CN112956662B - Preparation method of low-fat pumpkin crisp chips - Google Patents
Preparation method of low-fat pumpkin crisp chips Download PDFInfo
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- CN112956662B CN112956662B CN202110315587.5A CN202110315587A CN112956662B CN 112956662 B CN112956662 B CN 112956662B CN 202110315587 A CN202110315587 A CN 202110315587A CN 112956662 B CN112956662 B CN 112956662B
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Abstract
The invention relates to a preparation method of low-fat pumpkin chips, which adopts the procedures of pre-slicing, color protection blanching, coating treatment, freezing hardening, vacuum frying, deoiling and the like to prepare the pumpkin chips. The preparation method can obviously reduce the vacuum frying time of the pumpkin crisp chips, and solves the technical problem that the conventional vacuum fried pumpkin crisp chips have higher grease content. The pumpkin chips prepared by the method have the advantages of complete shape, golden color, crisp taste, fried flavor and pumpkin fragrance, greatly retains the original nutrient components of the pumpkin, and is simple in production equipment, low in cost and easy to realize industrial production.
Description
Technical Field
The invention relates to the technical field of food processing, in particular to a preparation method of low-fat pumpkin crisp chips.
Background
Pumpkin is belonging to Cucurbitaceae Cucurbita (Cucurbita moschata Duch), and is edible in both fruit and seed. With the development of socioeconomic and improvement of the living standard of people in China, people have higher and higher attention to health and life while pursuing rich material life, so that food nutrition and health care become new social requirements. The pumpkin pulp is rich in nutrient components, contains 19 amino acids (including 8 amino acids essential to human body and histidine essential to children), trigonelline, pentosan, pectin, mannitol, citrulline, soluble fiber, lutein, phosphorus, calcium, magnesium, zinc, silicon and the like, and has the effects of detoxifying, protecting digestive tract mucosa, helping digestion, preventing arteriosclerosis, preventing diabetes and the like. Therefore, the value of the method can be increased by deeply developing and utilizing the method.
In recent years, the health care function of the pumpkin increasingly attracts people's attention, and the pumpkin food integrating the nutrition and health care functions is more and more popular with people, so that the pumpkin food has wide market prospect. The common pumpkin products in the current market are instant foods such as pumpkin juice, pumpkin powder, pumpkin fermented food, pumpkin cake, pumpkin preserved food and the like.
The fruit and vegetable crisp chips are high-quality dehydrated food, mostly keep the color, the fragrance and the taste of agricultural product raw materials, have crisp mouthfeel, are rich in vitamins and various mineral substances, have extremely low content of artificially synthesized additives, are convenient to carry, and can be stored for a long time, so that the fruit and vegetable crisp chips become the key point of attention and research of people in a few years. Many researchers began to adopt different processing techniques to make pumpkin crisp chips. The method mainly comprises a microwave drying process, a microwave puffing method, an airflow puffing technology and the like, but the processed crisp chips are sensitive to air humidity, are light in taste, are not crisp and dry, and reduce the taste, the vacuum frying technology can better improve the taste and is beneficial to storage, but the patent reports about the vacuum fried pumpkin chips are less, and the patent reports of the preparation method of the salted egg yolk flavor pumpkin chips are reported at present. However, the frying time of the patent technology is too long, the influence on nutrient components is large, and the oil content of the crisp chips is still higher.
