CN112969303A - Circuit printing method based on 3D printing and prepared high-power circuit board - Google Patents
Circuit printing method based on 3D printing and prepared high-power circuit board Download PDFInfo
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- CN112969303A CN112969303A CN202110138208.XA CN202110138208A CN112969303A CN 112969303 A CN112969303 A CN 112969303A CN 202110138208 A CN202110138208 A CN 202110138208A CN 112969303 A CN112969303 A CN 112969303A
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- printing
- diamond
- circuit board
- ultrafast laser
- panel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
Abstract
The invention provides a circuit printing method based on 3D printing and a prepared high-power circuit board, which comprise the following steps: obtaining a diamond panel and carrying out pretreatment to obtain a flat diamond panel; setting ultrafast laser parameters, and ultrafast laser sintering the flat diamond panel to obtain blind holes penetrating through the upper surface and the lower surface of the flat diamond panel and obtain a processed diamond panel; fixing the processed diamond panel on a 3D printing platform, and inputting and setting printing parameters; and uniformly spreading AgCuTi powder on the upper surface and the lower surface of the diamond by adopting a powder spreader and leveling the AgCuTi powder, and controlling a 3D printing platform to print the upper surface and the lower surface of the processed diamond panel respectively according to printing parameters and a printing program to obtain the AgCuTi wire meeting the wiring requirement, thereby obtaining the double-layer circuit board. According to the invention, the AgCuTi wire printed by 3D printing is tightly combined with the diamond, and the obtained high-power circuit board can transmit high-frequency, high-speed and high-power.
Description
Technical Field
The invention relates to the field of 3D printing and the technical field of circuit printing, in particular to a circuit printing method based on a 3D printing method and a prepared high-power circuit board.
Background
With the rapid development of information technology, printed circuit boards are used as the key interconnection of most electrical and electronic devices, and their applications are more and more extensive, and their performance requirements are higher and higher. The mechanical support of the traditional printed circuit board is usually prepared by epoxy resin, glass fiber and polymer macromolecule, the thermal conductivity of the traditional printed circuit board is poor, and when an electronic element runs at high power, heat cannot be well dissipated so as to lead the temperature of the element to rise, so that the working efficiency of the element is reduced and even the element is damaged.
In order to overcome the above problems, it is proposed to use an insulating diamond as a circuit board material or a heat dissipation insulating layer to improve the heat dissipation efficiency of the circuit board. However, in the traditional copper-clad printing process, a circuit is etched on the surface of the diamond in a copper-clad manner, so that the circuit is poor in bonding with the diamond substrate and the insulating layer; the copper-clad printing process is complex, the copper-clad printing process needs to be prepared by processes such as film pressing, exposure, development, etching, film removing, washing and the like, and waste liquid generated in the etching process can cause environmental pollution. For example, patent CN101064991 discloses a technology: the technology can realize high-efficiency heat extraction of the circuit board, but fails to provide a solution for the problem of combination of the circuit structure layer and the diamond substrate; the used material is the diamond composite board, and the diamond composite board needs to be prepared by extruding, pressing, injecting, screen printing, spraying or pouring and the like, so that the process flow is very complex, and the heat conductivity can be reduced. For another example, patent CN101998758A discloses a technology: the amorphous diamond heat dissipation insulating layer is added between the printed circuit board and the copper circuit layer, the circuit is printed by laser etching of the diamond film and the copper coating mode, the technology obviously improves the heat dissipation effect, but the preparation of the diamond film deposited by the method and the traditional copper coating printing process are complex, and sp is compared with a diamond substrate3The amorphous diamond with the hybridization content of 50-70% has low heat conductivity, and the problem of combination of the diamond film and the copper wire after deposition cannot be solved.
Disclosure of Invention
The invention aims to provide a circuit printing method based on 3D printing and a prepared high-power circuit board, wherein AgCuTi active brazing filler metal is used as a wire material and can be tightly combined with diamond, so that the problem of poor bonding property between a metal wire and the diamond during the printing of the existing diamond substrate is solved; the 3D printing mode replaces the traditional copper-clad printing method, so that the printing process is simplified, and meanwhile, the generation of waste materials and waste liquid is avoided; the circuit printing can be completed on one device, and the production efficiency of the circuit board is improved.
