CN117411549B - Communication equipment and satellite - Google Patents
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- CN117411549B CN117411549B CN202311700338.3A CN202311700338A CN117411549B CN 117411549 B CN117411549 B CN 117411549B CN 202311700338 A CN202311700338 A CN 202311700338A CN 117411549 B CN117411549 B CN 117411549B
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/11—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
- H04B10/118—Arrangements specific to free-space transmission, i.e. transmission through air or vacuum specially adapted for satellite communication
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/27—Arrangements for networking
- H04B10/278—Bus-type networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/564—Power control
Abstract
The invention relates to the technical field of heat dissipation, and discloses communication equipment and a satellite, wherein the communication equipment comprises: the heat bus is provided with opposite connecting end faces and an externally-expanded mounting face which is used for conducting heat and is connected with an external mounting foundation, and the connecting end faces are provided with connecting points which are in one-to-one correspondence with the power components; the power components are located on one side, far away from the external expansion mounting surface, of the connecting end face and are respectively in thermal connection with the corresponding connecting points. The number of the thermal interfaces on the basis of external installation is simplified, and the heat exchange efficiency is improved.
Description
Technical Field
The present invention relates to the field of thermal control technologies, and in particular, to a communication device and a satellite.
Background
As the development trend of space communication is more remarkable, such as high speed, deep space and networking, the space laser communication technology becomes an important development direction due to the characteristics of high transmission rate, high bandwidth and low cost, and at present, the construction of the space-based internet has been developed in multiple countries, and the space laser communication equipment is faced with the trend of huge quantity demand and tension of progress requirement.
The thermal design is an important problem in the design of space laser communication load, and relates to various problems such as performance, service life and safety of the load, and the thermal design mainly comprises thermal control design, production and verification, wherein the thermal control design is based on a space thermal environment and a load working mode, analyzes the temperature of a key part component under a main working condition, designs a proper thermal transformation scheme to meet the temperature requirement of equipment, and comprises preparation and installation implementation of a thermal control product, and the thermal control verification mainly comprises thermal circulation, thermal vacuum and other tests. At present, the conventional thermal control method for the space laser load mainly comprises two types of passive thermal control and active thermal control. Passive thermal control refers to temperature control by means of optical materials, coatings, phase-change heat storage, protection structures and the like. And the active thermal control adopts active heating, a fluid loop and other technologies to realize temperature control.
Along with the increasing demand of communication rate, the heat flux density of the chip is greatly improved, and the existing heat control method has the problems of weak design adaptability and over-design, and is particularly characterized by low heat control efficiency, weak adaptability to heat environment, complex design, excessive occupation of heat control resources and the like. Particularly, in the related technical scheme, heat dissipation paths are designed separately for different power components such as an optical amplifying component, a power component, a camera component, a motor component, a fast-reflection component and the like in the space laser communication equipment, and heat is transmitted to a satellite body respectively, so that too many heat interfaces are formed on the surface of an external installation foundation (such as the satellite body), and the heat exchange efficiency of the power components is low.
Disclosure of Invention
The invention discloses communication equipment and a satellite, which are used for externally installing a thermal interface on a basic surface and improving heat exchange efficiency.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, there is provided a communication device comprising: the heat bus is provided with opposite connecting end faces and an externally-expanded mounting face which is used for conducting heat and is connected with an external mounting foundation, and the connecting end faces are provided with connecting points which are in one-to-one correspondence with the power components; the power components are located on one side, far away from the external expansion mounting surface, of the connecting end face and are respectively in thermal connection with the corresponding connecting points.
The heat of the power components is uniformly concentrated to the heat bus through the connecting end face, and then the heat is transferred to the external installation foundation through the external expansion installation face, so that each power component does not need to be respectively designed with a heat dissipation path to be in thermal connection with the external installation foundation, and the number of the heat interfaces on the external installation foundation is simplified; and the heat of the power components is firstly conducted by taking the heat bus as an intermediary, the preliminary balance is conducted, after the preliminary balance, if external heat is needed for heating, the heat bus sucks heat from an external installation base through an external expansion installation surface, the heat is provided for the needed power components, if the heat is needed to be discharged to the outside, the heat needed to be discharged is concentrated on the heat bus, and the heat bus discharges the heat towards the external installation base through the external expansion installation surface, so that the heat exchange efficiency is improved.
