CN112847973A - Mold cleaning method - Google Patents
Mold cleaning method Download PDFInfo
- Publication number
- CN112847973A CN112847973A CN202110013479.2A CN202110013479A CN112847973A CN 112847973 A CN112847973 A CN 112847973A CN 202110013479 A CN202110013479 A CN 202110013479A CN 112847973 A CN112847973 A CN 112847973A
- Authority
- CN
- China
- Prior art keywords
- mold
- cleaning
- mold cleaning
- mould
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 275
- 238000000034 method Methods 0.000 title claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 88
- 239000011347 resin Substances 0.000 claims abstract description 88
- 239000002390 adhesive tape Substances 0.000 claims abstract description 55
- 239000000126 substance Substances 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009736 wetting Methods 0.000 claims description 5
- 230000001050 lubricating effect Effects 0.000 claims description 4
- 238000004064 recycling Methods 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 22
- 239000004033 plastic Substances 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 229910052802 copper Inorganic materials 0.000 description 21
- 239000010949 copper Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1753—Cleaning or purging, e.g. of the injection unit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
- B29C2033/727—Cleaning cleaning during moulding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a mold cleaning method, relates to the technical field of mold cleaning, and solves the technical problems of low cleaning efficiency and high cost of a mold cleaning method for a plastic package mold of a semiconductor device. The mold cleaning method comprises the following steps: before mold cleaning resin is used for mold cleaning, a first mold cleaning adhesive tape is used for mold cleaning treatment, and dirt is removed after being softened and dissolved; and (4) carrying out mould cleaning treatment by using a second mould cleaning adhesive tape, and removing the dirt after adhering. Before the mold cleaning resin is used, the mold cleaning treatment is carried out by utilizing a first mold cleaning adhesive tape to soften and dissolve dirt, and then the mold cleaning treatment is carried out by utilizing a second mold cleaning adhesive tape to adhere the dirt; the mold cleaning principle of dissolving and adhering firstly is utilized, so that the damage to the mold coating by directly utilizing the adhering principle can be reduced, and the cleaning efficiency is improved; the use of mold cleaning resin particles and a lead frame is reduced, the mold cleaning cost of the mold is reduced, and the cleaning efficiency of the mold is improved.
Description
Technical Field
The invention relates to the technical field of die cleaning, in particular to a die cleaning method.
Background
In the process of continuously transferring, molding and packaging products, a part of components from a plastic packaging material epoxy resin and a release agent of the existing semiconductor device plastic packaging mold are oxidized and carbonized under the action of high temperature, and are attached to the surface of the mold to form dirt which is difficult to remove. If the dirt attached to the inside of the mold is not removed in time, not only the mold release is difficult during the packaging process and the appearance defects of the packaging body are caused, but also the surface of the mold cavity is damaged.
The material for cleaning the mold in the prior art mainly uses mold cleaning resin particles to match with a copper lead frame, which is shown in fig. 1 and 2, and fig. 1 is a schematic diagram of the copper lead frame in the prior art; FIG. 2 is a schematic representation of a prior art mold cleaning resin pellet; and putting a copper lead frame 3 'at a position to be cleaned in the die as a support, melting the die cleaning resin particles 100, injecting the melted die cleaning resin particles into the die, adhering dirt by using the die cleaning resin, and taking out the solidified die cleaning resin particles adhered to the copper lead frame 3'.
The applicant has found that the prior art has at least the following technical problems:
1. the existing mold cleaning method needs to use a large amount of copper lead frames and mold cleaning resin particles, the copper lead frames are high in price, a certain amount of lead frames need to be consumed for mold cleaning each time, and the mold cleaning cost is high;
2. the mold cleaning resin is only used for adhering dirt, the mold cleaning efficiency is low, and the time consumed in each routine mold cleaning process is long.