Disclosure of Invention
Technical problem to be solved
In view of the defects and shortcomings of the prior art, the invention provides a preparation method of low-fat pumpkin chips, aiming at the traditional vacuum frying process, a processing process of coating and dipping is added before pumpkin chips are frozen, and the coating liquid is frozen and hardened on the surfaces of the pumpkin chips and then is fried in vacuum, so that the vacuum frying time of the pumpkin chips can be obviously reduced, and the technical problem that the oil content of the existing vacuum fried pumpkin chips is higher is solved.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
a preparation method of low-fat pumpkin crisp chips comprises the following steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper base and the lower base, cutting and digging out the beard and the seeds, and preparing the pumpkin slices with the thickness of 2.5 mm-4.5 mm;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into color protection liquid for color protection, fishing out, soaking the pumpkin slices in water at the temperature of 75-95 ℃ for blanching, and cooling to normal temperature;
s3, coating treatment: adding the pumpkin slices obtained in the step S2 into the coating liquid, soaking and draining; wherein the coating liquid is an aqueous solution containing the following components: 1-5wt% of chitosan, 0.5-3wt% of whey protein, 0.5-3wt% of soy protein isolate, 0.5-3wt% of collagen peptide, 3-10wt% of white granulated sugar, 3-10wt% of trehalose, 3-10wt% of maltitol and 0.08-0.12% of citric acid in mass volume concentration;
s4, freeze hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator;
s5, vacuum frying: placing the pumpkin slices processed in the step S4 into a vacuum frying machine at the temperature of 80-95 ℃ for frying;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling at the speed of 200-300r/min, and cooling to obtain the pumpkin chips.
Preferably, in step S2, the color-protecting liquid is an aqueous solution comprising 0.05-0.15wt% of citric acid, 0.10-0.20wt% of vitamin C, 0.1-1wt% of NaCl and 0.1-0.3wt% of CaCl 2 。
More preferably, the optimal conditions for color protection in step S2 are: 0.1wt% of citric acid, 0.15wt% of vitamin C, 1.0wt% of NaCl and CaCl 2 0.1wt％。
Preferably, in step S2, the blanching time after color protection is 60S to 120S; more preferably, the blanching conditions are: blanching at 85 deg.C for 90s.
Preferably, in step S3, the coating solution is prepared by preparing 0.1% (g/mL) citric acid solution containing 1-5wt% of chitosan, adding 0.5-3wt% whey protein, 0.5-3wt% soy protein isolate and 0.5-3wt% collagen peptide, 3-10wt% white sugar, 3-10wt% trehalose, and 3-10wt% maltitol, and uniformly stirring to obtain the coating solution.
More preferably, the optimal composition conditions of the coating solution are 3wt% of white granulated sugar, 10wt% of trehalose, 3wt% of maltitol, 1wt% of chitosan, 0.5wt% of whey protein, 3wt% of soy protein isolate and 0.5wt% of collagen peptide.
Optionally, the chitosan used in the coating liquid is chitosan with deacetylation degree of more than or equal to 90%.
Alternatively, in step S3, the time of the coating treatment is not less than 2 hours.
Optionally, in step S4, the freezing time is 0.5 to 2 days.
Preferably, in step S5, the vacuum frying time is 1000S to 1400S, the vacuum degree is 0.096 to 0.098MPa, and the frying conditions are 88 ℃ and 1000S.
Preferably, in step S6, the deoiling time is 180 to 220 seconds.
(III) advantageous effects
The beneficial effects of the invention are:
the preparation method of the low-fat pumpkin chips adopts the processes of pre-slicing, color protection blanching, coating treatment, freezing hardening, vacuum frying and deoiling treatment to regulate and control the preparation of the pumpkin chips, the product is complete in shape, golden in color and luster, crisp in taste, fried flavor and pumpkin fragrance, the original nutritional ingredients of the pumpkin are reserved to the greatest extent, the production equipment is simple, the cost is low, and the industrial production is easy to realize.
The invention adds a film coating liquid consisting of macromolecular substances which are easy to form films, such as chitosan, soy protein isolate, whey protein and the like, on the basis of the traditional vacuum frying process to carry out film coating treatment on the blanched pumpkin slices. The processing method enables the macromolecular substances to be adsorbed on the surface of the pumpkin slice and form a film through interaction, so that on one hand, the crisp chips have better water-retaining property, the crisp and gloss of the fried crisp chips are improved, and the flavor of the crisp chip products is enriched; on the other hand, the adsorption of the vegetable oil on the surfaces of the crisp chips is prevented in the vacuum frying process, and tests show that the oil content of the crisp chips can be reduced, so that the oil content is lower than 15%, the crisp and non-greasy taste is realized, and the requirements of modern healthy low-fat food are met.
