CN113038729A - Method for repairing circuit of printed circuit board - Google Patents
Method for repairing circuit of printed circuit board Download PDFInfo
- Publication number
- CN113038729A CN113038729A CN201911249111.5A CN201911249111A CN113038729A CN 113038729 A CN113038729 A CN 113038729A CN 201911249111 A CN201911249111 A CN 201911249111A CN 113038729 A CN113038729 A CN 113038729A
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- China
- Prior art keywords
- defect
- circuit board
- conductive material
- circuit
- peelable layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
Abstract
The invention provides a line repairing method of a printed circuit board, which comprises the following steps: detecting the line defect, and acquiring the position information and the shape information of the line defect; coating a peelable layer on the surface of the circuit board and curing the peelable layer; removing the peelable layer covering the surface of the circuit defect by laser according to the position information and the shape information of the circuit defect; coating a conductive material at the line defect and curing; the peelable layer is torn off. The circuit repairing method of the printed circuit board provided by the invention can peel off the conductive material around the circuit defect along with the peelable layer when the peelable layer is torn off, and the peelable layer at the position where the circuit defect is eliminated by laser has higher precision, so that the circuit defect repairing precision is higher, the circuit precision requirement can be met, and the circuit repairing method is suitable for circuits with various shapes and sizes.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit repairing method of a printed circuit board.
Background
A printed circuit board is a circuit substrate having printed wiring for mounting and connecting circuit components. In the manufacturing process of the printed circuit board, due to the fact that the resolution of the conducting circuit is high, the process difficulty is high, various manufacturing defects can occur in the conducting circuit manufacturing process, and the defects of the conducting circuit are mostly circuit breakage, pits, air holes, short circuits and the like. Therefore, the production yield of the printed circuit board is low, and the production cost is indirectly increased. The existing line repairing method adopts a wire-bridge line open-circuit scheme which is simpler, and the method cannot repair bent lines and lines with high precision of less than 100 mu m.
Disclosure of Invention
The invention aims to provide a method for repairing a circuit of a printed circuit board, which aims to solve the technical problems in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that: provided is a method for repairing a circuit of a printed circuit board, including:
detecting the line defect, and acquiring the position information and the shape information of the line defect;
coating a peelable layer on the surface of the circuit board and curing the peelable layer;
removing the peelable layer covering the surface of the circuit defect by laser according to the position information and the shape information of the circuit defect;
coating a conductive material at the line defect and curing;
the peelable layer is torn off.
In one embodiment, the strippable layer is scraped off after the step of coating the surface of the circuit board with the strippable layer.
In one embodiment, in the step of coating the peelable layer on the surface of the circuit board: the strippable layer covers all the line defects as a whole.
In one embodiment, in the step of coating the conductive material at the line defect: the conductive material is separately coated in each line defect and the peripheral area corresponding to the line defect; or the conductive material is integrally coated on the surface of the peelable layer and in the circuit defect, and the covering area of the conductive material is in the covering area of the peelable glue.
In one embodiment, in the step of coating the peelable layer on the surface of the circuit board: the strippable layer covers the circuit defect and the peripheral region thereof.
In one embodiment, the step of curing the conductive material comprises: curing the conductive material at the line defect, or curing all of the conductive material.
In one embodiment, the peelable glue is transparent or translucent.
In one embodiment, the step of applying the conductive material at the line defect is followed by leveling the conductive material.
In one embodiment, the conductive material is a conductive paste, a conductive ink, or conductive particles.
In one embodiment, the peelable layer is a peelable blue glue, a wafer thinned temporary bond glue, or a thermoplastic acrylic glue.
The circuit repairing method of the printed circuit board provided by the invention has the beneficial effects that: compared with the prior art, the method for repairing the circuit of the printed circuit board has the advantages that after the circuit defect is detected, the strippable layer is coated on the surface of the circuit board, other areas of the circuit defect are covered, then the strippable layer corresponding to the circuit defect is eliminated by adopting laser, the laser elimination precision is high, the circuit defect can be accurately exposed, and then the conductive material is coated on the circuit defect and solidified, so that the conductive material on the periphery of the circuit defect can be stripped along with the strippable layer when the strippable layer is torn off, and the precision of the strippable layer at the circuit defect eliminated by the laser is high, so that the precision of repairing the circuit defect is high, the precision requirement of the circuit can be met, and the method is suitable for repairing circuits with various shapes and sizes.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for repairing a circuit of a printed circuit board according to an embodiment of the present invention;
FIG. 2(a) is a schematic diagram of a circuit board to be repaired according to an embodiment of the invention;
FIG. 2(b) is a schematic view of an embodiment of the present invention after the peelable adhesive is coated;
FIG. 2(c) is a schematic view of an embodiment of the present invention after removing a portion of the peelable glue;
FIG. 2(d) is a schematic view of an embodiment of the present invention after being coated with a conductive material;
FIG. 2(e) is a schematic diagram of the embodiment of the present invention after the peelable glue is peeled off.
