CN112960914A - Modified glass fiber and copper-clad plate - Google Patents
Modified glass fiber and copper-clad plate Download PDFInfo
- Publication number
- CN112960914A CN112960914A CN202110140087.2A CN202110140087A CN112960914A CN 112960914 A CN112960914 A CN 112960914A CN 202110140087 A CN202110140087 A CN 202110140087A CN 112960914 A CN112960914 A CN 112960914A
- Authority
- CN
- China
- Prior art keywords
- glass fiber
- modified glass
- copper
- polyamic acid
- clad plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/66—Chemical treatment, e.g. leaching, acid or alkali treatment
- C03C25/68—Chemical treatment, e.g. leaching, acid or alkali treatment by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/24—Coatings containing organic materials
- C03C25/26—Macromolecular compounds or prepolymers
- C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C03C25/328—Polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2485/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Derivatives of such polymers
- C08J2485/02—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Derivatives of such polymers containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Abstract
The invention belongs to the field of new materials, and discloses a modified glass fiber which is obtained by modifying the surface of a glass fiber by using a polyamide acid solution; the polyamic acid solution is synthesized from pyromellitic dianhydride and 4, 4' -diaminodiphenyl ether and/or 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane. The fiber adopts PMDA (pyromellitic dianhydride) to respectively synthesize two PAA (polyamide acid) with ODA (4, 4' -diaminodiphenyl ether) and 6FAP (2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane), and the two PAA can be modified with glass fiber, so that the expansion coefficient of a copper-clad plate is obviously reduced when the copper-clad plate is prepared by the modified glass fiber.
Description
Technical Field
The invention relates to the field of new materials, in particular to a modified glass fiber and a copper-clad plate.
Background
At present, copper-clad plates for IC packaging carrier plates are mainly made of Mitsubishi gas BT plates, and the main properties of the copper-clad plates are shown in the following table 1
TABLE 1 trade mark and main characteristic index of BT resin copper-clad plate for Mitsubishi gas semiconductor packaging carrier plate
The requirement on the expansion coefficient and the rigidity requirement of the IC packaging carrier plate are particularly strict, the IC packaging carrier plate is related to a resin formula and is also greatly related to glass cloth, the expansion coefficient and the rigidity of the Mitsubishi gas BT resin formula are good, but the expansion coefficient before Tg is larger and reaches 15 ppm/DEG C due to the change of tension of the traditional glass cloth because of twisting woven cloth.
Therefore, the technical problem to be solved by the scheme is as follows: how to improve the expansion coefficient of the copper-clad plate from the perspective of glass fiber.
Disclosure of Invention
The invention aims to provide a modified glass fiber, which adopts PMDA (pyromellitic dianhydride) to respectively synthesize two PAA (polyamide acid) with ODA (4, 4' -diaminodiphenyl ether) and 6FAP (2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane), and adopts the two PAA and the glass fiber to modify, so that the expansion coefficient of a copper-clad plate is obviously reduced when the copper-clad plate is prepared by the modified glass fiber.
The specific scheme of the invention is as follows: a modified glass fiber is obtained by modifying the surface of a glass fiber by using a polyamic acid solution;
the polyamic acid solution is synthesized from pyromellitic dianhydride and 4, 4' -diaminodiphenyl ether and/or 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane.
In the modified glass fiber, the glass fiber is subjected to surface oxidation etching treatment before modification.
In the modified glass fiber, the molar ratio of dianhydride to diamine in the polyamic acid solution is 1-1.1: 1.
in the modified glass fiber, the method for synthesizing the polyamic acid solution comprises the following steps:
weighing 4, 4' -diaminodiphenyl ether and/or 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, dissolving in a polar solvent N, N-dimethylacetamide under the condition of ice-water bath, adding pyromellitic dianhydride in batches after complete dissolution, and stirring for reaction to obtain a polyamic acid solution.
In the modified glass fiber, the surface modification process comprises the following steps: diluting the polyamic acid solution to a solid content of 4-6%; immersing the glass fiber into the polyamic acid solution through a wire drawing device;
then the glass fiber is heated at 200-300 to imidize the polyamic acid on the surface.
In the surface modification process of the modified glass fiber, the surface of the modified glass fiber is heated for 2 hours at 200 ℃ and then heated for 0.5 hour at 240 ℃ to imidize the polyamic acid on the surface.
