CN112853445B - Horizontal electroplating pool with laterally-pulled anode for wafer and horizontal electroplating device for wafer - Google Patents

Horizontal electroplating pool with laterally-pulled anode for wafer and horizontal electroplating device for wafer Download PDF

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Publication number
CN112853445B
CN112853445B CN202110021812.4A CN202110021812A CN112853445B CN 112853445 B CN112853445 B CN 112853445B CN 202110021812 A CN202110021812 A CN 202110021812A CN 112853445 B CN112853445 B CN 112853445B
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wafer
electroplating
anode
cathode
horizontal
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CN112853445A (en
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何志刚
余丞宏
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Dai Dai Feng Technology Co ltd
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Dai Dai Feng Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Abstract

The invention provides a wafer horizontal electroplating pool with a laterally drawable anode and a wafer horizontal electroplating device. Be equipped with the pull opening on a lateral wall of wafer horizontal electroplating device's plating bath pond, still be equipped with electrically conductive socket in plating bath pond, the positive pole subassembly passes in the pull opening is installed plating bath pond, and with electrically conductive socket is electrically conductive to be connected, and the end plate of positive pole subassembly is paid and is pressed through locking a pair the plating bath lateral wall in the pull opening outside be equipped with the sealing member between end plate and the plating bath lateral wall. The anode assembly can be integrally and directly drawn out from the lateral drawing opening of the electroplating liquid pool, so that the anode metal can be conveniently replaced, and the maintenance efficiency is greatly improved. Furthermore, a cathode plating solution nozzle is also arranged in a cathode plating solution pool of the wafer horizontal plating device, and fluid parallel to the surface of the wafer is generated by the cathode plating solution nozzle, so that air bubbles accumulated in a structural layer to be plated of the wafer are discharged along with the fluid, and plating cavities are prevented from being generated.

Description

Horizontal electroplating pool with laterally-drawn anode for wafer and horizontal electroplating device for wafer
Technical Field
The invention relates to the technical field of wafer packaging wet process, in particular to a wafer horizontal electroplating tank with an anode capable of being pulled laterally and a wafer horizontal electroplating device.
Background
The wafer horizontal electroplating refers to an electroplating device which is arranged in a state that the surface to be electroplated of the wafer is horizontal during electroplating, the surface to be electroplated of the wafer is downward, and the anode is horizontally arranged right below the wafer. The anode metal of the anode is continuously consumed in the electroplating process, and needs to be replaced after being used for a period of time.
In addition, for the wafer horizontal electroplating device, the surface to be electroplated of the wafer is downward, the anode is horizontally arranged right below the wafer, bubbles are generated in the electroplating solution during electroplating, as shown in fig. 6, the bubbles 30 float upward and enter the structural layer to be electroplated on the lower surface of the wafer 101, and as the wafer 101 is horizontally arranged, the bubbles 30 cannot smoothly discharge out of the wafer 101, so that a plating layer cavity is formed, and the electroplating quality is affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a wafer horizontal electroplating tank with an anode capable of being drawn laterally and a wafer horizontal electroplating device.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: a horizontal wafer electroplating pool with a laterally-pulled anode comprises an electroplating solution pool and an anode assembly, wherein a pull opening is formed in one side wall of the electroplating solution pool, a conductive socket is further arranged in the electroplating solution pool, the anode assembly comprises an end plate, a horizontal plate, anode metal and a conductive relay plate, the end plate is mounted at one end of the horizontal plate, the anode metal is placed on the horizontal plate, and the conductive relay plate is in conductive connection with the anode metal; the positive pole subassembly passes the pull opening is installed in the plating bath pond, just electrically conductive relay board with electrically conductive socket conductive connection, the end plate is paid and is pressed through locking the piece lock the plating bath lateral wall in the pull opening outside, still be equipped with the sealing member between end plate and the plating bath lateral wall.
Compared with the prior art, the anode assembly can be integrally and directly drawn out from the lateral drawing opening of the electroplating liquid pool, so that the replacement of anode metal is facilitated, and the maintenance efficiency is greatly improved.
Furthermore, the number of the conductive sockets is multiple, and the multiple conductive sockets are horizontally arranged on the inner side wall of the electroplating liquid pool.
