CN112994622B - Doherty radio frequency power amplifier and communication equipment - Google Patents
Doherty radio frequency power amplifier and communication equipment Download PDFInfo
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- CN112994622B CN112994622B CN201911295350.4A CN201911295350A CN112994622B CN 112994622 B CN112994622 B CN 112994622B CN 201911295350 A CN201911295350 A CN 201911295350A CN 112994622 B CN112994622 B CN 112994622B
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- 238000004891 communication Methods 0.000 title claims abstract description 39
- 238000006243 chemical reaction Methods 0.000 claims abstract description 84
- 230000005611 electricity Effects 0.000 claims abstract description 4
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- 239000002470 thermal conductor Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 238000004590 computer program Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000005678 Seebeck effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
- H03F1/04—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in discharge-tube amplifiers
- H03F1/06—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in discharge-tube amplifiers to raise the efficiency of amplifying modulated radio frequency waves; to raise the efficiency of amplifiers acting also as modulators
- H03F1/07—Doherty-type amplifiers
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Abstract
The application discloses a Doherty radio frequency power amplifier and communication equipment, wherein the Doherty radio frequency power amplifier and the communication equipment are provided with a mean power amplifier and a peak power amplifier which are arranged on a first side surface of a circuit board, a thermoelectric conversion module is arranged on a second side surface of the circuit board opposite to the first side surface, and an output end of the thermoelectric conversion module is connected with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the average power amplifier when the average power amplifier works, converts the absorbed heat energy into electric energy and inputs the electric energy into the power utilization module connected with the output end. The Doherty power amplifier solves the technical problem that a Doherty power amplifier in the prior art is unreasonable in heat dissipation structure.
Description
Technical Field
The application relates to the technical field of electronics, in particular to a Doherty radio frequency power amplifier and communication equipment.
Background
In current wireless communications, the most important characteristic of a Doherty power amplifier is load modulation (load modulation), which synthesizes the asymmetric output powers of the two amplifiers. The Doherty amplifier comprises a mean power amplifier and a peak power amplifier; only the carrier amplifier operates at low power levels; the peak power amplifier generates power at a higher power level and, due to good load modulation characteristics, the average power amplifier operates in peak efficiency mode in this region. This feature provides for efficient amplification of the amplitude modulated signal. The load modulated by the current ratio of the carrier and peak power amplifiers can be self-regulating and peak efficiency at two output power levels can be achieved: wherein the average power amplifier provides a first peak efficiency when the peak power amplifier is just on and the Doherty amplifier is at a second peak efficiency point at this output power level when both amplifiers are generating their full power.
With the advent of high-power-demand equipment components and software applications, the running time and the heat productivity of power amplifiers have been increased, so that providing a reasonable scheme to achieve heat dissipation of power amplifiers has become a problem to be solved. According to the working principle of the Doherty power amplifier and the setting of the power amplifier, the average power amplifier is always in a working state in the whole working engineering of the Doherty power amplifier, so that the Doherty power amplifier can continuously generate heat, and if the Doherty power amplifier cannot effectively dissipate heat, the power amplifier can be damaged, and even components arranged around the average power amplifier are damaged.
Disclosure of Invention
The application provides a Doherty radio frequency power amplifier and communication equipment, which are used for solving the technical problem that the Doherty power amplifier in the prior art is unreasonable in heat dissipation structure.
In a first aspect, please provide a Doherty radio frequency power amplifier, a mean power amplifier and a peak power amplifier disposed on a first side of a circuit board, further comprising:
a thermoelectric conversion module is arranged on a second side surface of the circuit board, which is opposite to the first side surface, and the output end of the thermoelectric conversion module is connected with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the average power amplifier when the average power amplifier works, converts the absorbed heat energy into electric energy and inputs the electric energy into the power utilization module connected with the output end.