3. The existing lead frame is made of copper, the mold cleaning resin is adhered to the copper lead frame after being cured and is difficult to peel off from the lead frame, so that the lead frame can only be discarded after being used once and cannot be recycled, and the mold cleaning cost is further increased.
4. The mold cleaning principle of the mold cleaning resin particles is that dirt on the surface of the mold is adhered by using self high viscosity and thermosetting property, and the mold cleaning resin particles are used for cleaning 6-8 times to achieve the effect when the mold is cleaned, so that the coating on the surface of the mold is easily damaged.
Disclosure of Invention
The invention aims to provide a mold cleaning method, which aims to solve the technical problems of low cleaning efficiency and high cost of the conventional mold cleaning method for the plastic package mold of the semiconductor device in the prior art; the technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the invention are described in detail in the following.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a mold cleaning method, which comprises the following steps: before mold cleaning resin is used for mold cleaning, a first mold cleaning adhesive tape is used for mold cleaning treatment, and dirt is removed after being softened and dissolved;
and (4) carrying out mould cleaning treatment by using a second mould cleaning adhesive tape, and removing the dirt after adhering.
Preferably, when the first mold cleaning adhesive tape is used for mold cleaning treatment:
placing the first mold cleaning adhesive tape on a position to be cleaned on a mold and then closing the mold;
heating the mould, wherein the first mould cleaning rubber strip is heated and melted by the mould and softens and dissolves dirt.
Preferably, a plurality of first mold cleaning rubber strips are respectively placed on the mold cavity and the runner, and then the mold is closed.
Preferably, when the second mold cleaning adhesive tape is used for mold cleaning treatment:
placing the second mold cleaning adhesive tape on a position to be cleaned on the mold and then closing the mold;
heating the mould, and the second mold cleaning rubber strip is heated by the mould to melt and adhere the dirt.
Preferably, the model of the first mold cleaning adhesive tape is ST-5300K; the model of the second mold cleaning adhesive tape is ST-6001.
Preferably, the first mold cleaning adhesive tape is used for mold cleaning treatment for 1-2 times; and carrying out mould cleaning treatment for 1-3 times by using the second mould cleaning adhesive tape.
Preferably, the die brushing treatment is respectively carried out on the die before and after the die cleaning treatment is carried out by using the first die cleaning adhesive tape.
Preferably, when the mold cleaning resin is used for mold cleaning, the mold cleaning resin is matched with the lead frame for mold cleaning treatment for 2-4 times.
Preferably, the lead frame is a sheet-like frame structure made of resin or a sheet-like frame structure made of paper.
Preferably, when the mold cleaning resin is used for mold cleaning:
placing the positioning hole of the lead frame in alignment with the positioning pin of the die;
placing the lead frame on two parts forming the die, and carrying out die closing calibration on the die;
placing the mold cleaning resin at a runner, and carrying out mold closing and injection molding to enable the mold cleaning resin to be adhered with dirt;
and taking out the lead frame with the cured substance after curing.
Preferably, the lead frame is a sheet-like frame structure made of resin or a sheet-like frame structure made of paper; after the lead frame with the cured substance is taken out, the cured substance is separated from the lead frame, and the lead frame is retained for recycling.
Preferably, after the mold cleaning with the mold cleaning resin, the mold wetting treatment is performed 2 to 3 times with the mold wetting resin in cooperation with the lead frame.
Preferably, when the mold cleaning is performed using a mold-wetting resin:
placing the positioning hole of the lead frame in alignment with the positioning pin of the die;
placing the lead frame on two parts forming the die, and carrying out die closing calibration on the die;
placing the mold lubricating resin at the runner, and carrying out mold closing and injection molding to lubricate the mold;
and taking out the lead frame with the cured substance after curing.
