CN112305454A - Circuit board for testing display panel, testing device and testing method for display panel - Google Patents
Circuit board for testing display panel, testing device and testing method for display panel Download PDFInfo
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- CN112305454A CN112305454A CN202011187294.5A CN202011187294A CN112305454A CN 112305454 A CN112305454 A CN 112305454A CN 202011187294 A CN202011187294 A CN 202011187294A CN 112305454 A CN112305454 A CN 112305454A
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- 238000012360 testing method Methods 0.000 title claims abstract description 150
- 239000000523 sample Substances 0.000 claims abstract description 162
- 238000001514 detection method Methods 0.000 claims description 85
- 238000000034 method Methods 0.000 claims description 13
- 238000007689 inspection Methods 0.000 description 26
- 239000002245 particle Substances 0.000 description 7
- 230000002950 deficient Effects 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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Abstract
The disclosure provides a circuit board for testing a display panel, a testing device and a testing method for the display panel, and belongs to the technical field of display. The display panel is provided with a pad binding area, the pad binding area is provided with a plurality of green light signal pads which are arranged along a straight line and are adjacent in sequence, and the green light signal pads are electrically connected with green sub-pixels of each row of the display panel in a one-to-one correspondence mode. The circuit board comprises a first probe area and a test binding area, the first probe area is provided with a plurality of test probes which are sequentially and adjacently arranged along a straight line, and each test probe is in one-to-one correspondence with each green light signal bonding pad of the display panel; the test binding area is provided with a first binding pad and a second binding pad. And each odd-numbered test probe is electrically connected with the first binding pad, and each even-numbered test probe is electrically connected with the second binding pad. The circuit board can detect the short circuit failure between two adjacent green signal pads.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a circuit board for a display panel test, a test apparatus for a display panel, and a test method for a display panel.
Background
Conductive particles (particles) are inevitably generated during the fabrication of an OLED (organic electroluminescent diode) display panel, and if the particles fall onto a bonding pad (bonding) of the display panel, short circuits may occur between two adjacent data signal leads.
Referring to fig. 1, green signal pads are arranged in a straight line and adjacent to each other in sequence in a pad bonding area of the display panel, and each green signal pad is electrically connected to each row of green sub-pixels of the display panel in a one-to-one correspondence manner. When the conductive particles 150 fall to the bonding region, a short circuit between two adjacent green signal pads may be caused. According to the existing testing method of the display panel, the situation that short circuit occurs between two adjacent green signal pads cannot be detected, so that the poor panel which is not detected enters the subsequent process and is wasted.
The above information disclosed in the background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute prior art that is known to a person of ordinary skill in the art.
Disclosure of Invention
The purpose of the present disclosure is to provide a circuit board for testing a display panel, a testing device and a testing method of the display panel, so as to detect a short circuit failure between two adjacent green signal pads.
In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:
according to a first aspect of the present disclosure, a circuit board for testing a display panel is provided, where the display panel has a pad bonding area, the pad bonding area is provided with a plurality of green signal pads which are arranged along a straight line and are adjacent in sequence, and each green signal pad is electrically connected to each row of green sub-pixels of the display panel in a one-to-one correspondence manner;
the circuit board comprises a first probe area and a test binding area, the first probe area is provided with a plurality of test probes which are sequentially and adjacently arranged along a straight line, and each test probe is in one-to-one correspondence with each green light signal bonding pad of the display panel; the test binding area is provided with a first binding pad and a second binding pad;
and each odd-numbered test probe is electrically connected with the first binding pad, and each even-numbered test probe is electrically connected with the second binding pad.
In an exemplary embodiment of the present disclosure, the circuit board further includes:
first connection leads connected to the odd-numbered test probes;
one end of the first routing is connected with the first binding pad, and the other end of the first routing is connected with an odd number of test probes or the first connecting lead;
second connection leads connected to the even-numbered test probes;
and one end of the second routing wire is connected with the second binding pad, and the other end of the second routing wire is connected with an even number of the test probes or the second connecting lead.
In an exemplary embodiment of the present disclosure, the display panel is further provided with an electrical detection unit and a plurality of electrical detection pads electrically connected to the electrical detection unit;
the circuit board further comprises electrical detection probes which are arranged in one-to-one correspondence with the electrical detection bonding pads.