Based on the combination of thermoelectric conversion and Doherty high efficiency technology, the embodiment of the application provides a novel architecture of a high-efficiency Doherty power amplifier based on a thermoelectric converter, which not only improves conversion efficiency, but also realizes the thermoelectric conversion of the Doherty power amplifier by using the area of a thermoelectric conversion module as small as possible, thereby achieving the effects of reducing cost and improving the energy utilization rate of equipment.
In an alternative embodiment, the power amplifier further comprises a first thermal conductor arranged between the thermoelectric conversion module and the circuit board.
In an alternative embodiment, the first thermal conductor comprises a first portion and a second portion; wherein the first part is connected with the circuit board, and the second part is connected with the thermoelectric conversion module; and the first portion has a greater thermal conductivity than the second portion.
In an alternative embodiment, the Doherty radio frequency power amplifier further comprises a second heat conductor, the second heat conductor is arranged at a position corresponding to the peak power amplifier on the second side, and the projection area of the second heat conductor on the circuit board is the same as that of the peak power amplifier.
In an alternative embodiment, the power module is the peak power amplifier; the output of the thermoelectric conversion module is connected to the drain of the peak power amplifier.
In the embodiment, because the peak power amplifier in the Doherty radio frequency power amplifier has great influence on the linear performance of a communication signal, the integral saturated power of the Doherty radio frequency power amplifier can be improved by improving the leakage voltage, and the linearity is improved, so that the output end of the thermoelectric conversion module can be directly connected to the drain electrode of the peak power amplifier in the embodiment, the power amplifier structure provided by the embodiment can improve the energy utilization rate and the saturated power of the Doherty radio frequency power amplifier through the optimal design, and when the Doherty radio frequency power amplifier is applied to the communication equipment for power amplification, the linear performance of the communication equipment is correspondingly improved, and the useless output radio frequency of the spurious communication equipment is reduced.
In an alternative embodiment, the Doherty radio frequency power amplifier comprises a plurality of peak power amplifiers, and the output end of the thermoelectric conversion module is connected with the drain electrode of at least one of the plurality of peak power amplifiers.
In an alternative embodiment, the thermoelectric conversion module is a rectangular sheet structure.
In an alternative embodiment, the thermoelectric conversion module includes a high temperature end and a low temperature end, wherein the high temperature end is connected to the second side of the circuit board.
In an alternative embodiment, the high temperature end connection on the second side of the circuit board comprises:
the high-temperature end is connected to the second side of the circuit board through paste or elastic heat-conducting silica gel.
In a second aspect, there is provided a communication device comprising a Doherty radio frequency power amplifier and a communication element as described in the first aspect and any optional implementation of the first aspect.
The beneficial effects of the application are as follows:
aiming at the problems in the prior art, the application provides a novel Doherty power amplifier structure, wherein a thermoelectric conversion module is arranged in the Doherty power amplifier structure, and heat energy released by a mean value amplifier in the Doherty power amplifier is converted into electric energy, so that the influence of heat dissipation of the mean value power amplifier on the Doherty power amplifier and surrounding components can be reduced due to the fact that the heat energy is converted. Meanwhile, because the heat dissipation mode provided in the prior art adjusts the heat released by the power amplifier in a diffusion mode by increasing the heated area, but the heat in the equipment cannot be reduced, and the heat dissipation mode reduces the influence on the heating element, but the heat dissipation may damage the elements around the heating element. By the scheme provided by the embodiment of the application, heat energy can be directly converted into electric energy, so that the heat of equipment content is effectively reduced, and the influence of heating of elements on equipment and the elements is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a Doherty rf power amplifier according to an embodiment of the present application;
fig. 2 is a schematic diagram of a connection structure between a thermoelectric conversion module and a peak power amplifier according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a communication device according to an embodiment of the present application.
Detailed Description
With the advent of high-power-demand equipment components and software applications, the running time and the heat productivity of power amplifiers have been increased, so that providing a reasonable scheme to achieve heat dissipation of power amplifiers has become a problem to be solved. According to the working principle of the Doherty power amplifier and the setting of the power amplifier, the average power amplifier is always in a working state in the whole working engineering of the Doherty power amplifier, so that the Doherty power amplifier can continuously generate heat, and if the Doherty power amplifier cannot effectively dissipate heat, the power amplifier can be damaged, and even components arranged around the average power amplifier are damaged.