Compared with the prior art, the mold cleaning method provided by the invention has the following beneficial effects: before the mold cleaning resin is used, the first mold cleaning adhesive tape is used for mold cleaning treatment to soften and dissolve dirt, and then the second mold cleaning adhesive tape is used for mold cleaning treatment to adhere the dirt; the mold cleaning principle of dissolving and adhering firstly is utilized, so that the damage to the mold coating by directly utilizing the adhering principle can be reduced, and the cleaning efficiency is improved; the use of mold cleaning resin particles and a lead frame is reduced, the mold cleaning cost of the mold is reduced, and the cleaning efficiency of the mold is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of a prior art copper lead frame;
FIG. 2 is a schematic representation of a prior art mold cleaning resin pellet;
FIG. 3 is a view showing the structure of a mold cleaning rubber strip;
FIG. 4 is a schematic view showing the placement positions of the mold cleaning adhesive tapes on the mold during mold cleaning;
FIG. 5 is a schematic structural view of a resin or paper lead frame after being attached to a mold;
FIG. 6 is a process flow diagram of one embodiment of the mold cleaning method of the present invention.
In the figure, 100, mold cleaning resin particles; 3', a copper lead frame; 1. cleaning the die adhesive tape; 2. separating the channel; 3. a lead frame; 31. positioning holes; 4. a mold; 41. a mold cavity; 42. and a flow passage.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "side", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the equipment or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The existing method for cleaning the plastic package mold of the semiconductor device mainly uses the mold cleaning resin particles 100 in figure 1 and the copper lead frame 3 ' in figure 2 to cooperate for mold cleaning treatment, the mold cleaning resin particles 100 are melted and then enter a mold cavity through an injection runner, wherein the molten mold cleaning resin flows into a position to be cleaned by using the copper lead frame 3 ' as a support to adhere dirt, and the mold cleaning resin and the dirt are adhered to the copper lead frame 3 ' and taken out together after solidification.
The embodiment provides a mold cleaning method, which can be used for cleaning a plastic package mold of a semiconductor device, and comprises the following steps: before mold cleaning resin is used for mold cleaning, a first mold cleaning adhesive tape 1 is used for mold cleaning treatment, and dirt is removed after being softened and dissolved; and (3) carrying out mould cleaning treatment by using a second mould cleaning adhesive tape 1, and removing the dirt after adhering.
The mold cleaning rubber strip is a mature prior art, and the main components of the mold cleaning rubber strip are rubber, a cleaning agent (or called a dissolving agent) and the like, so that resin residual rubber, organic oxides and other pollutants can be removed. The mold cleaning principle of the first mold cleaning rubber strip 1 in the method is to soften and dissolve dirt after heating, and the mold cleaning rubber strip 1 with high content of cleaning agent can be selected (such as ST-5300K); the second mold cleaning principle of the mold cleaning adhesive tape 1 is to remove dirt by adhering, and the mold cleaning adhesive tape 1 with stronger viscosity (such as ST-6001) can be selected.
In the mold cleaning method of the embodiment, before mold cleaning resin is used, mold cleaning treatment is firstly carried out by using the first mold cleaning adhesive tape 1 to soften and dissolve dirt, and then mold cleaning treatment is carried out by using the second mold cleaning adhesive tape 1 to adhere the dirt; before the mold cleaning adhesive tape 1 with strong viscosity is used, the mold cleaning adhesive tape 1 with strong solubility is used for softening and dissolving dirt, so that the damage to a coating at the beginning of cleaning can be prevented. Compared with a direct adhesion principle, the mold cleaning principle of firstly dissolving and then adhering can reduce the damage to the coating of the mold 4 and improve the cleaning efficiency; the use of mold cleaning resin particles and a lead frame is reduced, the mold cleaning cost of the mold 4 is reduced, and the cleaning efficiency of the mold 4 is improved.
