the signal wire in a one-to-one correspondence manner, the other end of the test pad is connected with the first ends of the test leads in a one-to-one correspondence manner, and the second ends of all the test leads in the same test area are connected with each other.
In the device for detecting contact performance of the puncture test probe in the above embodiment, a corresponding test pad and test lead are provided for each signal line in the signal line region, and the second ends of all the test leads in the same test region are connected to each other. By providing the device for the test equipment, the test equipment can form a measurement loop with other test leads through the test leads connected with the signal wire to be tested when the test equipment utilizes the probe to perform the needle insertion test on the signal wire, so that whether the contact failure of the probe and the test pad exists or not can be conveniently detected by measuring the equivalent resistance between two needle insertion points. The method has the advantages that when the contact defect of the probe and the test pad is detected, the alarm is given, the hidden danger of the contact defect of the probe needle insertion of the test equipment can be found in advance, after the hidden danger is eliminated, the signal line wiring open circuit or short circuit test is carried out on the panel, the panel with good signal line wiring can be prevented from being misjudged as the panel with the wiring open circuit, and accordingly the reject ratio and the rejection rate of the panel are reduced.
The test device can provide test signals to the test structure of the touch panel by using the probes for testing. The test structure can be cut off from the touch panel after the test is finished.
In some exemplary embodiments, the test leads are metal leads.
In some exemplary embodiments, the signal line region includes: the first signal line routing area and/or the second signal line routing area.
In some exemplary embodiments, as shown in fig. 2, when the signal line region is a first signal line routing region, the signal line region includes n signal lines, and the test region includes n test pads and n test leads; the first end of the ith signal line S (i) is connected with the first end of the ith test pad P (i); the second end of the ith test pad is connected with the first end of the ith test lead T (i); the second ends of the n test leads are connected with each other; i is more than or equal to 1 and less than or equal to n; n is greater than 1.
In some exemplary embodiments, as shown in fig. 3, when the signal line region is a second signal line routing region, the signal line region includes n groups of signal lines; the test area comprises 2n test pads and 2n test leads; the ith group of signal lines S (i) comprises a first signal line Si_1 and a second signal line Si_2, wherein the first end of the first signal line Si_1 is connected with the first end of an ith test pad P (i), the second end of the ith test pad is connected with the first end of an ith test lead T (i), the second end of the first signal line Si_1 is connected with the first end of a second signal line Si_2, the second end of the second signal line Si_2 is connected with the first end of a 2n+1-i test pad P (2n+1-i), and the second end of the 2n+1-i test pad is connected with the first end of a 2n+1-i test lead T (2n+1-i); the second ends of the 2n test leads are connected with each other; i is more than or equal to 1 and less than or equal to n; n is greater than 1.
In some exemplary embodiments, when the signal line region includes a first signal line trace region and a second signal line trace region, the second ends of the test leads in the first test region corresponding to the first signal line trace region and the second ends of the test leads in the second test region corresponding to the second signal line trace region are connected together or not connected to each other.
In some exemplary embodiments, as shown in fig. 4, the signal line region includes: a transmitting signal line routing area and a receiving signal line routing area;
the transmission signal line routing area comprises n groups of transmission signal lines, the ith group of transmission signal lines comprise a first transmission signal line Ti_1 and a second transmission signal line Ti_2, the first end of the first transmission signal line Ti_1 is connected with the first end of an ith test pad P (i), the second end of the first transmission signal line Ti_1 is connected with the first end of a second transmission signal line Ti_2, and the second end of the second transmission signal line Ti_2 is connected with the first end of a 2n+1-i th test pad P (2n+1-i);
the receiving signal line routing area comprises n receiving signal lines; the first end of the ith receiving signal wire is connected with the first end of the 2n+i test pad P (2n+i), and the second end of the 2n+i test pad is connected with the first end of the 2n+i test lead; i is more than or equal to 1 and less than or equal to n;
the second ends of all test leads in the same test zone are connected to each other and the second ends of test leads in different test zones are connected to each other or are disconnected from each other.