Aiming at the problems in the prior art, the application provides a novel Doherty power amplifier structure, wherein a thermoelectric conversion module is arranged in the Doherty power amplifier structure, and heat energy released by a mean value amplifier in the Doherty power amplifier is converted into electric energy, so that the influence of heat dissipation of the mean value power amplifier on the Doherty power amplifier and surrounding components can be reduced due to the fact that the heat energy is converted. Meanwhile, because the heat dissipation mode provided in the prior art adjusts the heat released by the power amplifier in a diffusion mode by increasing the heated area, but the heat in the equipment cannot be reduced, and the heat dissipation mode reduces the influence on the heating element, but the heat dissipation may damage the elements around the heating element. By the scheme provided by the embodiment of the application, heat energy can be directly converted into electric energy, so that the heat of equipment content is effectively reduced, and the influence of heating of elements on equipment and the elements is reduced.
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.
The terms "first," "second," "third," and "fourth" and the like in the description and in the claims of this application and in the drawings, are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The device provided in the embodiments of the present application is described in further detail below with reference to the accompanying drawings and specific application scenarios:
example 1
As shown in fig. 1, the embodiment of the present application provides a Doherty radio frequency power amplifier, which is provided with a mean power amplifier 102 and a peak power amplifier 103 on a first side of a circuit board 101, and further includes:
a thermoelectric conversion module 104 is arranged on a second side surface of the circuit board 101 opposite to the first side surface, and an output end of the thermoelectric conversion module 104 is connected with an electricity utilization module on the circuit board 101; the setting position of the thermoelectric conversion module 104 corresponds to the position of the average power amplifier 102, and when the average power amplifier 102 works, the thermoelectric conversion module 104 will absorb the heat energy generated when the average power amplifier 102 works, and convert the absorbed heat energy into electric energy, and input the electric energy to the power consumption module connected to the output end.
The output end of the thermoelectric conversion module 104 is connected to the circuit board 101, the purpose of reducing energy consumption is achieved by recovering part of electric energy, the thermoelectric conversion module can be directly connected to the power utilization modules on the circuit board, and the thermoelectric conversion module is directly connected to the power supply circuits of the power utilization modules, so that the electric energy of a battery can be saved to achieve the purpose of improving the energy consumption; meanwhile, the temperature rise of the communication terminal is reduced, and the influence of high temperature on the use of a user is reduced.
In this embodiment, in order to provide a good heat transfer effect between the thermoelectric conversion module 104 and the average power amplifier 102, the thermoelectric conversion module 104 is generally disposed on the front and back sides of the average power amplifier 102; alternatively, the thermoelectric conversion module 104 overlaps the projection of the average power amplifier 102 on the circuit board 101.
In the embodiment of the application, PA (Power Amplifier) is generally arranged on the front surface of the circuit board, and no component is arranged on the back surface of the circuit board, so that a better heat dissipation effect can be obtained; in order to achieve the best heat transfer effect, the thermoelectric conversion module may be disposed on the back surface of the circuit board provided with the PA.
The working principle of the thermoelectric conversion module 104 is as follows: when the PA works, heat is generated, part of the heat is firstly conducted to a circuit board contacted with the PA, and then is conducted to the thermoelectric conversion module contacted with the circuit board; a part of heat reaches the thermoelectric conversion module through heat convection and heat radiation at a heat dissipation through hole on the circuit board; the thermoelectric conversion module absorbs heat energy generated during the operation of the PA, so that the temperature of the high temperature end of the thermoelectric conversion module rises, and a temperature difference is formed between the thermoelectric conversion module and the low temperature end of the thermoelectric conversion module, and therefore electromotive force is generated at the output end of the thermoelectric conversion module by utilizing the Seebeck effect of the semiconductor.