When the die cleaning vertical particles are matched with the copper lead frame, the copper lead frame is attached to the die 4 and then is matched, and molten die cleaning resin is injected into the die 4, so that the operation is complicated. In the mold cleaning method of the embodiment, when the first mold cleaning adhesive tape 1 is used for mold cleaning treatment: referring to fig. 3, separating the mold cleaning rubber strips 1 into strips along the inter-rubber strip separation channels 2, and placing the number of the mold cleaning rubber strips 1 according to the area of the plastic package mold 4; when placing the mold cleaning adhesive tape 1, as shown in fig. 4, firstly placing the first mold cleaning adhesive tape 1 on the position to be cleaned on the mold 4, and then closing the mold; then the mould 4 is heated, the first mould cleaning adhesive tape 1 is heated and melted by the mould 4 and softens and dissolves dirt, the mould cleaning adhesive tape 1 is heated and melted by the mould 4, the dirt is dissolved and wrapped by the detergent component, and the dirt on the bottom layer of the mould 4 is decomposed, so that a stronger mould cleaning effect is achieved (the surface of the mould 4 is usually a plastic package material component and is relatively easy to peel off from the mould 4 in an adhesion mode). After the first mold cleaning adhesive tape 1 is cured, the dirt is cured on the first mold cleaning adhesive tape 1 and peeled off together, so that mold cleaning is realized.
As an alternative embodiment, referring to FIG. 4, a plurality of first mold cleaning strips 1 are placed on the mold cavity 41 and the runner 42 respectively, and then the mold is closed. When the mold 4 heats the first mold cleaning rubber strip 1, the first mold cleaning rubber strip 1 is melted to dissolve and clean dirt on the mold cavity 41 and the runner.
The mold cleaning process of the second mold cleaning adhesive tape 1 is similar to that of the first mold cleaning adhesive tape 1, but the mold cleaning principle is different. Specifically, referring to fig. 3 and 4, the mold cleaning rubber strip is separated by the inter-rubber-strip separation channel 2, and when the mold cleaning treatment is performed by using the second mold cleaning rubber strip 1: placing the second mold cleaning adhesive tape 1 on a position to be cleaned on the mold 4 and then closing the mold; the mold 4 is heated, and the second mold cleaning rubber strip 1 is heated by the mold 4 to melt and adhere dirt.
The second mold cleaning adhesive tape 1 is an adhesive tape with strong cohesiveness, bonds and removes the dirt remained in the mold 4 after being dissolved and softened, and cleans the first adhesive tape remained in the mold 4.
As an optional implementation manner, in this embodiment, the model of the first mold cleaning adhesive is ST-5300K, and the content of the solvent of the mold cleaning adhesive tape 1 of this model is high; the model of the second mold cleaning adhesive tape 1 is ST-6001, and the mold cleaning adhesive tape 1 of the model has strong cohesiveness.
As an optional embodiment, before the mold cleaning resin is used for mold cleaning, the first mold cleaning rubber strip 1 is used for 1-2 times of mold cleaning treatment; and then carrying out mould cleaning treatment for 1-3 times by using a second mould cleaning adhesive tape 1. The dissolving of dirt in the die 4 is accelerated, the use of die cleaning resin particles can be reduced, the damage of a plating layer of the die 4 caused by high viscosity of the die cleaning resin particles is reduced, the use of a copper lead frame is reduced, and the die cleaning cost is reduced.
As an alternative embodiment, in this embodiment, the mold 4 is brushed before and after the mold cleaning process using the first mold cleaning rubber strip 1. High-temperature-resistant soft material brushes such as copper brushes are adopted to brush the die 4, dirt on the surface of the die 4 is cleaned, and the cleaning of the dirt inside the die 4 is facilitated.
As an alternative embodiment, when the mold cleaning resin is used for mold cleaning, the mold cleaning resin is matched with the lead frame for mold cleaning treatment for 2-4 times. The model of the mold cleaning resin can adopt ECR-CL.