In an exemplary embodiment of the present disclosure, the display panel includes a first electrical detection bonding area and a second electrical detection bonding area, and the first electrical detection bonding area and the second electrical detection bonding area are respectively located at two sides of the pad bonding area; the electrical detection bonding pads comprise a first electrical detection bonding pad positioned in the first electrical detection binding region and a second electrical detection bonding pad positioned in the second electrical detection binding region;
the circuit board comprises a second probe region and a third probe region; the first probe region is located between the second probe region and the third probe region along the arrangement direction of the test probes;
the electrical detection probes comprise first electrical detection probes positioned in the second probe region and second electrical detection probes positioned in the third probe region; each of the first electrical property detection probes is arranged in one-to-one correspondence with each of the first electrical property detection pads, and each of the second electrical property detection probes is arranged in one-to-one correspondence with each of the second electrical property detection pads.
In an exemplary embodiment of the present disclosure, each of the test probes and each of the electrical detection probes are arranged along a same straight line.
In an exemplary embodiment of the present disclosure, the electrical property detection pad includes a first control pad and a first data pad; the electrical property detection unit comprises a plurality of first switches, the control end of any one first switch is electrically connected with the first control bonding pad, the first end of the first switch is electrically connected with the first data bonding pad, and the second end of the first switch is electrically connected with a row of green sub-pixels;
the electrical property detection probe comprises a first control probe and a first data probe, the first control probe is used for being correspondingly connected with the first control bonding pad, and the first data probe is used for being correspondingly connected with the first data bonding pad.
In an exemplary embodiment of the present disclosure, the electrical property detection pad further includes a second control pad, a third control pad, a second data pad, and a third data pad;
the electrical property detection unit comprises a plurality of second switches and third switches; the control end of any one second switch is electrically connected with the second control bonding pad, the first end of the second switch is electrically connected with the second data bonding pad, and the second end of the second switch is electrically connected with a column of red sub-pixels; a control end of any one of the third switches is electrically connected with the third control pad, a first end of the third switch is electrically connected with the third data pad, and a second end of the third switch is electrically connected with a column of blue sub-pixels;
the electrical property detection probe further comprises a second control probe correspondingly connected with the second control bonding pad, a third control probe correspondingly connected with the third control bonding pad, a second data probe correspondingly connected with the second data bonding pad and a third data probe correspondingly connected with the third data bonding pad.
According to a second aspect of the present disclosure, a testing apparatus for a display panel is provided, which includes the above circuit board for testing a display panel.
According to a third aspect of the present disclosure, there is provided a test method of a display panel, including:
connecting a display panel with the circuit board for testing the display panel, so that any one test probe is connected with the corresponding green light signal bonding pad;
measuring a resistance value between the first and second bond pads;
if the resistance value between the first binding pad and the second binding pad is not larger than a preset threshold value, judging that a short circuit fault exists between two adjacent green light signal bonding pads of the display panel;
and if the resistance value between the first binding pad and the second binding pad is larger than the preset threshold value, judging that no short circuit is caused between two adjacent green signal pads of the display panel.
According to a fourth aspect of the present disclosure, there is provided a test method of a display panel, including:
connecting the display panel with the circuit board for testing the display panel, so that any one test probe is connected with the corresponding green light signal bonding pad, and any one electrical detection probe is connected with the corresponding electrical detection bonding pad;
writing a first signal to the first control pad to turn off each of the first switches; writing a second signal to the second data pad and the third data pad to make the red sub-pixel and the green sub-pixel not emit light; loading a third signal to one of the first and second bond pads and a fourth signal to the other, wherein the third signal is capable of causing the green sub-pixel to emit light and the fourth signal causes the green sub-pixel to not emit light;
detecting whether a display area of the display panel has a dark line or not;
and if the dark line exists, judging that the short circuit failure exists between two adjacent green light signal pads of the display panel.
The circuit board, the testing device and the testing method for testing the display panel can detect the short circuit defect existing between two adjacent green light signal pads, and overcome the defect that the defect cannot be detected in the electrical property test and the spot light test in the prior art. So, when this disclosed circuit board of display panel test was applied to display panel's test, can reduce the hourglass of bad product and examine the rate, improve the yield of the product of module section, reduce the waste of processes such as module section. Moreover, when the short circuit failure between two adjacent green signal pads is detected, the conductive particles can be removed by a cleaning method to eliminate the failure, so that the defective panel is converted into a good product, and the yield of the display panel is improved. Particularly, by detecting the short circuit failure between two adjacent green signal pads, the defective products can be found and intercepted in time, and the improvement of the front-end process can be promoted to reduce the occurrence rate of the short circuit failure.