The invention optimizes and provides a new formula and composition of color protection liquid for pumpkin crisp chips, which comprises 0.1-0.20wt% of citric acid, 0.10-0.20wt% of vitamin C, 0.1-1wt% of NaCl and 0.1-0.3wt% of CaCl 2 . The citric acid and vitamin C in the formula achieve the purpose of color protection through chelation, antioxidation and other effects, caCl 2 And NaCl can inhibit browning of fruits and vegetables and achieve hardening effect, and can be used together with citric acid and vitamin C to produce addition effect. The color fixative provided by the invention can be effectively applied to pumpkin slices, is a sulfur-free and EDTA (ethylene diamine tetraacetic acid) -free color fixative, is safe to eat, and can obviously inhibit polyphenol oxidase in pumpkin.
In addition, the pumpkin crisp chip process provided by the invention keeps the components of pumpkin peel, improves the dietary fiber content of the pumpkin crisp chip and improves the edible nutritional functionality of the pumpkin crisp chip.
Drawings
FIG. 1 is a graph of the effect of thickness of pumpkin slices of examples 1-2 and comparative examples 1-3 on pumpkin crisp hardness and sensory score;
FIG. 2 is a graph of the effect of blanching time on pumpkin crisp firmness and sensory score for examples 3-4 and comparative examples 4-6;
FIG. 3 is a graph showing the effect of chitosan concentration on pumpkin crisp hardness and sensory score for examples 5-6 and comparative examples 7-9;
FIG. 4 is a graph showing the effect of freezing time on pumpkin crisp hardness and sensory score for examples 7-8 and comparative examples 10-11.
Detailed Description
For the purpose of better explaining the present invention, the present invention will be described in detail by way of specific embodiments for easy understanding.
According to the preparation method of the low-fat pumpkin chips, provided by the embodiment of the invention, before the traditional vacuum frying process, a coating dipping treatment process is utilized, and high-molecular film-forming materials such as chitosan/soybean protein isolate and the like are selected as components of a coating liquid, so that a complete film can be formed on the surface of the blanched pumpkin chips, the frying time can be greatly shortened, the fat content of the pumpkin chips can be effectively reduced, and the form and the nutritional ingredients of the pumpkin chips can be kept.
For a better understanding of the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention have been presented, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The dosage percentages in the invention are mass percentages without special indication.
Example 1
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a container containing 0.1% of citric acid, 0.15% of vitamin C, 1.0% of NaCl and 0.1% of CaCl by mass concentration 2 Soaking in the solution for 20min, blanching at 85 deg.C for 90s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freeze hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1.5 days;
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the condition of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 2
In this example, the thickness of the sliced pumpkin in the step S1 is changed to 4.5mm based on the example 1. The other conditions and procedures were the same as in example 1.
Comparative examples 1 to 3
In the comparative example, the thicknesses of the pumpkin slices in the step S1 are changed into 2.5mm, 3.0mm and 3.5mm on the basis of the example 1. The other conditions and procedures were the same as in example 1.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5g.
The pumpkin chips of examples 1 to 2 and comparative examples 1 to 3 were scored for sensory evaluation according to the scoring criteria shown in the following table (table 1).
Table 1: sensory evaluation standard of vacuum fried pumpkin crisp chips
The scoring results are shown in fig. 1.
As can be seen from fig. 1, the hardness of the pumpkin crisp increases and then decreases, and the sensory score decreases and then increases as the slice thickness increases. If the thickness of the slices is too small, the slices are easy to curl and fry during frying, and finished products are easy to break and cannot keep integrity, so that the production is not facilitated. If the thickness of the sliced pieces is too large, the fried pieces are easily cooked outside and not cooked inside. Therefore, sensory evaluation and hardness indexes are comprehensively considered, and when the slice thickness is 4-4.5 mm, the prepared pumpkin crisp slices have good color, crispness, taste and flavor, and are high in comprehensive evaluation and proper in hardness.