Furthermore, the plug elastic sheet of the conductive socket is M-shaped, and the conductive relay board is inserted into the middle concave part of the M-shaped plug elastic sheet.
With the above preferred arrangement, the reliability of the electrical connection is ensured.
Furthermore, a guide support piece for supporting the horizontal plate is arranged in the electroplating bath pool.
By adopting the preferable scheme, the anode assembly can be pulled out or pushed in along the guide support piece, so that the disassembly and the assembly are convenient, and the conductive relay board can be smoothly inserted and matched with the conductive socket.
Further, the sealing element is an annular sealing ring surrounding the outer side of the pull-out opening.
Furthermore, an annular groove is formed in the end plate, and the annular sealing ring is embedded in the annular groove.
By adopting the preferable scheme, the position of the sealing ring can be effectively regulated.
Further, the seal member includes a plurality of annular seal rings.
Adopt above-mentioned preferred scheme, improve sealed effect.
Further, the anode metal of the anode assembly is round, a round groove for placing the anode metal is formed in the horizontal plate, the anode metal is made of the same material as the material of the to-be-electroplated coating of the wafer, a round opening is formed in the conductive relay plate, the inner diameter of the round opening is slightly smaller than the outer diameter of the anode metal, and the edge of the round opening of the conductive relay plate is pressed against the edge of the anode metal and locked on the horizontal plate through a locking piece.
By adopting the preferable scheme, the metal position of the anode is kept stable, and the anode is ensured to be electrically conducted reliably.
Further, the outer side of the anode assembly end plate is provided with a handle.
Adopt above-mentioned preferred scheme, convenient pull operation.
A wafer horizontal electroplating device comprises:
the wafer carrier is used for loading a wafer to be electroplated, the wafer is horizontally arranged on the wafer carrier, the surface of the wafer to be electroplated faces downwards, and a cathode electrode in conductive contact with the wafer is arranged on the wafer carrier;
the anode can be laterally drawn out of the wafer horizontal electroplating tank;
the electroplating liquid pool comprises an anode electroplating liquid pool body and a cathode electroplating liquid pool body, wherein the cathode electroplating liquid pool body is positioned above the anode electroplating liquid pool body, a through opening is arranged between the cathode electroplating liquid pool body and the anode electroplating liquid pool body, and the electroplating liquid pool also comprises an ionic membrane for shielding the through opening; the anode assembly is horizontally arranged in the anode electroplating liquid tank body in a drawable manner;
and the cathode electroplating solution spray head is arranged in the cathode electroplating solution tank, and the jet flow direction of the cathode electroplating solution spray head is in the horizontal direction.
Compared with the prior art, the invention generates the fluid parallel to the surface of the wafer through the cathode electroplating solution spray head, thereby discharging the bubbles accumulated in the structural layer to be electroplated of the wafer along with the fluid and preventing electroplating cavities from being generated.
Furthermore, the cathode electroplating solution tank body comprises at least 1 group of cathode electroplating solution spray head combinations, each group of cathode electroplating solution spray head combinations comprises 2 oppositely-arranged cathode electroplating solution spray heads, and the jet flow direction of the cathode electroplating solution spray heads is in the horizontal direction.
By adopting the preferable scheme, during electroplating, the two oppositely arranged cathode electroplating solution nozzles respectively correspond to two sides below the outer circumference of the wafer, and all the cathode electroplating solution nozzles spray liquid in turn to generate liquid flows in different directions, so that the uneven thickness of a coating caused by a single liquid flow direction is prevented, and the uniform and stable coating of the wafer is ensured.
Furthermore, a shielding plate which is horizontally arranged is arranged in the cathode electroplating solution tank body, a plurality of flow guide holes are formed in the shielding plate, and the shielding plate is positioned below the cathode electroplating solution spray head.
By adopting the preferable scheme, the shielding plate is used for balancing the distribution of the power lines and improving the thickness uniformity of the plating layer.
Furthermore, the cathode plating solution nozzle is flat, and the head of the cathode plating solution nozzle is provided with a plurality of water outlet holes which are horizontally arranged.
