CN112956662A - Preparation method of low-fat pumpkin crisp chips - Google Patents

Preparation method of low-fat pumpkin crisp chips Download PDF

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CN112956662A
CN112956662A CN202110315587.5A CN202110315587A CN112956662A CN 112956662 A CN112956662 A CN 112956662A CN 202110315587 A CN202110315587 A CN 202110315587A CN 112956662 A CN112956662 A CN 112956662A
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pumpkin
chips
vacuum
crisp
frying
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CN112956662B (en
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吴金鸿
施依
涂兰兰
葛宇
荣玉芝
秦宇
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Shanghai Jiaotong University
Shanghai Institute of Quality Inspection and Technical Research
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Shanghai Jiaotong University
Shanghai Institute of Quality Inspection and Technical Research
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    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L19/00—Products from fruits or vegetables; Preparation or treatment thereof
    • A23L19/03—Products from fruits or vegetables; Preparation or treatment thereof consisting of whole pieces or fragments without mashing the original pieces
    • A23L19/05—Stuffed or cored products; Multilayered or coated products; Binding or compressing of original pieces
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L29/00—Foods or foodstuffs containing additives; Preparation or treatment thereof
    • A23L29/03—Organic compounds
    • A23L29/045—Organic compounds containing nitrogen as heteroatom
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L29/00—Foods or foodstuffs containing additives; Preparation or treatment thereof
    • A23L29/30—Foods or foodstuffs containing additives; Preparation or treatment thereof containing carbohydrate syrups; containing sugars; containing sugar alcohols, e.g. xylitol; containing starch hydrolysates, e.g. dextrin
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
    • A23L5/10—General methods of cooking foods, e.g. by roasting or frying
    • A23L5/11—General methods of cooking foods, e.g. by roasting or frying using oil
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
    • A23L5/00—Preparation or treatment of foods or foodstuffs, in general; Food or foodstuffs obtained thereby; Materials therefor
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    • A23L5/41—Retaining or modifying natural colour by use of additives, e.g. optical brighteners
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
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Abstract

The invention relates to a preparation method of low-fat pumpkin chips, which adopts the procedures of pre-slicing, color protection blanching, coating treatment, freezing hardening, vacuum frying, deoiling and the like to prepare the pumpkin chips. The preparation method can obviously reduce the vacuum frying time of the pumpkin chips, and solves the technical problem that the conventional vacuum fried pumpkin chips have high oil content. The pumpkin chips prepared by the method have the advantages of complete shape, golden color, crisp taste, fried flavor and pumpkin fragrance, greatly retains the original nutrient components of the pumpkin, and is simple in production equipment, low in cost and easy to realize industrial production.

Description

Preparation method of low-fat pumpkin crisp chips
Technical Field
The invention relates to the technical field of food processing, in particular to a preparation method of low-fat pumpkin crisp chips.
Background
Pumpkin is belonging to Cucurbitaceae Cucurbita (Cucurbita moschata Duch), and is edible in both fruit and seed. With the development of socioeconomic and improvement of the living standard of people in China, people have higher and higher attention to health and life while pursuing rich material life, so that food nutrition and health care become new social requirements. The pumpkin pulp is rich in nutrient components, contains 19 amino acids (including 8 amino acids essential to human body and histidine essential to children), trigonelline, pentosan, pectin, mannitol, citrulline, soluble fiber, lutein, phosphorus, calcium, magnesium, zinc, silicon and the like, and has the effects of detoxifying, protecting digestive tract mucosa, helping digestion, preventing arteriosclerosis, preventing diabetes and the like. Therefore, the value of the method can be increased by deeply developing and utilizing the method.
In recent years, the health care function of the pumpkin increasingly attracts people's attention, and the pumpkin food integrating the nutrition and health care functions is more and more popular with people, so that the pumpkin food has wide market prospect. The common pumpkin products in the current market are instant foods such as pumpkin juice, pumpkin powder, pumpkin fermented food, pumpkin cake, pumpkin preserved food and the like.
