CN112829295A - Laser optical path system for surface exposure type powder bed melting additive manufacturing - Google Patents

Laser optical path system for surface exposure type powder bed melting additive manufacturing Download PDF

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Publication number
CN112829295A
CN112829295A CN202011629521.5A CN202011629521A CN112829295A CN 112829295 A CN112829295 A CN 112829295A CN 202011629521 A CN202011629521 A CN 202011629521A CN 112829295 A CN112829295 A CN 112829295A
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laser
module
optical path
additive manufacturing
powder bed
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CN112829295B (en
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严鹏飞
严彪
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Tongji University
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Tongji University
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264Arrangements for irradiation
    • B29C64/268Arrangements for irradiation using laser beams; using electron beams [EB]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Abstract

The invention relates to a laser optical path system for surface exposure type powder bed melting additive manufacturing, which comprises a laser source, an ultra-high speed vibrating mirror group, a negative scanning module and a multi-stage laser amplification module, wherein the laser source is used for continuously emitting primary laser, the ultra-high speed vibrating mirror group is used for enabling the primary laser emitted by the laser source to be successively thrown into the negative scanning module in a high-speed scanning mode, and the negative scanning module performs monochromatic light finishing on a seed light source with bottom energy to form a required exposure shape and performs primary amplification, and then outputs the exposure shape to the multi-stage laser amplification module; the multi-stage laser amplification module is used for enhancing the light path input by the negative scanning module so as to achieve the energy required by each array point and finally output the pattern required by single-layer surface exposure. Compared with the prior art, the invention breaks through the slow multi-point scanning exposure mode in the traditional technology, and is expected to thoroughly break through the current bottleneck of printing speed through the optical path system of the surface exposure scanning mode.

Description

Laser optical path system for surface exposure type powder bed melting additive manufacturing
Technical Field
The invention relates to an optical path system in the field of additive manufacturing, in particular to a laser optical path system for surface exposure type powder bed melting additive manufacturing.
Background
Powder bed melt additive manufacturing (including SLS and SLM) is an important series of additive manufacturing or 3D printing techniques. It is mainly a fusion of powders together by means of a high-power laser.
The process of powder bed melting additive manufacturing has the advantages that: 1) when standard metal is processed, the compactness is over 99 percent, and the good mechanical property is equivalent to that of the traditional process. 2) The types of machinable materials are continuously increased, and the machined parts can be welded in the later period. 3) The precision and the surface quality are relatively highest and can be used directly or only relatively simple post-processing is needed. Thus, from a product quality perspective, powder bed melt additive manufacturing, and SLM in particular, is most promising from a performance perspective to replace existing high performance products of the high volume industrial industry represented by the automotive industry. However, the powder bed fusion additive manufacturing process has disadvantages in that: 1) the raw materials are expensive, 2) the speed is low. This creates a serious bottleneck for the spread of technology in these industries.
The problem of expensive raw materials can be overcome by developing materials with new performance, but is limited by the power and cooperative control technology level of a laser system, and the rate can be increased only by multiple lasers at present. Taking a typical SLM technology as an example, according to reports and industrial exhibitions, the most collaborative laser beams at present are also stopped at 12 lasers, and are still in the research and development stage, and the difficulty is very high, the cost is very high, and the difficulty of debugging the process is also very high because the control collaboration of multi-laser direct irradiation heating and the problem of melt forming are complicated. Even if the printing efficiency of the SLM technology is still far from the direct energy deposition additive manufacturing printing technology (DED technology) or the emerging supersonic deposition additive manufacturing technology (SD technology), the accuracy of the DED technology and the SD technology is poor, and precise machine tool post-processing is required; also the printing efficiency of SLM technology does not rival the lower density and limited performance 3DP technology. The printing efficiency of the SLM technology is far from the production efficiency of the conventional production technology.
Disclosure of Invention
The invention aims to provide a laser optical path system for surface exposure type powder bed melting additive manufacturing, which can be called as an ultrahigh-speed vibrating mirror continuous optical fiber system.
The purpose of the invention can be realized by the following technical scheme:
the invention provides a laser optical path system for surface exposure type powder bed melting additive manufacturing, which comprises a laser source, an ultra-high-speed vibrating mirror group, a negative scanning module and a multi-stage laser amplification module, wherein the laser source is used for continuously emitting primary laser, the ultra-high-speed vibrating mirror group is used for enabling the primary laser emitted by the laser source to be sequentially thrown into the negative scanning module in a high-speed scanning mode, and the negative scanning module performs monochromatic light finishing on a seed light source with bottom energy to form a required exposure shape and performs primary amplification, and then outputs the exposure shape to the multi-stage laser amplification module; the multi-stage laser amplification module is used for enhancing the light path input by the negative scanning module so as to achieve the energy required by each array point and finally output the pattern required by single-layer surface exposure.