By adopting the preferable scheme, liquid flow parallel to the surface to be electroplated of the wafer is conveniently formed, and the bubble discharge capacity is improved.
Furthermore, an overflow port is arranged on the wall of the cathode electroplating solution cell body, an overflow cell is arranged on the periphery of the cathode electroplating solution cell body, and a reflux port is arranged at the bottom of the overflow cell.
Furthermore, the overflow port is a plurality of strip holes distributed along the circumferential direction of the cathode electroplating solution tank body.
By adopting the preferable scheme, the cathode electroplating solution sprayed by the cathode electroplating solution spray head can uniformly overflow, and the electroplating solution in the cathode electroplating solution pool can circularly flow.
Furthermore, each cathode electroplating solution spray head is connected with a cathode electroplating solution pump, a water outlet of the cathode electroplating solution pump is connected to the cathode electroplating solution spray head through a pipeline, and a water inlet of the cathode electroplating solution pump is connected to a return port of the overflow tank through a pipeline.
By adopting the preferable scheme, only one cathode electroplating solution spray head works in the electroplating process, and the start and stop are realized by controlling the cathode electroplating solution pumps corresponding to the cathode electroplating solution spray heads respectively.
Furthermore, all cathode electroplating solution spray heads share one cathode electroplating solution pump, a water inlet of the cathode electroplating solution pump is connected to a return port of the overflow tank through a pipeline, and a water outlet of the cathode electroplating solution pump is connected to the electromagnetic control valve through a pipeline and then is respectively connected to each cathode electroplating solution spray head through a pipeline.
By adopting the preferable scheme, only one cathode plating solution pump is used, and the electromagnetic control valve is used for controlling each cathode plating solution spray head to spray liquid in sequence.
Furthermore, the wafer carrier device also comprises a rotary driving mechanism for driving the wafer carrier to rotate and a lifting driving mechanism for driving the wafer carrier to move up and down.
By adopting the preferable scheme, the rotary driving mechanism drives the wafer to rotate during electroplating, so that the wafer is contacted with electroplating solution in more areas as much as possible, and the difference of the thickness of the coating caused by uneven distribution of cations in the electroplating solution is further eliminated.
Furthermore, an anode electroplating solution circulating port is arranged in the anode electroplating solution tank body, and the anode electroplating solution circulating port is used for promoting the anode electroplating solution to circularly flow by one inlet and one outlet.
With the above preferred embodiment, the flow of metal ions to the cathode electrode side can be promoted.
Furthermore, each cathode electroplating solution spray head is respectively arranged above the shielding plate in a horizontally swinging manner through a rotating fulcrum, and the device also comprises a steering driving mechanism for driving each cathode electroplating solution spray head to swing around the rotating fulcrum and an angle detection sensor for detecting the swinging angle of each cathode electroplating solution spray head.
By adopting the preferable scheme, the direction of the cathode electroplating solution spray head can be adjusted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of an embodiment of the present invention;
FIG. 2 is a schematic perspective view of an electroplating bath;
FIG. 3 is a schematic perspective view of an anode assembly;
FIG. 4 is a top view of an embodiment of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is a diagram illustrating bubbles remaining in a structure to be plated on a wafer according to the prior art;
FIG. 7 is a schematic structural diagram of an embodiment of the present invention;
FIG. 8 is a schematic view showing a structure in which the wafer carrier is moved into the plating bath during plating;
FIG. 9 is a schematic view of bubbles being expelled from a wafer with liquid flow during electroplating according to the present invention;
FIG. 10 is a schematic structural diagram of another embodiment of the present invention;
FIG. 11 is an enlarged view at B of FIG. 10;
FIG. 12 is a layout view of a catholyte showerhead of another embodiment of the present invention;
FIGS. 13a-13d are schematic views of sequential unidirectional fluid jets from each cathode plating solution spray head;
FIG. 14 is a schematic view showing forward swirling flow by simultaneous jets of the respective cathode plating solution sprayers;
FIG. 15 is a schematic view showing that the cathode plating liquid spray heads simultaneously spray the plating liquid to effect reverse swirling flow.