Optionally, the heat conduction path between the power component with higher power and the corresponding connection point is shorter.
Optionally, the following relationship exists between the load Qload of the thermal bus and the area S of the external expansion mounting surface: q (Q) load S is more than or equal to 600mm when the W is less than or equal to 10W 2 ；10W＜Q load S is more than or equal to 2400mm when the W is less than or equal to 30W 2 ；30W＜Q load S is more than or equal to 12000mm when the W is less than or equal to 50W 2 。
Optionally, each connection point is formed with a boss integrated with the thermal bus, and each boss abuts against the corresponding power component; or each connection point is thermally connected with the corresponding power component through a flexible heat conducting piece.
Optionally, the communication device includes a bottom case, the bottom case forming the thermal bus.
Optionally, the material of the thermal bus is copper, aluminum nitride, silicon carbide or aluminum alloy.
Optionally, each of the communication devices comprises a plurality of the thermal buses.
Optionally, the communication device further comprises a thermal control component thermally connected to the thermal bus and configured to regulate the temperature of the thermal bus.
Optionally, the thermal control component is located in an interlayer of the thermal bus; or, the thermal control assembly has an input end face and an output end face opposite to each other, and the input end face is connected with the external expansion mounting face of the thermal bus.
Optionally, the load Q of the thermal bus load When the temperature is more than 0, the thermal control component is a refrigerating component; load Q of the thermal bus load When the temperature is less than 0, the thermal control component is a heating component; load Q of the thermal bus load And when the temperature is periodically changed, the thermal control component is a phase change heat storage component.
Optionally, the phase change heat storage component comprises a plate-shaped closed shell, and the plate-shaped closed shell is filled with a phase change material; one surface of the plate-like closed housing forms the input end face, and the other surface forms the output end face.
Optionally, the input end face is provided with a heat conduction interface layer, and the output end face is provided with a heat control coating with low absorption-emission ratio.
Optionally, the communication device is a space laser communication device, the external installation foundation is a satellite body, the power component comprises a motor component or a quick-reflection component, and a shell of the motor or a shell of the quick-reflection component is in thermal connection with the corresponding connection point.
A second aspect provides a satellite, including a satellite body and the communication device according to any one of the above claims, where an external expansion installation surface of the communication device is thermally connected to the satellite body; when the satellite comprises a thermal control assembly, the output end face of the thermal control assembly is thermally connected with the satellite body.
Compared with the prior art, the satellite has the same advantages as the communication device, and the description is omitted here.
Optionally, the satellite includes a plurality of communication devices, and the external expansion installation surfaces of the thermal buses of different communication devices are connected in series and/or in parallel through heat pipes.
Drawings
Fig. 1 is a schematic diagram of a part of a structure in a communication device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a thermal control component in a communication device according to an embodiment of the present application;
fig. 3a is a schematic diagram of a 100G optical module in CFP2 package form in a communication device after thermal interface normalization according to an embodiment of the present application;
FIG. 3b is a side view of the structure shown in FIG. 3 a;
fig. 4 shows a thermal design flow diagram of a spatial laser communication device based on a standardized thermal interface.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Please refer to fig. 1-2:
the communication device provided by the embodiment of the application may be a spatial laser communication device, including: a thermal bus 3 and a plurality of power components corresponding to the thermal bus 3, such as an optical amplifying component, a power supply component, a camera component, a motor component, a quick-reflection component and the like, wherein the motor component and the quick-reflection component are specific to the space laser communication equipment relative to other laser communication equipment, the thermal bus 3 is provided with opposite connection end faces S1 and an external expansion installation face S2 for heat conduction connection with an external installation base (such as a satellite body), and the connection end faces S1 are provided with connection points corresponding to the power components one by one; the power components are located on one side, far away from the external expansion mounting surface S2, of the connecting end surface S1 and are respectively in thermal connection with corresponding connecting points, wherein a shell of the motor component or a shell of the quick-return component is in thermal connection with the corresponding connecting points, so that heat dissipation is achieved. As shown in fig. 1, the number of the power components is two, namely, a first power component 1 and a second power component 4, where the first power component 1 may be a DSP (Digital Signal Processing, digital signal processing technology) chip, that is, a chip capable of implementing digital signal processing technology. The second power component 4 may be an FS400 IGBT module. Correspondingly, the number of the connection points is also two, namely a first connection point position N1 and a second connection point position N2, the first power component 1 is thermally connected with the first connection point position N1 through the first mounting structure 2, and the second power component 4 is thermally linked with the second connection point position N2 through the second mounting structure 5. The flatness of the outward-extending mounting surface S2 may be less than 0.1mm/100×100mm 2 To reduce contact thermal resistance.