Example 3
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, prefabricating and slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a container containing 0.1% of citric acid, 0.15% of vitamin C, 1.0% of NaCl and 0.1% of CaCl by mass concentration 2 Soaking in the solution for 20min, blanching at 85 deg.C for 60s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1d (day);
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling: and (4) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the condition of 200-300r/min, and cooling to obtain the pumpkin crisp chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 4
In this example, the blanching time in step S2 was changed to 75 seconds based on example 3. Other conditions and procedures were the same as in example 3.
Comparative examples 4 to 6
Comparative examples 4 to 6 on the basis of example 3, the blanching times in step S2 were changed to 90S, 105S, 120S. Other conditions and procedures were the same as in example 3.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5g.
The pumpkin chips of examples 3 to 4 and comparative examples 4 to 6 were scored according to the sensory evaluation in accordance with the scoring criteria of Table 1.
The scoring results are shown in fig. 2.
As can be seen from fig. 2, as the blanching time increases, the hardness of the pumpkin crisp increases to a maximum value, then decreases to a minimum value, and finally gradually increases. Therefore, the sensory score and hardness index are comprehensively considered, when the blanching time is 60-75 s, particularly 75s, the prepared pumpkin crisp chips are good in color, crispness, taste and flavor, high in comprehensive evaluation and proper in hardness.
Example 5
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a container containing 0.1% of citric acid, 0.15% of vitamin C, 1.0% of NaCl and 0.1% of CaCl by mass concentration 2 Soaking in the solution for 20min, blanching at 85 deg.C for 80s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into a coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1.5% of chitosan, 0.5% of whey protein, 3% of isolated soy protein and 0.5% of collagen peptide in mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freeze hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1.5 days;
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.098MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 200S under the condition of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 6
In this example, the concentration of chitosan in step S3 was changed to 2.5% based on example 5. The other conditions and procedures were the same as in example 5.
Comparative examples 7 to 9
Comparative examples 7 to 9 on the basis of example 5, the chitosan concentration in step S3 was changed to 1%, 2%, 3%, and the other conditions and steps were the same as in example 5.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5g.
The pumpkin chips of examples 5 to 6 and comparative examples 7 to 9 were scored for sensory evaluation according to the scoring criteria of table 1.
The scoring results are shown in fig. 3.
As can be seen from the graph 3, with the increase of the chitosan concentration, the hardness and the sensory score of the pumpkin crisp chips are firstly increased to reach the maximum value, then are reduced to reach the minimum value, and then are increased, namely the chitosan concentration in the film coating liquid has great influence on the hardness of the pumpkin crisp chips. Therefore, the sensory score and hardness index are comprehensively considered, and when the concentration of the chitosan is 2.5%, the prepared pumpkin crisp chips are good in color, crispness, taste and flavor, high in comprehensive evaluation and proper in hardness.
Example 7
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, prefabricating and slicing: after cleaning the pumpkin, removing the upper pedicle and the lower pedicle and the bad skin, performing cross cutting, removing the beard and the seeds, and cutting into U-shaped pumpkin slices with the thickness of 3.5 mm;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a container containing 0.1% of citric acid, 0.15% of vitamin C, 1.0% of NaCl and 0.1% of CaCl by mass concentration 2 Soaking in the solution for 20min, blanching at 85 deg.C for 80s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freeze hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 0.5d (day);
s5, vacuum frying: putting the frozen pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the condition of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 8
In this example, the freezing time in step S4 was changed to 1 day (day) on the basis of example 7. The other conditions and procedures were the same as in example 7.
Comparative examples 10 to 11
Comparative examples 10 to 11 on the basis of example 7, the freezing time in step S4 was changed to 1.5d, 2d. The other conditions and procedures were the same as in example 7.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5g.
The pumpkin chips of examples 7 to 8 and comparative examples 10 to 11 were scored for sensory evaluation according to the scoring criteria of Table 1.
The scoring results are shown in fig. 4.