Drawings
The above and other features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings.
Fig. 1 is a schematic structural diagram of a display panel in the related art.
Fig. 2 is a schematic structural diagram of a display panel.
Fig. 3 is a schematic structural diagram of another display panel.
Fig. 4 is a schematic structural diagram of a circuit board for testing a display panel according to an embodiment of the present disclosure.
Fig. 5 is a schematic flowchart of a method for testing a display panel according to an embodiment of the present disclosure.
The reference numerals of the main elements in the figures are explained as follows:
100. a display panel; 101. a pad bonding area; 102. a first electrical detection binding region; 103. a second electrical detection binding region; 111. a green signal pad; 112. a red light signal pad; 113. a blue signal pad; 120. an electrical property detection unit; 121. a first switch; 130. an electrical detection pad; 131. a first electrical detection pad; 132. a second electrical detection pad; 141. a first control pad; 142. a first data pad; 150. conductive particles; 160. a data line; 200. a circuit board; 201. a first probe region; 202. a second probe region; 203. a third probe region; 204. testing the binding region; 210. testing the probe; 220. a first binding pad; 221. a first connecting lead; 222. a first wire; 230. a second binding pad; 231. a second connecting lead; 232. a second routing; 240. an electrical detection probe; 241. a first electrical property detection probe; 242. a second electrical property detection probe; 251. a first control probe; 252. a first data probe; A. a display area; B. a peripheral region.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure.
The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the disclosure can be practiced without one or more of the specific details, or with other methods, components, materials, and so forth. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the primary technical ideas of the disclosure.
The terms "a," "an," "the," and the like are used to denote the presence of one or more elements/components/parts; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc. The terms "first" and "second", etc. are used merely as labels, and are not limiting on the number of their objects.
In the related art, referring to fig. 1, a display panel 100 has a display area a and a peripheral area B surrounding the display area a, and has a pad bonding area 101 in the peripheral area B, and a green signal pad 111, a red signal pad 112, and a blue signal pad 113 may be disposed in the pad bonding area 101. Each red signal pad 112 is electrically connected to each row of red sub-pixels of the display panel 100 in a one-to-one correspondence manner; each blue signal pad 113 is electrically connected to each column of blue sub-pixels of the display panel 100 in a one-to-one correspondence; each green signal pad 111 is electrically connected to each column of green sub-pixels of the display panel 100 in a one-to-one correspondence. The green signal pads 111 are arranged along a line and are adjacent in sequence; the red signal pads 112 and the blue signal pads 113 are alternately arranged in sequence along another straight line.
Whether short circuit failure exists between two adjacent signal pads can be detected in a lighting test. If there is a short circuit between the red signal pad 112 and the blue signal pad 113, a dark line appears in a monochrome picture when a red picture lighting test or a blue picture lighting test is performed, so that a short circuit failure between the red signal pad 112 and the blue signal pad 113 can be detected during the lighting test. However, when a short failure occurs between two adjacent green signal pads 111, a dark line does not occur because the two adjacent green signal pads 111 are both loaded with the same driving signal to light the green sub-pixel during the lighting test. Therefore, in the lighting test stage, a short failure between adjacent green signal pads 111 cannot be detected, resulting in a defective panel entering a subsequent process to be wasted.
To solve the above problems, the present disclosure provides a circuit board 200 for display panel testing. Referring to fig. 2 (the electrical property detection unit is not shown), the display panel 100 has a pad bonding area 101, the pad bonding area 101 is provided with a plurality of green signal pads 111 arranged along a straight line and adjacent in sequence, and each green signal pad 111 is electrically connected to each column of green sub-pixels of the display panel 100 in a one-to-one correspondence manner. Referring to fig. 4, the circuit board 200 includes a first probe region 201 and a test bonding region 204, the first probe region 201 has a plurality of test probes 210 arranged adjacent to each other in a straight line, and each test probe 210 is disposed in one-to-one correspondence with each green signal pad 111 of the display panel 100; the test bonding area 204 is provided with a first bonding pad 220 and a second bonding pad 230; each odd test probe 210 is electrically connected to the first bonding pad 220, and each even test probe 210 is electrically connected to the second bonding pad 230.
