CN106655893A - Module in chip and used for converting heat energy into electric energy - Google Patents
Module in chip and used for converting heat energy into electric energy Download PDFInfo
- Publication number
- CN106655893A CN106655893A CN201611211599.9A CN201611211599A CN106655893A CN 106655893 A CN106655893 A CN 106655893A CN 201611211599 A CN201611211599 A CN 201611211599A CN 106655893 A CN106655893 A CN 106655893A
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- CN
- China
- Prior art keywords
- chip
- module
- voltage
- energy
- electric
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
Abstract
The invention discloses a module in a chip and used for converting heat energy into electric energy, and aims to convert a large amount of heat released in large-scale computation of the chip into electric energy which can be utilized in equipment operation. According to the module used for converting the chip heat energy into electric energy, based on a seebeck effect in a packaging structure of the chip, electromotive force is generated through a temperature difference; then the generated electromotive force is processed into utility stable electromotive force through a series of modules of voltage stabilization, amplification and the like; next, the voltage is led out from the interior of a chip packaging block to the exterior of the packaging block, and an external module can utilize the voltage generated by the apparatus for driving; by virtue of the module, the heat generated in the chip can be converted into electric energy, so that waste of energy of the equipment can be lowered, and utilization rate of electric quantity of the equipment can be improved; and in addition, chip heat dissipation can be facilitated.
Description
Technical field
The present invention relates to it is a kind of be encapsulated in chip internal and the heat energy for sending of chip changed into electric energy and contributes to chip dissipate
The module of heat, can help chip internal radiating, and electric energy especially can be utilized and produced to chip liberated heat.
Background technology
Chip is the computing of the equipment such as computer, mobile phone and control core, is that the operation of the equipment such as computer is the most key
Part.But it can produce substantial amounts of heat in extensive running, raise chip temperature, and electric energy is changed into
Useless heat energy, the utilization rate for causing the equipment such as computer to electricity is not high, the waste of electricity, therefore how to chip institute
The recovery for giving off heat is also an important problem.
Current chip manufacturer energy is mainly concentrated on and how dispersed the great number heat for sending of chip, so as to lift core
The operating rate of piece, but ignores the recycling to heat, causes the loss of big energy.
The content of the invention
In view of the shortage of the technology for utilizing that gives off heat to chip above, it is an object of the invention to provide one kind is by chip
The great number converting heat for sending into electric energy a kind of module, and be conducive to radiating.
For achieving the above object and other purposes, the invention provides heat energy to be changed into a kind of chip internal the mould of electric energy
Block, the module utilizes chip heat electricity generation module, the module to include chip, substrate, electricity generation module, electricity generation module and core for a kind of
Piece is packaged together, and electricity generation module is temperature end with the contact jaw of chip, and electricity generation module is low-temperature end with the noncontact end of chip；
Chip is fixed on substrate.The voltage that electricity generation module is produced is guided to the outside of encapsulation chip by lead, for external module it is practical its
The electricity of generation.
Electricity generation module inside is containing using Seebeck effect thermo-electric generation circuit.
Electricity generation module inside is in order that voltage, size of current satisfaction requirement, it comprises multiple power generation circuits.
Contain voltage-stabilizing device, electric current, voltage amplifying device, voltage-stabilizing device, electric current, voltage amplifier in the inside of electricity generation module
Part is sequentially connected.
Together with electricity generation module is encapsulated in chip, and contact with chip.
Compared with prior art, the present invention can obtain following beneficial effect：
1st, into electric energy, for equipment, other modules carry out practicality to the converting heat that the present invention can send chip, have accomplished energy
The recycling of amount, makes equipment be improved the utilization rate of electricity,
2nd, the present invention absorbs heat that chip sends and is converted into electric energy, then the radiating to chip serves promotion
Effect.
Description of the drawings
Fig. 1 is the structure for longitudinally showing this new-generation module from chip.
Fig. 2 is Seebeck effect schematic diagram.
Fig. 3 is the structure of chip internal encapsulation.
Specific embodiment
Hereinafter there is particular specific embodiment to illustrate embodiments of the present invention.
Fig. 1,2,3 are referred to, it should however be clear that structure shown in this specification institute accompanying drawing, ratio, size etc., only coordinating explanation
Content described by book, for reader's understanding, is not limited to enforceable qualifications of the invention, therefore does not have technical
Essential meaning, the modification of any mechanism, proportionate relationship change or the adjustment of size, in the effect for not affecting the present invention can be generated
And under the purpose to be reached, all should fall in the range of disclosed technology contents.
Such as Fig. 1, the present invention provide it is a kind of be integrated in inside chip package block the heat energy produced by chip is changed into into electricity
Can module, carry out the loop of thermo-electric generation using Seebeck effect and carry out by the device of burning voltage and to voltage, electric current
Amplify and adjust, and inside it by multiple loops through connection in series-parallel, it utilizes the voltage that thermo-electric generation is produced, and electric current is again through steady
Pressure, size adjustment reaches the standard that external devices utilize and is powered.
The electricity generation module is encapsulated in the inside of chip, and it is simultaneously contacted with chip, absorbs the heat that chip sends, another
Face then keeps external temperature, and so, module two ends then produce temperature difference, can then make inside modules produce electricity according to Seebeck effect
Kinetic potential.
Heat is produced if chip is run, then the contact jaw temperature for causing two kinds of conductors has difference, then root
According to Seebeck effect, electrical potential difference will be in circuit produced, pin two ends have electrical potential difference, this electrical potential difference can be used for being set
Other standby modules provide energy, for example, be transferred to battery module and be charged, and being transferred to indicating lamp module carries out signal prompting
Etc..