The heat of the power components is uniformly concentrated to the thermal bus 3 through the connecting end face S1, and then the heat is transferred to the external installation foundation through the external expansion installation face S2, so that each power component does not need to be respectively designed with a heat dissipation path to be thermally connected with the external installation foundation, and the quantity of thermal interfaces on the external installation foundation is simplified; the heat of the power components is first balanced initially by the heat bus 3, after the initial balance, if external heat is needed to heat, the heat bus 3 sucks heat from the external installation foundation through the external expansion installation surface S2, and provides the heat to the needed power components, if the heat is needed to be discharged to the outside, the heat needed to be discharged is concentrated on the heat bus 3, and the heat bus 3 is used for discharging the heat to the external installation foundation through the external expansion installation surface S2, so that the heat exchange efficiency is improved.
In a specific embodiment, the thermal resistance between the power component and the thermal bus 3 is smaller as the heat conduction path between the power component with higher power and the corresponding connection point is shorter, so that the requirement on thermal resistance can be met, and standard thermal interfaces meeting different power requirements can be formed respectively. For example, the power of the first power component 1 is greater than the power of the second power component 4, the thickness of the first mounting structure 2 is smaller than the thickness of the second mounting structure 5, and the heat conduction path between the first power component 1 and the first connection point N1 is smaller than the heat conduction path between the second power component 4 and the second connection point N2.
In a specific embodiment, the load Q of the thermal bus 3 load The following relationship exists between the area S of the outward-extending mounting surface S2: q (Q) load S is more than or equal to 600mm when the W is less than or equal to 10W 2 ；10W＜Q load S is more than or equal to 2400mm when the W is less than or equal to 30W 2 ；30W＜Q load S is more than or equal to 12000mm when the W is less than or equal to 50W 2 . The relationship between the above load and the area S of the outward-extending mounting surface S2 can satisfy the heat exchange requirement. For Q load The thermal bus 3 of > 50W, which is specifically designed to be able to evaluate the dimensions of the external expansion mounting surface S2.
Load Q of thermal bus 3 load To the heat consumption to be dissipated, the conventional heat Q is generated by the corresponding power components of the heat bus 3 eq Ambient power load Q en . The environmental power load refers to heating power consumption and cooling power consumption required by the environmental temperature fluctuation to be applied when the environmental temperature fluctuation is larger than the normal operating temperature range of the equipment, and the specific calculation mode is as follows:
wherein n represents the number of power components corresponding to the standard thermal interface, m represents the combination of all working modes of the communication equipment, q represents the generated heat of each component, the subscript Ten represents the ambient temperature, teq represents the temperature of the power component, h represents the upper limit of the temperature range, l represents the lower limit of the temperature range, and θ represents the thermal resistance.
Referring to fig. 1, the heat consumption of the first power component 1 is 13.9W, the heat consumption of the second power component 4 is 5.5W, the thickness of the mounting structure 2 is 2mm, the contact surface is 40mm×30mm, the thermal contact resistance θ=0.008K/W is calculated, the thickness of the second mounting structure 5 of the second power component 4 is 4mm, the contact surface is 20mm×10mm, the thermal contact resistance θ=0.1K/W is calculated, and the thermal contact resistance θ=0.1K/W is calculated. The working temperature range of the corresponding component of the thermal bus 3 is 0-70 ℃, the temperature requirement of the outward expansion mounting surface S2 is 0-45 ℃, and therefore the load of the thermal bus 3 is 19.4W, and the size of the outward expansion mounting surface S2 is 60mm multiplied by 50mm. Finally, the thermal bus 3 may be satisfactory.