According to the circuit board 200 for testing a display panel of the present disclosure, in the electrical inspection stage, the test probes 210 may be pressed against the green signal pads 111 one by one, and then the resistance between the first bonding pads 220 and the second bonding pads 230 may be inspected. If a short circuit does not occur between two adjacent green signal pads 111, the first and second bonding pads 220 and 230 are disconnected, and thus a large resistance value can be detected. If a short circuit occurs between two adjacent green signal pads 111, the first and second bonding pads 220 and 230 are shorted, and thus a small resistance value is detected. Therefore, by detecting the resistance value between the first and second bonding pads 220 and 230, it is possible to effectively determine whether a short circuit occurs between the adjacent two green signal pads 111.
In addition, according to the circuit board 200 for testing a display panel of the present disclosure, in the lighting test stage, the first binding pad 220 and the second binding pad 230 may be independently loaded with driving signals, so that the green sub-pixel rows of the display panel 100 are divided into two groups to be respectively turned on, and any two adjacent green sub-pixel rows are respectively located in the two groups. In this way, in the lighting test of any one group of green sub-pixel columns, if the existence of the dark line is found, the existence of the short circuit failure between the two adjacent green signal pads is indicated.
Thus, the circuit board 200 for testing a display panel of the present disclosure can be applied to different testing methods of the display panel 100 to detect a short circuit failure between two adjacent green signal pads 111, and overcomes the defect that the short circuit failure cannot be detected in an electrical test and a lighting test in the prior art. Thus, when the circuit board 200 for testing the display panel is applied to testing the display panel, the missing rate of defective products can be reduced, the yield of products in a module section is improved, and the waste of processes such as the module section is reduced; furthermore, when a short-circuit failure between two adjacent green signal pads 111 is detected, an attempt can be made to remove conductive particles by cleaning to eliminate the failure, convert the defective panel into a good product, and improve the yield of the display panel. Particularly, by detecting a short-circuit failure between two adjacent green signal pads 111, a defective product can be found and intercepted in time, and the improvement of the front-end process can be promoted to reduce the occurrence rate of the short-circuit failure.
In the present disclosure, a column of subpixels may be each connected to the same data line. For example, referring to fig. 3 (the red and blue signal pads 112 and 113 are not shown), a column of green subpixels may be each green subpixel connected to the same data line 160, and the data line 160 is connected to one green signal pad 111.
The structure, principle and application of the circuit board for display panel testing of the present disclosure will be further described and explained with reference to the accompanying drawings.
The present disclosure provides a circuit board 200 for testing a display panel, the circuit board 200 may be applied to a testing apparatus of a display panel so as to enable the testing apparatus of the display panel to input a signal to the display panel 100 to test the display panel 100. The circuit board 200 may be provided with probes corresponding to pads provided on the display panel 100. When the display panel 100 needs to be tested, the display panel 100 may be connected to a testing apparatus of the display panel, specifically, a probe on the circuit board 200 is pressed against a pad on the display panel 100; then, the test apparatus of the display panel loads a test signal to the display panel 100 or receives test data through the circuit board 200. After the test is completed, the probes of the circuit board 200 may be separated from the pads of the display panel 100.
In the present disclosure, the probe on the circuit board 200 may be in a needle shape, a convex dot shape, a convex bar shape, or other shapes, so as to be able to realize the press-contact with the pad. For example, referring to fig. 4, the probe on the circuit board 200 may have a long bar shape.
In one embodiment of the present disclosure, referring to fig. 4, the circuit board 200 further includes:
first connection leads 221 connected to the respective odd-numbered test probes 210;
a first trace 222, one end of which is connected to the first bonding pad 220 and the other end of which is connected to an odd test probe 210 or a first connection lead 221;
second connection leads 231 connected to the respective even-numbered test probes 210;
one end of the second trace 232 is connected to the second bonding pad 230, and the other end is connected to an even number of test probes 210 or a second connection lead 231.
Thus, in the circuit board 200 of the present disclosure, the odd test probes 210 are connected to the first bonding pads 220, and the even test probes 210 are connected to the second bonding pads 230. In other words, two adjacent test probes 210 are connected to different bonding pads.
In some embodiments, referring to fig. 2 and 3, the display panel 100 is further provided with an electrical property detection unit 120 and a plurality of electrical property detection pads 130 electrically connected to the electrical property detection unit 120. Referring to fig. 4, the circuit board 200 further includes electrical inspection probes 240 disposed in one-to-one correspondence with the respective electrical inspection pads 130. Thus, the circuit board 200 can be used not only for testing whether a short circuit failure exists between two adjacent green signal pads 111, but also for electrical testing of the display panel 100, thereby realizing multiplexing of the circuit board 200 and improving the utilization rate of the testing device of the display panel.