Meanwhile, the invention also discloses a copper-clad plate, which comprises the following steps:
step 1: coating BT resin on the surface of the modified glass fiber by adopting the modified glass fiber;
step 2: chopping the modified glass fiber for protecting the BT resin obtained in the step (1), arranging the chopped modified glass fiber into layers with preset thickness in a transverse and vertical mode, and paving copper foils on two surfaces of each layer to obtain a composite raw material;
and step 3: and (3) carrying out hot pressing on the composite raw material obtained in the step (2) to obtain the copper-clad plate.
In the copper-clad plate, in the step 1, the modified glass fiber is immersed in a BT resin solution, wherein the BT resin solution comprises the following components in parts by weight: 50 parts of bismaleimide-triazine resin, 15 parts of polyphosphate flame retardant, 35 parts of propylene glycol methyl ether solvent and 0.05 part of catalyst.
In the copper-clad plate, the length of the chopped modified glass fiber is 3-5 mm; the thickness of the layer before hot pressing is 0.06-0.08 mm.
In the copper-clad plate, the hot-pressing technological parameters are as follows: heating to 200 deg.C at a rate of 2.5 deg.C/min, and pressing for 120 min.
Compared with the prior art, the invention has the following advantages and effects:
after the glass fiber is treated, the surface defects of the glass fiber are improved, the mechanical property of the GF/BT composite material is enhanced, the glass fiber does not need to be twisted, no stress residue exists, the CTE is stable after the glass fiber is pressed into a plate, the CTE before and after Tg can be kept at 5-6 ppm/DEG C, and the performance of the IC packaging carrier plate is greatly improved.
Detailed Description
The invention will now be further described with reference to the following examples, which are not to be construed as limiting the invention in any way, and any limited number of modifications which can be made within the scope of the claims of the invention are still within the scope of the claims of the invention.
Example 1:
a modified glass fiber prepared by the steps of:
step 1: carrying out surface oxidation etching treatment on glass fibers (the glass fibers without surface treatment are marked as GF-0), and carrying out oxidation etching on the GF-0 for 1h by using concentrated HNO3, and marking as GF;
step 2: PAA solution was diluted to 5% with DMAc (N, N-dimethylacetamide);
the preparation method of the PAA in the step comprises the following steps:
the preparation method comprises the steps of preparing PMDA (pyromellitic dianhydride) and ODA (4, 4 ' -diaminodiphenyl ether) according to the molar ratio of 1.015: 1, dissolving the 4, 4 ' -diaminodiphenyl ether in a polar solvent DMAc under the condition of ice-water bath, adding PMDA in batches after the 4, 4 ' -diaminodiphenyl ether is completely dissolved, and stirring for 24 hours to obtain a yellow and viscous ODA-PMDA PAA solution.
And step 3: preparing PAA-GF through a wire drawing device, wherein the wire drawing device comprises a raw material roller, a first supporting roller, a second supporting roller and a press roller between the first supporting roller and the second supporting roller, a material groove is arranged below the press roller, PAA is arranged in the material groove, and the press roller presses fibers into the material groove to realize surface modification of the PAA on the fibers;
and 4, step 4: and (3) putting the PAA-GF in an oven for thermal imidization at the temperature of 200 ℃/2h +240 ℃/0.5h to obtain the GF treated by the ODA-PMDA PI, and marking the GF as PI 2-GF-1.
Example 2
The same as example 1 except that ODA was replaced with 6FAP (2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane), the product was designated as PI 1-GF-1.
Example 3
A modified glass fiber prepared by the steps of:
step 1: performing surface oxidation etching treatment on glass fiber (the glass fiber without surface treatment is marked as GF-0), and performing oxidation etching on the GF-0 for 0.5h by using concentrated HNO3, and marking as GF;
step 2: PAA solution was diluted to 4% with DMAc (N, N-dimethylacetamide);
the preparation method of the PAA in the step comprises the following steps:
the preparation method comprises the steps of preparing PMDA (pyromellitic dianhydride) and ODA (4, 4 '-diaminodiphenyl ether) according to the molar ratio of 1.1: 1, dissolving the 4, 4' -diaminodiphenyl ether in a polar solvent DMAc under the condition of ice-water bath, adding PMDA in batches after complete dissolution, and stirring for 24 hours to obtain a yellow and viscous ODA-PMDA PAA solution.