In order to achieve the purpose, the invention provides the following scheme: the invention provides a circuit printing method based on 3D printing, which comprises the following steps:
s1, obtaining a diamond panel and preprocessing the diamond panel to obtain a flat diamond panel;
s2, setting ultrafast laser parameters, and ultrafast laser sintering the flat diamond panel according to the ultrafast laser parameters to obtain blind holes penetrating through the upper surface and the lower surface of the flat diamond panel and obtain a processed diamond panel;
s3, fixing the processed diamond panel on a 3D printing platform, and inputting and setting printing parameters;
and S4, uniformly spreading AgCuTi powder on the upper surface and the lower surface of the diamond by using a powder spreader, leveling, controlling a 3D printing platform to print the upper surface and the lower surface of the processed diamond panel respectively according to the printing parameters and the printing program to obtain AgCuTi wires meeting wiring requirements, and finally obtaining the double-layer circuit board.
Preferably, the diamond panel is a black polycrystalline diamond cuboid sheet.
Preferably, the pretreatment process is as follows: polishing the upper and lower surfaces of the diamond panel; and vertically fixing the polished diamond panel into a beaker containing alcohol, and drying the diamond panel after ultrasonic cleaning to obtain the diamond panel with a smooth surface.
Preferably, the ultrafast laser parameters include ultrafast laser power, ultrafast laser wavelength, ultrafast laser pulse width, ultrafast laser frequency, ultrafast laser spot diameter;
the power of the ultrafast laser is 10-70W; the ultrafast laser wavelength is 1064 nm; the pulse width of the ultrafast laser is 12 ps; the ultrafast laser frequency is 100-300 kHz; the diameter of the ultrafast laser spot is 1-100 μm.
Preferably, the blind holes are through holes, and the hole walls of the blind holes are conductive graphite formed by sintering diamond; the blind holes can also be subjected to a copper plating process.
Preferably, the printing parameters include laser power, spot diameter, scanning speed;
the laser power is 100-400W; the diameter of the laser spot is 50-500 mu m; the laser scanning speed is 200-1200 mm/s.
Preferably, the size of the AgCuTi powder is 200-400 meshes.
A high-power printed circuit board is manufactured by adopting the circuit printing method based on 3D printing.
Preferably, the high power printed circuit board can also be a single layer circuit board; and the upper surface of the single-layer circuit board is printed with an AgCuTi wire.
Preferably, the single-layer circuit board can be stacked to form a multi-layer circuit board according to the requirement.
The invention discloses the following technical effects:
(1) compared with the prior art, the invention adopts the single crystal or polycrystalline diamond cuboid sheet as the circuit substrate to replace the original diamond composite board and diamond deposition film, thereby simplifying the preparation process of the circuit substrate; the single crystal or polycrystalline diamond sheet has higher heat dissipation, insulativity and strength, and the performance of the circuit board is further improved;
(2) compared with the prior art, the method changes the original copper-clad printing method into a 3D printing AgCuTi circuit printing method, and the circuit printing process can be realized in one device; the 3D printing belongs to additive manufacturing, can avoid waste materials and waste liquid, is simple to operate, has high position precision, can print fine lines (less than or equal to 200 mu m), can better control the line width and the thickness, and is suitable for various wiring requirements; the AgCuTi wire has higher conductivity and large current-carrying capacity, and the high-power circuit board obtained by combining the AgCuTi wire with the diamond sheet with high heat dissipation and high insulation performance can be suitable for high-frequency high-speed high-power circuit transmission.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic flow chart of a 3D printing-based circuit printing method according to the present invention;
FIG. 2 is a schematic view of the blind hole processing of the present invention;
wherein: the laser processing device comprises a laser 1, a first reflector 2, a second reflector 3, an aperture 4, an attenuator 5, a shutter 6, a current detector 7, a diamond plate 8 and a processing blind hole 9, wherein the femtosecond laser, the first reflector 2, the second reflector 3, the aperture 5, the attenuator 6, the current detector 7, the diamond plate 8 and the processing blind hole 9 are respectively arranged on a substrate;
FIG. 3 is a schematic view of the AgCuTi wire processing of the present invention;
wherein: 10 is a laser system, 11 is tiled AgCuTi powder, 12 is a printed and molded AgCuTi wire, and 13 is a wire path which is not printed;
FIG. 4 is a schematic diagram of a two-layer circuit structure;
wherein: 14 is an AgCuTi printed wire on the upper surface of the diamond, and 15 is an AgCuTi printed wire on the lower surface of the diamond;
FIG. 5 is a schematic diagram of a multi-layer circuit structure;
wherein: 16 is an adhesive layer, 17 is a first layer circuit, and 18 is a second layer circuit.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Example 1
As shown in fig. 1, the present invention provides a circuit printing method based on 3D printing, comprising the steps of:
s1, preparing a circuit board, and preprocessing the diamond substrate to obtain the flat diamond panel.
