CN113008400B - Three-dimensional array type multi-node thin film thermocouple, preparation method and packaging structure thereof - Google Patents
Three-dimensional array type multi-node thin film thermocouple, preparation method and packaging structure thereof Download PDFInfo
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- CN113008400B CN113008400B CN202110212783.XA CN202110212783A CN113008400B CN 113008400 B CN113008400 B CN 113008400B CN 202110212783 A CN202110212783 A CN 202110212783A CN 113008400 B CN113008400 B CN 113008400B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- H—ELECTRICITY
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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Abstract
The invention discloses a three-dimensional array type multi-node film thermocouple, a preparation method and a packaging structure thereof, wherein one side of a first pure copper film area is positioned in a first straight groove, one side of a second pure copper film area is positioned in a second straight groove, one side of a third pure copper film area is positioned in a third straight groove, one side of a constantan film area is positioned in a fourth straight groove, the other side of the first pure copper film area, the other side of the second pure copper film area, the other side of the third pure copper film area and the other side of the constantan film area are all positioned on the front end surface of a columnar substrate, and the constantan film area is respectively overlapped with the first pure copper film area, the second pure copper film area and the third pure copper film area on the front end surface of the columnar substrate to form three thermal nodes, the thermocouple can realize instantaneous temperature measurement in a variable temperature flow field, and has high spatial resolution and measurement precision.
Description
Technical Field
The invention belongs to the field of sensor design and preparation and rapid measurement of low-temperature fluid temperature, and relates to a three-dimensional array type multi-node thin-film thermocouple, a preparation method and a packaging structure thereof.
Background
The design and research and development of the conventional film thermocouple are usually applied to testing the temperature of the surfaces of turbine blades of engines, the inner walls of combustion chambers and other parts, and belong to the field of high-temperature and ultrahigh-temperature measurement. Although the conventional thermocouple and other types of temperature sensors exist in the field of low-temperature measurement, the response time is often larger, and the manufacturing and packaging processes are more complicated, so that a temperature measuring device which is simple in structure, fast in response time and capable of achieving high spatial resolution and high precision is required to be designed, but similar disclosures do not appear in the domestic prior art.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a three-dimensional array type multi-node thin-film thermocouple, a preparation method and a packaging structure thereof.
In order to achieve the above object, the three-dimensional array type multi-node thin film thermocouple of the invention comprises a columnar substrate, a constantan thin film area and three pure copper thin film areas, wherein the side surface of the tail part of the columnar substrate is provided with a first straight groove, a second straight groove, a third straight groove and a fourth straight groove along the axial direction, one side of the first pure copper thin film area is positioned in the first straight groove, one side of the second pure copper thin film area is positioned in the second straight groove, one side of the third pure copper thin film area is positioned in the third straight groove, one side of the constantan thin film area is positioned in the fourth straight groove, the other side of the first pure copper thin film area, the other side of the second pure copper thin film area, the other side of the third pure copper thin film area and the other side of the constantan thin film area are all positioned on the front end surface of the columnar substrate, and on the front end surface of the columnar substrate, the constantan thin film area is respectively overlapped with the first pure copper thin film area, the second pure copper thin film area and the third pure copper thin film area, to form three thermal nodes.
The copper film structure further comprises three first metal leads and one second metal lead, wherein the three first metal leads are respectively connected with the first pure copper film area, the second pure copper film area and the third pure copper film area, and the second metal lead is connected with the constantan film area.
The width of the first straight groove, the width of the second straight groove, the width of the third straight groove and the width of the fourth straight groove are all 1 mm.
The connecting positions of the front end surface of the columnar substrate and the first straight groove, the second straight groove, the third straight groove and the fourth straight groove are all in a fillet transition structure.
The surfaces of the first pure copper film area, the second pure copper film area, the third pure copper film area and the constantan film area are all provided with epoxy resin protective layers.
The first pure copper film area and the first metal lead wire, the second pure copper film area and the second first metal lead wire, the third pure copper film area and the third first metal lead wire and the constantan film area and the second metal lead wire are connected through high-temperature conductive silver adhesive.
The columnar substrate is made of columnar polyether-ether-ketone plastic.
The back end of the columnar substrate is of a conical structure.
