CN105376954A - Method for preventing hard gold surface of battery PCB from being scratched - Google Patents
Method for preventing hard gold surface of battery PCB from being scratched Download PDFInfo
- Publication number
- CN105376954A CN105376954A CN201510772780.6A CN201510772780A CN105376954A CN 105376954 A CN105376954 A CN 105376954A CN 201510772780 A CN201510772780 A CN 201510772780A CN 105376954 A CN105376954 A CN 105376954A
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- Prior art keywords
- battery pcb
- hard
- pcb
- prevents
- battery
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cell Electrode Carriers And Collectors (AREA)
Abstract
The invention discloses a method for preventing a hard gold surface of a battery PCB from being scratched. The method comprises the following steps: hard gold electroplating, etching; AOI, resistance welding, characters forming, testing, blue-gel printing, molding and final inspection. Blue-gel printing treatment is carried out on the battery PCB after the testing step and before the molding step; a panel of the battery PCB is protected through peelable blue-gel; and the panel of the battery PCB is not damaged even if die stamping is carried out through a high tonnage punch in the molding process. The blue-gel can be manually peeled before the molding and final inspection steps; and the quality of the battery PCB is not affected. Compared with the prior art, according to the battery PCB fabricated by the technology disclosed by the invention, the scratching reject ratio is reduced to existing 0.53% from original 8.7%, so that the quality of a product is greatly improved and the production cost of the product is reduced.
Description
technical field:
The invention belongs to printed wiring board manufacturing technology field, what be specifically related to is the method that the hard golden face of a kind of battery PCB prevents from wiping flower.
background technology:
The appearance requirement of battery PCB is very strict, has not allowed a bit to wipe flower, otherwise will affect activation signal, cause the product using battery abnormal, and wipe flower problem in order to avoid the outward appearance of battery PCB, usually need to adopt the hard gold process of electricity to protect battery PCB, with improving product performance.
Current battery PCB needs the flow process through " etching → AOI → welding resistance → character → test → shaping " six operations to make and transhipment after the hard gold of electricity; and battery PCB does not flow at different lines in transport process; in order to the problem preventing the hard golden face of battery PCB from wiping flower, usually can between battery PCB, blank sheet of paper film or expanded polyethylene foam etc. be adopted to carry out dividing plate.
But in the process that actual battery PCB is shaping, the molding mode usually adopted due to battery PCB is stamping, and stamping adopts is high tonnage punch press (80T-160T), if blank sheet of paper film is every onboard time, and the easy stressed plate face that weighs wounded in blanking process; Although expanded polyethylene foam is more soft can dividing plate, in stamping process, punch press is worked continuously and can be produced high heat, expanded polyethylene foam can be made to melt adhesion sheet face, cause PCB to pollute, therefore cannot at plate interval blank sheet of paper, expanded polyethylene foam and film.
It can thus be appreciated that, in the process that battery PCB is shaping, blank sheet of paper film or expanded polyethylene foam etc. cannot be adopted to carry out the mode of dividing plate to the problem of preventing cell panel face to wipe flower; And in flow process use procedure before battery PCB is shaping, adopt the dividing plate such as blank sheet of paper film or expanded polyethylene foam instrument also because of problems such as material purity, cleanliness factors, the wiping flower problem in the hard golden face of battery PCB can be caused.
summary of the invention:
For this reason, the object of the present invention is to provide a kind of battery PCB after the hard gold of electricity, carry out flow process and make with transport process, prevent the hard golden face of battery PCB from wiping the method for flower.
For achieving the above object, the present invention mainly adopts following technical scheme:
The hard golden face of battery PCB prevents a method of wiping flower, comprises step:
The hard gold of electricity; Etching; AOI; Welding resistance; Character; Test; Shaping; Inspection eventually.
Further, after a test also need to print blue glue process to battery PCB before, shaping.
Further, also comprise after whole inspection and tear blue glue process.
Further, the plating last layer in the pad face of battery PCB by the thick golden liquid medicine of electrolysis after the hard gold of described electricity is firmly golden.
Further, the hard gold of described electricity comprises pickling, electronickelling, in advance gold-plated, electrogilding cobalt alloy.
Further, the lead-in wire that described etching comprises battery PCB produces after the hard gold of electricity etches away.
Further, the process of described print blue glue comprises: adopt 18T silk-screen grenadine to shine net according to thick carat (measure of the purity of gold) figure and be made into half tone, and recycling silk-screen hardness is the scraper of 60HV and the blue glue of pressure silk-screen of 5-8KG/ square centimeter.
Further, the peelable blue glue of described blue glue to be model be SD-2952.
The present invention after a test, shaping before blue glue process is printed to battery PCB, the plate face of battery PCB is protected, even if carry out by high tonnage punch press the plate face that stamping also can not injure battery PCB in forming process by peelable blue glue.And the blue glue of the present invention after shaping and whole inspection can by peel manually from, it can not affect the quality of battery PCB.Compared with prior art, adopt the battery PCB that present invention process makes, it is wiped flower fraction defective and drops to existing 0.53% by original 8.7%, thus the quality substantially increasing product reduces the production cost of product.
embodiment:
For setting forth thought of the present invention and object, below in conjunction with specific embodiment, the present invention is described further.