Fig. 4 shows a schematic view of the interconnection of the second ends of the test leads in a different test zone. In other embodiments, the second ends of the test leads in different test zones may also be disconnected from each other.
In some exemplary embodiments, the signal line may be a touch signal line. In other embodiments, the signal line may be another type of signal line, such as: and displaying the signal line.
As shown in fig. 5, an embodiment of the present disclosure provides a method for detecting contact performance of a puncture test probe, which is applied to a test system including the above-mentioned device for detecting contact performance of a puncture test probe, and includes the following steps:
step S10, taking any signal wire to be tested in a signal wire area to be tested as a target signal wire, taking a test lead directly connected with the target signal wire through a test pad as a target test lead, and taking a test area where the target test lead is positioned as a target test area; taking other test areas with connection relation with the test leads in the target test area as associated test areas;
step S20, taking the test pad connected with the target signal line as a first node; if the second end of the target signal line is open, optionally selecting a test pad except the first node from the target test area as a second node; if the second end of the target signal line is connected with another signal line in the same signal line area, the test pad connected with the other signal line is used as a second node;
step S30, if the target signal line has an associated test area, shorting together first ends of all test leads except the target test lead in the target test area and the associated test area; if the target signal line does not have an associated test area, shorting first ends of all test leads except the target test lead in the target test area together;
and S40, needling a first node by using a first probe and inputting an electric signal, needling a second node by using a second probe and outputting the electric signal, measuring the equivalent resistance between the first node and the second node, comparing the resistance measured value of the equivalent resistance with a resistance threshold value, and determining whether the needled poor contact exists according to the comparison result.
According to the embodiment of the disclosure, for any signal wire to be tested, a test pad connected with the signal wire to be tested is used as a first node, a test pad connected with another signal wire which is the same as the signal wire to be tested in one signal wire area is used as a second node, first ends of all test wires except the target test wire in a target test area and an associated test area are short-circuited together, or first ends of all test wires except the target test wire in the target test area are short-circuited together, a first probe is used for needling the first node and inputting an electric signal, a second probe is used for needling the second node and outputting an electric signal, and whether the needled contact failure exists or not is determined by measuring the equivalent resistance between the first node and the second node and comparing the measured resistance value with a resistance threshold value.
In some exemplary embodiments, the electrical signal input at the first node is a direct current signal. That is, a direct current signal is input from the first node.
In some exemplary embodiments, the method of detecting contact performance of a needle-punched test probe further comprises: and alarming when the poor contact of the puncture is detected. When the contact defect of the probe and the test pad is detected, the alarm is given, the hidden danger of the contact defect of the probe needle insertion can be found in advance, the signal line wiring open circuit or short circuit test is carried out on the panel after the hidden danger is eliminated, and the panel with good signal line wiring can be prevented from being misjudged as the panel with the wiring open circuit, so that the reject ratio of the panel is reduced. In the testing process, whether the probe is in good contact with the test pad or not can be monitored in real time, if the contact is poor, the equipment alarms, and the problem that the panel is scrapped due to the fact that a signal line is opened and is inspected due to the fact that the probe is in poor contact can be effectively prevented in time.
In some exemplary embodiments, determining whether there is a needle-stick poor contact based on the comparison result includes: and if the resistance measured value of the equivalent resistance is larger than the resistance threshold value, determining that the needle insertion poor contact exists.
In some exemplary embodiments, determining whether there is a needle-stick poor contact based on the comparison result includes: and if the resistance measured value of the equivalent resistance is smaller than or equal to the resistance threshold value, determining that the needle insertion contact is good.
In some exemplary embodiments, the method of detecting contact performance of a needle-punched test probe further comprises: and determining a resistance threshold according to the wiring mode of the signal wire to be tested and the connection relation between the test area where the test pad connected with the signal wire to be tested is positioned and other test areas.