Selecting a diamond panel with the size of 30mm multiplied by 15mm multiplied by 1mm, and polishing the upper surface and the lower surface of the diamond panel to ensure the parallelism and the flatness of the upper surface and the lower surface of the diamond panel; and vertically fixing the polished diamond panel into a beaker containing alcohol, and drying after ultrasonic cleaning to obtain the diamond panel 8 with a smooth surface.
And S2, processing blind holes, and adopting ultrafast laser sintering to penetrate through the blind holes on the upper and lower surfaces of the diamond.
Setting ultrafast laser parameters: the laser power is 40W, the wavelength is 1064nm, the pulse width is 12ps, the frequency is 300kHz, the spot diameter is 50 μm, the processing blind hole 9 with the diameter of 1mm is obtained by sintering and reaming, and a graphite layer with a certain thickness is obtained on the hole wall, as shown in figure 2.
S3, preparing for printing, namely fixing the processed diamond panel on a 3D printing platform, and inputting and setting printing parameters;
S4, uniformly spreading AgCuTi powder on the upper surface of the diamond by using a powder spreader, leveling, and controlling a 3D printing platform to print the diamond panel according to printing parameters and a printing program to obtain an AgCuTi wire meeting the wiring requirement;
uniformly spreading AgCuTi powder 11 with the size of 300 meshes on the surface of the diamond by using a powder spreader, strickling, starting a printing program, and obtaining an AgCuTi printed wire 14 on the upper surface of the diamond; through the display screen, the line width of the obtained AgCuTi printed wire 14 on the upper surface of the diamond was observed to be 200 μm, and the wire was well bonded to the diamond face plate 8, as shown in fig. 3.
And (3) circuit printing of the lower surface, namely fixing the lower surface of the diamond panel on a 3D printing platform upwards, uniformly spreading 300-mesh AgCuTi powder 11 on the surface of the diamond by using a powder spreader and scraping, starting a printing program to obtain the AgCuTi printed wire 15 of the lower surface of the diamond and obtain a double-layer circuit board, wherein the double-layer circuit board is shown in figure 4. The prepared high-power circuit board has high electrical conductivity and heat dissipation, and is suitable for high-speed high-frequency high-power transmission.
The high-power circuit board can also be a single-layer circuit board, the single-layer circuit board is only printed with AgCuTi wires on the upper surface, and a plurality of single-layer circuit boards can be stacked into a multi-layer circuit board structure through blind holes, as shown in fig. 5.
Example 2
The difference from example 1 is that in example 2, AgCuTi powder 11 was subjected to powder-laying sintering 2 times, and the other conditions were the same as example 1. Compared with the embodiment 1, the thickness of the AgCuTi lead 14 is increased, the line width is slightly widened, the bonding strength of the lead and the diamond panel 8 is increased, and the prepared high-power circuit board has better conductivity.
Example 3
The difference from the embodiment 1 is that the embodiment 3 uses the laser power of 400W, and the other conditions are the same as the embodiment 1. Compared with the embodiment 1, the line width of the AgCuTi printed wire 14 on the upper surface of the diamond is increased, and the thickness is thinned; the prepared high-power circuit board has high electrical conductivity and heat dissipation, and is suitable for high-speed high-frequency high-power transmission.
Example 4
The difference from example 1 is that example 4 uses a spot diameter of 200 μm. The other conditions were the same as in example 1. Compared with the embodiment 1, the line width and the thickness of the AgCuTi printed lead 14 on the upper surface of the diamond are increased, and the bonding strength of the lead and the diamond panel is reduced; the prepared high-power circuit board has high electrical conductivity and heat dissipation, and is suitable for high-speed high-frequency high-power transmission.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements of the technical solutions of the present invention can be made by those skilled in the art without departing from the spirit of the present invention, and the technical solutions of the present invention are within the scope of the present invention defined by the claims.