The fruit and vegetable crisp chips are high-quality dehydrated food, mostly keep the color, the fragrance and the taste of agricultural product raw materials, have crisp mouthfeel, are rich in vitamins and various mineral substances, have extremely low content of artificially synthesized additives, are convenient to carry, and can be stored for a long time, so that the fruit and vegetable crisp chips become the key point of attention and research of people in a few years. Many researchers began to produce pumpkin chips by different processing techniques. The method mainly comprises a microwave drying process, a microwave puffing method, an airflow puffing technology and the like, but the processed crisp chips are sensitive to air humidity, are light in taste, are not crisp and dry, and reduce the mouthfeel, and the vacuum frying technology can better improve the mouthfeel and is beneficial to storage. However, the frying time of the patent technology is too long, the influence on nutrient components is large, and the oil content of the crisp chips is still higher.
Disclosure of Invention
Technical problem to be solved
In view of the defects and shortcomings of the prior art, the invention provides a preparation method of low-fat pumpkin chips, aiming at the traditional vacuum frying process, a processing process of coating and dipping is added before pumpkin chips are frozen, and the coating liquid is frozen and hardened on the surfaces of the pumpkin chips and then is fried in vacuum, so that the vacuum frying time of the pumpkin chips can be obviously reduced, and the technical problem that the oil content of the existing vacuum fried pumpkin chips is higher is solved.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
a preparation method of low-fat pumpkin crisp chips comprises the following steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper base and the lower base, cutting and digging out the beard and the seeds, and preparing the pumpkin slices with the thickness of 2.5 mm-4.5 mm;
s2, color protection and blanching: putting the pumpkin slices obtained in the step S1 into color protection liquid for color protection, fishing out, soaking the pumpkin slices in water at the temperature of 75-95 ℃ for blanching, and cooling to normal temperature;
s3, coating treatment: adding the pumpkin slices obtained in the step S2 into the coating liquid, soaking and draining;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator;
s5, vacuum frying: placing the pumpkin slices processed in the step S4 into a vacuum frying machine at 80-95 ℃ for frying;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
Preferably, in step S2, the color protection solution is an aqueous solution comprising 0.05-0.15 wt% of citric acid, 0.10-0.20 wt% of vitamin C, 0.1-1 wt% of NaCl, and 0.1-0.3 wt% of CaCl2。
More preferably, the optimal conditions for color protection in step S2 are: 0.1 wt% of citric acid, 0.15 wt% of vitamin C, 1.0 wt% of NaCl and CaCl2 0.1wt％。
Preferably, in step S2, the blanching time after color protection is 60 to 120 seconds; more preferably, the blanching conditions are: blanching at 85 deg.C for 90 s.
Preferably, in step S3, the membrane coating solution is prepared by preparing 0.1% (g/mL) citric acid solution containing 1-5 wt% of chitosan, adding 0.5-3 wt% whey protein, 0.5-3 wt% soy protein isolate and 0.5-3 wt% collagen peptide, 3-10 wt% white sugar, 3-10 wt% trehalose, and 3-10 wt% maltitol, and stirring uniformly to obtain the membrane coating solution.
More preferably, the optimal composition conditions of the coating solution are 3 wt% of white granulated sugar, 10 wt% of trehalose, 3 wt% of maltitol, 1 wt% of chitosan, 0.5 wt% of whey protein, 3 wt% of soy protein isolate and 0.5 wt% of collagen peptide.
Optionally, the chitosan used in the coating liquid is chitosan with deacetylation degree of more than or equal to 90%.
Alternatively, in step S3, the time of the coating treatment is not less than 2 hours.
Optionally, in step S4, the freezing time is 0.5 to 2 days.
Preferably, in step S5, the vacuum frying time is 1000S to 1400S, the vacuum degree is 0.096 to 0.098MPa, and the frying conditions are 88 ℃ and 1000S.
Preferably, in step S6, the deoiling time is 180 to 220 seconds.
(III) advantageous effects
The invention has the beneficial effects that:
the preparation method of the low-fat pumpkin chips adopts the processes of pre-slicing, color protection blanching, coating treatment, freezing hardening, vacuum frying and deoiling treatment to regulate and control the preparation of the pumpkin chips, the product is complete in shape, golden in color and luster, crisp in taste, fried flavor and pumpkin fragrance, the original nutritional ingredients of the pumpkin are reserved to the greatest extent, the production equipment is simple, the cost is low, and the industrial production is easy to realize.