Wherein, in the figures, the respective reference numerals:
1-a substrate; 2-a line; 20-defect; 3-peelable layer; 4-conductive material.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1, a method for repairing a circuit of a printed circuit board according to an embodiment of the present invention will now be described.
In one embodiment, the method for repairing the circuit of the printed circuit board comprises the following steps:
s10: detecting the line defect 20, and acquiring the position information and the shape information of the line defect 20;
s20: coating a peelable layer 3 on a surface of a circuit board and curing the peelable layer 3;
s30: removing the strippable layer 3 covering the surface of the line defect 20 by laser according to the position information and the shape information of the line defect 20;
s40: coating and curing a conductive material 4 at the line defect 20;
s50: the peelable layer 3 is peeled off.
The substrate 1 of the printed circuit board may be a resin substrate, a glass substrate, a ceramic substrate, etc., and the material of the substrate 1 is not limited herein. Referring to fig. 2(a), the circuit 2 on the substrate 1 may generate a defect 20 during manufacturing, and the defect 20 may be a pit, a breakage, a void, an open circuit, or other depression lacking conductive material. Along with the continuous improvement of the precision of the circuit 2, the yield of the circuit 2 is lower and lower, and the printed circuit board can be reprocessed by adopting a circuit repairing method, so that the processing yield is improved.
In the circuit repairing method of the printed circuit board in the embodiment, after the circuit defect 20 is detected, the peelable layer 3 is coated on the surface of the circuit board, other regions of the circuit defect 20 are covered, then the peelable layer 3 corresponding to the circuit defect 20 is eliminated by laser, the laser elimination precision is high, the circuit defect 20 can be accurately exposed, and then the conductive material 4 is coated on the circuit defect 20 and cured, so that when the peelable layer 3 is torn off, the conductive material 4 around the circuit defect 20 can be peeled off along with the peelable layer 3, and the circuit defect 20 is repaired with high precision due to the high precision of the peelable layer 3 at the position where the circuit defect 20 is eliminated by laser, so that the precision requirement of the circuit 2 can be met, and the method is suitable for circuits of various shapes and sizes.
In step S10, a defect 20 on the circuit may be detected by using a full Automatic Optical Inspection (AOI) principle, where AOI is based on an Optical principle to detect a common defect 20, and during automatic detection, a camera automatically scans a PCB, collects an image, compares the image with design parameters, and after image processing, detects the circuit defect 20 on the PCB, and the defect 20 is represented or identified by a detection device. More specifically, after a circuit image of the printed circuit board is acquired, marking points on the circuit image are found and matched with the marking points in the design image one by one, so that the position of the defect 20 relative to the marking points and the specific shape of the defect 20 are obtained, and each coordinate point of the edge of the defect 20 is calculated according to the information. Of course, other line detection methods, such as probe detection, etc., may also be used.
When the line defect 20 is detected, the height of the line defect 20 does not need to be detected, and only the shape and the position of the line defect 20 need to be detected, so that the detection workload and the detection difficulty can be reduced.
In step S20, referring to fig. 2(b), in the step of coating the peelable layer 3 on the surface of the circuit board, the peelable layer 3 entirely covers all the circuit defects 20, and the peelable layer 3 is a continuous whole covering all the circuit defects 20. The line 2 of, for example, a printed circuit board has two defects, and a single peelable layer 3 covers both defects 20.
In another embodiment, in the step of coating the strippable layer on the surface of the circuit board, the strippable layer covers the circuit defect and the peripheral region thereof. Specifically, when the line defect is two or more, the peelable layers are discretely distributed at the respective line defects, and each peelable layer individually covers one line defect.
In other embodiments, the strippable layer 3 may be covered in other shapes as long as it covers the wiring defect 20 and the area around the defect 20.
Optionally, the strippable layer 3 is transparent or semitransparent, so that the condition of the circuit 2 can be observed conveniently after the strippable layer 3 covers the circuit 2, and the condition that whether the circuit defect 20 is completely exposed or not can be observed conveniently after the strippable layer 3 corresponding to the circuit defect 20 is removed.