In a specific embodiment, each connection point is formed with a boss integrated with the thermal bus 3, each boss is abutted against a corresponding power component, so that the interface separation between the boss and the thermal bus 3 is reduced, the thermal resistance between the power component and the thermal bus 3 is reduced, an integrated structure of the thermal bus 3 and the boss can be manufactured by using an integrated molding manufacturing technology or a 3D printing technology, and heat conducting materials such as heat conducting silicone grease, heat conducting gel, metal heat conducting pads and the like can be filled between the power component and the boss to offset dimensional tolerance, reduce fit clearance and reduce thermal resistance; or each connection point is thermally connected with the corresponding power component through a flexible heat conducting piece, and the thermal connection between the power component at a complex position and the thermal bus 3 can be established through flexible heat conducting pieces such as a heat conducting belt, a heat conducting cable and the like.
In a specific embodiment, the illustrated communication device includes a bottom shell, the bottom shell forms the thermal bus 3, and the thermal bus 3 directly serves as the bottom shell of the communication device, so that the integration level with the communication device is higher.
In a specific embodiment, the material of the thermal bus 3 is copper, aluminum nitride, silicon carbide or aluminum alloy, and these materials have good heat conduction performance, and the weight and the cost are all within reasonable ranges.
In a specific embodiment, each communication device comprises a plurality of thermal buses 3, for the case of a distributed comparison within the communication device or a complex structure within the communication device, to thermally connect different groups of power components with different thermal buses 3, respectively.
In a specific embodiment, the communication device further includes a thermal control assembly 100, where the thermal control assembly 100 is thermally connected to the thermal bus 3 and is used to regulate the temperature of the thermal bus 3, and the thermal control assembly 100 may specifically be configured to actively conduct heat from the external mounting base to the power assembly, or to conduct heat from the power assembly to the external mounting base, and the thermal control assembly 100 may be configured to exchange heat between the power assembly and the external mounting base more actively and efficiently than to directly thermally connect only to the external mounting base.
In a specific embodiment, the thermal control assembly 100 is located in an interlayer of the thermal bus 3 to increase the heat exchange area and fully exchange heat; alternatively, the thermal control assembly 100 has opposite input and output end faces P1 and P2, the input end face P1 being connected to the external expansion mounting surface S2 of the thermal bus 3, and the thermal control assembly 100 being mounted between the external expansion mounting surface S2 and the external mounting contact can conveniently exchange heat between the thermal bus 3 and the external mounting base.
In a specific embodiment, the load Q of the thermal bus 3 load When the temperature is more than 0, the thermal control assembly 100 is a refrigerating assembly to carry the heat of the thermal bus 3 to an external installation foundation for heat dissipation; load Q of thermal bus 3 load When less than 0, the thermal control assembly 100 is a heating assembly to convey the heat of the external installation foundation to the thermal bus 3 for heating; load Q of thermal bus 3 load When periodically changing, the thermal control component 100 is a phase change heat storage component, so that the temperature stability of the power component can be improved.
In a specific embodiment, referring to fig. 2, the phase change heat storage component includes a plate-shaped closed shell 6, where the plate-shaped closed shell 6 may be made of a high heat conduction material to perform sufficient heat exchange, and the plate-shaped closed shell 6 is filled with a phase change material 9; one surface of the plate-like closed casing 6 forms an input end face P1, and the other surface forms an output end face P2. Heat conduction reinforcing ribs 10 may be provided in the plate-like closed casing 6 to enhance normal heat conduction.
In a specific embodiment, the input end face P1 is provided with a heat conducting interface layer 8 to facilitate heat exchange from the external expansion mounting face S2 of the thermal bus 3, and the output end face P2 is provided with a thermal control coating with a low absorption-emission ratio to facilitate the output of heat from the output end face P2 to the external mounting base.