The invention adds a film coating liquid consisting of macromolecular substances which are easy to form films, such as chitosan, soy protein isolate, lactalbumin and the like, on the basis of the traditional vacuum frying process to carry out film coating treatment on the blanched pumpkin slices. The processing method enables the macromolecular substances to be adsorbed on the surface of the pumpkin slice and form a thin film through interaction, so that on one hand, the crisp slices have better water-retaining property, the crisp mouthfeel and the glossiness of the fried crisp slices are improved, and the flavor of the crisp slices is enriched; on the other hand, the adsorption of the vegetable oil on the surfaces of the crisp chips is prevented in the vacuum frying process, and tests show that the oil content of the crisp chips can be reduced, so that the oil content is lower than 15%, the crisp and non-greasy taste is realized, and the requirements of modern healthy low-fat food are met.
The invention optimizes and provides a new formula and composition of color protection liquid for pumpkin crisp chips, which comprises 0.1-0.20 wt% of citric acid, 0.10-0.20 wt% of vitamin C, 0.1-1 wt% of NaCl and 0.1-0.3 wt% of CaCl2. The citric acid and vitamin C in the formula achieve the purpose of color protection through chelation, antioxidation and other effects, CaCl2And NaCl can inhibit the browning of fruits and vegetables and achieve the hardening effect, and the NaCl and the citric acid are used together to generate the addition effect. The color fixative provided by the invention can be effectively applied to pumpkin slices, is a sulfur-free and EDTA-free color fixative, is safe to eat, and can obviously inhibit polyphenol oxidase in pumpkin.
In addition, the pumpkin crisp chip process provided by the invention keeps the components of pumpkin peel, improves the dietary fiber content of the pumpkin crisp chip and improves the edible nutritional functionality of the pumpkin crisp chip.
Drawings
FIG. 1 is a graph of the effect of thickness of pumpkin slices of examples 1-2 and comparative examples 1-3 on pumpkin crisp hardness and sensory score;
FIG. 2 is a graph of the effect of blanching time on pumpkin crisp hardness and sensory score for examples 3-4 and comparative examples 4-6;
FIG. 3 is a graph showing the effect of chitosan concentration on pumpkin crisp hardness and sensory score for examples 5-6 and comparative examples 7-9;
FIG. 4 is a graph showing the effect of freezing time on pumpkin crisp hardness and sensory score for examples 7-8 and comparative examples 10-11.
Detailed Description
For the purpose of better explaining the present invention, the present invention will be described in detail by way of specific embodiments for easy understanding.
According to the preparation method of the low-fat pumpkin chips, provided by the embodiment of the invention, before the traditional vacuum frying process, a coating dipping treatment process is utilized, and high-molecular film-forming materials such as chitosan/soybean protein isolate and the like are selected as components of a coating liquid, so that a complete film can be formed on the surface of the blanched pumpkin chips, the frying time can be greatly shortened, the fat content of the pumpkin chips can be effectively reduced, and the form and the nutritional ingredients of the pumpkin chips can be kept.
For a better understanding of the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention have been presented, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The dosage percentages in the invention are mass percentages without special indication.
Example 1
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into a container containing 0.1% by mass of citric acid, 0.15% by mass of vitamin C,1.0% NaCl and 0.1% CaCl2Soaking in the solution for 20min, blanching at 85 deg.C for 90s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1.5d (days);
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 2
In this example, the thickness of the sliced pumpkin in the step S1 was changed to 4.5mm based on example 1. The other conditions and procedures were the same as in example 1.
Comparative examples 1 to 3
In this comparative example, the thickness of the pumpkin chips obtained in step S1 was changed to 2.5mm, 3.0mm, and 3.5mm, based on example 1. The other conditions and procedures were the same as in example 1.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5 g.
The pumpkin chips of examples 1 to 2 and comparative examples 1 to 3 were scored for sensory evaluation according to the scoring criteria shown in the following table (table 1).
Table 1: sensory evaluation standard of vacuum fried pumpkin crisp chips
Figure BDA0002991366670000061
Figure BDA0002991366670000071
The scoring results are shown in fig. 1.