When the invention is used, for the situation that the optical element of the ultra-high speed vibration mirror group or the multi-stage laser amplification module can not reach the final output surface energy density (namely, the total energy is divided by the pattern area), a larger light path light spot is adopted to pass through the ultra-high speed vibration mirror group and enter the multi-stage laser amplification module for reinforcement, and then a set of optical focusing mirror is added to ensure that the light spot focusing meets the design requirement of pattern output.
That is, in an embodiment of the present invention, the laser optical path system for surface exposure type powder bed melting additive manufacturing further includes a focusing module, the focusing module focuses the enhanced laser spot from the multistage laser amplification module to meet the energy density requirement of pattern output, and outputs the enhanced laser spot, and the focusing module is an optical focusing lens.
The focusing module mainly comprises a convex lens and a concave lens, and has the function of changing the output with lower energy density into the output with high energy density so as to meet the requirement of melting powder. The focal lengths of the convex lens and the concave lens are equal, and the focal length and the distance between the convex lens and the concave lens are determined by the magnification requirement.
For some devices with requirements on the installation position of the multistage laser amplification module, a set of optical phase change unit for turning light rays is additionally arranged between the multistage laser amplification module and an optical focusing lens which may be needed.
That is, in one embodiment of the present invention, the laser optical path system for surface exposure type powder bed fusion additive manufacturing further includes an optical phase change unit, and the optical phase change unit is configured to turn and input the enhanced laser light emitted from the multistage laser amplification module to the optical focusing mirror.
The laser optical path system is used for the layered surface exposure high-speed forming of the powder bed melting additive manufacturing process, aims to heat powder consumables, and is suitable for powder bed melting processes of various materials, including alloy powder, ceramic powder and polymer powder.
In an embodiment of the present invention, the number of the laser sources is multiple, the number of the ultra-high speed oscillating mirror group and the number of the multi-stage laser amplification modules are the same as the number of the laser sources, and each laser source corresponds to one ultra-high speed oscillating mirror group and one multi-stage laser amplification module.
In an embodiment of the present invention, the ultra-high speed vibrating mirror set adopts an MEMS micro-vibrating mirror system or a resonant vibrating mirror set.
The ultrafast mirror set may operate all laser sources at all times in a near full power mode, maximizing the use of laser energy, and creating a small natural delay that is invisible to the tiny naked eye, which may be advantageous for area exposure, or which is an ultrafast area scan.
In one embodiment of the present invention, the structure of the MEMS micro-galvanometer system is known.
For XY scanning on a local surface, a single MEMS micro-galvanometer is adopted, the single MEMS micro-galvanometer forms a set of subsystem, the frequency of the horizontal direction of the subsystem can reach 20000Hz which is 200 times of that of a conventional SLM (the maximum frequency of the current SLM-used galvanometer system is 100 Hz), the frequency of the vertical direction of the subsystem can reach 1000Hz, in order to maximize the utilization of the speed advantage of the system, the scanning is carried out in a horizontal direction and a vertical direction in a zigzag path, and the points of patterns in the surface are not scanned, so that the horizontal direction is compensated.
In an embodiment of the present invention, the ultrahigh-speed mirror group is a resonant mirror group, the resonant mirror group is a universal component, and the resonant mirror group is used for realizing scanning. The frequency of the resonant vibrating mirror can reach 10000Hz, which is 100 times of that of the vibrating mirror system of the conventional SLM.
The reason for adopting the ultra-high-speed vibrating mirror group in the invention is as follows:
(1) local on-plane XY scan enhancement or implementation: the MEMS micro-mirrors differ by about 2 orders of magnitude in vertical direction compared to horizontal scanning speed (from frequency), whereas resonant mirrors have only a single axis. Two micro-vibration mirrors form a set of subsystem, and a proper light path is adjusted, so that for the MEMS micro-vibration mirror, if the X direction is the original high-speed direction, the XY can reach the scanning speed in the X direction; for the resonant vibration mirror, after two resonant vibration mirror tables form a set of subsystem, the biaxial high-speed scanning in XY directions can be realized.