Referring to fig. 2, 100G of n-octadecane is selected as the phase-change material 9, and the phase-change heat storage component can meet the use scene that a 100G optical module continuously works for 1000s at 30 ℃. Specifically, two or more optical modules can be respectively fixed at the connection end face S1 of the same thermal bus 3, and the phase-change heat storage module can be used for maintaining stable temperature.
Fig. 3a is a schematic diagram of a 100G optical module in CFP2 package form in a communication device after thermal interface normalization according to an embodiment of the present application; FIG. 3b is a side view of the structure shown in FIG. 3 a; referring to fig. 3a and 3b, one side surface of two optical modules 7 is connected to a thermal bus 3, the thermal bus 3 is used as a standard thermal interface of the optical modules 7, the thermal bus 3 is thermally connected with an external installation foundation through an external expansion installation surface S2 and is respectively connected with the two optical modules 7 through 4 external expansion M2 installation holes 71, the main thermal diffusion surfaces of the 24W thermal loads of the optical modules 7 are the external expansion installation surface S2, the upper and lower flatness of the thermal bus 3 is smaller than 0.1mm, the thermal bus 3 is made of aluminum-based silicon carbide with a thermal conductivity of 200W/m·k, the thermal bus 3 is installed with the surface of the optical modules 7 through the external expansion M2 installation holes 71, and the contact thermal resistance between the thermal bus 3 and the optical modules 7 is reduced through thermal conduction silicone grease. Through the modification, the temperature equalizing module and the semiconductor refrigeration component with corresponding sizes and heat dissipation power can be selected from the spectrum thermal control component library according to the actual conditions of the existence of a cold source, the satellite energy allowance and the like of the accessory at the installation position, so that the temperature control effect is achieved.
Based on the same inventive concept, the embodiment of the application also provides a satellite, which comprises a satellite body and the communication equipment of any technical scheme, wherein the externally-expanded mounting surface of the communication equipment is in thermal connection with the satellite body; when the satellite includes the thermal control assembly 100, the output end P2 of the thermal control assembly 100 is thermally connected to the satellite body. The effect of which can be referred to the communication device provided by the previous embodiment.
In a specific embodiment, the satellite comprises a plurality of communication devices, the external expansion installation surfaces S2 of the thermal buses 3 of different communication devices are connected in series and/or in parallel through heat pipes, and the thermal connection relation among the communication devices is established through topology optimization by taking the working mode of each power component, the thermal load of each communication device and the thermal environment of the satellite space as boundary conditions, so that energy optimization is realized.
The traditional thermal control method can not meet the requirements of communication equipment configuration expansibility and the diversity of use environments due to the fact that the design is relatively fixed, particularly when large-scale production and construction are faced, if the same thermal control design scheme is adopted, the problem of poor adaptability is remarkable, and if each communication equipment is independently designed with the thermal control scheme, the problem of heavy workload and slow progress is solved. In the aspect of passive heat management, due to factors such as materials, structures, regulation and control and the like, the heat management effect is difficult to improve. In the aspect of design, the prior proposal is an idea of taking a communication function as a main part and taking heat control as an auxiliary part, and the heat design is carried out after basic functions and structural design are generally completed, so that the problem that the component layout is unfavorable for heat dissipation and resource waste is generated easily occurs.
Referring to fig. 4, a method for designing a standardized thermal control design and a molded spectral thermal control component of a spatial laser communication device will be described below with reference to heat dissipation of a power component in the spatial laser communication device as an example. The temperature control method mainly considers the thermal control design standardization and the thermal control component type spectroscopy temperature control method which are developed by taking a thermal bus thought as a center under the conditions of high heat density and complex working scenes of the space laser communication equipment, and comprises the definition of a standard thermal interface and the adaptive thermal control development standard of the space laser communication equipment, the design of a thermal control component type spectroscopy module and the establishment of a product library.
Standard thermal interface for defining a spatial laser communication device
When the laser communication load design is performed, the working characteristics and the temperature requirements of the functional components are firstly identified, a thermal bus (refer to the thermal bus 3 in the previous embodiment) is introduced into the structural design, and the thermal connection relationship between the functional components and the thermal bus is established.