In some embodiments of the present disclosure, referring to fig. 2, the display panel 100 includes a first electrical detection bonding region 102 and a second electrical detection bonding region 103, where the first electrical detection bonding region 102 and the second electrical detection bonding region 103 are respectively located at two sides of the pad bonding region 101; the electrical inspection pads 130 include a first electrical inspection pad 131 located in the first electrical inspection bonding area 102 and a second electrical inspection pad 132 located in the second electrical inspection bonding area 103. Referring to fig. 4, the circuit board 200 includes a second probe region 202 and a third probe region 203; along the arrangement direction of the test probes 210, the first probe region 201 is located between the second probe region 202 and the third probe region 203; the electrical probing probes 240 include first electrical probing probes 241 located in the second probing region 202 and second electrical probing probes 242 located in the third probing region 203; each of the first electrical property inspection probes 241 is disposed corresponding to each of the first electrical property inspection pads 131, and each of the second electrical property inspection probes 242 is disposed corresponding to each of the second electrical property inspection pads 132.
Further, referring to fig. 4, each of the test probes 210 and each of the electrical detection probes 240 are arranged along the same straight line.
In one embodiment of the present disclosure, referring to fig. 3, the electrical property inspection pad 130 includes a first control pad 141 and a first data pad 142; the electrical property detecting unit 120 includes a plurality of first switches 121, a control terminal of any one of the first switches 121 is electrically connected to the first control pad 141, a first terminal thereof is electrically connected to the first data pad 142, and a second terminal thereof is electrically connected to the data line 160 of a row of green sub-pixels. Referring to fig. 4, the electrical inspection probe 240 includes a first control probe 251 and a first data probe 252, the first control probe 251 is used for being correspondingly connected to the first control pad 141, and the first data probe 252 is used for being correspondingly connected to the first data pad 142.
Thus, when testing the display panel 100, the first control probe 251 can be pressed against the first control pad 141, and the first data probe 252 can be pressed against the first data pad 142; meanwhile, it is also possible to have the respective test probes 210 connected to the respective green signal pads 111 in one-to-one correspondence. Then, a first signal can be applied to the first control pad 141 through the first control probe 251, and the first signal can turn off each first switch 121, so as to prevent the green sub-pixels of different columns from being electrically connected with each other through the first switch 121 elements which are turned on.
In one test mode, the resistance between the first bonding pad 220 and the second bonding pad 230 can be detected, and whether there is a short circuit failure between two adjacent green signal pads 111 can be determined according to the resistance. In one embodiment of the present disclosure, if the resistance value between the first and second bonding pads 220 and 230 is not greater than the preset threshold, it is determined that there is a short circuit failure between two adjacent green signal pads 111 of the display panel 100; if the resistance value between the first and second bonding pads 220 and 230 is greater than the preset threshold value, it is determined that there is no short circuit failure between two adjacent green signal pads 111 of the display panel 100. Further, the preset threshold may be 750 ohms to 1200 ohms.
In another test mode, the green sub-pixel column on the display panel 100 is divided into two parts, the first part is connected to the first bonding pad 220, and the second part is connected to the second bonding pad 230. As such, one of the first and second bonding pads 220 and 230 may be loaded with a third signal and the other with a fourth signal, wherein the third signal is capable of causing the green sub-pixel to emit light and the fourth signal causes the green sub-pixel not to emit light. Thus, two green sub-pixel columns can be lit up separately, and if a dark line is detected when any one of the green sub-pixel columns is lit up, it can be judged that the display panel 100 has a defect that two adjacent green signal pads 111 are short-circuited to each other.
Further, the electrical inspection pad 130 further includes a second control pad, a third control pad, a second data pad, and a third data pad. The electrical property detection unit 120 further includes a plurality of second switches and third switches. The control end of any one second switch is electrically connected with the second control bonding pad, the first end of the second switch is electrically connected with the second data bonding pad, and the second end of the second switch is electrically connected with the data line of one column of red sub-pixels. And a control end of any one third switch is electrically connected with the third control bonding pad, a first end of the third switch is electrically connected with the third data bonding pad, and a second end of the third switch is electrically connected with the data line of one column of blue sub-pixels. The electrical inspection probe 240 further includes a second control probe correspondingly connected to the second control pad, a third control probe correspondingly connected to the third control pad, a second data probe correspondingly connected to the second data pad, and a third data probe correspondingly connected to the third data pad.