(2) The integration of large picture is realized: and dividing sub-areas of the multi-stage laser amplification module corresponding to the whole picture, wherein each area is provided with a set of galvanometer subsystem for XY scanning, and finally, the whole picture is changed into a large picture. According to the integration mode of the large picture, due to the fact that instantaneous simultaneous exposure forming is carried out after the multi-stage laser amplification module is used for amplification, each partition only needs to conduct its own work, the precise cooperative work problem does not need to be considered, and the complex laser handover problem and the multi-laser cooperative algorithm problem in the conventional SLM direct multi-laser scanning process are avoided. Therefore, the multi-laser and multi-machine integration expansion is very easy to realize, and compared with the existing SLM technology, the difficulty of realizing large or ultra-large high-speed SLM scanning by the technology is close to 0 threshold.
In one embodiment of the invention, the negative scanning module, i.e. the secondary pumping source arranged in the semiconductor array, the laser semiconductor arrays arranged in the matrix are all connected with the power supply for array excitation; when the seed light source scans a certain array unit, a stable laser pixel point is formed by primary pumping filtration initial amplification and the opposite Q-switched gain (array), and the stable laser pixel point is output to enter the multi-stage laser amplification module.
Firstly, light rays pass through an optical refraction curved lens to ensure that the light rays can be directly emitted into the corresponding secondary resonant cavity array element, and the energy-enhanced light source is obtained.
The multistage laser amplification module can accumulate lower ultrahigh-speed laser energy to obtain high-power laser energy output, and meets the requirements of a powder bed melting process, so that the requirements of electronic components on laser power can be reduced, and the printing defects caused by local overlarge temperature gradient thermal stress caused by high-speed and high-energy laser beams are avoided; namely, the multistage laser amplification module can realize high-power surface exposure by adopting a relatively low total energy input source.
In one embodiment of the invention, the multi-stage laser amplification module is composed of a plurality of semiconductor laser excited sheets connected with an excitation power supply module, and is used for amplifying the energy of a pixel laser image emitted by the negative scanning module to meet the requirement.
In one embodiment of the present invention, the laser source is a laser generator capable of emitting continuous laser light, and generally, a CW mode of an optical fiber is used, and a QCW mode is also used to obtain higher power for a short time.
The invention is suitable for low power edge scanning: in order to obtain a uniform temperature field at the melting part, the optical path system performs extra low-power scanning in a near domain close to the boundary of a required scanning pattern according to a calculated compensation result (generally, approximate Gaussian curve compensation), and when the optical path system is synchronously projected to the forming layer through the multi-stage laser amplification module, the temperature gradient of the forming layer is improved, so that a printing result with smaller thermal stress is obtained.
Compared with the prior art, the laser optical path system is used for the exposure and high-speed forming of the layered surface of the powder bed melting additive manufacturing process, aims to heat powder consumables, and is suitable for powder bed melting processes of various materials, including alloy powder, ceramic powder and polymer powder.
Drawings
Fig. 1 is a schematic structural diagram of a laser optical path system for surface-exposed powder bed melting additive manufacturing in example 1.
Fig. 2 is a structural block diagram of a laser optical path system for surface exposure type powder bed melting additive manufacturing in example 1.
FIG. 3 shows the ultra high speed scanning mode of the film scanning module.
Fig. 4 is a schematic XY scan.
Fig. 5 is a schematic view of the scanning pattern boundary and pattern region of the formed layup.
Detailed Description
Implementation mode one
A laser optical path system for surface exposure type powder bed melting material increase manufacturing comprises a laser source, an ultra-high speed vibration mirror group, a negative scanning module and a multi-stage laser amplification module, wherein the laser source is used for continuously emitting primary laser, the ultra-high speed vibration mirror group is used for enabling the primary laser emitted by the laser source to be sequentially input into the negative scanning module in a high-speed scanning mode, the negative scanning module performs monochromatic light finishing on a seed light source with bottom energy to form a required exposure shape and performs primary amplification, then the required exposure shape is output to the multi-stage laser amplification module, and the multi-stage laser amplification module is used for enhancing an optical path input by the negative scanning module to achieve the required energy of each array point and finally output a pattern required by single-layer surface exposure.
Second embodiment
For the situation that the optical elements of the ultra-high speed vibration mirror group or the multi-stage laser amplification module cannot achieve the final output surface energy density (namely, the total energy is divided by the pattern area), a set of optical focusing mirror is additionally arranged after large light path light spots pass through the ultra-high speed vibration mirror group and enter the multi-stage laser amplification module for enhancement, so that the light spot focusing meets the design requirement of pattern output.