Names of corresponding parts represented by numerals and letters in the drawings:
10-a wafer carrier; 101-a wafer; 20-an electroplating solution pool; 201-pull opening; 21-anode electroplating bath body; 22-cathode electroplating solution tank body; 221-overflow port; 23-a through opening; 24-an ionic membrane; 25-cathode plating solution showerhead; 26-a shielding plate; 27-an overflow tank; 29-anode plating solution circulation port; 30-bubbles; 40-an anode assembly; 401-end plate; 402-a horizontal plate; 403-anodic metal; 404-conductive relay board; 405-a sealing member; 406-a handle; 50-a conductive socket; 60-a guide support; 701-a drive motor; 702-a drive gear; 703-a driven gear; 704-a drive shaft; 705-eccentric wheel; 706-a long-strip limiting groove; 707-position detecting piece; 708-a photosensor; 709-rotation fulcrum.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-5, one embodiment of the present invention is: a horizontal wafer electroplating pool with an anode capable of being pulled laterally comprises an electroplating liquid pool 20 and an anode assembly 40, wherein a pull opening 201 is formed in one side wall of the electroplating liquid pool 20, a conductive socket 50 is further arranged in the electroplating liquid pool 20, the anode assembly 40 comprises an end plate 401, a horizontal plate 402, anode metal 403 and a conductive relay plate 404, the end plate 401 is installed at one end of the horizontal plate 402, the anode metal 403 is placed on the horizontal plate 402, and the conductive relay plate 404 is in conductive connection with the anode metal 403; the anode assembly 40 is installed in the electroplating liquid pool 20 through the drawing opening 201, the conductive relay plate 404 is in conductive connection with the conductive socket 50, the end plate 401 is locked and pressed on the outer side wall of the electroplating liquid pool outside the drawing opening through the locking piece, and a sealing piece 405 is further arranged between the end plate 401 and the outer side wall of the electroplating liquid pool.
The beneficial effect of adopting above-mentioned technical scheme is: the anode assembly can be integrally and directly drawn out from the lateral drawing opening of the electroplating liquid pool, so that the replacement of anode metal is facilitated, and the maintenance efficiency is greatly improved.
In other embodiments of the present invention, the conductive socket may be mounted on a sidewall or a bottom of the plating solution tank or suspended via a fixing plate, and the specific form is not limited. As shown in fig. 2 and 5, the conductive socket 50 is mounted on the inner side wall of the plating liquid bath on the opposite side to the drawing opening 201. The number of the conductive sockets 50 is plural, and the plural conductive sockets are installed on the inner side wall of the plating solution tank in the same horizontal direction. The insertion spring of the conductive socket 50 is formed in an M shape, and the conductive relay board 404 is inserted into the middle concave portion of the M-shaped insertion spring. The beneficial effect of adopting above-mentioned technical scheme is: ensuring the reliability of the electrical continuity connection.
In other embodiments of the present invention, as shown in fig. 2 and 5, a guiding support 60 for supporting the horizontal plate 402 is further disposed in the plating solution tank 20. The beneficial effect of adopting above-mentioned technical scheme is: the anode assembly can be pulled out or pushed in along the guide support piece, so that the anode assembly is convenient to disassemble and assemble, and the conductive relay board can be smoothly inserted and matched with the conductive socket.
In further embodiments of the invention, the sealing element 405 is an annular sealing ring surrounding the outer side of the pull-out opening, and the end plate 405 is provided with an annular groove in which the annular sealing ring is embedded. The beneficial effect of adopting above-mentioned technical scheme is: the position of the sealing ring can be effectively regulated.
In other embodiments of the present invention, the seal comprises a multi-pass o-ring seal. The beneficial effect of adopting above-mentioned technical scheme is: the sealing effect is improved.
In other embodiments of the present invention, as shown in fig. 3 and 5, the anode metal 403 of the anode assembly is circular, the horizontal plate 402 is provided with a circular groove for placing the anode metal 403, the material of the anode metal 403 is the same as the material of the plating layer to be plated on the wafer, the conductive relay plate 404 is provided with a circular opening, the inner diameter of the circular opening is slightly smaller than the outer diameter of the anode metal 403, and the edge of the circular opening of the conductive relay plate 404 is pressed against the edge of the anode metal 403 and locked on the horizontal plate 402 via the locking member. The beneficial effect of adopting above-mentioned technical scheme is: the metal position of the anode is kept stable and the electric conduction reliability of the anode is ensured.
In other embodiments of the invention, as shown in fig. 5, the anode assembly end plate is provided with a handle 406 on the outside. The beneficial effect of adopting above-mentioned technical scheme is: the drawing operation is convenient.
As shown in fig. 7 and 8, one embodiment of the present invention is: a wafer horizontal electroplating device comprises:
the wafer carrier 10 is used for loading a wafer to be electroplated, the wafer 101 is horizontally arranged on the bottom surface of the wafer carrier 10, the surface to be electroplated of the wafer 101 faces downwards, and a cathode electrode in conductive contact with the wafer is arranged on the wafer carrier 10;
an electroplating liquid pool which comprises an anode electroplating liquid pool body 21 and a cathode electroplating liquid pool body 22, wherein the cathode electroplating liquid pool body 22 is positioned above the anode electroplating liquid pool body 21, a through opening 23 is arranged between the cathode electroplating liquid pool body 22 and the anode electroplating liquid pool body 21, and the electroplating liquid pool also comprises an ionic membrane 24 for shielding the through opening 23; an anode assembly 28 which is horizontally arranged is arranged in the anode electroplating solution tank body 21; the anode electroplating solution and the cathode electroplating solution are separated by the ionic membrane 24, metal ions in the anode electroplating solution can enter the cathode electroplating solution through the ionic membrane 24, only organic additives for improving the quality of the plating layer are added in the cathode electroplating solution, and no organic additives are added in the anode electroplating solution, so that the additives can be prevented from being damaged by contacting with an anode assembly;
1 group of cathode electroplating solution sprayer assemblies which are arranged in a cathode electroplating solution tank body 22, wherein each group of cathode electroplating solution sprayer assemblies comprises 2 cathode electroplating solution sprayers 25 which are oppositely arranged, the 2 cathode electroplating solution sprayers 25 are positioned outside the projection outer ring of the wafer in horizontal plane projection, and the connection line of the 2 cathode electroplating solution sprayers passes through the projection circle center of the wafer horizontal plane; the direction of the jet flow of the cathode plating liquid jet head 25 is horizontal.
The beneficial effect of adopting above-mentioned technical scheme is: as shown in fig. 4, a liquid flow parallel to the surface of the wafer is generated by the cathode plating liquid showerhead 25, so that the bubbles 30 accumulated in the structural layer to be plated of the wafer are discharged along with the liquid, thereby preventing the generation of plating voids. During electroplating, the two oppositely arranged cathode electroplating solution nozzles 25 respectively correspond to two sides below the outer circumference of the wafer, all the cathode electroplating solution nozzles 25 spray liquid in turn, so that liquid flows in different directions are generated, the phenomenon that the thickness of a coating is uneven due to a single liquid flow direction is prevented, and the uniformity and stability of the coating of the wafer are ensured.
In other embodiments of the present invention, as shown in fig. 7, a shielding plate 26 is horizontally disposed in the cathode plating solution tank 22, a plurality of flow guiding holes are disposed in the shielding plate 26, and the shielding plate 26 is disposed below the cathode plating solution showerhead 25. The beneficial effect of adopting above-mentioned technical scheme is: the shielding plate is used for balancing the distribution of the power lines and improving the thickness uniformity of the plating layer.
In another embodiment of the present invention, as shown in fig. 7, the cathode plating solution showerhead 25 is formed in a flat shape, and the head of the cathode plating solution showerhead 25 is provided with a plurality of outlet holes arranged horizontally. The beneficial effect of adopting above-mentioned technical scheme is: the liquid flow parallel to the surface to be electroplated of the wafer is conveniently formed, and the bubble discharge capacity is improved.
In other embodiments of the present invention, as shown in fig. 7, an overflow port 221 is provided on the cell wall of the catholyte cell body 22, an overflow cell 27 is provided on the periphery of the catholyte cell body, and a return port is provided at the bottom of the overflow cell 27. The overflow ports 221 are a plurality of elongated holes distributed along the circumferential direction of the cathode electrolyte tank body 22. The beneficial effect of adopting above-mentioned technical scheme is: the cathode electroplating solution sprayed by the cathode electroplating solution spray head can uniformly overflow, and the electroplating solution in the cathode electroplating solution pool can circularly flow.
In other embodiments of the present invention, each catholyte sprayer is connected to a catholyte pump, a water outlet of the catholyte pump is connected to the catholyte sprayer via a pipe, and a water inlet of the catholyte pump is connected to the return port of the overflow tank via a pipe. The beneficial effect of adopting above-mentioned technical scheme is: in the electroplating process, only one cathode electroplating solution spray head works, and the start and stop are realized by controlling the cathode electroplating solution pumps respectively corresponding to the cathode electroplating solution spray heads.
In other embodiments of the present invention, all the catholyte solution nozzles share one catholyte solution pump, a water inlet of the catholyte solution pump is connected to the return port of the overflow tank through a pipeline, and a water outlet of the catholyte solution pump is connected to the electromagnetic control valve through a pipeline and then is connected to each of the catholyte solution nozzles through a pipeline. The beneficial effect of adopting above-mentioned technical scheme is: only one cathode plating solution pump is used, and the electromagnetic control valve is used for controlling each cathode plating solution spray head to spray liquid in sequence.
In other embodiments of the present invention, the apparatus further includes a rotation driving mechanism for driving the wafer carrier to rotate, and a lifting driving mechanism for driving the wafer carrier to move up and down. The beneficial effect of adopting above-mentioned technical scheme is: during electroplating, the rotary driving mechanism drives the wafer to rotate, so that the wafer is contacted with electroplating solution in more areas as much as possible, and the difference of the thickness of the plating layer caused by uneven distribution of cations in the electroplating solution is further eliminated.
In another embodiment of the present invention, as shown in FIG. 7, an anode plating solution circulation port 29 is provided in the anode plating solution tank body 21 so as to circulate the anode plating solution in one inlet and one outlet. The beneficial effect of adopting above-mentioned technical scheme is: the diffusion of the metal ions toward the cathode side flow can be promoted.
As shown in fig. 13a-13d, 4 catholyte solution nozzles 25 are included, and each of the catholyte solution nozzles is activated in turn during electroplating of the wafer to generate a high-speed liquid flow parallel to the wafer below the surface to be electroplated, wherein when one of the catholyte solution nozzles is spraying liquid, the rest of the catholyte solution nozzles are not spraying liquid, and the working time of each of the catholyte solution nozzles is the same.
In other embodiments of the present invention, as shown in fig. 10 to 12, each of the catholyte bath nozzles 25 is mounted above the shielding plate so as to be horizontally swingable via a pivot 709, and includes a steering drive mechanism for driving each of the catholyte bath nozzles 25 to swing about the pivot 709, and an angle detection sensor for detecting a swing angle of each of the catholyte bath nozzles. The steering driving mechanism comprises a driving motor 701, a driving gear 702, a driven gear 703, a transmission shaft 704 and an eccentric wheel 705, wherein the driving gear 702 is arranged on an output shaft of the driving motor 701, the driving gear 702 is meshed with the driven gear 703, the driven gear 703 is arranged at the upper end part of the transmission shaft 704, the eccentric wheel 705 is arranged at the lower end part of the transmission shaft 704, the eccentric wheel 705 is arranged in a long limiting groove 706 of the cathode electroplating solution spray head, a position detecting sheet 707 is arranged on the transmission shaft 704, 3 photoelectric sensors 708 matched with the position of the position detecting sheet on the transmission shaft are arranged on the upper part of the electroplating solution pool, when the position detecting sheet 707 shields the light paths of 3 photoelectric sensors 708 in turn, the eccentric wheel causes the cathode electroplating solution nozzle to swing to a clockwise position, a middle position and a counterclockwise position in turn, here, the clockwise and counterclockwise positions refer to the horizontal inclined positions at which the jets can induce a clockwise or counterclockwise swirl of the plating solution. By adopting the mechanism of the embodiment, a unidirectional jet flow mode, a forward rotational flow mode and a reverse rotational flow mode can be alternately carried out during wafer electroplating; as shown in fig. 13a-13d, the unidirectional spray mode means that each of the catholyte sprayer is activated in turn, the catholyte sprayer spraying liquid is in the middle position, and direct current parallel to the wafer is generated below the surface to be electroplated of the wafer, wherein when one of the catholyte sprayers sprays liquid, the other catholyte sprayers do not spray liquid, and the working time of each of the catholyte sprayers is the same; as shown in fig. 14, the forward rotational flow mode is that each cathode plating solution nozzle is adjusted to be positioned clockwise by the steering driving mechanism, and each cathode plating solution nozzle is started simultaneously to generate a forward rotational flow parallel to the wafer in the clockwise direction below the surface to be plated of the wafer; as shown in fig. 15, the reverse rotational flow mode is that each cathode plating solution nozzle is adjusted to be in a counterclockwise position by the steering driving mechanism, and each cathode plating solution nozzle is simultaneously started to generate a counterclockwise reverse rotational flow parallel to the wafer below the surface to be plated of the wafer.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.

Claims (8)

1. A wafer horizontal electroplating device is characterized by comprising:
the wafer carrier is used for loading a wafer to be electroplated, the wafer is horizontally arranged on the wafer carrier, the surface of the wafer to be electroplated faces downwards, and a cathode electrode in conductive contact with the wafer is arranged on the wafer carrier;
the horizontal wafer electroplating pool with the laterally-pulled anode comprises an electroplating liquid pool and an anode assembly, wherein a pull opening is formed in one side wall of the electroplating liquid pool, a conductive socket is further arranged in the electroplating liquid pool, the anode assembly comprises an end plate, a horizontal plate, anode metal and a conductive relay plate, the end plate is mounted at one end of the horizontal plate, the anode metal is placed on the horizontal plate, and the conductive relay plate is in conductive connection with the anode metal; the anode assembly penetrates through the drawing opening to be installed in the electroplating bath, the conductive relay board is in conductive connection with the conductive socket, the end plate is locked by the locking part and pressed on the outer side wall of the electroplating bath outside the drawing opening, and a sealing part is further arranged between the end plate and the outer side wall of the electroplating bath;
the electroplating liquid pool comprises an anode electroplating liquid pool body and a cathode electroplating liquid pool body, wherein the cathode electroplating liquid pool body is positioned above the anode electroplating liquid pool body, a through opening is arranged between the cathode electroplating liquid pool body and the anode electroplating liquid pool body, and the electroplating liquid pool also comprises an ionic membrane for shielding the through opening; the anode assembly is horizontally arranged in the anode electroplating liquid tank body in a drawable manner;
and the cathode electroplating solution spray head is arranged in the cathode electroplating solution tank, and the jet flow direction of the cathode electroplating solution spray head is in the horizontal direction.
2. The wafer level plating apparatus of claim 1, wherein the number of the conductive sockets is plural, and the plural conductive sockets are installed on the inner side wall of the plating solution tank in the same level.
3. The wafer level plating apparatus of claim 1, wherein the insertion spring of the conductive socket is formed in an M shape, and the conductive relay board is inserted into a middle inner concave portion of the M-shaped insertion spring.
4. The horizontal wafer plating apparatus as claimed in claim 1, wherein a guide support for supporting the horizontal plate is further provided in the plating bath.
5. The wafer level plating apparatus of claim 1, wherein the seal is an annular seal ring surrounding the draw opening.
6. The horizontal electroplating device for wafers as claimed in claim 5, wherein the end plate is provided with an annular groove, and the annular sealing ring is embedded in the annular groove.
7. The horizontal electroplating device for the wafers as claimed in claim 1, wherein the anode metal of the anode assembly is round, the horizontal plate is provided with a round groove for placing the anode metal, the anode metal is made of the same material as the material of the coatings to be electroplated on the wafers, the conductive relay plate is provided with a round opening, the inner diameter of the round opening is slightly smaller than the outer diameter of the anode metal, and the edge of the round opening of the conductive relay plate is pressed against the edge of the anode metal and locked on the horizontal plate through a locking piece.
8. The horizontal electroplating device for the wafer as claimed in claim 1, wherein a handle is arranged on the outer side of the anode assembly end plate.
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