In this way, when the display panel 100 is connected to the circuit board 200, any one of the test probes 210 may be connected to the corresponding green signal pad 111, and any one of the electrical inspection probes 240 may be connected to the corresponding electrical inspection pad 130. At the time of testing, a first signal may be written to the first control pad 141 to turn off each first switch 121; writing a second signal to the second data pad and the third data pad to make the red sub-pixel and the green sub-pixel not emit light; one of the first and second bonding pads 220 and 230 is loaded with a third signal and the other with a fourth signal, wherein the third signal enables the green sub-pixel to emit light and the fourth signal disables the green sub-pixel from emitting light. Then, whether a dark line exists in the display area a of the display panel 100 may be detected; if the dark line exists, it is judged that there is a short-circuit failure between two adjacent green signal pads 111 of the display panel 100.
In the present disclosure, the first switch 121, the second switch and the third switch of the electrical property detection unit 120 may be thin film transistors, and particularly, may be all P-type thin film transistors or all N-type thin film transistors. The voltages of the first to fourth signals may be determined according to the types of the thin film transistors of the electrical property detection unit 120, the types of the thin film transistors of the pixel driving circuit of the display panel 100, and the like.
Illustratively, the first switch 121, the second switch, and the third switch are all P-type thin film transistors. The first signal may be a high level signal of 7V to turn off the first switch 121. The second signal may be a high-level signal of 7V so that the red and blue sub-pixels of the display panel 100 do not emit light. One of the third signal and the fourth signal may be at a high level of 7V, and the other may be at a low level of 1-3V. Wherein a high level causes the green sub-pixel to emit no light and a low level causes the green sub-pixel to emit light.
Optionally, the substrate of the circuit board 200 is a flexible substrate. As such, the circuit board 200 provided by the present disclosure may be a flexible circuit board 200.
The embodiment of the present disclosure further provides a testing apparatus for a display panel, which includes any one of the circuit boards 200 for testing a display panel described in the above embodiments of the circuit board for testing a display panel. Since the testing apparatus for a display panel has any one of the circuit boards 200 for testing a display panel described in the above embodiments of the circuit board for testing a display panel, the same advantages are obtained, and the details of the disclosure are not repeated herein.
The present disclosure also provides a method for testing a display panel 100, as shown in fig. 5, including:
step S110, connecting the display panel 100 to any one of the circuit boards 200 for display panel testing described in the above embodiments of the circuit board 200 for display panel 100 testing, so that any one of the test probes 210 is connected to the corresponding green signal pad 111;
step S120, measuring a resistance value between the first bonding pad 220 and the second bonding pad 230;
step S130, if the resistance between the first bonding pad 220 and the second bonding pad 230 is not greater than the preset threshold, determining that a short circuit failure exists between two adjacent green signal pads 111 of the display panel 100;
in step S140, if the resistance between the first and second bonding pads 220 and 230 is greater than the predetermined threshold, it is determined that there is no short circuit between two adjacent green signal pads 111 of the display panel 100.
The present disclosure further provides another testing method for a display panel 100, wherein the display panel 100 has a pad bonding area 101, the pad bonding area 101 is provided with a plurality of green signal pads 111 arranged along a straight line and adjacent in sequence, and each green signal pad 111 is electrically connected to each column of green sub-pixels of the display panel 100 in a one-to-one correspondence manner. The display panel 100 is further provided with an electrical property detection unit 120 and a plurality of electrical property detection pads 130 electrically connected to the electrical property detection unit 120. The electrical inspection pad 130 includes a first control pad 141 and a first data pad 142; the electrical property detecting unit 120 includes a plurality of first switches 121, a control terminal of any one of the first switches 121 is electrically connected to the first control pad 141, a first terminal is electrically connected to the first data pad 142, and a second terminal is electrically connected to a row of green sub-pixels. The electrical inspection pad 130 further includes a second control pad, a third control pad, a second data pad, and a third data pad. The electrical property detection unit 120 includes a plurality of second switches and third switches; the control end of any one second switch is electrically connected with the second control bonding pad, the first end of the second switch is electrically connected with the second data bonding pad, and the second end of the second switch is electrically connected with a column of red sub-pixels; and a control end of any one third switch is electrically connected with the third control bonding pad, a first end of the third switch is electrically connected with the third data bonding pad, and a second end of the third switch is electrically connected with one column of blue sub-pixels.