Wherein, the strippable layer 3 is made of strippable blue gel, temporary bonding glue for thinning the wafer, thermoplastic acrylic resin glue and the like. The peelable glue is in a flowable state when applied. The material of the peelable layer 3 is not limited herein, and the material has workability, does not flow after treatment after coating, can be burned off by laser, can be peeled by heating or other treatment, and does not damage the wiring.
In step S20, after the step of coating the peelable layer 3 on the surface of the circuit board, the peelable layer 3 is scraped off, and the thickness of the defect 20 after the scraping off is made to coincide with the thickness of the wiring 2 there, i.e., the wiring 2 is restored to the design value in thickness. The strippable layer 3 can be scraped off by adopting tools such as a soft scraper, so that the circuit 2 is prevented from being scratched by the tools, and the circuit 2 is prevented from being damaged.
In step S20, the peelable layer 3 is cured by thermal curing or photo-curing, so that the peelable layer 3 is bonded to the surface of the circuit 2 in a solid state. Such as baking the printed circuit board using an oven or irradiating the peelable layer 3 with ultraviolet light.
In step S30, referring to fig. 2(c), according to the position information and the shape information of the line defect 20 and by removing the strippable layer 3 covering the surface of the line defect 20 by using a laser, the remaining strippable layer 3 can prevent the conductive material 4 from being directly coated on the surface of the line defect 2, so that the conductive paste 4 which is not needed is directly torn off through the strippable layer, and only the conductive material 4 filled in the line defect 20 remains. The strippable layer 3 on the line defect 20 is removed by adopting a laser engraving method, so that the removal precision of the strippable layer 3 can be improved, and the profile of the strippable layer 3 removed by laser is matched with the profile of the line defect 20. When laser engraving is carried out, the substrate 1 of the printed circuit board can be slightly damaged, so that the strippable glue can be completely removed.
In step S40, when the conductive material 4 is coated on the line defects 20, in one embodiment, referring to fig. 2(d), the peelable layer 3 covers all the line defects 20 entirely, and the peelable layer 3 is a continuous whole covering all the line defects 20. The conductive material 4 is entirely coated on the surface of the peelable layer 3 and in the circuit defect 20, the coverage area of the conductive material 4 is within the coverage area of the peelable glue 3, and the conductive material 4 does not exceed the coverage area of the peelable layer 3.
In another embodiment, a strippable layer covers the line defect and its peripheral region. Specifically, when the line defect is two or more, the peelable layers are discretely distributed at the respective line defects, and each peelable layer individually covers one line defect. The conductive material is also discretely coated in each line defect and in the peripheral area corresponding to the line defect as long as the conductive material does not exceed the area covered by the strippable layer.
Of course, the coating shape of the conductive material may be other shapes as long as the conductive material is filled in the defect and does not exceed the area covered by the peelable layer. When the conductive material is coated, the coating precision of the conductive material is not required to be controlled, the difficulty of line repair is reduced under the condition of ensuring certain precision, and the redundant conductive material is torn off through the strippable layer.
In step S40, after the step of coating the conductive material 4 at the line defect 20, the conductive material 4 is scraped off to make the conductive material 4 better fill the defect and to make the filling thickness close to the defect depth. The conductive material 4 may be scraped off using a soft scraper or the like.
In step S40, when the conductive material 4 is cured, the conductive material 4 at the line defect 20 is cured, and all the conductive materials 4 may also be cured. In curing only the conductive material 4 at the line defect 20, a laser may be used to laser heat the conductive material 4 at the line defect 20, causing the conductive material 4 within the defect 20 to melt, sinter, and cure. Curing only the conductive material 4 within the line defect 20 facilitates subsequent tearing of the peelable layer 3. Preferably, the printed circuit board is not moved past when the laser is used to heat cure the conductive material 4, otherwise it cannot be repositioned. The laser in this step may be optionally the same as the laser engraved in step S30, but at a different power.
When all the conductive materials 4 are cured, the printed circuit board can be placed into a baking oven or a mesh belt oven to be baked, heated and cured.
The conductive material 4 may be conductive paste, conductive ink, or conductive particles. The conductive paste, including but not limited to silver paste, copper paste, aluminum paste, nickel paste, carbon paste, etc., has conductive capability and can be effectively attached to the substrate after being cured. The conductive ink can be nano-silver ink, nano-copper ink and other nano-inks with conductive capability, and can be effectively attached to the substrate after being cured; or low-temperature alloy ink, including but not limited to tin alloy, bismuth alloy, indium alloy and other alloy ink with conductivity, the melting point is below 300 ℃, and the alloy ink can be alloyed with the substrate line material and effectively attached after being heated.