And step 3: preparing PAA-GF through a wire drawing device, wherein the wire drawing device comprises a raw material roller, a first supporting roller, a second supporting roller and a press roller between the first supporting roller and the second supporting roller, a material groove is arranged below the press roller, PAA is arranged in the material groove, and the press roller presses fibers into the material groove to realize surface modification of the PAA on the fibers;
and 4, step 4: and (3) putting the PAA-GF in an oven for thermal imidization under the conditions of 200 ℃/3h +240 ℃/0.5h to obtain the GF treated by the ODA-PMDA PI, and marking the GF as PI 2-GF-2.
Example 4
A modified glass fiber prepared by the steps of:
step 1: performing surface oxidation etching treatment on glass fiber (the glass fiber without surface treatment is marked as GF-0), and performing oxidation etching on the GF-0 for 1.5h by using concentrated HNO3, and marking as GF;
step 2: PAA solution was diluted to 6% with DMAc (N, N-dimethylacetamide);
the preparation method of the PAA in the step comprises the following steps:
the method comprises the steps of preparing PMDA (pyromellitic dianhydride) and ODA (4, 4 ' -diaminodiphenyl ether) according to the molar ratio of 1: 1, dissolving the 4, 4 ' -diaminodiphenyl ether in a polar solvent DMAc under the condition of ice-water bath, adding PMDA in batches after the 4, 4 ' -diaminodiphenyl ether is completely dissolved, and stirring for 24 hours to obtain a yellow and viscous ODA-PMDA PAA solution.
And step 3: preparing PAA-GF through a wire drawing device, wherein the wire drawing device comprises a raw material roller, a first supporting roller, a second supporting roller and a press roller between the first supporting roller and the second supporting roller, a material groove is arranged below the press roller, PAA is arranged in the material groove, and the press roller presses fibers into the material groove to realize surface modification of the PAA on the fibers;
and 4, step 4: and (3) putting the PAA-GF in an oven for thermal imidization at the temperature of 200 ℃/3h +240 ℃/1h to obtain ODA-PMDA PI treated GF, which is marked as PI 2-GF-3.
Example 5
A modified glass fiber prepared by the steps of:
step 1: performing surface oxidation etching treatment on glass fiber (the glass fiber without surface treatment is marked as GF-0), and performing oxidation etching on the GF-0 for 0.5h by using concentrated HNO3, and marking as GF;
step 2: PAA solution was diluted to 6% with DMAc (N, N-dimethylacetamide);
the preparation method of the PAA in the step comprises the following steps:
the preparation method comprises the steps of preparing PMDA (pyromellitic dianhydride) and 6FAP according to the molar ratio of 1.1: 1, dissolving 6FAP in a polar solvent DMAc under the condition of ice-water bath, adding PMDA in batches after complete dissolution, and stirring for 24 hours to obtain a yellow and viscous 6FAP-PMDA PAA solution.
And step 3: preparing PAA-GF through a wire drawing device, wherein the wire drawing device comprises a raw material roller, a first supporting roller, a second supporting roller and a press roller between the first supporting roller and the second supporting roller, a material groove is arranged below the press roller, PAA is arranged in the material groove, and the press roller presses fibers into the material groove to realize surface modification of the PAA on the fibers;
and 4, step 4: and (3) placing the PAA-GF in an oven for thermal imidization at the temperature of 220 ℃/2.5h +260 ℃/0.5h to obtain 6FAP-PMDA PI treated GF, which is recorded as PI 1-GF-2.
Example 6
A modified glass fiber prepared by the steps of:
step 1: performing surface oxidation etching treatment on glass fiber (the glass fiber without surface treatment is marked as GF-0), and performing oxidation etching on the GF-0 for 1.5h by using concentrated HNO3, and marking as GF;
step 2: PAA solution was diluted to 4% with DMAc (N, N-dimethylacetamide);
the preparation method of the PAA in the step comprises the following steps:
the preparation method comprises the steps of preparing PMDA (pyromellitic dianhydride) and 6FAP according to the molar ratio of 1: 1, dissolving 6FAP in a polar solvent DMAc under the condition of ice-water bath, adding PMDA in batches after complete dissolution, and stirring for 24 hours to obtain a yellow and viscous 6FAP-PMDA PAA solution.
And step 3: preparing PAA-GF through a wire drawing device, wherein the wire drawing device comprises a raw material roller, a first supporting roller, a second supporting roller and a press roller between the first supporting roller and the second supporting roller, a material groove is arranged below the press roller, PAA is arranged in the material groove, and the press roller presses fibers into the material groove to realize surface modification of the PAA on the fibers;
and 4, step 4: and (3) placing the PAA-GF in an oven for thermal imidization at the temperature of 240 ℃/2.5h +280 ℃/1h to obtain 6FAP-PMDA PI treated GF, which is recorded as PI 1-GF-3.