That is, in this embodiment, the laser optical path system for surface exposure type powder bed melting additive manufacturing further includes a focusing module, the focusing module focuses the enhanced laser spot from the multistage laser amplification module to meet the energy density requirement of pattern output, and outputs the enhanced laser spot, and the focusing module is an optical focusing lens.
The focusing module mainly comprises a convex lens and a concave lens, and has the function of changing the output with lower energy density into the output with high energy density so as to meet the requirement of melting powder. The focal lengths of the convex lens and the concave lens are equal, and the focal length and the distance between the convex lens and the concave lens are determined by the magnification requirement.
Third embodiment
For some devices with requirements on the installation position of the multistage laser amplification module, a set of optical phase change unit for turning light rays is additionally arranged between the multistage laser amplification module and an optical focusing lens which may be needed.
That is, in the present embodiment, the laser optical path system for surface-exposure powder bed fusion additive manufacturing further includes an optical phase change unit configured to turn and input the intensified laser light emitted from the multistage laser amplification module to the optical focusing mirror.
In the above embodiments one, two or three,
the laser optical path system is used for the layered surface exposure high-speed forming of the powder bed melting additive manufacturing process, aims to heat powder consumables, and is suitable for powder bed melting processes of various materials, including alloy powder, ceramic powder and polymer powder.
The laser source sets up a plurality ofly, the number of hypervelocity group of shaking and multistage laser amplification module is the same with the laser source, and every laser source corresponds a hypervelocity group of shaking and a multistage laser amplification module.
The ultra-high-speed vibrating mirror group adopts an MEMS micro-vibrating mirror system or a resonant vibrating mirror group.
The ultrafast mirror set may operate all laser sources at all times in a near full power mode, maximizing the use of laser energy, and creating a small natural delay that is invisible to the tiny naked eye, which may be advantageous for area exposure, or which is an ultrafast area scan.
The structure of the MEMS micro-galvanometer system is known.
Referring to fig. 4, for XY scanning on a local surface, a single MEMS micro-galvanometer is adopted, the single MEMS micro-galvanometer forms a set of subsystems, the frequency in the horizontal direction can reach 20000Hz, which is 200 times that of the conventional SLM galvanometer system (the maximum frequency is also at the level of 100Hz in the current SLM galvanometer system used for SLM), and the frequency in the vertical direction can reach 1000Hz, in order to maximize the utilization of the speed advantage, the scanning is performed in the horizontal direction and then in the vertical direction by using a zigzag path, and the scanning is performed without scanning the vacancy of points of patterns in the surface, so as to make up the horizontal direction.
The resonant vibration mirror group is a universal accessory and is used for realizing scanning. The frequency of the resonant vibrating mirror can reach 10000Hz, which is 100 times of that of the vibrating mirror system of the conventional SLM.
The reason for using the ultra-high-speed vibrating mirror group in the above first, second or third embodiments is as follows:
(1) local on-plane XY scan enhancement or implementation: the MEMS micro-mirrors differ by about 2 orders of magnitude in vertical direction compared to horizontal scanning speed (from frequency), whereas resonant mirrors have only a single axis. Two micro-vibration mirrors form a set of subsystem, and a proper light path is adjusted, so that for the MEMS micro-vibration mirror, if the X direction is the original high-speed direction, the XY can reach the scanning speed in the X direction; for the resonant vibration mirror, after two resonant vibration mirror tables form a set of subsystem, the biaxial high-speed scanning in XY directions can be realized.
(2) The integration of large picture is realized: and dividing sub-areas of the multi-stage laser amplification module corresponding to the whole picture, wherein each area is provided with a set of galvanometer subsystem for XY scanning, and finally, the whole picture is changed into a large picture. According to the integration mode of the large picture, due to the fact that instantaneous simultaneous exposure forming is carried out after the multi-stage laser amplification module is used for amplification, each partition only needs to conduct its own work, the precise cooperative work problem does not need to be considered, and the complex laser handover problem and the multi-laser cooperative algorithm problem in the conventional SLM direct multi-laser scanning process are avoided. Therefore, the multi-laser and multi-machine integration expansion is very easy to realize, and compared with the existing SLM technology, the difficulty of realizing large or ultra-large high-speed SLM scanning by the technology is close to 0 threshold.