Because before using the mould cleaning resin, adopt two kinds of different mould cleaning adhesive tapes 1 to carry out the mould cleaning treatment earlier, when using mould cleaning resin to carry out the mould cleaning treatment again, can reduce the use of mould cleaning resin granule, reduce because of the high damage that causes mould 4 cladding material of mould cleaning resin granule viscosity, reduce the use of copper lead frame, reduce the mould cleaning cost.
The lead frame in the prior art is made of copper, and after the mold cleaning resin is solidified and taken out, the mold cleaning resin on the lead frame made of copper is difficult to peel, so that the existing copper frame is usually discarded after being used once, and the mold cleaning cost is further increased. In view of the above problem, the lead frame in the present embodiment is a sheet-like frame structure made of resin or a sheet-like frame structure made of paper, as shown in fig. 5.
The lead frame is a resin or paper lead frame, when the lead frame is taken out, the mold cleaning resin, the mold moistening resin and the like are easily and fully stripped from the lead frame, and the resin or paper lead frame can be continuously recycled after being stripped, so that the mold cleaning cost is reduced.
As an alternative embodiment, referring to fig. 5, when the mold cleaning is performed using the mold cleaning resin:
the positioning holes 31 of the lead frame 3 are aligned with the positioning pins of the mold 4 and placed, as shown in fig. 5, so that the lead frame is attached to the mold 4; placing lead frames on two parts forming the mold 4, and carrying out mold closing calibration on the mold 4; wherein, the two parts forming the die 4 mainly refer to a left die and a right die or an upper die and a lower die; placing mold cleaning resin at the runner 42, and carrying out mold closing and injection molding to ensure that dirt is adhered to the mold cleaning resin; taking out the lead frame with the cured substance after curing; the die cleaning process of the die cleaning resin particles matched with the lead frame can clean the left die and the right die (or the upper die and the lower die), and the using times of the die cleaning resin particles can be reduced on the basis of the die cleaning adhesive tape 1. Wherein, the mold cleaning once means that the left mold 4 and the right mold 4 or the upper mold 4 and the lower mold 4 are closed once.
As an alternative embodiment, the lead frame 3 is a sheet-like frame structure made of resin or a sheet-like frame structure made of paper; after the lead frame 3 with the cured product is taken out, the cured product is separated from the lead frame, and the remaining lead frame is recycled. And stripping the cured product from the lead frame, and continuously recycling the remained resin or paper lead frame. Based on the lead frame with the structure, the lead frame can be recycled in the mold cleaning process of the mold cleaning resin, and the mold cleaning cost is reduced.
The following compares the lead frame of the present embodiment with the lead frame of the prior art, as shown in the following table:
as can be seen, the resin or paper lead frame 3 in the present embodiment is lower in cost and can be recycled.
As an alternative embodiment, after the mold cleaning is carried out by using the mold cleaning resin, the mold moistening treatment is carried out for 2-3 times by using the mold moistening resin and the lead frame. The model of the mold-wetting resin can adopt KMC-R-52HW 3.
The use method of the mould moistening resin particles is similar to that of the mould cleaning resin particles, and specifically, when mould moistening resin is used for mould cleaning: the positioning hole 31 of the lead frame is aligned to the positioning pin of the die 4 to be placed; placing the lead frame 3 on two parts forming the mold 4, and carrying out mold closing calibration on the mold 4; placing mold lubricating resin at the runner and carrying out mold closing and injection molding to lubricate the mold 4; after curing, the lead frame 3 with the cured product is taken out. The mold lubricating resin protects and lubricates the surface of the mold 4 after the mold 4 is cleaned, so that the mold 4 meets the next production requirement.
Referring to fig. 6, a process flow of a specific embodiment of the mold cleaning method in this embodiment is as follows: brushing the mold once; cleaning the mold for 1 time by using an ST-5300K mold cleaning adhesive tape; brushing the mold once; cleaning the mold twice by using an ST-6001 mold cleaning adhesive tape; using ECR-CL mould cleaning resin particles to clean the mould for 2-3 times; using KMC-R-52HW3 to wet the mold resin particles for 2 times; and finishing the die cleaning operation.