Example 7
The copper-clad plate is prepared by adopting the products of the embodiments 1 to 6, and the specific method comprises the following steps:
50 parts of BT glue solution bismaleimide-triazine resin, 15 parts of polyphosphate flame retardant, 35 parts of propylene glycol methyl ether solvent and 0.05 part of catalyst which are well prepared by soaking PI2-GF-1 are baked for 3-5 minutes at 100-200 ℃ to obtain semi-cured BT composite fiber, the fiber is chopped into a certain size, is horizontally and vertically arranged according to the thickness requirement, is coated with copper foil on two sides, is separated by a steel plate, is put into a hot press, is heated to 200 ℃ at the heating rate of 2.5 ℃/minute and is pressed for 120 minutes to obtain the copper-clad plate 1 for the IC carrier plate.
PI2-GF-2, PI2-GF-3, PI1-GF-1, PI1-GF-2 and PI1-GF-3 are respectively adopted to prepare the copper-clad plate 2-6 according to the method.
The expansion coefficient of each product was measured, and the results were as follows:
after the glass fiber is treated, the surface defects of the glass fiber are improved, the mechanical property of the GF/BT composite material is enhanced, the glass fiber does not need to be twisted, no stress residue exists, the CTE is stable after the glass fiber is pressed into a plate, the CTE before and after Tg can be kept at 5-6 ppm/DEG C, and the performance of the IC packaging carrier plate is greatly improved.
Claims (10)
1. A modified glass fiber is characterized in that the modified glass fiber is obtained by modifying the surface of a glass fiber by using a polyamic acid solution;
the polyamic acid solution is synthesized from pyromellitic dianhydride and 4, 4' -diaminodiphenyl ether and/or 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane.
2. The modified glass fiber of claim 1, wherein prior to modification, the glass fiber is subjected to a surface oxidation etching treatment.
3. The modified glass fiber according to claim 1, wherein the molar ratio of dianhydride to diamine in the polyamic acid solution is 1 to 1.1: 1.
4. the modified glass fiber of claim 3, wherein the polyamic acid solution is synthesized by:
weighing 4, 4' -diaminodiphenyl ether and/or 2, 2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane, dissolving in a polar solvent N, N-dimethylacetamide under the condition of ice-water bath, adding pyromellitic dianhydride in batches after complete dissolution, and stirring for reaction to obtain a polyamic acid solution.
5. The modified glass fiber of claim 1, wherein the surface modification process is: diluting the polyamic acid solution to a solid content of 4-6%; immersing the glass fiber into the polyamic acid solution through a wire drawing device;
then the glass fiber is heated at 200-300 to imidize the polyamic acid on the surface.
6. The modified glass fiber of claim 5, wherein the surface modification process comprises heating at 200 ℃ for 2h, and then at 240 ℃ for 0.5h to imidize the polyamic acid on the surface.
7. The copper-clad plate is characterized by comprising the following steps:
step 1: coating BT resin on the surface of the modified glass fiber by using the modified glass fiber as claimed in any one of claims 1 to 6;
step 2: chopping the modified glass fiber for protecting the BT resin obtained in the step (1), arranging the chopped modified glass fiber into layers with preset thickness in a transverse and vertical mode, and paving copper foils on two surfaces of each layer to obtain a composite raw material;
and step 3: and (3) carrying out hot pressing on the composite raw material obtained in the step (2) to obtain the copper-clad plate.
8. The copper-clad plate according to claim 7, wherein in the step 1, the modified glass fiber is immersed in a BT resin solution, and the BT resin solution comprises the following components in parts by weight: 50 parts of bismaleimide-triazine resin, 15 parts of polyphosphate flame retardant, 35 parts of propylene glycol methyl ether solvent and 0.05 part of catalyst.
9. The copper-clad plate according to claim 7, wherein the length of the chopped modified glass fiber is 3-5 mm; the thickness of the layer before hot pressing is 0.06-0.08 mm.