As can be seen from fig. 4, the hardness and the sensory score of the pumpkin chips are reduced along with the increase of the freezing time, so that the sensory score and the hardness index are comprehensively considered, and the pumpkin chips prepared when the freezing time is 1d (day) have good color, crispness, taste and flavor, high comprehensive evaluation and proper hardness.
The change in the nutritional components of the pumpkin crisp of example 1 at different processing steps during the processing was measured, and the results are shown in table 2. The samples comprise fresh pumpkins, sliced pumpkins, blanched pumpkins, coated pumpkins and vacuum fried pumpkin crisp chips, and the content of total sugar, vitamin E, carotene and inositol in the samples is determined by the following method:
the total sugar is determined by the second method of national standard GB 5009.8-2016;
the amino acid content is determined according to the national standard GB5009.124-2016;
the vitamin E content is determined according to the national standard GB5009.82-2016;
the carotene content is determined according to the national standard GB5009.83-2106.
TABLE 2 variation of nutrient composition during the processing of pumpkin chips
As can be seen from Table 2, the amount of carotene in the vacuum fried pumpkin chips was increased 40-fold compared to fresh pumpkin, 4.31mg/100g, which was significantly higher than the purple sweet potato chips, potato chips and apple chips. The total sugar content of the pumpkin crisp chip is increased by 3.5 times compared with that of fresh pumpkin and is 15.2 percent. This is because most of the moisture is removed during the freeze hardening and vacuum frying process and the sugar is enriched. Compared with fresh pumpkin, the vitamin E content of the vacuum fried pumpkin crisp chips is reduced, which is caused by the oxidation of part of the vitamin E in the vacuum frying process. Inositol is a growth factor, and can reduce cholesterol and prevent arteriosclerosis. As can be seen from Table 2, the vacuum fried pumpkin chips have an increased inositol content of 225.31mg/100g compared to fresh pumpkin.
A batch of pumpkin chips prepared and produced by the process of example 4 were measured for moisture, fat content, trace elements and amino acid content, and the results are shown in table 3; the method of testing was as follows,
and (3) moisture determination: reference is made to national standard GB5009.3;
fat content is measured according to national standard GB5009.6-2016;
the microelement determination refers to national standard GB5009.268-2016;
the amino acid content is determined according to the national standard GB5009.124-2016.
TABLE 3 nutrient contents and contents of pumpkin crisp chips
As shown in Table 3, the content of trace elements such as potassium, phosphorus, magnesium and calcium in the pumpkin chips prepared by the invention is high, wherein the content of potassium element is up to 452.2mg/100g, which is 2 times of the potassium content (244.2 mg/100 g) of the pumpkin chips reported in the literature. The contents of phosphorus, magnesium and calcium are respectively 54.35, 24.43 and 15.93mg/100g, which is similar to the content reported in the literature. The content of iron is lower, which is averagely 3.81mg/100g and is 1.8 times of the content reported in the literature, and the content of selenium is lower, which is averagely less than 0.03mg/100g. The pumpkin chips contain various elements and 17 amino acids required by human bodies, wherein the content of essential amino acids such as lysine, valine, leucine, isoleucine, phenylalanine, threonine and the like is high. The loss degree of trace elements and amino acids of the vacuum fried pumpkin chips is small, and the nutritional ingredients are completely reserved. The pumpkin crisp chips have low fat content, good sensory index and storage resistance, and the nutrient components and the flavor of the pumpkin are greatly reserved.