As can be seen in fig. 1, as the slice thickness increases, the hardness of the squash chips increases and then decreases, and the sensory score decreases and then increases. If the thickness of the slices is too small, the slices are easy to curl and fry during frying, and finished products are easy to break and cannot keep integrity, so that the production is not facilitated. If the thickness of the sliced pieces is too large, the fried pieces are likely to have the appearance of being cooked outside and the interior of the fried pieces being unripe. Therefore, sensory evaluation and hardness indexes are comprehensively considered, when the slice thickness is 4-4.5 mm, the prepared pumpkin crisp slices are good in color, crispness, taste and flavor, high in comprehensive evaluation and proper in hardness.
Example 3
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in step S1 into a container containing 0.1% citric acid, 0.15% vitamin C, 1.0% NaCl and 0.1% CaCl2Soaking in the solution for 20min, blanching at 85 deg.C for 60s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1d (day);
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 4
In this embodiment, the blanching time in step S2 is changed to 75S based on embodiment 3. Other conditions and procedures were the same as in example 3.
Comparative examples 4 to 6
Comparative examples 4 to 6 on the basis of example 3, the blanching times in step S2 were changed to 90S, 105S, and 120S. Other conditions and procedures were the same as in example 3.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5 g.
The pumpkin chips of examples 3 to 4 and comparative examples 4 to 6 were scored according to the sensory evaluation in accordance with the scoring criteria of Table 1.
The scoring results are shown in fig. 2.
As can be seen from fig. 2, as the blanching time increases, the hardness of the pumpkin crisp increases to a maximum value, then decreases to a minimum value, and finally gradually increases. Therefore, the sensory score and hardness index are comprehensively considered, when the blanching time is 60-75 s, particularly 75s, the prepared pumpkin crisp chips are good in color, crispness, taste and flavor, high in comprehensive evaluation and proper in hardness.
Example 5
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 4mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in step S1 into a container containing 0.1% citric acid, 0.15% vitamin C, 1.0% NaCl and 0.1% CaCl2Soaking in the solution for 20min, blanching at 85 deg.C for 80s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 in coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1.5% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 1.5d (days);
s5, vacuum frying: putting the pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.098MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 200S under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 6
In this example, the concentration of chitosan in step S3 was changed to 2.5% based on example 5. The other conditions and procedures were the same as in example 5.
Comparative examples 7 to 9
Comparative examples 7 to 9 on the basis of example 5, the concentrations of chitosan in step S3 were changed to 1%, 2%, 3%, and the other conditions and steps were the same as those of example 5.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5 g.
The pumpkin chips of examples 5 to 6 and comparative examples 7 to 9 were scored according to the sensory evaluation in accordance with the scoring criteria of Table 1.
The scoring results are shown in fig. 3.
As can be seen from fig. 3, as the concentration of chitosan increases, the hardness and sensory score of the pumpkin crisp chip increase to the maximum value, then decrease to the minimum value, and then increase again, i.e. the concentration of chitosan in the coating solution has a great influence on the hardness of the pumpkin crisp chip. Therefore, the sensory score and hardness index are comprehensively considered, and when the concentration of the chitosan is 2.5%, the prepared pumpkin crisp chips are good in color, crispness, taste and flavor, high in comprehensive evaluation and proper in hardness.
Example 7
The embodiment provides a production method of vacuum fried pumpkin chips, which comprises the following specific steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper and lower pedicles and the bad surface, cutting into U-shaped pumpkin slices with the thickness of 3.5mm in a cross cutting mode, and removing the whiskers and seeds;
s2, color protection and blanching: placing the pumpkin slices obtained in step S1 into a container containing 0.1% citric acid, 0.15% vitamin C, 1.0% NaCl and 0.1% CaCl2Soaking in the solution for 20min, blanching at 85 deg.C for 80s, and cooling to room temperature;
s3, coating treatment: placing the pumpkin slices obtained in the step S2 into coating liquid containing 3% of white granulated sugar, 10% of trehalose, 3% of maltitol, 1% of chitosan, 0.5% of whey protein, 3% of soybean protein isolate and 0.5% of collagen peptide by mass concentration, soaking for 2 hours, and draining for 1 hour after soaking in the coating liquid;
s4, freezing and hardening: freezing the pumpkin slices obtained in the step S3 in a refrigerator at the temperature of-20 ℃ for 0.5d (day);
s5, vacuum frying: putting the frozen pumpkin slices obtained in the step S4 into a vacuum air frying pan with the vacuum degree of 0.096MPa and the temperature of 88 ℃ for frying for 1000S;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling for 180S under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
The vacuum fried pumpkin chips obtained by the blending scheme have crisp mouthfeel without greasiness, golden yellow appearance, fried flavor and pumpkin fragrance.