10. The copper-clad plate according to claim 7, wherein the hot-pressing process parameters are as follows: heating to 200 deg.C at a rate of 2.5 deg.C/min, and pressing for 120 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110140087.2A CN112960914A (en) | 2021-02-01 | 2021-02-01 | Modified glass fiber and copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110140087.2A CN112960914A (en) | 2021-02-01 | 2021-02-01 | Modified glass fiber and copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112960914A true CN112960914A (en) | 2021-06-15 |
Family
ID=76273101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110140087.2A Pending CN112960914A (en) | 2021-02-01 | 2021-02-01 | Modified glass fiber and copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112960914A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011874A (en) * | 2007-01-22 | 2007-08-08 | 浙江大学 | Lightening fire resistant polymer porous membrane laminated composite material and manufacturing method thereof |
| CN102459466A (en) * | 2009-04-03 | 2012-05-16 | 株式会社斗山 | Polyamic acid solution, polyimide resin and a soft metal-foil laminate employing the same |
| CN104191627A (en) * | 2014-09-23 | 2014-12-10 | 山东中天华德集团有限公司 | Production device and preparation method of glass fiber reinforced polyimide film |
| US20160009882A1 (en) * | 2013-02-27 | 2016-01-14 | Korea Advanced Institute Of Science And Technology | Method of manufacturing colorless transparent polyimide film having impregnated glass fabric and of flattening surface thereof |
| CN105625041A (en) * | 2015-12-25 | 2016-06-01 | 广东生益科技股份有限公司 | Shape-finalized polyimide fabric and manufacturing method thereof |
-
2021
- 2021-02-01 CN CN202110140087.2A patent/CN112960914A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011874A (en) * | 2007-01-22 | 2007-08-08 | 浙江大学 | Lightening fire resistant polymer porous membrane laminated composite material and manufacturing method thereof |
| CN102459466A (en) * | 2009-04-03 | 2012-05-16 | 株式会社斗山 | Polyamic acid solution, polyimide resin and a soft metal-foil laminate employing the same |
| US20160009882A1 (en) * | 2013-02-27 | 2016-01-14 | Korea Advanced Institute Of Science And Technology | Method of manufacturing colorless transparent polyimide film having impregnated glass fabric and of flattening surface thereof |
| CN104191627A (en) * | 2014-09-23 | 2014-12-10 | 山东中天华德集团有限公司 | Production device and preparation method of glass fiber reinforced polyimide film |
| CN105625041A (en) * | 2015-12-25 | 2016-06-01 | 广东生益科技股份有限公司 | Shape-finalized polyimide fabric and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 张耀明等主编: "《玻璃纤维与矿物棉全书》", 31 March 2001, 化学工业出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI544031B (en) | Polyimide resin, thin film and method for manufacturing thereof | |
| US20090069532A1 (en) | Polyimide Film | |
| KR20140114953A (en) | Polyimide Film | |
| CN106810692B (en) | Preparation method of polyamic acid solution and polyimide film | |
| CN103232609B (en) | A kind of preparation method of flyash modified nano aluminium oxide/polyimide composite film | |
| KR20230157271A (en) | Polyimide film | |
| KR101493595B1 (en) | Polyimide Film | |
| KR20200030268A (en) | Polyimide Film with Improved Surface Property and Method for Preparing the Same | |
| KR101444694B1 (en) | Flexible metal-clad laminate manufacturing method thereof | |
| TW201819294A (en) | Polyimide film for roll-type graphitization and method for manufacturing graphite film wherein the polyimide film is obtained from the reaction of diamine compound and dianhydride to provide a proper mechanical strength for avoiding cracks or breakages | |
| KR101644483B1 (en) | Polyimide film | |
| JP7461475B2 (en) | Polyimide film, its manufacturing method, and soft metal foil laminate containing the same | |
| KR101232587B1 (en) | Polyimde Film and Method for Preparing the Same | |
| KR20160094551A (en) | Polyamic acid composition and polyimide substrate | |
| KR102347589B1 (en) | Low Dielectric Polyimide Film and Manufacturing Method Thereof | |
| CN112960914A (en) | Modified glass fiber and copper-clad plate | |
| CN110272549B (en) | Method for producing polyimide film | |
| KR20150095113A (en) | Polyimide film | |
| KR101608922B1 (en) | Polyimide film with improved adhesion and chemical resistance properties | |
| KR102617724B1 (en) | Polyimide film WITH HIGH DIMENSIONAL STABILTY and manufacturing method thereof | |
| CN111057256B (en) | Preparation method of size-stable polyimide film | |
| TW202227533A (en) | Polyimide film, method of producing the same, flexible metal foil clad laminate and electronic component containing the same | |
| JP4737666B2 (en) | Laminate for wiring board | |
| KR20160077479A (en) | Manufacturing method of polyimide precursor solution, polyimide film manufactured using the same | |
| TWI836691B (en) | Polyimide film, flexible metal foil laminate and electronic part including the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210615 |