As shown in fig. 4, the working modes and the working temperature requirements of the power components, such as the laser communication functional component a, the laser communication functional components B and … …, the laser communication functional component n, and the like, are defined, and the power components, such as the optical amplifying component, the power component, the camera component, the motor component, the fast-reflection component, and the like, ensure that the functional components and the thermal bus are in a direct heat conduction installation state, or the connection between the power components with complex positions and the thermal bus at the equipment end is established by additionally arranging heat conduction strips, heat conduction cables, and the like, so that the heat conduction connection between the external surfaces of the components and the structure and the thermal bus is enhanced.
For power components with a power of less than 1W, the thermal resistance with the thermal bus 3 should be less than 1K/W, for power components with a power of between 1W and 10W, the thermal resistance with the thermal bus should be less than 0.1K/W, and for power components with a power of more than 10W, the thermal resistance with the thermal bus should be less than 0.01K/W. The higher the power, the shorter the thermal conduction path between the power component and the corresponding connection point. Thus, in making the selection of the thermal bus location, the principle of preferentially approaching the high power component and preferentially approaching the primary power component is followed.
The load Qload of the standard thermal interface is defined as the heat consumption that needs to be dissipated, including the conventional generated heat Qeq of the corresponding power components of the thermal bus and the ambient power load Qen. The calculation is referred to the previous examples.
External design standard thermal interface of thermal bus, load Q of thermal bus load The relationship with the area S of the externally-extended mounting surface S2 of the thermal bus is referred to the description of the foregoing embodiment. The shape of the plurality of typical outward expansion mounting surfaces S2 can be determined within the same load range so as to match the requirements of different communication equipment shapes.
For spatial laser communication devices where there is a complex internal structure or power component location dispersion, multiple thermal buses may be designed, each of which individually designs an external expansion interface.
Laser communication loads satisfying the above relationships with respect to thermal bus size, configuration, and thermal conductivity are defined as standard thermal interface laser communication loads, which can be rapidly adapted for thermal design.
And secondly, establishing a thermal control component type spectral product library meeting the standard of the standard thermal interface.
The search dimension of the product library comprises a power consumption load Q load, Interface size and other special use requirements. Each thermal control component is macroscopically divided into an input end, a working end and an output end, wherein the input end (refer to the input end face P1 of the previous embodiment) is physically connected with a standard thermal interface of the space laser communication equipment, and the size and the flatness meet the standard thermal interface requirement; the working end is a part for realizing the thermal control function of the thermal control assembly, is in heat conduction connection with the input end during manufacturing, and can be additionally arranged at a later stage or integrally formed; the output (refer to the output face P2 of the previous embodiment) meets the satellite body thermal interface requirements.
All thermal control components meet the on-board use standard by the requirements of aerospace industry standards on total mass loss rate, condensable volatile and water vapor recovery amount.
Deriving load Q from individual power components load And carrying out requirement judgment on the selection of the thermal control component. According to the load Q load The shape and area of the external expansion mounting surface S2 are obtained, whereby the standard thermal interface of the thermal control assembly end (thermal module end in fig. 4) is selected to match the external expansion mounting surface S2, while at the same time a suitable type of thermal control assembly is selected. The general principle is as follows: load Q of thermal bus load When the temperature is more than 0, the thermal control component is a refrigeration component; load Q of thermal bus load When the temperature is less than 0, the thermal control component is a heating component; load Q of thermal bus load The thermal control assembly is a phase change thermal storage assembly (phase change module in fig. 4) when periodically changed. In addition, other expansion modules can be selected as thermal control components according to the use environment selection and the power consumption requirement.
The heating assembly (heating module in fig. 4) adopts electric heaters with different powers to realize heat input, and the working mode of the heating assembly is controlled by a computer. The refrigeration assembly (including the radiant heat module, fluid circuit heat module in fig. 4) has mainly radiant panels, louvers, fluid circuits, thermoelectric coolers, etc. with different surface characteristics.
The thermal control assembly meeting the interface standard can be flexibly matched with different satellite configurations, and the proper thermal control assembly can be quickly selected by calculating the environmental heat flow of the space laser communication equipment instead of complete temperature calculation. For example, the net output external heat flow surface uses an electrical heating module as the thermal control assembly, and when the satellite configuration is adjusted such that the spatial laser communication device is mounted on the net input external heat flow surface, only the thermal control assembly that is thermally isolated or the thermal control assembly that is thermally dissipated, i.e., the refrigeration assembly, needs to be replaced.