The mold cleaning method of the present embodiment can be applied to cleaning the plastic package mold 4 of the semiconductor device, and the mold cleaning method in the present embodiment is compared with the mold cleaning method in the prior art from a plurality of aspects, as shown in the following table:
therefore, the die cleaning method in the embodiment has the advantages of good die cleaning effect, high efficiency, less time consumption of single die cleaning, reduction of the use of the lead frame and low cost, and the die cleaning method is superior to the existing die cleaning method in all aspects.
The particular features, structures, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (13)
1. A method of mold cleaning, the method comprising: before mold cleaning resin is used for mold cleaning, a first mold cleaning adhesive tape is used for mold cleaning treatment, and dirt is removed after being softened and dissolved;
and (4) carrying out mould cleaning treatment by using a second mould cleaning adhesive tape, and removing the dirt after adhering.
2. A method for cleaning molds according to claim 1, wherein, in the mold cleaning process using said first mold cleaning strip:
placing the first mold cleaning adhesive tape on a position to be cleaned on a mold and then closing the mold;
heating the mould, wherein the first mould cleaning rubber strip is heated and melted by the mould and softens and dissolves dirt.
3. A method according to claim 2, wherein a plurality of said first mold cleaning strips are placed on the mold cavity and the runner respectively and then the mold is closed.
4. A method for mold cleaning according to any one of claims 1-3, wherein, during the mold cleaning process using the second mold cleaning strip:
placing the second mold cleaning adhesive tape on a position to be cleaned on the mold and then closing the mold;
heating the mould, and the second mold cleaning rubber strip is heated by the mould to melt and adhere the dirt.
5. A mould cleaning method according to any one of the claims 1-3, wherein the first mould cleaning adhesive tape is of the type ST-5300K; the model of the second mold cleaning adhesive tape is ST-6001.
6. A mould cleaning method according to any one of the claims 1-3, characterized in that 1-2 times mould cleaning treatment is carried out by using the first mould cleaning rubber strip; and carrying out mould cleaning treatment for 1-3 times by using the second mould cleaning adhesive tape.
7. A method for cleaning a mould according to any one of the claims 1-3, wherein the mould is brushed before and after the mould cleaning process using the first mould cleaning rubber strip.
8. A mold cleaning method according to any one of claims 1 to 3, wherein in the mold cleaning using the mold cleaning resin, the mold cleaning resin is used in cooperation with the lead frame to perform the mold cleaning process 2 to 4 times.
9. A mold stripping method as claimed in claim 8, characterized in that the lead frame is a sheet frame structure made of resin or a sheet frame structure made of paper.
10. A mold cleaning method according to claim 8, wherein, in the mold cleaning using the mold cleaning resin:
placing the positioning hole of the lead frame in alignment with the positioning pin of the die;
placing the lead frame on two parts forming the die, and carrying out die closing calibration on the die;
placing the mold cleaning resin at a runner, and carrying out mold closing and injection molding to enable the mold cleaning resin to be adhered with dirt;
and taking out the lead frame with the cured substance after curing.
11. A mold stripping method as claimed in claim 10, characterized in that the lead frame is a sheet frame structure made of resin or a sheet frame structure made of paper; after the lead frame with the cured substance is taken out, the cured substance is separated from the lead frame, and the lead frame is retained for recycling.
12. A mold cleaning method according to any one of claims 1 to 3, wherein after the mold cleaning with the mold cleaning resin, the mold moistening treatment is performed 2 to 3 times using a mold moistening resin in cooperation with the lead frame.