Fig. 6 shows an equivalent circuit diagram of a puncture test for one signal line. As shown in fig. 6, the test system includes a signal line area and a test area, where the signal line area includes n signal lines S (1), S (2), …, S (n), and any two signal lines are not directly connected. The test area comprises n test pads P (1), P (2), … and P (n), and n test leads T (1), T (2), … and T (n). The first end of the ith signal line S (i) is connected with the first end of the ith test pad P (i); the second end of the ith test pad is connected with the first end of the ith test lead T (i); the second ends of the n test leads are connected with each other; i is more than or equal to 1 and n is more than or equal to n. Assume that the first signal line S1 is taken as a target signal line, and a puncture test is performed on the target signal line. The puncture test of any other signal line is the same as the puncture test method of the first signal line.
The test pad connected to the first signal line S (1) is used as a first node N1, the test lead T (1) directly connected to the signal line S (1) through the test pad is used as a target test lead, and one test pad except the first node is selected from the test area as a second node, for example, the second test pad is selected as a second node N2. The first ends of all the test leads in the test area except the target test lead are shorted together, i.e., the first ends of the test lines T (2), T (3), …, T (n) are shorted together.
Assuming that the internal resistances of all the test leads in the target test area are R, setting the resistance threshold value as the sum of the resistance target value R and the resistance error allowable value; wherein the resistance target value R is calculated using the following formula (1):
the allowable resistance error value can be determined according to an empirical value in the test process.
In some exemplary embodiments, the determining the resistance threshold includes:
when the second end of the target signal line is open and the target signal line does not have an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (1):
wherein r is the internal resistance of any one test lead in the target test area, the internal resistances of all the test leads are the same, and n is the number of the test leads included in the target test area.
Fig. 7 shows an equivalent circuit diagram of a puncture test for one signal line. As shown in fig. 7, taking a test system including one signal line region and one test region as an example, the signal line region includes n sets of signal lines; the test area comprises 2n test pads and 2n test leads; the ith group of signal lines Si comprises a first signal line Si_1 and a second signal line Si_2, wherein the first end of the first signal line Si_1 is connected with the first end of an ith test pad P (i), the second end of the ith test pad is connected with the first end of an ith test lead T (i), the second end of the first signal line Si_1 is connected with the first end of a second signal line Si_2, the second end of the second signal line Si_2 is connected with the first end of a 2n+1-i test pad P (2n+1-i), and the second end of the 2n+1-i test pad is connected with the first end of a 2n+1-i test lead T (2n+1-i); the second ends of the 2n test leads are connected with each other; i is more than or equal to 1 and n is more than or equal to n.
Assume that the first signal line s1_1 is taken as a target signal line, and a puncture test is performed on the target signal line. The puncture test of any other signal line is the same as the puncture test method of the first signal line.
The test pad connected to the first signal line s1_1 is used as a first node N1, the test lead T (1) directly connected to the signal line s1_1 through the test pad is used as a target test lead, the second end of the target signal line is connected to another signal line s1_2 in the same signal line area, and the test pad connected to the other signal line s1_2 is used as a second node N2. The first ends of all the test leads in the test area except the target test lead are shorted together, i.e., the first ends of the test lines T (2), T (3), …, T (2 n) are shorted together.
Assuming that the internal resistances of all the test leads in the target test area are r, the total internal resistance of the signal line s1_1 to be tested and the connected signal line s1_2 is r0.
Then the resistance threshold is set to the sum of the resistance target value R and the resistance error allowance;
assuming that the signal line s1_1 to be measured and the signal line s1_2 connected thereto are both well wired, the resistance target value R is calculated using the following formulas (2 a) and (2 b):
assuming that at least one signal line is open between the signal line s1_1 to be tested and the signal line s1_2 connected thereto, the resistance target value R is calculated by the following formula (3):
the allowable resistance error value can be determined according to an empirical value in the test process.
The resistance target value calculated according to the formula (3) is larger than the resistance target values calculated according to the formulas (2 a) and (2 b), and thus, the final resistance target value is determined as the resistance target value calculated according to the formula (3).