A preparation method of a three-dimensional array type multi-node thin-film thermocouple comprises the following steps:
1) cleaning and drying the columnar substrate;
2) coating a first shielding layer on the side surface, and drying;
3) adhering a first film plate on the end face of the columnar substrate, preparing a constantan film area on the columnar substrate by adopting a magnetron sputtering method, and then carrying out photoresist removing treatment;
4) cleaning and drying the columnar substrate;
5) coating a second shielding layer on the side surface of the columnar substrate, and drying;
6) attaching a second mask on the front end face of the columnar substrate, preparing a first pure copper film area, a second pure copper film area and a third pure copper film area on the columnar substrate by adopting a magnetron sputtering method, removing the second mask, performing photoresist removing treatment, cleaning and drying;
7) annealing the device obtained in the step 6) in vacuum or inert gas atmosphere;
8) preparing epoxy resin coatings on the surfaces of a first pure copper film area, a second pure copper film area, a third pure copper film area and a constantan film area by adopting a pulling method, and then carrying out curing heat treatment to form an epoxy resin protective layer;
9) the three first metal leads are respectively connected with the first pure copper film area, the second pure copper film area and the third pure copper film area, and the second metal lead is connected with the constantan film area to obtain the three-dimensional array type multi-node film thermocouple.
The utility model provides a packaging structure of three-dimensional array multinode film thermocouple includes output cable, axial retaining ring and hexagon head bolt, wherein, and column base and axial retaining ring are equipped with the axial hole along axial in hexagon head bolt, have seted up on the axial retaining ring, and wherein, first metal lead wire and second metal lead wire pass output cable is connected behind the axial hole.
The invention has the following beneficial effects:
when the three-dimensional array type multi-node thin-film thermocouple, the preparation method and the packaging structure are specifically operated, the three-dimensional columnar substrate is adopted, the metal thin-film thermocouple is formed on the end face of the complex three-dimensional substrate, the cold end lead is led out through the side straight groove, three thermal nodes are formed, specifically, three groups of thin-film thermocouples with shared cathodes and independent anodes are formed, the three-dimensional array type multi-node thin-film thermocouple has high spatial resolution and measurement accuracy, and is simple in structure, convenient to operate and fast in response. In addition, during preparation, the preparation is carried out by adopting a magnetron sputtering method, and the preparation method is simple, easy to realize and small in volume. And finally, during packaging, the axial retainer ring and the hexagon head bolt are used for packaging, and the packaging structure is simple.
Furthermore, the first metal lead and the second metal lead are positioned in the straight groove, so that the film is prevented from being damaged by contacting with surrounding objects and losing effectiveness is avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an assembly view of the present invention;
FIG. 4 is a schematic view of a thermocouple according to the present invention.
Wherein, 1 is a columnar substrate, 2 is a constantan film area, 3 is a pure copper film area, 4 is a first metal lead, 5 is an output lead, 6 is a hexagon head bolt, and 7 is an axial retainer ring.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 4, the three-dimensional array type multi-node thin-film thermocouple of the invention includes a cylindrical substrate 1, a constantan thin-film region 2 and three pure copper thin-film regions 3, wherein a first straight slot, a second straight slot, a third straight slot and a fourth straight slot are axially formed on a side surface of a tail portion of the cylindrical substrate 1, one side of the first pure copper thin-film region 3 is located in the first straight slot, one side of the second pure copper thin-film region 3 is located in the second straight slot, one side of the third pure copper thin-film region 3 is located in the third straight slot, one side of the constantan thin-film region 2 is located in the fourth straight slot, the other side of the first pure copper thin-film region 3, the other side of the second pure copper thin-film region 3, the other side of the third pure copper thin-film region 3 and the other side of the constantan thin-film region 2 are all located on a front end surface of the cylindrical substrate 1, and on the front end surface of the cylindrical substrate 1, the constantan thin-film region 2 is respectively connected with the first pure copper thin-film region 3, the second straight slot, the third straight slot, the second straight slot, the third straight copper thin-film region 3, the third straight slot, and the second straight slot, and the third slot are located in the third slot, and the third slot, and the, The second pure copper film area 3 and the third pure copper film area 3 are overlapped to form three thermal nodes, and the rear end of the columnar substrate 1 is in a conical structure.
The invention also comprises three first metal leads 4 and one second metal lead, wherein the three first metal leads 4 are respectively connected with the first pure copper film area 3, the second pure copper film area 3 and the third pure copper film area 3, and the second metal lead is connected with the constantan film area 2.
The width of the first straight groove, the width of the second straight groove, the width of the third straight groove and the width of the fourth straight groove are all 1 mm; the connecting positions of the front end surface of the columnar substrate 1 and the first straight groove, the second straight groove, the third straight groove and the fourth straight groove are all in a fillet transition structure; the surfaces of the first pure copper film area 3, the second pure copper film area 3, the third pure copper film area 3 and the constantan film area 2 are all provided with epoxy resin protective layers.