Example 8
In this example, the freezing time in step S4 was changed to 1 day (day) on the basis of example 7. The other conditions and procedures were the same as in example 7.
Comparative examples 10 to 11
Comparative examples 10 to 11 on the basis of example 7, the freezing time in step S4 was changed to 1.5d, 2 d. The other conditions and procedures were the same as in example 7.
The hardness (or brittleness) of the pumpkin crisp chips is measured by a food physical property tester (TA.XTPlus). The measurement conditions were: the HDP-3PB type stainless steel spherical probe has the speed of 2mm/s before testing, the testing speed of 1mm/s, the speed of 2mm/s after testing, the testing distance of 5mm and the threshold value of 5 g.
The pumpkin chips of examples 7 to 8 and comparative examples 10 to 11 were scored for sensory evaluation according to the scoring criteria of Table 1.
The scoring results are shown in fig. 4.
As can be seen from fig. 4, the hardness and the sensory score of the pumpkin chips are reduced along with the increase of the freezing time, so that the sensory score and the hardness index are comprehensively considered, and the pumpkin chips prepared when the freezing time is 1d (day) have good color, crispness, taste and flavor, high comprehensive evaluation and proper hardness.
The change in the nutritional content of the pumpkin chips of example 1 at different processing steps during the processing was measured, and the results are shown in table 2. The samples comprise fresh pumpkins, sliced pumpkins, blanched pumpkins, film-coated pumpkins and vacuum fried pumpkin crisp chips, and the content of total sugar, vitamin E, carotene and inositol in the samples is determined by the following method:
the total sugar is determined by the second method of national standard GB 5009.8-2016;
the amino acid content is determined according to the national standard GB 5009.124-2016;
the vitamin E content is determined according to the national standard GB 5009.82-2016;
the carotene content is determined according to the national standard GB 5009.83-2106.
TABLE 2 variation of nutrient composition during the processing of pumpkin chips
Figure BDA0002991366670000111
As can be seen from Table 2, the amount of carotene in the vacuum fried pumpkin chips was increased 40-fold compared to fresh pumpkin, 4.31mg/100g, which was significantly higher than the purple sweet potato chips, potato chips and apple chips. The total sugar content of the pumpkin crisp chip is increased by 3.5 times compared with that of fresh pumpkin and is 15.2 percent. This is because most of the moisture is removed during the freeze hardening and vacuum frying process and the sugar is enriched. Compared with fresh pumpkin, the vitamin E content of the vacuum fried pumpkin crisp chips is reduced, which is caused by the oxidation of part of the vitamin E in the vacuum frying process. Inositol is a growth factor, and can reduce cholesterol and prevent arteriosclerosis. As can be seen from Table 2, the vacuum fried squash chips had an inositol content of 225.31mg/100g, which is an increase over fresh squash.
A batch of pumpkin chips prepared and produced by the process of example 4 were measured for moisture content, fat content, trace elements and amino acid content, respectively, and the results are shown in table 3; the method of testing was as follows,
and (3) moisture determination: reference is made to the national standard GB 5009.3;
fat content is measured according to the national standard GB 5009.6-2016;
the determination of the trace elements refers to the national standard GB 5009.268-2016;
the amino acid content is determined according to the national standard GB 5009.124-2016.