Further to ensure that the electrical energy voltage converted by the thermoelectric conversion module 104 is more stable, the thermoelectric conversion module may be adapted to power more components, and in this example, a DC-DC conversion module 107 may also be included. The DC-DC conversion module 107 inverts (performs a step-up or step-down operation) the direct current supplied from the thermoelectric conversion module 104 to an alternating current, and rectifies and converts the alternating current into another direct current voltage.
Further, in order to ensure the heat transfer effect between the thermoelectric conversion module 104 and the average power amplifier 102, in order to better enable the heat dissipation of the average power amplifier 102 and the heat dissipated by the average power amplifier to better enable the conversion of the thermoelectric conversion module 104, the Doherty radio frequency power amplifier in this example further includes a first heat conductor 105, which is disposed between the thermoelectric conversion module 104 and the circuit board 101.
Further, to achieve better conversion efficiency of the thermoelectric conversion module 104 and better heat dissipation of the average power amplifier 102, the first thermal conductor 105 may further include a first portion and a second portion in this embodiment;
the first part is connected with the circuit board (i.e. the first part realizes the heat dissipation of the mean power amplifier 102), and the second part is connected with the thermoelectric conversion module (i.e. the second part transmits the heat released by the mean power amplifier 102 to the thermoelectric conversion module 104 in a reasonable manner); and the first portion has a greater thermal conductivity than the second portion.
Of course, the first portion and the second portion of the first heat conductor 105 may be formed by combining multiple heat transfer materials, so that the heat transfer efficiency of the portion of the heat conductor 105 contacting the average power amplifier 102 is high, and the purpose of transferring the heat released by the average power amplifier 102 at the fastest speed is achieved; the portion (i.e., the second portion) of the first heat conductor 105, which is in contact with the thermoelectric conversion module 104, may be selected to be a heat transfer material having a thermal conductivity coefficient matching the thermal conversion efficiency of the thermoelectric conversion module, so that the thermoelectric conversion module 104 can convert all heat released by the average power amplifier 102 into electric energy as much as possible, thereby improving the energy conversion rate and the utilization rate.
In the embodiment of the application, because the communication debugging signals generally have peak-to-average ratio characteristics, the average signal is mainly transmitted, and the peak value can appear under a certain probability and the linear performance is influenced; meanwhile, according to the Doherty technology theory, doherty is an impedance modulation technology, and two or more power amplifiers can comprise a mean power amplifier (or called mean power amplifier) and a peak power amplifier (or called peak power amplifier); the average power amplifier may be PA1; the peak power amplifier may be PA2, PA 3; when the average signal is input, only the average power amplifier (namely PA 1) works, and when the peak signal is input, the average power amplifier (namely PA 1) and the peak power amplifier (namely PA2 and PA 3) work simultaneously, so that the aim of high efficiency and high power is fulfilled;
according to the working principle of the Doherty radio frequency power amplifier, when the Doherty radio frequency power amplifier works, most of debugging signal power is generated by a mean power amplifier (namely PA 1), and the heat consumption is concentrated on the back surface of the mean power amplifier; therefore, in the embodiment of the present application, the thermoelectric conversion module 104 is disposed on the back of the average power amplifier, so that heat emitted by the Doherty radio frequency power amplifier can be converted into electric energy to the greatest extent. In addition, because the Doherty radio frequency power amplifier basically uses the average power amplifier when working, the heat emitted by the average power amplifier is collected to perform electric energy conversion, and the forwarded electric energy can achieve the effects of relative persistence and stability, so that the Doherty radio frequency power amplifier can be applied to more electric elements.
It can be determined, of course, according to the above-mentioned working principle of the Doherty rf power amplifier, that when the Doherty rf power amplifier is operated, although the operation time of the peak power amplifier 103 is not too long and the peak power amplifier 103 is operated with relatively large power, the Doherty rf power amplifier in this embodiment further includes a second thermal conductor 106, where the second thermal conductor 106 is disposed at a position corresponding to the peak power amplifier 103 on the second side, and the projected area of the second thermal conductor 106 and the peak power amplifier 103 on the circuit board 101 are the same.