In some exemplary embodiments, the determining the resistance threshold includes:
when the second end of the target signal line is connected with another signal line in the same signal line area and the target signal line does not have an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (3):
wherein r is the internal resistance of any one test lead in the target test area, the internal resistances of all the test leads are the same, and the target test area comprises 2n test leads.
Fig. 8 shows an equivalent circuit diagram of a puncture test for one signal line. As shown in fig. 8, taking the test system as an example including two signal line areas and two test areas, the first signal line area includes n signal lines S1 (1), S1 (2), …, S1 (n), and any two signal lines are not directly connected. The first test area includes n test pads P1 (1), P1 (2), …, P1 (n), and the first test area further includes n test leads T1 (1), T1 (2), …, T1 (n). The first end of the ith signal line S1 (i) in the first signal line area is connected with the first end of the ith test pad P1 (i) in the first test area; the second end of the ith test pad is connected with the first end of the ith test lead T1 (i); i is more than or equal to 1 and n is more than or equal to n. The second test zone includes m test pads and m test leads. The second ends of all the test leads in the two test zones are connected to each other.
Assume that a first signal line S1 (1) in a first signal line region is taken as a target signal line, and a puncture test is performed on the target signal line. The puncture test of any other signal line is the same as the puncture test method of the first signal line.
The test pad connected to the first signal line S1 (1) is used as a first node N1, the test lead T1 (1) directly connected to the signal line S1 (1) through the test pad is used as a target test lead, and one test pad except the first node is selected from the first test area as a second node, for example, the second test pad is selected as a second node N2. All test leads in the first test zone except the target test lead, and the first ends of all test leads in the second test zone are shorted together, i.e., the first ends of test lines T1 (2), T1 (3), …, T1 (n), T2 (1), T2 (2), …, T2 (m) are shorted together.
Assuming that the internal resistances of all the test leads in the first test area and the second test area are R, the resistance threshold is set to be the sum of the resistance target value R and the resistance error allowable value; wherein the resistance target value R is calculated using the following formula (4):
the allowable resistance error value can be determined according to an empirical value in the test process.
In some exemplary embodiments, the determining the resistance threshold includes:
when the second end of the target signal line is open and the target signal line has an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (4):
wherein r is the internal resistance of any one test lead in the target test area and the associated test area, the internal resistances of all the test leads are the same, n is the number of test leads included in the target test area, and m is the number of test leads included in the associated test area.
Fig. 9 shows an equivalent circuit diagram of a puncture test for one signal line. As shown in fig. 9, taking a test system including two signal line regions and two test regions as an example, a first signal line region includes n sets of signal lines; the first test area comprises 2n test pads and 2n test leads; the ith group of signal lines Si in the first signal line area comprises a first signal line Si_1 and a second signal line Si_2, wherein the first end of the first signal line Si_1 is connected with the first end of an ith test pad P1 (i) in the first test area, the second end of the ith test pad is connected with the first end of an ith test lead T1 (i), the second end of the first signal line Si_1 is connected with the first end of a second signal line Si_2, the second end of the second signal line Si_2 is connected with the first end of a 2n+1-i test pad P (2n+1-i), and the second end of the 2n+1-i test pad is connected with the first end of a 2n+1-i test lead T (2n+1-i); i is more than or equal to 1 and n is more than or equal to n. The second signal line region includes n signal lines. The second test zone includes n test pads and n test leads. The second ends of all the test leads in the two test zones are connected to each other.
Assume that a first signal line s1_1 in a first signal line region is taken as a target signal line, and a puncture test is performed on the target signal line. The puncture test of any other signal line in the first signal line region is the same as the puncture test method of the first signal line.
The test pad connected to the first signal line s1_1 is used as a first node N1, the test lead T1 (1) directly connected to the signal line s1_1 through the test pad is used as a target test lead, the second end of the target signal line is connected to another signal line s1_2 in the same signal line area, and the test pad connected to the other signal line s1_2 is used as a second node N2. All test leads in the first test zone except the target test lead, and the first ends of all test leads in the second test zone are shorted together, i.e., the first ends of test lines T1 (2), T1 (3), …, T1 (2 n), T2 (1), T2 (2), …, T2 (n) are shorted together.