And designing heat pipes of which the input end and the output end meet interface standards, so as to meet the serial-parallel connection use of a plurality of space laser communication devices, and establishing a thermal connection relationship among the devices through topology optimization by taking the working modes of the devices, the thermal load of a single device and the satellite space thermal environment as boundary conditions, thereby realizing energy optimization.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (12)
1. A communication device, comprising: the heat bus is provided with opposite connecting end faces and an externally-expanded mounting face which is used for conducting heat and is connected with an external mounting foundation, and the connecting end faces are provided with connecting points which are in one-to-one correspondence with the power components;
the power assemblies are positioned on one side of the connecting end face away from the outward expansion mounting surface and are respectively in thermal connection with the corresponding connecting points;
the communication equipment is space laser communication equipment, the external installation foundation is a satellite body, the power assembly comprises a motor assembly or a quick-return assembly, and a shell of the motor or a shell of the quick-return assembly is in thermal connection with the corresponding connection point;
the communication device further comprises a thermal control assembly thermally connected with the thermal bus and used for adjusting the temperature of the thermal bus;
load Q of the thermal bus load When the temperature is more than 0, the thermal control component is a refrigerating component;
load Q of the thermal bus load When the temperature is less than 0, the thermal control component is a heating component;
load Q of the thermal bus load And when the temperature is periodically changed, the thermal control component is a phase change heat storage component.
2. The communication device of claim 1, wherein a thermal conduction path between the power component and the corresponding connection point is shorter for greater power.
3. The communication device of claim 1, wherein the load Q of the thermal bus load The following relationship exists between the area S of the outward expansion mounting surface and the surface S:
Q load s is more than or equal to 600mm when the W is less than or equal to 10W 2 ；
10W＜Q load S is more than or equal to 2400mm when the W is less than or equal to 30W 2 ；
30W＜Q load S is more than or equal to 12000mm when the W is less than or equal to 50W 2 。
4. The communication device of claim 1, wherein each of said connection points is formed with a boss integral with said thermal bus, each of said bosses abutting a corresponding one of said power components; or,
each connection point is thermally connected with the corresponding power component through a flexible heat conducting piece.
5. The communication device of claim 1, wherein the communication device comprises a bottom shell that forms the thermal bus.
6. The communication device of claim 1, wherein the thermal bus is made of copper, aluminum nitride, silicon carbide, or an aluminum alloy.
7. The communication device of claim 1, wherein each of the communication devices comprises a plurality of the thermal buses.
8. The communication device of claim 1, wherein the thermal control component is located in an interlayer of the thermal bus; or,
the thermal control assembly is provided with an input end face and an output end face which are opposite to each other, and the input end face is connected with an external expansion mounting face of the thermal bus.
9. The communication device of claim 8, wherein the phase change heat storage assembly comprises a plate-shaped enclosure housing filled with a phase change material;
one surface of the plate-like closed housing forms the input end face, and the other surface forms the output end face.
10. The communication device of claim 9, wherein the input face is provided with a thermally conductive interface layer and the output face is provided with a thermally controlled coating of low absorption to emission ratio.
11. A satellite comprising a satellite body and the communication device of any one of claims 1 to 10, the externally-extended mounting surface of the communication device being thermally connected to the satellite body;
when the satellite comprises a thermal control assembly, the output end face of the thermal control assembly is thermally connected with the satellite body.
12. The satellite according to claim 11, wherein the satellite comprises a plurality of communication devices, and wherein the externally-extended mounting surfaces of the thermal buses of different communication devices are connected in series and/or in parallel by heat pipes.
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| US10029808B2 (en) * | 2016-02-29 | 2018-07-24 | The Boeing Company | Structurally integrated thermal management system for aerospace vehicles |
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| CN104812218A (en) * | 2015-04-30 | 2015-07-29 | 昆山荣科钣金科技有限公司 | High-heat-dissipation control box and production method |
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