After the hard gold of electricity, in process operations process, occur that in order to prevent battery PCB plate face is wiped flower and produced the problem of polishing scratch; the present invention by after battery PCB tests, shaping before on pcb board face, increase the blue compound protective layer of one deck, layer shell effective problem such as the wiping flower in the hard golden face of prevention and friction in the forming process of battery PCB protected by this blue glue.
To achieve these goals, present embodiments provide the method that the hard golden face of a kind of battery PCB prevents from wiping flower, it specifically comprises the steps:
The hard gold of electricity: electroplate the hard gold (containing cobalt) of last layer, to guarantee follow-up use plug rub by the mode of the thick golden liquid medicine of electrolysis on PCB pad face.The hard metal of electricity is in a kind of mode of electrogilding, it is for electroplating mild alloy, the composition that the difference of hard gold and soft gold this layer of being finally to plate is golden, plating proof gold or alloy can be selected time gold-plated, because pure gold hardness is softer, so be also just referred to as soft gold, if select electronickelling alloy or gold cobalt alloy, because alloy ratio proof gold is hard, so be also just referred to as hard gold.And be alloy because the plating adopted in the present embodiment is firmly golden, so hardness is harder, be suitable for use in the place needing stressed friction, be applicable to the use of battery PCB.And the mode of the hard gold of plating is mainly as follows: pickling → electronickelling → gold-plated → electrogilding nickel or gold cobalt alloy in advance.
Etching: because the hard gold of electricity thickeies gold for local, need the conducting that goes between in electrolytic process, and electrolysis complete after lead-in wire do not need in battery PCB, therefore need to adopt etchant flow to remove lead-in wire.It mainly utilizes etching solution to be dissolved by the lead-in wire etching solution not having dry film to protect, and other are then stayed by the line pattern that dry film is protected.
AOI(AutomaticOpticalInspection, automatic optics inspection): first circuit file is called in AOI equipment, then made comparisons by the simulation files in AOI device scan printed line road in kind and equipment, find out different position, namely find out shortcoming position.
Welding resistance: solidify at the surperficial silk-screen of pcb board or coating one deck wet film, when welding to prevent PCB and the short circuit of non-solder place, plays insulating effect.Welding resistance, is commonly called as " green oil ", and its object comprises anti-welding, backplate and insulation.Anti-welding being mainly reserves pad on plate and welding hole, all uses ink to cover in all circuits and copper face, to prevent from causing short circuit during wave-soldering, and saves the consumption of scolding tin.Backplate mainly prevents moisture and various electrolytical infringement from making circuit be oxidized and endanger electric property, and prevents the mechanical wounding of outer Come with the good insulation in retaining plate face.Insulation is then because plank live width is apart from more and more thin, therefore the Insulation Problems day shape between conductor highlights, and also increases the importance of solder mask insulation property.
And the concrete technology of welding resistance includes: pre-treatment, printing first surface, prebake conditions, printing second, prebake conditions, exposure, development, solidification.The oxide of PCB surface is mainly removed in pre-treatment, increases the roughness in plate face, the ink adhesion in stiffener face by volcanic ash.Printing mainly utilize silk screen by ink printing on plank, prebake conditions is then the solvent in partially desiccated ink, and ink portions is hardened, unlikely when exposing sticky end sheet.Exposure imaging mainly realizes image transfer by exposure machine; Development is then the photosensitive-ink of not being polymerized got rid of.Solidification is mainly thoroughly hardened by the epoxy resin in ink by high-temperature baking.
Character: at PCB surface silk-screen character, provide components and parts to identify when pasting part welding to follow-up PCB and distinguish.Ink correspondence is mainly formed character by the mode of silk screen printing by silk-screen character onboard, so that follow-up identification is distinguished and maintenance.
Test: the conduction property detecting PCB product, guarantees that product is without opening short circuit problem.
Print blue glue: adopt 18T silk-screen grenadine to shine net according to thick carat (measure of the purity of gold) figure and be made into half tone, recycling silk-screen hardness is the scraper of 60HV and the blue glue of pressure silk-screen of 5-8KG/ square centimeter.Put down after silk-screen completes and battery PCB is placed on thousand layers of frame, and be placed in baking box maintenance 150 DEG C of bakings 50 minutes.
In the present embodiment, blue glue is peelable blue glue, and its model is SD-2952, and outward appearance is blue pasty state liquid, and viscosity is 200-400Ps (20 DEG C, 10rpm); Solid content >90%.Its occupation mode, for first to stir 10 ~ 15mi, then controls 130 DEG C of solidification 10 ~ 15min, adopts 200 order polyester nets or stainless steel cloth to print on battery PCB afterwards.Peelable blue glue in the present embodiment is blue sticky silk fabric shape ink, and its main feature is exactly can peel off easily with hand or instrument after application, and does not have residue face on the substrate.