Assuming that the internal resistances of all the test leads in the first test region and the second test region are r, the sum of the internal resistances of the signal line s1_1 to be tested and the connected signal line s1_2 is r0.
Then the resistance threshold is set to the sum of the resistance target value R and the resistance error allowance;
assuming that the signal line s1_1 to be measured and the signal line s1_2 to be connected are both well wired, the resistance target value R is calculated using the following equation (5 a) and equation (5 b):
assuming that at least one signal line is open between the signal line s1_1 to be tested and the signal line s1_2 connected thereto, the resistance target value R is calculated by the following equation (6):
the allowable resistance error value can be determined according to an empirical value in the test process.
The resistance target value calculated according to the formula (6) is larger than the resistance target values calculated according to the formulas (5 a) and (5 b), and thus, the final resistance target value is determined as the resistance target value calculated according to the formula (6).
In some exemplary embodiments, the determining the resistance threshold includes:
when the second end of the target signal line is connected with another signal line in the same signal line area and the target signal line has an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (6):
and r is the internal resistance of any one test lead in the target test area and the associated test area, wherein the internal resistances of all the test leads are the same, the target test area comprises 2n test leads, and the associated test area comprises n test leads.
The embodiment of the disclosure also provides a panel, which comprises the system for detecting the contact performance of the probe during the signal wire puncture test.
The panel may be an organic light emitting touch panel. Such as a Flexible AM-OLED touch panel. The panel may be: any product or component with touch display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the panel will be understood by those of ordinary skill in the art, and are not described in detail herein, nor should they be limiting of the present disclosure.
While the embodiments disclosed in the present disclosure are described above, the embodiments are only employed for facilitating understanding of the present disclosure, and are not intended to limit the present disclosure. Any person skilled in the art to which this disclosure pertains will appreciate that numerous modifications and changes in form and details can be made without departing from the spirit and scope of the disclosure, but the scope of the disclosure is to be determined by the appended claims.
Claims (15)
1. An apparatus for detecting contact performance of a needle-punched test probe, comprising: a signal line structure and a test structure; the signal line structure comprises one or more signal line regions, and the test structure comprises one or more test regions;
any one of the signal line regions includes: a plurality of signal lines; any one of the test zones includes: a plurality of test pads and a plurality of test leads; the signal line areas are in one-to-one correspondence with the test areas;
for any one test area, the test pad is used for contacting with the probe, one end of the test pad is connected with one end of the signal wire in a one-to-one correspondence manner, the other end of the test pad is connected with the first ends of the test leads in a one-to-one correspondence manner, and the second ends of all the test leads in the same test area are connected with each other; the probe is used for inputting or outputting an electrical signal.
2. The apparatus of claim 1, wherein:
the signal line section includes: the first signal line routing area and/or the second signal line routing area.
3. The apparatus of claim 2, wherein:
when the signal line area is a first signal line wiring area, the signal line area comprises n signal lines, and the test area comprises n test pads and n test leads; the first end of the ith signal line S (i) is connected with the first end of the ith test pad P (i); the second end of the ith test pad is connected with the first end of the ith test lead T (i); the second ends of the n test leads are connected with each other; i is more than or equal to 1 and less than or equal to n; n is greater than 1.
4. The apparatus of claim 2, wherein:
when the signal line area is a second signal line wiring area, the signal line area comprises n groups of signal lines; the test area comprises 2n test pads and 2n test leads; the ith group of signal lines S (i) comprises a first signal line Si_1 and a second signal line Si_2, wherein the first end of the first signal line Si_1 is connected with the first end of an ith test pad P (i), the second end of the ith test pad is connected with the first end of an ith test lead T (i), the second end of the first signal line Si_1 is connected with the first end of a second signal line Si_2, the second end of the second signal line Si_2 is connected with the first end of a 2n+1-i test pad P (2n+1-i), and the second end of the 2n+1-i test pad is connected with the first end of a 2n+1-i test lead T (2n+1-i); the second ends of the 2n test leads are connected with each other; i is more than or equal to 1 and less than or equal to n; n is greater than 1.