TABLE 3 nutrient components and contents of pumpkin crisp chips
Figure BDA0002991366670000121
Figure BDA0002991366670000131
Figure BDA0002991366670000141
As shown in Table 3, the content of trace elements such as potassium, phosphorus, magnesium and calcium in the pumpkin chips prepared by the invention is high, wherein the content of potassium element is up to 452.2mg/100g, which is 2 times of the potassium content (244.2mg/100g) of the pumpkin chips reported in the literature. The contents of phosphorus, magnesium and calcium are respectively 54.35, 24.43 and 15.93mg/100g, which is similar to the content reported in the literature. The content of iron is lower, which is averagely 3.81mg/100g and is 1.8 times of the content reported in the literature, and the content of selenium is lower, which is averagely less than 0.03mg/100 g. The pumpkin chips contain various elements and 17 amino acids required by human bodies, wherein the content of essential amino acids such as lysine, valine, leucine, isoleucine, phenylalanine, threonine and the like is high. The loss degree of trace elements and amino acids of the vacuum fried pumpkin chips is small, and the nutritional ingredients are completely reserved. The pumpkin crisp chips have low fat content, good sensory index and storage resistance, and the nutrient components and the flavor of the pumpkin are greatly reserved.
Research shows that when the oil content is about 20%, the water content of the crisp is lower than 7%, and the water activity can be ensured to be not higher than 0.65, so that the sensory index and the storage resistance of the crisp are good. The water content of the pumpkin crisp chips prepared by the method is about 7.7 percent, slightly higher than 7 percent, the oil content is about 12 percent and obviously lower than 20 percent, so the pumpkin crisp chips prepared by the preparation method disclosed by the invention can be predicted to have better storability, and compared with the known preparation technology of vacuum fried pumpkin crisp chips, the frying time is greatly shortened, the oil content is very low, and the low-fat and healthy requirements are met.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (9)

1. The preparation method of the low-fat pumpkin crisp chips is characterized by comprising the following steps:
s1, pre-slicing: after cleaning the pumpkin, removing the upper base and the lower base, cutting and digging out the beard and the seeds, and preparing the pumpkin slices with the thickness of 2.5 mm-4.5 mm;
s2, color protection and blanching: placing the pumpkin slices obtained in the step S1 into color protection liquid for color protection treatment, fishing out, soaking the pumpkin slices in water at the temperature of 75-95 ℃ for blanching, and cooling to normal temperature;
s3, coating treatment: adding the pumpkin slices obtained in the step S2 into the coating liquid, soaking and draining;
s4, freezing and hardening: putting the pumpkin slices obtained in the step S3 into a refrigerator for freezing;
s5, vacuum frying: placing the pumpkin slices processed in the step S4 into a vacuum frying machine at 80-95 ℃ for frying;
s6, deoiling treatment: and (5) placing the pumpkin slices obtained in the step (S5) into a deoiling device, deoiling under the conditions of 200-300r/min, and cooling to obtain the pumpkin chips.
2. The method of claim 1, wherein: in step S2, the color protection liquid is an aqueous solution containing: 0.05-0.15 wt% of citric acid, 0.10-0.20 wt% of vitamin C, 0.1-1 wt% of NaCl and 0.1-0.3 wt% of CaCl2。
3. The method of claim 1, wherein: in step S2, the blanching time after color protection is 60 to 120 seconds.
4. The method of claim 1, wherein: in step S3, the coating solution is an aqueous solution containing:
1-5 wt% of chitosan, 0.5-3 wt% of whey protein, 0.5-3 wt% of soy protein isolate, 0.5-3 wt% of collagen peptide, 3-10 wt% of white granulated sugar, 3-10 wt% of trehalose, 3-10 wt% of maltitol and 0.08-0.12% of citric acid in mass volume concentration.
5. The method of claim 4, wherein: the deacetylation degree of the chitosan used in the coating liquid is more than or equal to 90 percent.
6. The method of claim 1, wherein: in step S3, the pumpkin slices processed in step S2 are immersed in the coating liquid for not less than 2 hours.
7. The method of claim 1, wherein: in step S4, the freezing time is 0.5 to 2 days.
8. The method of claim 1, wherein: in step S5, the vacuum degree of vacuum frying is 0.096-0.098 MPa, and the frying time is 1000-1400S.
9. The method of claim 1, wherein: in step S6, the deoiling time is 180 to 220 seconds.
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