Claims (10)
1. A circuit printing method based on 3D printing is characterized by comprising the following steps:
s1, obtaining a diamond panel and preprocessing the diamond panel to obtain a flat diamond panel;
s2, setting ultrafast laser parameters, and ultrafast laser sintering the flat diamond panel according to the ultrafast laser parameters to obtain blind holes penetrating through the upper surface and the lower surface of the flat diamond panel and obtain a processed diamond panel;
s3, fixing the processed diamond panel on a 3D printing platform, and inputting and setting printing parameters;
and S4, uniformly spreading AgCuTi powder on the upper surface and the lower surface of the diamond by using a powder spreader, leveling, controlling a 3D printing platform to print the upper surface and the lower surface of the processed diamond panel respectively according to the printing parameters and the printing program to obtain AgCuTi wires meeting wiring requirements, and finally obtaining the double-layer circuit board.
2. The 3D printing-based circuit printing method of claim 1, wherein the diamond panel is a black polycrystalline diamond cuboid sheet.
3. The 3D printing-based circuit printing method according to claim 1, wherein the preprocessing is performed by: polishing the upper and lower surfaces of the diamond panel; and vertically fixing the polished diamond panel into a beaker containing alcohol, and drying the diamond panel after ultrasonic cleaning to obtain the diamond panel with a smooth surface.
4. The 3D printing-based circuit printing method according to claim 1, wherein the ultrafast laser parameters include ultrafast laser power, ultrafast laser wavelength, ultrafast laser pulse width, ultrafast laser frequency, ultrafast laser spot diameter;
the power of the ultrafast laser is 10-70W; the ultrafast laser wavelength is 1064 nm; the pulse width of the ultrafast laser is 12 ps; the ultrafast laser frequency is 100-300 kHz; the diameter of the ultrafast laser spot is 1-100 μm.
5. The 3D printing-based circuit printing method according to claim 1, wherein the blind holes are through holes, and the walls of the blind holes are conductive graphite sintered by diamond; the blind holes can also be subjected to a copper plating process.
6. The 3D printing-based circuit printing method according to claim 1, wherein the printing parameters include laser power, spot diameter, scanning speed;
the laser power is 100-400W; the diameter of the laser spot is 50-500 mu m; the laser scanning speed is 200-1200 mm/s.
7. The 3D printing-based circuit printing method according to claim 1, wherein the AgCuTi powder is 200-400 mesh in size.
8. A high power printed circuit board manufactured using the 3D printing-based circuit printing method according to any one of claims 1 to 7.
9. The high power circuit board of claim 8, wherein the high power printed circuit board can also be a single layer circuit board; and the upper surface of the single-layer circuit board is printed with an AgCuTi wire.
10. The 3D printing-based circuit printing method according to claim 9, wherein the single-layer circuit board can be stacked to form a multi-layer circuit board as required.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110138208.XA CN112969303A (en) | 2021-02-01 | 2021-02-01 | Circuit printing method based on 3D printing and prepared high-power circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110138208.XA CN112969303A (en) | 2021-02-01 | 2021-02-01 | Circuit printing method based on 3D printing and prepared high-power circuit board |
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| CN112969303A true CN112969303A (en) | 2021-06-15 |
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| CN202110138208.XA Pending CN112969303A (en) | 2021-02-01 | 2021-02-01 | Circuit printing method based on 3D printing and prepared high-power circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023236412A1 (en) * | 2022-06-08 | 2023-12-14 | 芯体素(杭州)科技发展有限公司 | High-precision multilayer circuit board and 3d printing preparation method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031638A (en) * | 1998-07-14 | 2000-01-28 | Sumitomo Electric Ind Ltd | Formation of conductive through-hole in diamond plate, and the diamond plate |
| CN104822223A (en) * | 2015-05-11 | 2015-08-05 | 惠宇 | Ceramic-based circuit board and preparation method thereof |
| CN111992708A (en) * | 2020-08-30 | 2020-11-27 | 中南大学 | Method for preparing high-performance diamond/copper composite material |
-
2021
- 2021-02-01 CN CN202110138208.XA patent/CN112969303A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031638A (en) * | 1998-07-14 | 2000-01-28 | Sumitomo Electric Ind Ltd | Formation of conductive through-hole in diamond plate, and the diamond plate |
| CN104822223A (en) * | 2015-05-11 | 2015-08-05 | 惠宇 | Ceramic-based circuit board and preparation method thereof |
| CN111992708A (en) * | 2020-08-30 | 2020-11-27 | 中南大学 | Method for preparing high-performance diamond/copper composite material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023236412A1 (en) * | 2022-06-08 | 2023-12-14 | 芯体素(杭州)科技发展有限公司 | High-precision multilayer circuit board and 3d printing preparation method therefor |
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Application publication date: 20210615 |
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