In the first, second or third embodiments, the negative scanning module, i.e. the secondary pumping source arranged in the semiconductor array, the laser semiconductor arrays arranged in the matrix are all connected with the power supply for array excitation; when the seed light source scans a certain array unit, a stable laser pixel point is formed by primary pumping filtration initial amplification and the opposite Q-switched gain (array), and the stable laser pixel point is output to enter the multi-stage laser amplification module. The ultra high speed scan mode of the negative film scan module is shown in figure 3.
Firstly, light rays pass through an optical refraction curved lens to ensure that the light rays can be directly emitted into the corresponding secondary resonant cavity array element, and the energy-enhanced light source is obtained.
The multistage laser amplification module can accumulate lower ultrahigh-speed laser energy to obtain high-power laser energy output, and meets the requirements of a powder bed melting process, so that the requirements of electronic components on laser power can be reduced, and the printing defects caused by local overlarge temperature gradient thermal stress caused by high-speed and high-energy laser beams are avoided; namely, the multistage laser amplification module can realize high-power surface exposure by adopting a relatively low total energy input source.
In the first, second or third embodiments, the multi-stage laser amplification module is formed by connecting a plurality of semiconductor laser-excited sheets with an excitation power module, so that the energy amplification of the "pixel laser image" emitted by the negative scanning module can meet the requirement.
In the first, second or third embodiments, the laser source is a laser generator capable of emitting continuous laser light, and generally, a CW mode of an optical fiber is used, and a QCW mode may be used to obtain higher power for a short time.
Referring to fig. 5, the present invention is suitable for low power edge scanning: in order to obtain a uniform temperature field at the melting part, the optical path system performs extra low-power scanning in a near domain close to the boundary of a required scanning pattern according to a calculated compensation result (generally, approximate Gaussian curve compensation), and when the optical path system is synchronously projected to the forming layer through the multi-stage laser amplification module, the temperature gradient of the forming layer is improved, so that a printing result with smaller thermal stress is obtained.
The invention is described in detail below with reference to the figures and specific embodiments.
Example 1
Referring to fig. 1 and 2, a laser optical path system for surface exposure type powder bed melting additive manufacturing comprises a laser source 1, an ultra-high speed vibration mirror group 2, a negative scanning module 3, a multi-stage laser amplification module 4, an optical phase change unit 5 and an optical focusing mirror 6, wherein the laser source 1 is used for continuously emitting primary laser, the ultra-high speed vibration mirror group 2 is used for enabling the primary laser emitted by the laser source 1 to be sequentially thrown into the negative scanning module 3 in a high-speed scanning mode, the negative scanning module 3 performs monochromatic light shaping on a seed light source with bottom energy to form a required exposure shape and performs primary amplification, and then outputs the exposure shape and the primary amplification to the multi-stage laser amplification module 4, the multi-stage laser amplification module 4 is used for enhancing the optical path thrown into the negative scanning module to achieve the required energy of each array point and finally outputs a pattern required by single-layer surface exposure, and the optical phase change unit 5 is used for turning the enhanced laser coming out of the multi-stage laser amplification module And the optical focusing lens 6 is used for focusing the enhanced laser spots from the multistage laser amplification module 4 to meet the design requirement of pattern output and reach the bottom plate 7. The hollow lines in fig. 1 indicate the course of light.
In this embodiment, the laser source 1 is a laser generator capable of emitting continuous laser light, and a CW mode of an optical fiber is used.
In this embodiment, the ultra-high-speed mirror group 2 adopts an MEMS micro-vibration mirror system, and the structure of the MEMS micro-vibration mirror system is known. The ultrafast mirror set may operate all laser sources at all times in a near full power mode, maximizing the use of laser energy, and creating a small natural delay that is invisible to the tiny naked eye, which may be advantageous for area exposure, or which may be an ultrafast area scan.
In this embodiment, the negative scanning module 3, i.e. the two-stage pumping source arranged in the semiconductor array, and the laser semiconductor arrays arranged in the matrix are all connected with the power supply for array excitation; when the seed light source scans a certain array unit, a stable laser pixel point is formed by primary pumping filtration initial amplification and the opposite Q-switched gain (array), and the stable laser pixel point is output to enter the multi-stage laser amplification module. The ultra high speed scan mode of the negative film scan module is shown in figure 3.