In this example, because the working persistence of the peak power amplifier is not high, and because the peak power amplifier needs to work at high power and corresponding it is possible to instantaneously release a relatively large amount of heat, if the heat released by the peak power amplifier and the average power amplifier is converted at the same time, the voltage output by the thermoelectric conversion module is quite unstable, so that the use of converting electric energy is inconvenient.
In addition, based on another characteristic of the Doherty radio frequency power amplifier: the Doherty peak power amplifier (namely, PA2 and PA 3.) has great influence on the linearity performance of communication signals, and the overall saturated power of the Doherty radio frequency power amplifier can be improved and the linearity can be improved by improving the drain voltage (namely, VDD2 and vdd3.). Therefore, in this embodiment, the output end of the thermoelectric conversion module 104 may be further connected to the peak power amplifier (the connection structure between the thermoelectric conversion module 104 and the peak power amplifier is shown in schematic diagram 2), and the specific implementation may be:
the power-on module is the peak power amplifier; the output of the thermoelectric conversion module 104 is connected to the drain of the peak power amplifier 103.
When the Doherty radio frequency power amplifier comprises a plurality of peak power amplifiers, the output end of the thermoelectric conversion module is connected with the drain electrode of at least one of the plurality of peak power amplifiers (as shown in fig. 2).
Wherein the thermoelectric conversion module 104 may be a rectangular sheet structure. And the thermoelectric conversion module 104 includes a high temperature end and a low temperature end, wherein the high temperature end is connected to the second side of the circuit board.
The high-temperature end is connected to the second side of the circuit board through paste or elastic heat-conducting silica gel.
As shown in fig. 1, the thermoelectric conversion module 104 absorbs the heat energy generated during the operation of the average power amplifier (i.e., PA 1), so that the temperature at one end (high temperature end) of the thermoelectric conversion module rises and forms a temperature difference with the other end (low temperature end), thereby generating an electromotive force at an output end of the thermoelectric conversion module by using the seebeck effect of the semiconductor, and the output end is connected with a drain electrode of the peak power amplifier; as shown in fig. 2, the output end is connected with the drain electrode of the peak power amplifier (i.e., PA2, PA 3.), and the drain voltages of the peak power amplifier (i.e., VDD2, vddi.) of PA2, PA3 are superimposed with the voltage output from the output end, so that the drain voltage of the peak power amplifier is increased, the overall saturated power of the Doherty radio frequency power amplifier is increased, and the linearity performance is improved.
Compared with the traditional Doherty radio frequency power amplifier, the scheme provided by the embodiment of the application improves the conversion efficiency on the original basis, reduces the area of the thermoelectric conversion module, reduces the cost and improves the saturated power of the Doherty radio frequency power amplifier.
As shown in fig. 3, based on the Doherty radio frequency power amplifier provided in the foregoing embodiment, the embodiment of the present application further provides a communication device 300, where the communication device 300 is configured to implement a communication function, and the communication device 300 includes, in addition to the Doherty radio frequency power amplifier 301, a plurality of communication elements 302 with other functions, where in this embodiment, the communication elements 302 with other functions are combined with the Doherty radio frequency power amplifier 301 to implement each function of the communication device; the communication device 300 may be a mobile terminal or a base station, etc., and any communication device may be used as long as the Doherty rf power amplifier is applicable. Of course, based on the specific implementation of the communication device, the communication element 302 in this embodiment may include many specific implementations, which are not illustrated herein;
according to the structural description of the Doherty rf power amplifier in the above embodiment, the thermoelectric conversion module in the Doherty rf power amplifier may output electric energy to other electric devices, so in the communication device in this embodiment, the communication device 302 may include an electric communication device and other communication devices; in some cases, the power-consumption communication element can be connected with the output end of the thermoelectric conversion module of the Doherty radio frequency power amplifier, so that the electric energy output by the thermoelectric conversion module is effectively utilized.