Claims (6)
1. heat energy is changed into a kind of chip internal the module of electric energy, it is characterised in that：The module utilizes chip heat for one kind
Electricity generation module, the module includes chip, substrate, electricity generation module, electricity generation module together with chip package, electricity generation module and chip
Contact jaw be temperature end, the noncontact end of electricity generation module and chip is low-temperature end；Chip is fixed on substrate；Electricity generation module is produced
Raw voltage is guided to the outside of encapsulation chip by lead, for the practical electricity that it is produced of external module.
2. heat energy is changed into a kind of chip internal according to claim 1 the module of electric energy, it is characterised in that：Generating mould
Block inside is containing using Seebeck effect thermo-electric generation circuit.
3. heat energy is changed into a kind of chip internal according to claim 1 the module of electric energy, it is characterised in that：Generating mould
Block inside is in order that voltage, size of current satisfaction requirement, it comprises multiple power generation circuits.
4. heat energy is changed into a kind of chip internal according to claim 1 the module of electric energy, it is characterised in that：Generating mould
Voltage-stabilizing device, electric current, voltage amplifying device are contained in the inside of block, and voltage-stabilizing device, electric current, voltage amplifying device are sequentially connected.
5. heat energy is changed into a kind of chip internal according to claim 1 the module of electric energy, it is characterised in that：Generating mould
Together with block is encapsulated in chip, and contact with chip.
6. heat energy is changed into a kind of chip internal according to claim 1 the module of electric energy, it is characterised in that：Using plug
Bake effect carries out the loop of thermo-electric generation and regulation, and its is amplified by the device of burning voltage and to voltage, electric current
By multiple loops through connection in series-parallel, it utilizes the voltage that thermo-electric generation is produced, and again through voltage stabilizing, size adjustment reaches electric current for inside
The standard that external devices are utilized is powered；
The module two ends then produce temperature difference, can then make inside modules produce electromotive force according to Seebeck effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611211599.9A CN106655893A (en) | 2016-12-25 | 2016-12-25 | Module in chip and used for converting heat energy into electric energy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611211599.9A CN106655893A (en) | 2016-12-25 | 2016-12-25 | Module in chip and used for converting heat energy into electric energy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106655893A true CN106655893A (en) | 2017-05-10 |
Family
ID=58827741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611211599.9A Pending CN106655893A (en) | 2016-12-25 | 2016-12-25 | Module in chip and used for converting heat energy into electric energy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106655893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109818531A (en) * | 2019-01-17 | 2019-05-28 | 重庆蓝岸通讯技术有限公司 | High-speed Control chip thermoelectricity recovery structure based on Seebeck effect |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533808A (en) * | 2009-02-12 | 2009-09-16 | 深圳华为通信技术有限公司 | Energy dissipation device |
| CN201682722U (en) * | 2009-12-28 | 2010-12-22 | 深圳华为通信技术有限公司 | Data card |
| CN102130076A (en) * | 2010-12-25 | 2011-07-20 | 紫光股份有限公司 | Thermoelectric computer chip radiator |
| CN102396146A (en) * | 2009-04-15 | 2012-03-28 | 惠普开发有限公司 | Generating and using electricity derived from waste heat of an electrical appliance |
| CN203225684U (en) * | 2013-04-24 | 2013-10-02 | 深圳市金立通信设备有限公司 | Mobile terminal |
| WO2015185204A1 (en) * | 2014-06-02 | 2015-12-10 | Halil Kilic | Integrated circuit with cooling array |
| CN105305886A (en) * | 2015-11-02 | 2016-02-03 | 无锡海斯凯尔医学技术有限公司 | Heat energy treatment device for elastic detection equipment |
| CN105870083A (en) * | 2016-05-31 | 2016-08-17 | 福州大学 | Three-dimensional chip adopting micro-thermal electric generator and implementation method of chip |
-
2016
- 2016-12-25 CN CN201611211599.9A patent/CN106655893A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533808A (en) * | 2009-02-12 | 2009-09-16 | 深圳华为通信技术有限公司 | Energy dissipation device |
| CN102396146A (en) * | 2009-04-15 | 2012-03-28 | 惠普开发有限公司 | Generating and using electricity derived from waste heat of an electrical appliance |
| CN201682722U (en) * | 2009-12-28 | 2010-12-22 | 深圳华为通信技术有限公司 | Data card |
| CN102130076A (en) * | 2010-12-25 | 2011-07-20 | 紫光股份有限公司 | Thermoelectric computer chip radiator |
| CN203225684U (en) * | 2013-04-24 | 2013-10-02 | 深圳市金立通信设备有限公司 | Mobile terminal |
| WO2015185204A1 (en) * | 2014-06-02 | 2015-12-10 | Halil Kilic | Integrated circuit with cooling array |
| CN105305886A (en) * | 2015-11-02 | 2016-02-03 | 无锡海斯凯尔医学技术有限公司 | Heat energy treatment device for elastic detection equipment |
| CN105870083A (en) * | 2016-05-31 | 2016-08-17 | 福州大学 | Three-dimensional chip adopting micro-thermal electric generator and implementation method of chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109818531A (en) * | 2019-01-17 | 2019-05-28 | 重庆蓝岸通讯技术有限公司 | High-speed Control chip thermoelectricity recovery structure based on Seebeck effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |