CN210886263U - Horizontal electroplating equipment for solar cell - Google Patents
Horizontal electroplating equipment for solar cell Download PDFInfo
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- CN210886263U CN210886263U CN201921663100.7U CN201921663100U CN210886263U CN 210886263 U CN210886263 U CN 210886263U CN 201921663100 U CN201921663100 U CN 201921663100U CN 210886263 U CN210886263 U CN 210886263U
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Abstract
The utility model discloses a horizontal electroplating device for solar cells, which comprises an electroplating component and a guiding component (10) which are arranged on a shell, wherein the electroplating component comprises a plurality of anode groups (20) which are parallel to each other, a liquid medicine conveying group is arranged at the position of the anode groups (20), water-blocking roller groups (30) are arranged at two sides of each anode group (20), a conductive cathode roller group (40) is arranged between every two adjacent water-blocking roller groups (30), each adjacent water-blocking roller group (30), the anode group (20), the water-blocking roller groups (30) and the conductive cathode roller groups (40) form a group of electroplating units (50), and the cells (60) can at least cover one electroplating unit (50); the guide assemblies (10) are arranged at two ends of the electroplating assembly. This application can reduce solar wafer manufacturing cost, solves the unable problem of replacing of current silver thick liquid, makes solar wafer more civilian.
Description
Technical Field
The utility model relates to a horizontal electroplating device for solar cells.
Background
With the enlargement and rapid development of the scale of the photovoltaic industry and the adjustment of policies, the market has stricter and stricter requirements on the price of solar energy, a plurality of task sequences are reduced in complexity, and materials which are convenient to obtain are adopted for use.
The existing solar cell adopts printed silver paste, the silver paste accounts for more than 25% of the total cost of producing the solar cell, obviously, the metal with low price is adopted to replace part of or even all the silver paste, and the method has obvious significance in reducing the production cost of the crystalline silicon solar cell.
The adoption of metal copper is a good method for replacing expensive silver paste. However, at high temperature, copper ions are easily diffused into crystalline silicon, so that the minority carrier lifetime of the crystalline silicon is reduced, namely the photoelectric conversion efficiency of the crystalline silicon solar cell is reduced, and metal copper can be deposited on the crystalline silicon solar cell at low temperature to form an electrode of the crystalline silicon solar cell.
In the production process of the crystalline silicon solar cell, two methods can deposit metal copper on the surface of the crystalline silicon solar cell under the condition of low temperature to generate the crystalline silicon solar cell electrode: low temperature physical or chemical metal deposition methods. The low-temperature physical metal deposition method adopts sputtering and other methods. The disadvantage of the low-temperature physical metal deposition method is that selective metal deposition cannot be carried out, a mask technology is required, expensive equipment is required to be purchased, the production cost is increased, and the starting point of cost reduction is deviated.
The method used for chemical deposition of metals is an electroplating process. Compared with the process of physical deposition of metal, the electroplating process not only has simple process, but also has the advantage of being capable of selectively depositing metal. Therefore, the production cost of the electroplating process can be controlled to be low, so that the cost of producing the crystalline silicon solar cell can be greatly reduced. Therefore, the use of electroplating processes to deposit metals on crystalline silicon solar cells is currently a fairly active area of technology development.
At present, the problems that how to solve the problems that the existing silver paste printing is expensive in material cost and high in total cost ratio are solved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide an adopt copper ion to replace silver thick liquid, in order to reduce solar wafer manufacturing cost, solve the problem that current silver thick liquid can not replace, make the solar wafer horizontal electroplating equipment of more civilian ization.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a horizontal electroplating device for solar cells comprises an electroplating assembly and a guide assembly which are arranged on a shell, wherein the electroplating assembly comprises a plurality of anode groups which are parallel to each other, a liquid medicine conveying group is arranged at the position of each anode group, water-blocking roller groups which are parallel to each anode group are arranged on two sides of each anode group, a conductive cathode roller group is arranged between every two adjacent water-blocking roller groups, each adjacent water-blocking roller group, each anode group, each water-blocking roller group and each conductive cathode roller group form a group of electroplating units, and the cells can at least cover one electroplating unit; the battery piece that the direction subassembly set up electroplating assembly's both ends, the battery piece that the direction subassembly will wait to electroplate is leading-in proper order electroplating assembly, the battery piece two-sided/single face passes a plurality of electroplating units simultaneously in proper order, the battery piece that the direction subassembly will electroplate is derived from electroplating assembly.
The utility model discloses equipment is electroplated to solar wafer level's beneficial effect is, the guide assembly of casing one end from equipment, put into and do not make silver thick liquid solar wafer (silicon chip), guide assembly drives the battery piece and comes first electroplating unit earlier, the battery piece is earlier through the roller train that blocks water, the anode group, roller train and the electrically conductive negative pole gyro wheel that blocks water, the electrically conductive plating solution of copper ion is carried to the anode to the liquid medicine transport group on the anode group, the roller that blocks water removes liquid medicine, in order to avoid the electrically conductive plating solution and the electrically conductive negative pole contact of copper ion, be used for keeping the battery piece aridity, the battery piece is positive afterwards, the reverse side passes all the other a plurality of electroplating units simultaneously in proper order, the anode-cathode circuit is put through, carry out the copper electroplating to the positive and. The method for depositing the metal copper by using the electrochemistry (namely the electroplating process) replaces the printing of silver paste, so that the production cost of the solar cell is reduced, the problem that the existing silver paste cannot replace the existing silver paste is solved, and the solar cell is more civilized.
Preferably, each anode group includes two parallel positive poles from top to bottom, and each water blocking roller group includes two parallel water blocking rollers from top to bottom, and each conductive cathode roller group includes two parallel conductive cathode rollers from top to bottom, and the battery piece realizes that the front and back of battery piece contact multiunit simultaneously in proper order between two positive poles, between two water blocking rollers and between two conductive cathode rollers. The double-layer rollers are aligned up and down and are arranged in an equidistant mode or a non-equidistant mode.
Preferably, each water-blocking roller adopts a hollow shaft of a whole water-absorbing sponge roller; or the shaft/hollow shaft is sleeved with a roller made of acid-alkali-resistant water-absorbing material, the axis of the shaft/hollow shaft is made of metal or nonmetal material, and the water-blocking roller drives the silicon chip to move forward.
Preferably, the acid-base resistant water-absorbing material includes but is not limited to PP, PE, PVC, PU, PO.
Preferably, a vacuum suction nozzle or an air knife may be additionally installed at least one end of each of the water blocking rollers. The water blocking roller can be provided with a vacuum suction nozzle and an air knife or not. The vacuum suction nozzle is only one means for maintaining the drying of the cathode, and redundant liquid medicine is sucked by the vacuum suction nozzles at two ends/one end of the water-blocking roller, so that the drying performance of the battery piece is ensured. The air knife can prevent liquid medicine from overflowing to the cathode, and the drying effect is strengthened when the surface of the silicon wafer is dried. Other means of blocking water may also be employed to keep the cathode from contacting the copper ion plating solution.
Preferably, the conductive cathode roller takes the form of a whole shaft, or the contact form of at least one small roller.
Preferably, a soft conductive buffer material can be attached to the surface of the conductive cathode roller, so that the hard conductive metal is prevented from rolling and cracking the battery piece. The material of the conductive cathode roller includes, but is not limited to, titanium metal, stainless steel metal, phosphor copper metal or other forms of conductive materials.
Wherein, the anode and the liquid medicine delivery group can adopt various structures, including but not limited to the following structures:
the first preferred mode is that the positive pole adopts the porous insoluble conductive anode in area, and this insoluble conductive anode can adopt titanium, titanium alloy etc. two the top and the bottom in the box body are installed respectively to the insoluble conductive anode, box body top or/and bottom all are provided with the trompil with cavity intercommunication in the box body, liquid medicine carries the group to be into the liquid medicine water pipe, it sets up at box body top or/and bottom and is connected with the trompil respectively to advance the liquid medicine water pipe. The liquid medicine conveying group can pour the liquid medicine of the copper ion-containing conductive plating solution into the box body from the top of the box body through the liquid medicine inlet pipe, the liquid medicine slides inside the box body, the insoluble conductive anode at the top of the box body is immersed into the box body, the bottom of the box body can enter the box body through the liquid medicine inlet pipe below, and the insoluble conductive anode below the inside of the box body is immersed.
Preferably, a rotating roller is arranged in the box body.
In a second preferred mode, the anode can be an insoluble anode or a porous hollow cylinder, the insoluble titanium mesh/insoluble anode is arranged in the porous hollow cylinder and can be used for circulating the copper ion conductive plating solution, a sponge roller is arranged outside the porous hollow cylinder, and one end of the porous hollow cylinder is connected with a drug inlet water pipe.
A third preferred mode is that, similarly to the second preferred mode, the anode is an insoluble anode having a structure of a solid cylinder or an insoluble anode having a structure of a solid cylinder provided with sponge rollers on the outside, but differs from the second preferred mode in that: one end of the solid cylinder is connected with a medicine inlet pipe, a liquid medicine dropper is arranged above the solid cylinder, the solid cylinder below is immersed in the liquid medicine box, and the medicine box and the liquid medicine dropper above are used for replacing a medicine inlet pipe structure at one end of a second optimal mode.
Preferably, the sponge roller is an acid and alkali resistant water absorbent sponge.
Drawings
FIG. 1 is a top view of the first embodiment;
FIG. 2 is a side view of the first embodiment;
FIG. 3 is a perspective view of the first embodiment;
FIG. 4 is a perspective view of an electroplating unit according to one embodiment;
FIG. 5 is a perspective view of the top of the case in the first embodiment;
FIG. 6 is a top view of the second embodiment;
FIG. 7 is a perspective view of the second embodiment;
FIG. 8 is a perspective view of a plating unit according to a second embodiment;
FIG. 9 is a plan view of the third embodiment;
FIG. 10 is a side view of the third embodiment;
FIG. 11 is a perspective view of a third embodiment;
FIG. 12 is an exploded view of an electroplating unit according to the third embodiment.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
First embodiment, referring to fig. 1 to 6, a solar cell horizontal electroplating apparatus of the present embodiment includes a plating assembly disposed on a housing, and a guide assembly 10.
The electroplating assembly comprises a plurality of anode groups 20 which are parallel to each other, a liquid medicine conveying group is arranged at the position of each anode group 20, water-blocking roller groups 30 which are parallel to each anode group 20 are arranged on two sides of each anode group 20, a conductive cathode roller group 40 is arranged between every two adjacent water-blocking roller groups 30, each adjacent water-blocking roller group 30, each anode group 20, each water-blocking roller group 30 and each conductive cathode roller group 40 form a group of electroplating units 50, and a battery piece 60 can at least cover one electroplating unit 50. The guide assemblies 10 are arranged at two ends of the electroplating assembly, the guide assembly 10 at one end of the electroplating assembly is a sheet inlet, the guide assembly 10 at the other end of the electroplating assembly is a sheet outlet, the guide assembly 10 guides the battery sheets 60 to be electroplated entering from the sheet inlet into the electroplating assembly in sequence, the two sides/single side of the battery sheets 60 sequentially penetrate through the electroplating units 50, and the guide assembly 10 guides the electroplated battery sheets 60 out of the electroplating assembly.
In order to ensure the electroplating efficiency, the embodiment adopts a double-sided electroplating mode. That is, each anode set 20 includes two anodes parallel to each other, each water blocking roller set 30 includes two water blocking rollers 31 parallel to each other, each conductive cathode roller set 40 includes two conductive cathode rollers 41 parallel to each other, and the battery sheet 60 simultaneously contacts the multiple sets of electroplating units 50 on the two sides of the battery sheet 60 in sequence through the space between the two anodes, the space between the two water blocking rollers 31, and the space between the two conductive cathode rollers 41.
The guide assembly 10 adopts prior art, including a plurality of guiding axles 11 around self center pin is rotatory, and guiding axle 11 in this embodiment also sets up from top to bottom, and one side of guiding axle 11 is provided with the motor, and the tip of every guiding axle 11 and all gyro wheels in this embodiment is provided with drive gear, is provided with drive gear on the motor, and drive gear passes through drive chain and drives drive gear and rotate, realizes then that the motor drives guiding axle 11 and arbitrary gyro wheel and rotates.
The form of each water-blocking roller 31 is various, and a whole water-absorbing sponge roller hollow shaft can be adopted; or the shaft/hollow shaft 31a can be sleeved with a roller 31b made of acid-alkali-resistant water-absorbing material. Wherein, the acid and alkali resistant water absorbing material includes but is not limited to PP, PE, PVC, PU, PO. In order to ensure the water resistance of the water blocking rollers 31, a vacuum suction nozzle 32 or an air knife may be additionally installed at least one end of each water blocking roller 31. Redundant liquid medicine is sucked through vacuum suction nozzles at two ends/one end of the water-blocking roller, so that the dryness of the battery piece is ensured. The air knife can prevent liquid medicine from overflowing to the cathode, blow the silicon wafer surface and strengthen the drying effect.
The conductive cathode roller 41 may take various forms, and may take the form of an integral shaft, or the form of a contact with at least one small roller. The material of the conductive cathode roller 41 includes, but is not limited to, titanium metal, stainless steel metal, phosphorus copper metal, and the surface of the conductive cathode roller 41 is attached with a soft conductive buffer material for preventing the hard conductive metal from rolling and cracking the battery piece 60.
The difference between this embodiment and other embodiments is that the anode and the liquid medicine delivery group in this embodiment are different, the anode in this embodiment adopts an insoluble conductive anode 21a with multiple holes, the insoluble conductive anode can adopt titanium, titanium alloy, etc., two insoluble conductive anodes 21a are respectively installed at the top and the bottom in a box body 22a, the top or/and the bottom of the box body 22a is provided with openings communicated with the cavity in the box body 22a, the liquid medicine delivery group is a liquid medicine inlet pipe 23a, and the liquid medicine inlet pipe 23a is arranged at the top or/and the bottom of the box body 22a and is respectively connected with the corresponding openings. The case 22a is provided with a rotary roller 24 a.
The working principle of the first embodiment is that a battery 60 (silicon chip) to be electroplated is placed between the upper and lower guiding shafts 11 of the guiding assembly 10 at the wafer inlet, the driving gear is driven by the motor to drive the driving gear, thereby driving the guiding shafts 11 and all rollers (water-blocking roller 31, conductive cathode roller 41), under the action of the guiding shafts 11, taking an electroplating unit 50 as an example, the battery 60 firstly comes to the first water-blocking roller set 30 and then comes to between the two insoluble conductive anodes 21a, at this time, copper ion electroplating solution is sprinkled (copper ion electroplating solution enters from the drug inlet pipe 23a, enters from the opening at the top of the box body 22a into the box body 22a, passes through the plurality of holes on the insoluble conductive anodes 21a, and then flows to the battery 60 between the two insoluble conductive anodes 21a, copper ion electroplating solution is discharged at the lower end (copper ion electroplating solution enters from the opening at the bottom of the box body 22a, entering the box body 22a, passing over the insoluble conductive anode 21a below, finally contacting the battery piece 60, and then circulating all the time), wherein the anode exists in the copper ion electroplating solution, the battery piece 60 continues to move forwards, enters the second water-blocking roller group 30, continues to move forwards, enters the two conductive cathode rollers 41, the circuit is switched on, and the battery piece 60 begins to be electroplated on the upper surface and the lower surface simultaneously.
The battery piece 60 continues to move forwards to be separated from the previous electroplating unit 50, then enters the next electroplating unit 50, and reciprocates in such a way, and finally the battery piece 60 runs out of the piece outlet to finish electroplating. When the cell 60 is further plated, the plating is performed in a light-shielded environment without light.
The flow control of the plating solution in the box 22a is designed to meet and ensure that the plating solution is sprayed downward from the box 22a and gushes upward from the box 22a in an uninterrupted manner, thereby ensuring that the surface of the cell 60 passing through the insoluble conductive anode 21a is contacted with the plating solution uniformly and uninterruptedly.
Second embodiment, referring to fig. 6-8, the anode and the chemical solution delivery set in this embodiment are different from the first embodiment, in which the anode in this embodiment can be an insoluble anode with a whole root, or a porous hollow cylinder 21b, a sponge roller is arranged outside the porous hollow cylinder 21b, an insoluble titanium mesh/insoluble anode is arranged inside the porous hollow cylinder 21b, and one end of the porous hollow cylinder 21b is connected to a chemical solution inlet pipe 22 b. Wherein the sponge roller is acid and alkali resistant water absorbing sponge.
The working principle of the second embodiment is that, similarly, a battery 60 (silicon chip) to be electroplated is placed between the upper and lower guiding shafts 11 of the guiding assembly 10 at the wafer inlet, the driving gear is driven by the motor to drive the driving gear, thereby driving the guiding shafts 11 and all the rollers (water-blocking roller 31, conductive cathode roller 41), under the action of the guiding shafts 11, taking an electroplating unit 50 as an example, the battery 60 firstly comes to the first water-blocking roller set 30 and then comes between the porous hollow cylinders 21b, where the electroplating solution at the upper end is sprinkled (the copper ion electroplating solution enters from the upper drug inlet pipe 22b and enters into the porous hollow cylinders 21b, the copper ion electroplating solution contacts the insoluble titanium mesh/insoluble anode, the copper ion electroplating solution flows out from the porous hollow cylinders 21b and then contacts with the battery 60), the plating solution at the lower end is flooded (the copper ion plating solution enters from the lower liquid inlet pipe 22b, enters into the porous hollow cylinder 21b, contacts the insoluble titanium mesh/insoluble anode, and the copper ion plating solution flows out from the porous hollow cylinder 21b, contacts the cell piece 60, and then circulates all the way around), with the anode in the copper ion plating solution. The battery piece 60 continues to advance to the second water-blocking roller set 30, and the water-blocking rollers suck out the excess copper ion electroplating solution through the vacuum suction at two ends/one end, so as to keep the dryness of the battery piece 60. The process continues to advance into the two conductive cathode rollers 41, the circuit is completed, and the simultaneous plating of the upper and lower surfaces of the cell 60 is started.
And the electroplating device continuously moves forwards to be separated from the previous electroplating unit 50, then enters the next electroplating unit 50, reciprocates in this way, and finally, the battery piece 60 flows out of the piece outlet and flows to the piece outlet to finish electroplating. When the cell 60 is further plated, the plating is performed in a light-shielded environment without light.
Similarly, the flow control of the plating solution in the porous hollow cylinder 21b is designed to meet the requirement that the plating solution is sprayed downwards from the upper porous hollow cylinder 21b and gushes out from the lower porous hollow cylinder 21b in an uninterrupted manner, so as to ensure that the surface of the battery piece 60 is uniformly and uninterruptedly contacted with the plating solution.
Example three, referring to fig. 9 to 12, similarly to the example two, the anode is an insoluble anode having a structure of a solid cylinder 21c, or an insoluble anode having a structure of a solid cylinder 21c provided with sponge rollers on the outside, wherein the sponge rollers are acid and alkali resistant water absorbent sponges. However, unlike the second embodiment, the present embodiment does not employ the following structure: one end of the porous hollow cylinder 21b is connected to the liquid medicine inlet pipe 22b, but a liquid medicine dropper 22c and a liquid medicine box 23c are used instead, the liquid medicine dropper 22c in this embodiment is arranged above the upper solid cylinder 21c, and the lower solid cylinder 21c is immersed in the liquid medicine box 23 c.
The working principle of the third embodiment is that, similarly, a battery piece 60 (silicon chip) to be electroplated is placed between the upper and lower guiding shafts 11 of the guiding assembly 10 at the sheet inlet, the driving gear is driven by the motor to drive the driving gear, thereby driving the guiding shafts 11 and all rollers (water-blocking roller 31, conductive cathode roller 41), under the action of the guiding shaft 11, taking an electroplating unit 50 as an example, the battery piece 60 firstly comes to the first water-blocking roller set 30 and then comes between the two solid cylinders 21c, where the electroplating solution at the upper end is sprinkled (the copper ion electroplating solution enters from the upper liquid medicine dropper 22c and enters into the solid cylinder 21c, the copper ion electroplating solution contacts the insoluble titanium mesh/insoluble anode, the copper ion electroplating solution then flows out from the porous holes on the solid cylinder 21c and then contacts with the battery piece 60), and the electroplating solution at the lower end is gushed (the copper ion electroplating solution enters from the lower liquid medicine box 23c, the copper ion plating solution is passed over the insoluble titanium mesh/insoluble anode and the sponge roller to contact the cell 60 and then circulated all the way around), with the anode in the copper ion plating solution. The battery piece 60 continues to advance to the second water-blocking roller set 30, and the water-blocking rollers suck out the excess copper ion electroplating solution through the vacuum suction at two ends/one end, so as to keep the dryness of the battery piece 60. The process continues to advance into the two conductive cathode rollers 41, the circuit is completed, and the simultaneous plating of the upper and lower surfaces of the cell 60 is started.
And the electroplating device continuously moves forwards to be separated from the previous electroplating unit 50, then enters the next electroplating unit 50, reciprocates in this way, and finally, the battery piece 60 flows out of the piece outlet and flows to the piece outlet to finish electroplating. When the cell 60 is further plated, the plating is performed in a light-shielded environment without light.
Similarly, the flow control of the plating solution in the solid cylinder 21c is designed to ensure that the plating solution is sprayed downward from the upper solid cylinder 21c and gushes upward from the lower solid cylinder 21c in an uninterrupted manner, thereby ensuring that the surface of the cell 60 is uniformly and uninterruptedly contacted with the plating solution.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (10)
1. The utility model provides a horizontal electroplating equipment of solar wafer which characterized in that: comprises an electroplating component and a guide component (10) which are arranged on a shell,
the electroplating assembly comprises a plurality of anode groups (20) which are parallel to each other, a liquid medicine conveying group is arranged at each anode group (20), water-blocking roller groups (30) which are parallel to the anode groups are arranged on two sides of each anode group (20), a conductive cathode roller group (40) is arranged between every two adjacent water-blocking roller groups (30), each adjacent water-blocking roller group (30), each anode group (20), each water-blocking roller group (30) and each conductive cathode roller group (40) form a group of electroplating units (50), and a battery piece (60) can cover at least one electroplating unit (50);
the battery piece that direction subassembly (10) set up at the both ends of electroplating the subassembly, battery piece (60) that the subassembly (10) will wait to electroplate are leading-in proper order and are electroplated the subassembly, battery piece (60) two sides/single face pass a plurality of electroplating units (50) simultaneously in proper order, battery piece (60) that direction subassembly (10) will electroplate are derived from electroplating the subassembly.
2. The horizontal electroplating equipment for solar cells according to claim 1, wherein: every anode group (20) includes two parallel positive poles from top to bottom, every the gyro wheel group (30) that blocks water includes two gyro wheels (31) that block water parallel from top to bottom, every electrically conductive cathode gyro wheel group (40) includes two electrically conductive cathode gyro wheels (41) that are parallel from top to bottom, battery piece (60) are through passing between two positive poles, two blocks water between gyro wheel (31) and two electrically conductive cathode gyro wheels (41) between realize that the just, reverse side of battery piece (60) contact multiunit electroplating cell (50) simultaneously in proper order.
3. The horizontal electroplating equipment for solar cells according to claim 2, wherein: each water-blocking roller (31) adopts a hollow shaft of a whole water-absorbing sponge roller; or a roller (31b) made of acid-base-resistant water-absorbing material is sleeved on the shaft/hollow shaft (31 a).