In step S50, referring to fig. 2(e), the method for removing the peelable layer 3 is not limited herein, and after the peelable layer 3 is removed, the conductive material 4 on the surface of the peelable layer 3 is also removed, and only the conductive material 4 filled in the defect 20 remains.
Optionally, after step S50, the conductive material 4 with the defect edge forming burr may be laser removed to make the edge of the torn defect 20 smoother. When the peelable layer 3 is peeled off, the edge of the defect 20 may be jagged or burred if the peeling method is not proper. Laser ablation can avoid this.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The method for repairing the circuit of the printed circuit board is characterized by comprising the following steps:
detecting the line defect, and acquiring the position information and the shape information of the line defect;
coating a peelable layer on the surface of the circuit board and curing the peelable layer;
removing the peelable layer covering the surface of the circuit defect by laser according to the position information and the shape information of the circuit defect;
coating a conductive material at the line defect and curing;
the peelable layer is torn off.
2. The method for repairing wiring of a printed circuit board as claimed in claim 1, wherein the peelable layer is scraped off after the step of coating the peelable layer on the surface of the circuit board.
3. The method for repairing a circuit of a printed circuit board according to claim 1, wherein in the step of coating the peelable layer on the surface of the circuit board: the strippable layer covers all the line defects as a whole.
4. The method for repairing a wiring of a printed circuit board according to claim 3, wherein in the step of applying a conductive material at the wiring defect: the conductive material is separately coated in each line defect and the peripheral area corresponding to the line defect; or the conductive material is integrally coated on the surface of the peelable layer and in the circuit defect, and the covering area of the conductive material is in the covering area of the peelable glue.
5. The method for repairing a circuit of a printed circuit board according to claim 1, wherein in the step of coating the peelable layer on the surface of the circuit board: the strippable layer covers the circuit defect and the peripheral region thereof.
6. The method of repairing a circuit of a printed circuit board according to claim 1, wherein: the step of curing the conductive material comprises: curing the conductive material at the line defect, or curing all of the conductive material.
7. The method of repairing a circuit of a printed circuit board according to claim 1, wherein: the peelable glue is transparent or semitransparent.
8. The method of repairing a circuit of a printed circuit board according to claim 1, wherein: and scraping the conductive material after the step of coating the conductive material at the line defect.
9. A method for repairing a wiring of a printed circuit board according to any one of claims 1 to 8, wherein: the conductive material is conductive paste, conductive ink or conductive particles.
10. A method for repairing a wiring of a printed circuit board according to any one of claims 1 to 8, wherein: the peelable layer is peelable blue glue, temporary bonding glue for thinning the wafer or thermoplastic acrylic resin glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249111.5A CN113038729A (en) | 2019-12-09 | 2019-12-09 | Method for repairing circuit of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911249111.5A CN113038729A (en) | 2019-12-09 | 2019-12-09 | Method for repairing circuit of printed circuit board |
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| Publication Number | Publication Date |
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| CN113038729A true CN113038729A (en) | 2021-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201911249111.5A Pending CN113038729A (en) | 2019-12-09 | 2019-12-09 | Method for repairing circuit of printed circuit board |
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| CN (1) | CN113038729A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784534A (en) * | 2021-08-13 | 2021-12-10 | 苏州科韵激光科技有限公司 | Open circuit repairing method and open circuit repairing device |
| CN114190004A (en) * | 2021-11-17 | 2022-03-15 | 深圳市百柔新材料技术有限公司 | PCB (printed circuit board) repairing method |
| CN115863499A (en) * | 2023-02-28 | 2023-03-28 | 成都鸿睿光电科技有限公司 | Pad repair control method, system, terminal and medium based on 3D scanning |
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| CN108848620A (en) * | 2018-06-13 | 2018-11-20 | 深圳市百柔新材料技术有限公司 | The circuit mending method of printed wiring board |
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| US20020016018A1 (en) * | 2000-07-07 | 2002-02-07 | Seiji Oka | Method of manufacturing multi-layer printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113784534A (en) * | 2021-08-13 | 2021-12-10 | 苏州科韵激光科技有限公司 | Open circuit repairing method and open circuit repairing device |
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| CN115863499A (en) * | 2023-02-28 | 2023-03-28 | 成都鸿睿光电科技有限公司 | Pad repair control method, system, terminal and medium based on 3D scanning |
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