The first pure copper film area 3 and the first metal lead 4, the second pure copper film area 3 and the second metal lead 4, the third pure copper film area 3 and the third first metal lead 4 and the constantan film area 2 and the second metal lead are connected through high-temperature conductive silver adhesive; the material of the columnar substrate 1 is columnar polyether-ether-ketone plastic.
The preparation method of the three-dimensional array type multi-node thin-film thermocouple comprises the following steps:
1) cleaning and drying the columnar substrate 1;
specifically, the columnar substrate 1 is sequentially subjected to ultrasonic cleaning in an acetone solution for 10min, in an absolute ethyl alcohol solution for 10min, then is washed clean by deionized water, and then is dried;
2) coating a first shielding layer on the side surface, and drying;
wherein the drying temperature is 100 ℃, and the drying time is 10 min;
3) attaching a first film plate on the end face of a columnar substrate 1, and preparing a constantan film area 2 on the columnar substrate 1 by adopting a magnetron sputtering method, wherein the power is 200W, the vacuum degree is 1x10 -6 Torr and sputtering time is 50min, then photoresist removing treatment is carried out, drying is carried out after cleaning, and concretely, soaking and cleaning are carried out in acetone solution;
4) cleaning and drying the columnar substrate 1;
specifically, the columnar substrate 1 is sequentially subjected to ultrasonic cleaning in an acetone solution for l0min, in an absolute ethyl alcohol solution for 10min, then is washed clean by deionized water, and then is dried;
5) coating a second shielding layer on the side surface of the columnar substrate 1, and drying, wherein the drying temperature is 100 ℃, and the drying time is 10 min;
6) attaching a second mask on the front end face of the columnar substrate 1, and preparing a first pure copper film area 3, a second pure copper film area 3 and a third pure copper film area 3 on the columnar substrate 1 by adopting a magnetron sputtering method, wherein the power is 200W, and the vacuum degree is lx10 -6 Torr is adopted, the sputtering time is 40min, the second mask is removed, the photoresist is removed, and the second mask is dried after cleaning;
7) carrying out annealing treatment on the device obtained in the step 6) for 2h in a vacuum or inert gas atmosphere at the temperature of 200 ℃ so as to reduce the crystal defects of the thin film and improve the tissue density of the thin film;
8) preparing epoxy resin coatings on the surfaces of the first pure copper film area 3, the second pure copper film area 3, the third pure copper film area 3 and the constantan film area 2 by adopting a pulling method, and then carrying out curing heat treatment to form an epoxy resin protective layer;
9) the three first metal leads 4 are respectively connected with the first pure copper film area 3, the second pure copper film area 3 and the third pure copper film area 3, and the second metal lead is connected with the constantan film area 2, so that the three-dimensional array type multi-node film thermocouple is obtained.
Referring to fig. 1, 2 and 3, the packaging structure of the three-dimensional array type multi-node thin-film thermocouple comprises an output cable 5, an axial retainer 7 and a hexagon head bolt 6, wherein the cylindrical base 1 and the axial retainer 7 are axially assembled in the hexagon head bolt 6, the axial retainer 7 is provided with an axial hole, the output cable 5 is connected after a first metal lead 4 and a second metal lead penetrate through the axial hole, and finally the main body structure achieves the purposes of insulation and sealing by encapsulating epoxy resin glue.
The invention selects metal copper and constantan alloy as thermoelectric materials, adopts magnetron sputtering technology, integrates the hot point of the thermocouple on the three-dimensional complex anisotropic polymer plastic substrate at the end of the sensor, leads out the cold junction node through the side straight groove, and connects at the cold junction, thereby avoiding being in the same high temperature area with the hot point, and simultaneously forming three groups of array type thin film thermocouples with the common negative electrodes and the independent positive electrodes.