4. The horizontal electroplating equipment for solar cells according to claim 3, wherein: at least one end of each water blocking roller (31) is provided with a vacuum suction nozzle (32) or an air knife.
5. The horizontal electroplating equipment for solar cells according to claim 2, wherein: the conductive cathode roller (41) takes the form of a whole shaft or the form of a contact of at least one small roller.
6. The horizontal electroplating equipment for solar cells according to claim 2, wherein: and the surface of the conductive cathode roller (41) is pasted with a soft conductive buffer material.
7. The horizontal electroplating equipment for solar cells according to claim 2, wherein: the positive pole adopts and takes porous insoluble conductive anode (21a), two top and bottom in box body (22a) are installed respectively to insoluble conductive anode (21a), box body (22a) top or bottom all are provided with the trompil with cavity intercommunication in box body (22a), liquid medicine carries the group for advancing liquid medicine water pipe (23a), it sets up at box body (22a) top or bottom and is connected with the trompil respectively to advance liquid medicine water pipe (23 a).
8. The horizontal electroplating equipment for solar cells according to claim 7, wherein: a rotating roller (24a) is arranged in the box body (22 a).
9. The horizontal electroplating equipment for solar cells according to claim 2, wherein: the anode is an insoluble anode or a porous hollow cylinder (21b), an insoluble titanium mesh/insoluble anode is arranged in the porous hollow cylinder (21b), a sponge roller is arranged outside the porous hollow cylinder (21b), and one end of the porous hollow cylinder (21b) is connected with a medicine inlet water pipe (22 b).
10. The horizontal electroplating equipment for solar cells according to claim 2, wherein: the anode adopts an insoluble anode with a structure of a solid cylinder (21c) or an insoluble anode with a structure of a solid cylinder (21c) with a sponge roller arranged outside, the solid cylinder (21b) at the upper part is provided with a liquid medicine dropper (22c), and the solid cylinder (21c) at the lower part is immersed in a liquid medicine box (23 c).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921663100.7U CN210886263U (en) | 2019-09-30 | 2019-09-30 | Horizontal electroplating equipment for solar cell |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921663100.7U CN210886263U (en) | 2019-09-30 | 2019-09-30 | Horizontal electroplating equipment for solar cell |
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| CN210886263U true CN210886263U (en) | 2020-06-30 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725895B (en) * | 2020-07-14 | 2021-04-21 | 單伶寶 | Horizontal single-sided or double-sided simultaneous plating equipment to increase the plating area of solar cells |
| CN114164477A (en) * | 2021-11-25 | 2022-03-11 | 普菲芯(苏州)半导体科技有限公司 | Electroplating device for solar cell production |
| CN114318471A (en) * | 2020-10-12 | 2022-04-12 | 福建钧石能源有限公司 | Horizontal coating device for preparing HIT crystalline silicon solar cell |
| WO2023179748A1 (en) * | 2022-03-25 | 2023-09-28 | 苏州太阳井新能源有限公司 | Cell electroplating method and apparatus |
-
2019
- 2019-09-30 CN CN201921663100.7U patent/CN210886263U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI725895B (en) * | 2020-07-14 | 2021-04-21 | 單伶寶 | Horizontal single-sided or double-sided simultaneous plating equipment to increase the plating area of solar cells |
| CN114318471A (en) * | 2020-10-12 | 2022-04-12 | 福建钧石能源有限公司 | Horizontal coating device for preparing HIT crystalline silicon solar cell |
| CN114164477A (en) * | 2021-11-25 | 2022-03-11 | 普菲芯(苏州)半导体科技有限公司 | Electroplating device for solar cell production |
| CN114164477B (en) * | 2021-11-25 | 2024-02-23 | 普菲芯(苏州)半导体科技有限公司 | Electroplating device for solar cell production |
| WO2023179748A1 (en) * | 2022-03-25 | 2023-09-28 | 苏州太阳井新能源有限公司 | Cell electroplating method and apparatus |
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