In this embodiment, the multi-stage laser amplification module 4 is composed of a plurality of semiconductor laser-excited sheets connected to the excitation power module, so that the "pixel laser image" emitted from the negative scanning module is subjected to energy amplification to meet the required requirements. The multistage laser amplification module can accumulate lower ultrahigh-speed laser energy to obtain high-power laser energy output, and meets the requirements of a powder bed melting process, so that the requirements of electronic components on laser power can be reduced, and the printing defects caused by local overlarge temperature gradient thermal stress caused by high-speed and high-energy laser beams are avoided; namely, the multistage laser amplification module can realize high-power surface exposure by adopting a relatively low total energy input source.
In this embodiment, the optical phase-changing unit 5 is configured to turn and input the enhanced laser light coming out from the multistage laser amplification module to the optical focusing mirror.
In this embodiment, the optical focusing lens 6 focuses the enhanced laser spots from the multi-stage laser amplification module to meet the energy density requirement of pattern output, and outputs the enhanced laser spots.
The embodiments described above are described to facilitate an understanding and use of the invention by those skilled in the art. It will be readily apparent to those skilled in the art that various modifications to these embodiments may be made, and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above embodiments, and those skilled in the art should make improvements and modifications within the scope of the present invention based on the disclosure of the present invention.

Claims (10)

1. A laser optical path system for surface exposure type powder bed melting additive manufacturing is characterized in that,
comprises a laser source, an ultra-high speed vibrating mirror group, a negative film scanning module and a multi-stage laser amplification module,
the laser source is used for continuously emitting primary laser,
the ultra-high speed galvanometer group is used for enabling the primary laser emitted by the laser source to be sequentially thrown into the negative scanning module in a high-speed scanning mode,
the negative film scanning module performs monochromatic finishing on the seed light source with the bottom energy to form a required exposure shape, primarily amplifies the exposure shape and then outputs the exposure shape to the multi-stage laser amplification module;
the multi-stage laser amplification module is used for enhancing the light path input by the negative scanning module so as to achieve the energy required by each array point and finally output the pattern required by single-layer surface exposure.
2. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 1, further comprising a focusing module, wherein the focusing module focuses the enhanced laser spot from the multi-stage laser amplification module to meet the energy density requirement of pattern output and outputs the pattern.
3. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 2, wherein the focusing module mainly comprises a convex lens and a concave lens, the focal lengths of the convex lens and the concave lens are equal, the focal length and the distance between the focal length and the concave lens are determined by the magnification requirement, and the focusing module is an optical focusing lens.
4. The laser optical path system for surface exposure type powder bed melting additive manufacturing according to claim 2, further comprising an optical phase change unit, wherein the optical phase change unit is used for turning the enhanced laser light coming out of the multistage laser amplification module to be incident on an optical focusing mirror.
5. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 1, wherein the number of the laser sources is the same as that of the laser sources, and each laser source corresponds to one ultra-high speed vibration mirror group and one multi-stage laser amplification module.
6. The laser optical path system for surface exposure type powder bed fusion additive manufacturing of claim 1, wherein the ultra-high speed vibration mirror group adopts a MEMS micro vibration mirror system or a resonant vibration mirror group.
7. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 6, wherein for XY scanning on a local surface, a single MEMS micro-galvanometer is adopted, the single MEMS micro-galvanometer is a set of subsystems, and scanning is performed in a zigzag path in a horizontal direction and a vertical direction, and the scanning is not performed on the vacancy of the pattern in the surface.
8. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 1, wherein the negative scanning module is a secondary pumping source arranged in a semiconductor array, and the laser semiconductor arrays arranged in a matrix are connected with an array excitation power supply; when the seed light source scans a certain array unit, a stable laser pixel point is formed by primary pumping filtration initial amplification and opposite Q-switched gain, and the stable laser pixel point is output to enter a multi-stage laser amplification module.
9. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 1, wherein the multistage laser amplification module is composed of a plurality of semiconductor laser excited sheets connected with an excitation power module, so that a pixel laser image emitted by the negative scanning module is subjected to energy amplification to meet the required requirements.
10. The laser optical path system for surface exposure type powder bed melting additive manufacturing of claim 1, wherein the laser source is a laser generator capable of emitting continuous laser.
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN113385690A (en) * 2021-06-16 2021-09-14 中国工程物理研究院机械制造工艺研究所 Scanning path design method based on metal surface exposure selective laser melting technology
CN114101708A (en) * 2021-10-28 2022-03-01 西安交通大学 Lattice laser scanning method and device for laser additive manufacturing
CN114101701A (en) * 2021-09-30 2022-03-01 西安铂力特增材技术股份有限公司 Multi-beam additive manufacturing method

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