5. The apparatus of claim 2, wherein:
when the signal line area comprises a first signal line wiring area and a second signal line wiring area, the second ends of the test leads in the first test area corresponding to the first signal line wiring area and the second ends of the test leads in the second test area corresponding to the second signal line wiring area are connected together or not connected with each other.
6. The apparatus of any one of claims 1-5, wherein:
the test leads are metal leads.
7. A method of detecting contact performance of a needle-punched test probe, applied to a test system comprising the apparatus for detecting contact performance of a needle-punched test probe according to any one of claims 1 to 6, the method comprising the steps of:
taking any signal wire to be tested in a signal wire area to be tested as a target signal wire, taking a test lead directly connected with the target signal wire through a test pad as a target test lead, and taking a test area where the target test lead is positioned as a target test area; taking other test areas with connection relation with the test leads in the target test area as associated test areas;
taking the test pad connected with the target signal line as a first node; if the second end of the target signal line is open, optionally selecting a test pad except the first node from the target test area as a second node; if the second end of the target signal line is connected with another signal line in the same signal line area, the test pad connected with the other signal line is used as a second node;
if the target signal wire has an associated test area, shorting together first ends of all test leads except the target test lead in the target test area and the associated test area; if the target signal line does not have an associated test area, shorting first ends of all test leads except the target test lead in the target test area together;
the method comprises the steps of needling a first node by using a first probe, inputting an electric signal, needling a second node by using a second probe, outputting the electric signal, measuring the equivalent resistance between the first node and the second node, comparing the resistance measured value of the equivalent resistance with a resistance threshold value, and determining whether the needled contact failure exists according to a comparison result.
8. The method of claim 7, wherein:
determining whether there is a needle insertion contact failure based on the comparison result, including: if the resistance measured value of the equivalent resistance is larger than the resistance threshold value, determining that the needle insertion poor contact exists; and if the resistance measured value of the equivalent resistance is smaller than or equal to the resistance threshold value, determining that the needle insertion contact is good.
9. The method of claim 7, wherein the method further comprises:
and determining a resistance threshold according to the wiring mode of the signal wire to be tested and the connection relation between the test area where the test pad connected with the signal wire to be tested is positioned and other test areas.
10. The method of claim 9, wherein:
the determining the resistance threshold includes:
when the second end of the target signal line is open and the target signal line does not have an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (1):
wherein r is the internal resistance of any one test lead in the target test area, the internal resistances of all the test leads are the same, and n is the number of the test leads included in the target test area.
11. The method of claim 9, wherein:
the determining the resistance threshold includes:
when the second end of the target signal line is connected with another signal line in the same tested area and the target signal line does not have an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (2):
wherein r is the internal resistance of any one test lead in the target test area, the internal resistances of all the test leads are the same, and the target test area comprises 2n test leads.
12. The method of claim 9, wherein:
the determining the resistance threshold includes:
when the second end of the target signal line is open and the target signal line has an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (3):
wherein r is the internal resistance of any one test lead in the target test area and the associated test area, the internal resistances of all the test leads are the same, n is the number of test leads included in the target test area, and m is the number of test leads included in the associated test area.
13. The method of claim 9, wherein:
the determining the resistance threshold includes:
when the second end of the target signal line is connected with another signal line in the same tested area and the target signal line has an associated test area, setting a resistance threshold value to be the sum of a resistance target value R and a resistance error allowable value; wherein the resistance target value R is calculated using the following formula (4):
and r is the internal resistance of any one test lead in the target test area and the associated test area, wherein the internal resistances of all the test leads are the same, the target test area comprises 2n test leads, and the associated test area comprises n test leads.
14. The method of any one of claims 7-13, wherein the method further comprises: and alarming when the poor contact of the puncture is detected.
15. A panel comprising the device for detecting contact performance of a puncture test probe of any of claims 1-6.
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