Claims (8)
1. A three-dimensional array type multi-node film thermocouple is characterized by comprising a columnar substrate (1), a constantan film area (2) and three pure copper film areas (3), wherein the side surface of the tail part of the columnar substrate (1) is provided with a first straight groove, a second straight groove, a third straight groove and a fourth straight groove along the axial direction, one side of the first pure copper film area (3) is positioned in the first straight groove, one side of the second pure copper film area (3) is positioned in the second straight groove, one side of the third pure copper film area (3) is positioned in the third straight groove, one side of the constantan film area (2) is positioned in the fourth straight groove, the other side of the first pure copper film area (3), the other side of the second pure copper film area (3), the other side of the third pure copper film area (3) and the other side of the constantan film area (2) are positioned on the front end surface of the columnar substrate (1) and on the front end surface of the columnar substrate (1), the constantan film area (2) is respectively overlapped with the first pure copper film area (3), the second pure copper film area (3) and the third pure copper film area (3) to form three thermal nodes;
three first metal leads (4) are respectively connected with a first pure copper film area (3), a second pure copper film area (3) and a third pure copper film area (3), and a second metal lead is connected with a constantan film area (2) to obtain a three-dimensional array type multi-node film thermocouple;
the packaging structure of the three-dimensional array type multi-node thin-film thermocouple comprises an output cable (5), an axial retainer ring (7) and a hexagonal head bolt (6), wherein a columnar substrate (1) and the axial retainer ring (7) are axially assembled in the hexagonal head bolt (6), an axial hole is formed in the axial retainer ring (7), a first metal lead (4) and a second metal lead penetrate through the axial hole and then the output cable (5) is connected,
a three-dimensional columnar substrate is adopted, a metal film thermocouple is formed on the end face of the complex three-dimensional substrate, and a cold end lead is led out through a side straight groove to form three thermal nodes, specifically three groups of film thermocouples with shared cathodes and independent anodes;
the preparation method of the three-dimensional array type multi-node thin-film thermocouple comprises the following steps:
1) cleaning and drying the columnar substrate (1);
2) coating a first shielding layer on the side surface, and drying;
3) pasting a first film plate on the end face of the columnar substrate (1), preparing a constantan film area (2) on the columnar substrate (1) by adopting a magnetron sputtering method, and then carrying out photoresist removing treatment;
4) cleaning and drying the columnar substrate (1);
5) coating a second shielding layer on the side surface of the columnar substrate (1), and drying;
6) attaching a second mask on the front end face of the columnar substrate (1), preparing a first pure copper film area (3), a second pure copper film area (3) and a third pure copper film area (3) on the columnar substrate (1) by adopting a magnetron sputtering method, removing the second mask, performing photoresist removal treatment, cleaning and drying;
7) annealing the device obtained in the step 6) in vacuum or inert gas atmosphere;
8) preparing epoxy resin coatings on the surfaces of the first pure copper film area (3), the second pure copper film area (3), the third pure copper film area (3) and the constantan film area (2) by a pulling method, and then carrying out curing heat treatment to form an epoxy resin protective layer;
9) the three first metal leads (4) are respectively connected with the first pure copper film area (3), the second pure copper film area (3) and the third pure copper film area (3), and the second metal lead is connected with the constantan film area (2), so that the three-dimensional array type multi-node film thermocouple is obtained.
2. The three-dimensional array type multi-node thin-film thermocouple according to claim 1, further comprising three first metal leads (4) and one second metal lead, wherein the three first metal leads (4) are respectively connected to the first pure copper thin-film region (3), the second pure copper thin-film region (3) and the third pure copper thin-film region (3), and the second metal lead is connected to the constantan thin-film region (2).
3. The three-dimensional array type multi-node thin film thermocouple according to claim 1, wherein the width of the first straight groove, the width of the second straight groove, the width of the third straight groove, and the width of the fourth straight groove are all 1 mm.
4. The three-dimensional array type multi-node thin-film thermocouple according to claim 1, wherein the connection positions of the front end surface of the columnar substrate (1) and the first, second, third and fourth straight grooves are all fillet transition structures.
5. The three-dimensional array type multi-node thin-film thermocouple according to claim 1, wherein epoxy resin protective layers are disposed on the surfaces of the first pure copper thin-film region (3), the second pure copper thin-film region (3), the third pure copper thin-film region (3) and the constantan thin-film region (2).
6. The three-dimensional array type multi-node thin-film thermocouple according to claim 1, wherein a first pure copper thin-film region (3) and a first metal lead (4), a second pure copper thin-film region (3) and a second first metal lead (4), a third pure copper thin-film region (3) and a third first metal lead (4), and a constantan thin-film region (2) and a second metal lead are connected by high-temperature conductive silver paste.
7. The three-dimensional array type multi-node thin-film thermocouple according to claim 1, wherein the columnar substrate (1) is made of columnar polyetheretherketone plastic.
8. The three-dimensional array type multi-node thin film thermocouple according to claim 1, wherein the rear end of the pillar-shaped base (1) has a tapered structure.
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