The test method of the display panel 100 includes:
step S210, the display panel 100 is connected to the circuit board 200 for display panel testing. The circuit board 200 includes a first probe area 201 and a test binding area 204, the first probe area 201 has a plurality of test probes 210 arranged adjacently in sequence along a straight line, and each test probe 210 is arranged in one-to-one correspondence with each green signal pad 111 of the display panel 100; the test harness 204 is provided with a first strap pad 220 and a second strap pad 230. Each odd test probe 210 is electrically connected to the first bonding pad 220, and each even test probe 210 is electrically connected to the second bonding pad 230. The circuit board 200 further includes electrical inspection probes 240 disposed in one-to-one correspondence with the respective electrical inspection pads 130. The electrical inspection probe 240 includes a first control probe 251 and a first data probe 252, wherein the first control probe 251 is used for being correspondingly connected to the first control pad 141, and the first data probe 252 is used for being correspondingly connected to the first data pad 142. The electrical inspection probe 240 further includes a second control probe correspondingly connected to the second control pad, a third control probe correspondingly connected to the third control pad, a second data probe correspondingly connected to the second data pad, and a third data probe correspondingly connected to the third data pad.
When the display panel 100 is connected to the circuit board 200 for display panel testing, any one of the test probes 210 is connected to the corresponding green signal pad 111, and any one of the electrical property inspection probes 240 is connected to the corresponding electrical property inspection pad 130.
Step S220 of writing a first signal to the first control pad 141 to turn off each of the first switches 121; writing a second signal to the second data pad and the third data pad to make the red sub-pixel and the green sub-pixel not emit light; loading one of the first and second bonding pads 220 and 230 with a third signal and the other with a fourth signal, wherein the third signal enables the green sub-pixel to emit light and the fourth signal disables the green sub-pixel from emitting light;
step S230, detecting whether a dark line exists in the display area a of the display panel 100;
in step S240, if there is a dark line, it is determined that there is a short circuit failure between two adjacent green signal pads 111 of the display panel 100.
It should be noted that although the various steps of the methods of the present disclosure are depicted in the drawings in a particular order, this does not require or imply that these steps must be performed in this particular order, or that all of the depicted steps must be performed, to achieve desirable results. Additionally or alternatively, certain steps may be omitted, multiple steps combined into one step execution, and/or one step broken down into multiple step executions, etc., are all considered part of this disclosure.
It is to be understood that the disclosure is not limited in its application to the details of construction and the arrangements of the components set forth in the specification. The present disclosure is capable of other embodiments and of being practiced and carried out in various ways. The foregoing variations and modifications are within the scope of the present disclosure. It should be understood that the disclosure disclosed and defined in this specification extends to all alternative combinations of two or more of the individual features mentioned or evident from the text and/or drawings. All of these different combinations constitute various alternative aspects of the present disclosure. The embodiments of this specification illustrate the best mode known for carrying out the disclosure and will enable those skilled in the art to utilize the disclosure.
Claims (10)
1. The circuit board for testing the display panel is characterized in that the display panel is provided with a pad binding area, the pad binding area is provided with a plurality of green light signal pads which are arranged along a straight line and are adjacent in sequence, and each green light signal pad is electrically connected with each row of green sub-pixels of the display panel in a one-to-one correspondence manner;
the circuit board comprises a first probe area and a test binding area, the first probe area is provided with a plurality of test probes which are sequentially and adjacently arranged along a straight line, and each test probe is in one-to-one correspondence with each green light signal bonding pad of the display panel; the test binding area is provided with a first binding pad and a second binding pad;
and each odd-numbered test probe is electrically connected with the first binding pad, and each even-numbered test probe is electrically connected with the second binding pad.
2. The circuit board for display panel testing of claim 1, further comprising:
first connection leads connected to the odd-numbered test probes;
one end of the first routing is connected with the first binding pad, and the other end of the first routing is connected with an odd number of test probes or the first connecting lead;
second connection leads connected to the even-numbered test probes;
and one end of the second routing wire is connected with the second binding pad, and the other end of the second routing wire is connected with an even number of the test probes or the second connecting lead.