In addition, in the present embodiment, the thickness of blue glue adjusts by scraper pressure, and the blue glue of silk-screen does not need too thick, too thick shaping time plate and mould between gap large, unbalance stress, too thin personnel are not easy to operate when rear operation tears blue glue.
Shaping: to adopt the shape that the PCB Product processing of bulk becomes client to need by the mode of Digit Control Machine Tool or punch press.
Inspection eventually: by 100% visual inspection plate open defect, and place under repair to light defects, has avoided problem and defect plate to flow out.
Tear blue glue: before shaping rear shipment, adopt the pattern of handwork to tear blue glue.
More than prevent the method for wiping flower to be described in detail to the hard golden face of a kind of battery PCB provided by the present invention, apply specific case herein to set forth structural principle of the present invention and execution mode, above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1. the hard golden face of battery PCB prevents a method of wiping flower, it is characterized in that, comprises step:
The hard gold of electricity; Etching; AOI; Welding resistance; Character; Test; Shaping; Inspection eventually.
2. the hard golden face of battery PCB as claimed in claim 1 prevents the method for wiping flower, it is characterized in that, after a test, shaping before also need to print blue glue process to battery PCB.
3. the hard golden face of battery PCB as claimed in claim 2 prevents the method for wiping flower, it is characterized in that, also comprises and tear blue glue process after examining eventually.
4. the hard golden face of battery PCB as claimed in claim 3 prevents the method for wiping flower, it is characterized in that, the plating last layer in the pad face of battery PCB by the thick golden liquid medicine of electrolysis after the hard gold of described electricity is firmly golden.
5. the hard golden face of battery PCB as claimed in claim 4 prevents the method for wiping flower, and it is characterized in that, the hard gold of described electricity comprises pickling, electronickelling, in advance gold-plated, electrogilding cobalt alloy.
6. the hard golden face of battery PCB as claimed in claim 4 prevents the method for wiping flower, and it is characterized in that, the lead-in wire that described etching comprises battery PCB produces after the hard gold of electricity etches away.
7. the hard golden face of battery PCB as claimed in claim 6 prevents the method for wiping flower, it is characterized in that, the process of described print blue glue comprises: adopt 18T silk-screen grenadine to shine net according to thick carat (measure of the purity of gold) figure and be made into half tone, and recycling silk-screen hardness is the scraper of 60HV and the blue glue of pressure silk-screen of 5-8KG/ square centimeter.
8. the hard golden face of battery PCB as claimed in claim 7 prevents the method for wiping flower, it is characterized in that, the peelable blue glue of described blue glue to be model be SD-2952.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772780.6A CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510772780.6A CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
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| Publication Number | Publication Date |
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| CN105376954A true CN105376954A (en) | 2016-03-02 |
| CN105376954B CN105376954B (en) | 2018-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510772780.6A Expired - Fee Related CN105376954B (en) | 2015-11-12 | 2015-11-12 | A kind of firmly golden faces of battery PCB prevent the method for wiping flower |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617106A (en) * | 2018-04-24 | 2018-10-02 | 昆山大洋电路板有限公司 | A kind of complete golden face sheet copper protective film processing method |
| CN113766762A (en) * | 2021-06-01 | 2021-12-07 | 奥士康科技股份有限公司 | Method for preventing gold surface from being scratched and scratched |
Citations (4)
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|---|---|---|---|---|
| JP2007234734A (en) * | 2006-02-28 | 2007-09-13 | Fujikura Ltd | Flexible printed circuit and its production process |
| CN103002661A (en) * | 2012-09-19 | 2013-03-27 | 胜宏科技（惠州）股份有限公司 | Post production process of thin panels |
| CN104507257A (en) * | 2014-12-11 | 2015-04-08 | 江门崇达电路技术有限公司 | Printed circuit board (PCB) molding method |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
-
2015
- 2015-11-12 CN CN201510772780.6A patent/CN105376954B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234734A (en) * | 2006-02-28 | 2007-09-13 | Fujikura Ltd | Flexible printed circuit and its production process |
| CN103002661A (en) * | 2012-09-19 | 2013-03-27 | 胜宏科技（惠州）股份有限公司 | Post production process of thin panels |
| CN104507257A (en) * | 2014-12-11 | 2015-04-08 | 江门崇达电路技术有限公司 | Printed circuit board (PCB) molding method |
| CN105050330A (en) * | 2015-07-02 | 2015-11-11 | 江门崇达电路技术有限公司 | Method for manufacturing thickened silk printing plate and method for silk printing blue gel by using thickened silk printing plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108617106A (en) * | 2018-04-24 | 2018-10-02 | 昆山大洋电路板有限公司 | A kind of complete golden face sheet copper protective film processing method |
| CN113766762A (en) * | 2021-06-01 | 2021-12-07 | 奥士康科技股份有限公司 | Method for preventing gold surface from being scratched and scratched |
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| CN105376954B (en) | 2018-06-22 |
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| CB03 | Change of inventor or designer information |
Inventor after: Gao Tuanfen Inventor after: Jiang Yanping Inventor after: An Guoyi Inventor before: Gao Tuanfen |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 Termination date: 20181112 |
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| CF01 | Termination of patent right due to non-payment of annual fee |