13. A mold cleaning method according to claim 12, wherein, in the mold cleaning using the mold-wetting resin:
placing the positioning hole of the lead frame in alignment with the positioning pin of the die;
placing the lead frame on two parts forming the die, and carrying out die closing calibration on the die;
placing the mold lubricating resin at the runner, and carrying out mold closing and injection molding to lubricate the mold;
and taking out the lead frame with the cured substance after curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110013479.2A CN112847973A (en) | 2021-01-06 | 2021-01-06 | Mold cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110013479.2A CN112847973A (en) | 2021-01-06 | 2021-01-06 | Mold cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112847973A true CN112847973A (en) | 2021-05-28 |
Family
ID=76004258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110013479.2A Pending CN112847973A (en) | 2021-01-06 | 2021-01-06 | Mold cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112847973A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986757A (en) * | 2022-05-31 | 2022-09-02 | 成都瀚德胜邦光学有限公司 | Maintenance method for micro Fresnel mold core of mold |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101955858A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | Die cleaning agent composition and mould cleaning material and the mould cleaning method that uses it |
| CN109501075A (en) * | 2018-11-30 | 2019-03-22 | 四川素恩吉科技有限公司 | A kind of clear mould method of mold |
| CN111823452A (en) * | 2020-06-17 | 2020-10-27 | 苏州德林泰精工科技有限公司 | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket |
-
2021
- 2021-01-06 CN CN202110013479.2A patent/CN112847973A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101955858A (en) * | 2009-07-17 | 2011-01-26 | 日东电工株式会社 | Die cleaning agent composition and mould cleaning material and the mould cleaning method that uses it |
| CN109501075A (en) * | 2018-11-30 | 2019-03-22 | 四川素恩吉科技有限公司 | A kind of clear mould method of mold |
| CN111823452A (en) * | 2020-06-17 | 2020-10-27 | 苏州德林泰精工科技有限公司 | Cleaning method for lead frame packaging and encapsulating mold based on resin gasket |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986757A (en) * | 2022-05-31 | 2022-09-02 | 成都瀚德胜邦光学有限公司 | Maintenance method for micro Fresnel mold core of mold |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112847973A (en) | Mold cleaning method | |
| TWI327756B (en) | Resin molding machine | |
| JPS59155139A (en) | Sealing molding machine and sealing molding method | |
| JP3564700B2 (en) | Mold cleaning method and cleaning device | |
| CN107599231A (en) | The method of plastic injection processing | |
| JP2003507205A (en) | Method for simultaneously forming a fusible core and an overmold assembly | |
| CN103817836B (en) | The clear modeling method of a kind of semiconductor dies | |
| JPH03202327A (en) | Cleaning process of mold face for molding resin, sheet member for cleaning used in same process and continuous automatic resin-molding process | |
| JP4295090B2 (en) | Sheet back side molding method | |
| CN102873816A (en) | Screening method of integrated injection moulding glue | |
| CN202318917U (en) | Diamond removal machine for resin diamond | |
| CN201436190U (en) | Mould with pre-cut structure | |
| JPS63246218A (en) | Continuous automatic resin sealing method | |
| CN201345355Y (en) | Cleaning template structure of mold | |
| CN103182759B (en) | Guide wheel and production method thereof | |
| JPH11198151A (en) | Sheet for cleaning molding die and method for cleaning molding die using the sheet | |
| CN112428597A (en) | Method for preventing composite material from forming resin-rich area | |
| CN218462845U (en) | Plastic toy injection mold of leak protection material | |
| CN214082560U (en) | A mould for making conducting resin standard spline | |
| US20030034049A1 (en) | Cleaning substrate for cleaning and regenerating a mold | |
| CN205069596U (en) | Seal lead frame mould in advance | |
| JP2004179283A (en) | Feeding method, removing method, and feeding mechanism and removal mechanism to resin molding die | |
| CN211030987U (en) | Injection molding and encapsulation mold | |
| CN218256274U (en) | Uncoated anti-cutting glove core demoulding auxiliary device | |
| CN211191967U (en) | Casting forming mechanism for processing waste copper products |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210528 |
|
| RJ01 | Rejection of invention patent application after publication |