In addition, for the communication device with high efficiency and linearity requirements, the output end of the thermoelectric conversion module of the Doherty radio frequency power amplifier 301 in the embodiment is connected with the drain electrode of the peak power amplifier in the Doherty radio frequency power amplifier 301. The design of the Doherty radio frequency power amplifier can be optimized, the saturated power of the Doherty radio frequency power amplifier 301 is improved, the efficiency of communication equipment can be improved, the power consumption is reduced, the cost is reduced, and the linearity is improved by matching with a carrier signal with a peak-to-average ratio; especially in the application scene of the Doherty technology, the linearity performance of the communication equipment can be improved, and the mutual interference of the communication equipment is reduced.
It will be appreciated by those skilled in the art that embodiments of the present application may be provided as a method, system, or computer program product. Accordingly, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present application may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present application without departing from the spirit or scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims and the equivalents thereof, the present application is intended to cover such modifications and variations.
Claims (7)
1. The utility model provides a Doherty radio frequency power amplifier which characterized in that, set up the mean power amplifier and the peak power amplifier of circuit board first side, still include:
a thermoelectric conversion module is arranged on a second side surface of the circuit board, which is opposite to the first side surface, and the output end of the thermoelectric conversion module is connected with an electricity utilization module on the circuit board; the thermoelectric conversion module is arranged at a position corresponding to the position of the average power amplifier, absorbs heat energy generated by the average power amplifier when the average power amplifier works, converts the absorbed heat energy into electric energy and inputs the electric energy to the power utilization module connected with the output end;
providing a first thermal conductor between the thermoelectric conversion module and the circuit board, wherein the first thermal conductor comprises a first portion and a second portion; wherein the first part is connected with the circuit board, and the second part is connected with the thermoelectric conversion module; and the first portion has a greater thermal conductivity than the second portion;
and a second heat conductor is arranged at a position of the second side surface corresponding to the peak power amplifier, and the projection area of the second heat conductor and the peak power amplifier on the circuit board is the same.
2. The Doherty radio frequency power amplifier of claim 1 wherein said power module is said peak power amplifier; the output of the thermoelectric conversion module is connected to the drain of the peak power amplifier.
3. The Doherty radio frequency power amplifier of claim 2 wherein the Doherty radio frequency power amplifier comprises a plurality of peak power amplifiers, and an output of the thermoelectric conversion module is connected to a drain of at least one of the plurality of peak power amplifiers.
4. The Doherty radio frequency power amplifier of any one of claims 1 to 3, wherein the thermoelectric conversion module is of a rectangular piece structure.
5. The Doherty radio frequency power amplifier of claim 4, wherein the thermoelectric conversion module comprises a high temperature end and a low temperature end, wherein the high temperature end is connected to the second side of the circuit board.
6. The Doherty radio frequency power amplifier of claim 5, wherein the high temperature side connection at the second side of the circuit board comprises:
the high-temperature end is connected to the second side of the circuit board through paste or elastic heat-conducting silica gel.
7. A communication device comprising a Doherty radio frequency power amplifier as claimed in any one of claims 1 to 6 and a communication element.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911295350.4A CN112994622B (en) | 2019-12-16 | 2019-12-16 | Doherty radio frequency power amplifier and communication equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911295350.4A CN112994622B (en) | 2019-12-16 | 2019-12-16 | Doherty radio frequency power amplifier and communication equipment |
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| CN112994622A CN112994622A (en) | 2021-06-18 |
| CN112994622B true CN112994622B (en) | 2023-12-29 |
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| KR20130049931A (en) * | 2011-11-07 | 2013-05-15 | 한국전자통신연구원 | Power amplifier improving power efficiency |
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| CN101931347A (en) * | 2010-07-23 | 2010-12-29 | 惠州Tcl移动通信有限公司 | Method for raising energy consumption efficiency and mobile terminal thereof, and use of thermoelectric conversion module |
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| CN107404290A (en) * | 2017-07-10 | 2017-11-28 | 东南大学 | The LDMOS power amplifiers with self-powered function of internet of things oriented |
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