Research shows that when the oil content is about 20%, the water content of the crisp is lower than 7%, and the water activity can be ensured to be not higher than 0.65, so that the sensory index and the storage resistance of the crisp are good. The water content of the pumpkin crisp chips prepared by the method is about 7.7 percent, slightly higher than 7 percent, the oil content is about 12 percent and obviously lower than 20 percent, so the pumpkin crisp chips prepared by the preparation method disclosed by the invention can be predicted to have better storability, and compared with the known preparation technology of vacuum fried pumpkin crisp chips, the frying time is greatly shortened, the oil content is very low, and the low-fat and healthy requirements are met.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (5)
1. The preparation method of the low-fat pumpkin crisp chips is characterized by comprising the following steps of:
s1, prefabricating and slicing: after cleaning the pumpkin, removing the upper base and the lower base, cutting and removing the beard and the seeds, and preparing pumpkin slices with the thickness of 4 mm-4.5 mm;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a color protection solution for color protection treatment, taking out the pumpkin slices, soaking the pumpkin slices in water at the temperature of 75-95 ℃ for blanching for 60s-75s, and cooling to normal temperature;
s3, coating treatment: adding the pumpkin slices obtained in the step S2 into the coating liquid, soaking and draining;
wherein, the coating liquid is an aqueous solution containing the following components: 1.5-2.5wt% of chitosan, 0.5-3wt% of whey protein, 0.5-3wt% of isolated soy protein, 0.5-3wt% of collagen peptide, 3-10wt% of white granulated sugar, 3-10wt% of trehalose, 3-10wt% of maltitol and 0.08-0.12% of citric acid in mass volume concentration;
s4, freezing and hardening: putting the pumpkin slices obtained in the step S3 into a refrigerator for freezing for 0.5-1 day;
s5, vacuum frying: placing the pumpkin slices processed in the step S4 into a vacuum frying machine at the temperature of 80-95 ℃ for frying;
s6, deoiling treatment: placing the pumpkin slices obtained in the step S5 into a deoiling device, deoiling at 200-300r/min, and cooling to obtain pumpkin chips;
in step S2, the color protection liquid is an aqueous solution containing the following components: 0.05-0.15wt% citric acid, 0.10-0.20wt% vitamin C, 0.1-1wt% NaCl and 0.1-0.3wt% CaCl 2 。
2. The method of claim 1, wherein: the deacetylation degree of chitosan used in the film coating liquid is more than or equal to 90 percent.
3. The method of claim 1, wherein: in step S3, the pumpkin slices processed in step S2 are immersed in the coating liquid for not less than 2 hours.
4. The method of claim 1, wherein: in step S5, the vacuum degree of vacuum frying is 0.096 to 0.098MPa, and the frying time is 1000s to 1400S.
5. The method of claim 1, wherein: in step S6, the oil removing time is 180s to 220s.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103689552A (en) * | 2013-12-19 | 2014-04-02 | 山东商业职业技术学院 | Flavored low-fat white mushroom crisp chip and preparation method thereof |
| CN104783081A (en) * | 2014-12-31 | 2015-07-22 | 湖北工业大学 | A preparing method of pumpkin flower crisp sheet fried in vacuum at low temperature |
| CN105851949A (en) * | 2016-04-15 | 2016-08-17 | 重庆品有农业发展有限公司 | Fried crisp pumpkin chips and preparation method |
| PH22019001212Y1 (en) * | 2019-09-02 | 2020-11-16 | Pangasinan State Univ Psu Dost 1 Food Innovation Center | A process of producing vacuum fried crispy squash chips (cucurbita sp.) as an alternative healthy snacks |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103689552A (en) * | 2013-12-19 | 2014-04-02 | 山东商业职业技术学院 | Flavored low-fat white mushroom crisp chip and preparation method thereof |
| CN104783081A (en) * | 2014-12-31 | 2015-07-22 | 湖北工业大学 | A preparing method of pumpkin flower crisp sheet fried in vacuum at low temperature |
| CN105851949A (en) * | 2016-04-15 | 2016-08-17 | 重庆品有农业发展有限公司 | Fried crisp pumpkin chips and preparation method |
| PH22019001212Y1 (en) * | 2019-09-02 | 2020-11-16 | Pangasinan State Univ Psu Dost 1 Food Innovation Center | A process of producing vacuum fried crispy squash chips (cucurbita sp.) as an alternative healthy snacks |
Non-Patent Citations (1)
| Title |
|---|
| 南瓜的贮藏和南瓜脆片的加工技术;陈云;《农业科技通讯》;20040917(第09期);第41页 * |
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