3. The circuit board for testing a display panel according to claim 1, wherein the display panel is further provided with an electrical detection unit and a plurality of electrical detection pads electrically connected to the electrical detection unit;
the circuit board further comprises electrical detection probes which are arranged in one-to-one correspondence with the electrical detection bonding pads.
4. The circuit board for testing a display panel according to claim 3, wherein the display panel comprises a first electrical detection bonding area and a second electrical detection bonding area, the first electrical detection bonding area and the second electrical detection bonding area are respectively located at two sides of the pad bonding area; the electrical detection bonding pads comprise a first electrical detection bonding pad positioned in the first electrical detection binding region and a second electrical detection bonding pad positioned in the second electrical detection binding region;
the circuit board comprises a second probe region and a third probe region; the first probe region is located between the second probe region and the third probe region along the arrangement direction of the test probes;
the electrical detection probes comprise first electrical detection probes positioned in the second probe region and second electrical detection probes positioned in the third probe region; each of the first electrical property detection probes is arranged in one-to-one correspondence with each of the first electrical property detection pads, and each of the second electrical property detection probes is arranged in one-to-one correspondence with each of the second electrical property detection pads.
5. The circuit board for testing a display panel according to claim 3, wherein each of the test probes and each of the electrical detection probes are arranged along a same straight line.
6. The circuit board for display panel testing according to claim 3, wherein the electrical detection pad includes a first control pad and a first data pad; the electrical property detection unit comprises a plurality of first switches, the control end of any one first switch is electrically connected with the first control bonding pad, the first end of the first switch is electrically connected with the first data bonding pad, and the second end of the first switch is electrically connected with a row of green sub-pixels;
the electrical property detection probe comprises a first control probe and a first data probe, the first control probe is used for being correspondingly connected with the first control bonding pad, and the first data probe is used for being correspondingly connected with the first data bonding pad.
7. The circuit board for display panel testing according to claim 6, wherein the electrical detection pad further comprises a second control pad, a third control pad, a second data pad, and a third data pad;
the electrical property detection unit comprises a plurality of second switches and third switches; the control end of any one second switch is electrically connected with the second control bonding pad, the first end of the second switch is electrically connected with the second data bonding pad, and the second end of the second switch is electrically connected with a column of red sub-pixels; a control end of any one of the third switches is electrically connected with the third control pad, a first end of the third switch is electrically connected with the third data pad, and a second end of the third switch is electrically connected with a column of blue sub-pixels;
the electrical property detection probe further comprises a second control probe correspondingly connected with the second control bonding pad, a third control probe correspondingly connected with the third control bonding pad, a second data probe correspondingly connected with the second data bonding pad and a third data probe correspondingly connected with the third data bonding pad.
8. A testing device for a display panel, characterized by comprising the circuit board for testing a display panel according to any one of claims 1 to 7.
9. A method for testing a display panel, comprising:
connecting the display panel with the circuit board for display panel testing according to any one of claims 1 to 7, so that any one of the test probes is connected with the corresponding green signal pad;
measuring a resistance value between the first and second bond pads;
if the resistance value between the first binding pad and the second binding pad is not larger than a preset threshold value, judging that a short circuit fault exists between two adjacent green light signal bonding pads of the display panel;
and if the resistance value between the first binding pad and the second binding pad is larger than the preset threshold value, judging that no short circuit is caused between two adjacent green signal pads of the display panel.
10. A method for testing a display panel, comprising:
connecting the display panel with the circuit board for display panel testing of claim 7, such that any one of the test probes is connected with the corresponding green signal pad, and any one of the electrical detection probes is connected with the corresponding electrical detection pad;
writing a first signal to the first control pad to turn off each of the first switches; writing a second signal to the second data pad and the third data pad to make the red sub-pixel and the green sub-pixel not emit light; loading a third signal to one of the first and second bond pads and a fourth signal to the other, wherein the third signal is capable of causing the green sub-pixel to emit light and the fourth signal causes the green sub-pixel to not emit light;
detecting whether a display area of the display panel has a dark line or not;
and if the dark line exists, judging that the short circuit failure exists between two adjacent green light signal pads of the display panel.
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| CN202011187294.5A CN112305454A (en) | 2020-10-30 | 2020-10-30 | Circuit board for testing display panel, testing device and testing method for display panel |
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| CN202011187294.5A CN112305454A (en) | 2020-10-30 | 2020-10-30 | Circuit board for testing display panel, testing device and testing method for display panel |
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